Semiconductor cleaning apparatus

Abstract

The application provides a kind of semiconductor cleaning device, it is related to semiconductor cleaning technical field, including ultrasonic cleaner and the support piece being arranged in ultrasonic cleaner, the bottom end of support piece is provided with first connecting piece, first connecting piece is connected with first bearing plate, and the top of first bearing plate is provided with a plurality of first limiting grooves;Support piece is provided with a sleeve ring, and a fastener is arranged between the sleeve ring and the support piece, a connecting pipe is connected to one side of the sleeve ring through a damping pivot, and two support plates are inserted into the connecting pipe.The sleeve ring is connected to the support piece through the fastener in the application, and the height of the second bearing plate can be adjusted by moving the sleeve ring up and down after releasing the fixation of the fastener.The distance between the two second bearing plates can also be adjusted, so that the application has an adjustable function, which can be flexibly adjusted according to different sizes of semiconductor plates, and improves the versatility and practicality of the cleaning device.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor cleaning technology, and more specifically, to a semiconductor cleaning device. Background Technology

[0002] In semiconductor manufacturing processes, the oxidation and regeneration of semiconductor boards is a critical step. During this process, various films are deposited on the surface of the semiconductor board due to the production process. If these films are not removed in time, they will seriously affect the quality and effect of subsequent processing steps. Currently, ultrasonic cleaning technology is widely used in the field of semiconductor board cleaning. The conventional method involves placing the semiconductor board on a carrier frame of an ultrasonic cleaner, then immersing the entire carrier frame in the ultrasonic cleaner. The cavitation effect generated by ultrasonic waves removes impurities from the surface of the semiconductor board. However, most existing ultrasonic cleaner carrier frames are fixed in design, with relatively fixed dimensions and structures, making it difficult to flexibly adjust them to accommodate semiconductor boards of different sizes. Therefore, we propose an improvement to this design, namely a semiconductor cleaning device. Utility Model Content

[0003] This utility model provides a semiconductor cleaning device, including an ultrasonic cleaner and a support member disposed inside the ultrasonic cleaner. The bottom end of the support member is provided with a first connector, the first connector is connected to a first bearing plate, and the top of the first bearing plate is provided with a plurality of first limiting grooves. The support member is provided with a collar, and a fastener is provided between the collar and the support member. One side of the collar is connected to a connecting pipe through a damping shaft. Two support plates are inserted into the connecting pipe. The ends of the two support plates that are far apart from each other extend to the outside of the connecting pipe and are connected to a second connecting member. The two second connecting members are connected to a second bearing plate. The sides of the two second bearing plates that are close to each other are provided with a second limiting groove. The position and number of the second limiting grooves correspond to the position and number of the first limiting grooves.

[0004] As a preferred technical solution of this application, the support member includes a support tube, the collar is slidably sleeved on the outer surface of the support tube, and the fastener is a third hand-tightening bolt threaded on the side of the collar away from the connecting tube, one end of the third hand-tightening bolt is inserted into the collar and abuts against the support tube.

[0005] As a preferred technical solution of this application, the top and bottom of the collar are both connected to a limiting plate through a damping shaft, and the limiting plate is in contact with the outer surface of the connecting tube.

[0006] As a preferred technical solution of this application, the support plate is provided with a plurality of second through holes, and a fifth hand-tightening bolt is threadedly connected to the connecting pipe, the end of the fifth hand-tightening bolt being inserted into the second through hole.

[0007] As a preferred technical solution of this application, the second connector includes a second connecting seat fixedly connected to one end of the support plate. Two second clamping plates are fixedly installed on the side of the second connecting seat near the second bearing plate. A fourth hand-tightening bolt is provided between the two second clamping plates. A second connecting plate is sleeved on the outer surface of the fourth hand-tightening bolt. One side of the second connecting plate is fixedly connected to the second bearing plate.

[0008] As a preferred technical solution of this application, the second clamping plate is arc-shaped at one corner away from the second connecting seat and close to the inner side, and the inner corner of the second connecting plate close to the second connecting seat is also arc-shaped.

[0009] As a preferred technical solution of this application, a support rod is inserted through the inner wall of the support tube, a first connecting seat is fixedly connected to the bottom end of the support rod, a plurality of first through holes are opened on the support rod, a first hand-tightening bolt is threadedly connected to the support tube, and one end of the first hand-tightening bolt is inserted into one of the first through holes.

[0010] As a preferred technical solution of this application, the first connector includes two first clamping plates fixedly connected to the first connecting seat, a second hand-tightening bolt is provided between the two first clamping plates, the outer surface of the second hand-tightening bolt is fitted with a first connecting plate, and the first connecting plate is fixedly connected to the first bearing plate.

[0011] As a preferred technical solution of this application, the top of the first connecting plate near the first connecting seat is arc-shaped, and the top of the first clamping plate away from the first connecting seat is also arc-shaped.

[0012] As a preferred technical solution of this application, a lifting ring is fixedly installed on the top of the support tube, and mounting plates are fixedly installed on both sides of the support tube, with mounting holes provided on the mounting plates.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: In the scheme of this application: This application features a collar connected to a support member via fasteners. After the fasteners are released, the collar can be moved up and down to adjust the height of the second support plate. The distance between the two second support plates can also be adjusted, giving this application an adjustable function. It can be flexibly adjusted according to semiconductor plates of different sizes, improving the versatility and practicality of the cleaning device. Attached Figure Description

[0014] Figure 1 A partial structural schematic diagram of the semiconductor cleaning apparatus provided in this application; Figure 2 Provided for this application Figure 1 A schematic diagram of the structure viewed from below; Figure 3 A schematic diagram of the support plate provided in this application; Figure 4 A schematic diagram of the structure of the first connecting plate provided in this application; Figure 5 A schematic diagram of the folded structure of the semiconductor cleaning apparatus provided in this application; Figure 6 This is a schematic diagram of the semiconductor cleaning apparatus provided in this application.

[0015] The image shows: 1. Support component; 101. Support tube; 102. Support rod; 103. Mounting plate; 104. Mounting hole; 105. Lifting ring; 106. First through hole; 107. First hand-tightening bolt; 2. First connecting seat; 201. First clamping plate; 202. Second hand-tightening bolt; 203. First connecting plate; 204. First bearing plate; 205. First limiting groove; 3. Collar; 301. Connecting tube; 302. Third hand-tightening bolt; 303. Support plate; 304. Second connecting seat; 305. Second clamping plate; 306. Second connecting plate; 307. Second bearing plate; 308. Second limiting groove; 309. Fourth hand-tightening bolt; 310. Second through hole; 311. Fifth hand-tightening bolt; 313. Limiting plate; 4. Ultrasonic cleaning machine. Detailed Implementation

[0016] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0017] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.

[0018] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0019] For an example, please refer to... Figures 1-4 and Figure 6A semiconductor cleaning device includes an ultrasonic cleaner 4 and a support member 1 disposed inside the ultrasonic cleaner 4. The bottom end of the support member 1 is provided with a first connector, the first connector is connected to a first carrier plate 204, and the top of the first carrier plate 204 is provided with a plurality of first limiting grooves 205. A collar 3 is provided on the support member 1. Fasteners are provided between the collar 3 and the support member 1. A connecting pipe 301 is connected to one side of the collar 3 through a damping shaft. Two support plates 303 are inserted into the connecting pipe 301. The ends of the two support plates 303 that are far apart from each other extend to the outside of the connecting pipe 301 and are connected to a second connector. The two second connectors are connected to a second bearing plate 307. The sides of the two second bearing plates 307 that are close to each other are provided with a second limiting groove 308. The position and number of the second limiting grooves 308 correspond to the position and number of the first limiting grooves 205. After the fasteners are released, the collar 3 can be moved up and down to adjust the height of the second carrier plate 307, and the distance between the two second carrier plates 307 can also be adjusted, so that this application has an adjustable function and can be flexibly adjusted according to semiconductor plates of different sizes, which improves the versatility and practicality of the cleaning device. It should be noted that this application can be adapted to semiconductor plates of different sizes, but it is not applicable to all sizes.

[0020] Furthermore, the support member 1 includes a support tube 101, and a collar 3 is slidably sleeved on the outer surface of the support tube 101. The fastener is a third hand-tightening bolt 302 threadedly connected to the side of the collar 3 away from the connecting tube 301. One end of the third hand-tightening bolt 302 is inserted into the collar 3 and abuts against the support tube 101. Loosening the third hand-tightening bolt 302 allows the collar 3 to move up and down, while tightening the third hand-tightening bolt 302 can fix the position of the collar 3.

[0021] Furthermore, the top and bottom of the collar 3 are connected to the limiting plate 313 via a damping shaft. The limiting plate 313 contacts the outer surface of the connecting pipe 301 and can limit the connecting pipe 301 to prevent it from rotating. The damping shaft between the collar 3 and the limiting plate 313 and the damping shaft between the collar 3 and the connecting pipe 301 are two different damping shafts.

[0022] Furthermore, the support plate 303 has several second through holes 310, and the connecting pipe 301 is threaded with a fifth hand-tightening bolt 311. The end of the fifth hand-tightening bolt 311 is inserted into the second through hole 310. The position of the support plate 303 can be fixed by the cooperation of the fifth hand-tightening bolt 311 and the second through hole 310.

[0023] Furthermore, the second connecting member includes a second connecting seat 304 fixedly connected to one end of the support plate 303. Two second clamping plates 305 are fixedly installed on the side of the second connecting seat 304 near the second bearing plate 307. A fourth hand-tightening bolt 309 is provided between the two second clamping plates 305. A second connecting plate 306 is sleeved on the outer surface of the fourth hand-tightening bolt 309. One side of the second connecting plate 306 is fixedly connected to the second bearing plate 307. The fourth hand-tightening bolt 309 is threadedly connected to the lower second clamping plate 305, and the fourth hand-tightening bolt 309 is interlocked with the upper second clamping plate 305, so that when the fourth hand-tightening bolt 309 is tightened, the second connecting plate 306 can be clamped and fixed, and when the fourth hand-tightening bolt 309 is loosened, the second bearing plate 307 can be rotated.

[0024] Furthermore, one corner of the second clamping plate 305, furthest from the second connecting seat 304 and closer to its inner side, is arc-shaped; similarly, one corner of the inner side of the second connecting plate 306, near the second connecting seat 304, is also arc-shaped. (Refer to...) Figure 3 This arrangement ensures that when the second carrier plate 307 is perpendicular to the support plate 303, the second connecting plate 306 and the second connecting seat 304 can abut against each other, preventing the second carrier plate 307 from rotating outwards. Furthermore, after the semiconductor plate is inserted into the second limiting groove 308, the second carrier plate 307 cannot rotate inwards. However, after the semiconductor plate separates from the second limiting groove 308, the second carrier plate 307 can rotate and fold inwards. For ease of understanding, the arc-shaped areas in the accompanying drawings are marked with R.

[0025] Furthermore, a support rod 102 is inserted through the inner wall of the support tube 101, and a first connecting seat 2 is fixedly connected to the bottom end of the support rod 102. Several first through holes 106 are opened on the support rod 102, and a first hand-tightening bolt 107 is threadedly connected to the support tube 101. One end of the first hand-tightening bolt 107 is inserted into one of the first through holes 106. The first hand-tightening bolt 107 and the first through hole 106 cooperate with each other to fix the first connecting seat 2. After unscrewing the first hand-tightening bolt 107, the distance between the first bearing plate 204 and the second bearing plate 307 can be further adjusted.

[0026] Furthermore, the first connector includes two first clamping plates 201 fixedly connected to the first connecting seat 2, and a second hand-tightening bolt 202 is provided between the two first clamping plates 201. A first connecting plate 203 is sleeved on the outer surface of the second hand-tightening bolt 202, and the first connecting plate 203 is fixedly connected to the first bearing plate 204. The second hand-tightening bolt 202 and the two first clamping plates 201 cooperate with each other to clamp and fix the first connecting plate 203.

[0027] Furthermore, the top of the first connecting plate 203 near the first connecting seat 2 is arc-shaped, and the top of the first clamping plate 201 away from the first connecting seat 2 is also arc-shaped, as shown in the reference. Figure 4 This arrangement allows the first connecting plate 203 and the collar 3 to abut against each other when the first carrier plate 204 is perpendicular to the support tube 101, preventing the first carrier plate 204 from rotating downwards. Also, the first carrier plate 204 cannot rotate upwards after the semiconductor plate is inserted into the first limiting groove 205. However, after the semiconductor plate separates from the first limiting groove 205, the first carrier plate 204 can rotate upwards and fold.

[0028] Furthermore, a lifting ring 105 is fixedly installed on the top of the support tube 101, and mounting plates 103 are fixedly installed on both sides of the support tube 101. Mounting holes 104 are provided on the mounting plates 103. The lifting ring 105 and the mounting plates 103 can be connected to existing lifting equipment to drive the lifting of this application through existing lifting components.

[0029] In use, first adjust the height difference between the first bearing plate 204 and the second bearing plate 307. Specifically, after unscrewing the first hand-tightening bolt 107, move the first connecting seat 2 up and down to adjust the distance between the first connecting seat 2 and the support tube 101. After adjustment, make the first hand-tightening bolt 107 and the first through hole 106 fit together. Alternatively, after loosening the third hand-tightening bolt 302, move the collar 3 up and down to adjust the distance between the collar 3 and the first connecting seat 2. After unscrewing the fifth hand-tightening bolt 311, pull the two second bearing plates 307 away from each other to adjust the distance between the two second bearing plates 307. After adjustment, tighten the fifth hand-tightening bolt 311 and make the fifth hand-tightening bolt 311 fit into the second through hole 310. Both the lifting ring 105 and the mounting plate 103 can be connected to existing lifting equipment to drive the lifting of this application through existing lifting components. After the semiconductor board is inserted between the first limiting groove 205 and the second limiting groove 308, the application and the semiconductor board can be placed into the ultrasonic cleaning machine 4 for cleaning through existing lifting equipment.

[0030] During folding, loosen the first hand-tightening bolt 107 and the second hand-tightening bolt 202, rotate the first limiting groove 205 to be parallel with the support tube 101, and then tighten the second hand-tightening bolt 202. Push the first connecting seat 2 upward and tighten the first hand-tightening bolt 107. Loosen the fifth hand-tightening bolt 311 and the fourth hand-tightening bolt 309, and then fold the two second bearing plates 307 together one after the other. Then push the two second connecting seats 304 closer to each other, tighten the fourth hand-tightening bolt 309 and the fifth hand-tightening bolt 311, rotate the limiting plate 313 to separate it from the connecting tube 301, and rotate the connecting tube 301 to stand it upright. This completes the folding process. Figure 5As shown, the overall structure is now more compact, making it easier to store and transport. When using it again, this application shall be submitted by Figure 5 Switch to Figure 1 In this configuration, after unscrewing the first hand-tightening bolt 107, push the first connecting seat 2 downwards, then tighten the first hand-tightening bolt 107 and loosen the second hand-tightening bolt 202. Rotate the first bearing plate 204 to open it and then tighten the second hand-tightening bolt 202. Rotate the connecting pipe 301 horizontally and then rotate the limiting plate 313 to reset it and make it contact the connecting pipe 301. After loosening the fourth hand-tightening bolt 309, rotate the second bearing plate 307 to open it and then tighten the fourth hand-tightening bolt 309.

[0031] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0032] Obviously, the embodiments described above are only some embodiments of this utility model, not all embodiments. The accompanying drawings show preferred embodiments of this utility model, but do not limit the patent scope of this utility model. This utility model can be implemented in many different forms; rather, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of this utility model. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this utility model specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the patent protection scope of this utility model.

Claims

1. A semiconductor cleaning apparatus, characterized in that, It includes an ultrasonic cleaner (4) and a support member (1) disposed inside the ultrasonic cleaner (4). The bottom end of the support member (1) is provided with a first connector, and the first connector is connected to a first bearing plate (204). The top of the first bearing plate (204) is provided with a plurality of first limiting grooves (205). A collar (3) is provided on the support member (1), and a fastener is provided between the collar (3) and the support member (1). One side of the collar (3) is connected to a connecting pipe (301) through a damping shaft. Two support plates (303) are inserted into the connecting pipe (301). The ends of the two support plates (303) that are far apart from each other extend to the outside of the connecting pipe (301) and are connected to a second connector. The two second connectors are connected to a second bearing plate (307). The sides of the two second bearing plates (307) that are close to each other are provided with a second limiting groove (308). The position and number of the second limiting groove (308) correspond to the position and number of the first limiting groove (205).

2. The semiconductor cleaning apparatus according to claim 1, characterized in that, The support member (1) includes a support tube (101), the collar (3) is slidably sleeved on the outer surface of the support tube (101), and the fastener is a third hand-tightening bolt (302) threaded on the side of the collar (3) away from the connecting tube (301). One end of the third hand-tightening bolt (302) is inserted into the collar (3) and abuts against the support tube (101).

3. The semiconductor cleaning apparatus according to claim 1, characterized in that, The top and bottom of the collar (3) are connected to a limiting plate (313) via a damping shaft, and the limiting plate (313) is in contact with the outer surface of the connecting pipe (301).

4. The semiconductor cleaning apparatus according to claim 1, characterized in that, The support plate (303) has several second through holes (310), and the connecting pipe (301) is threaded with a fifth hand-tightening bolt (311), the end of which is inserted into the second through hole (310).

5. The semiconductor cleaning apparatus according to claim 1, characterized in that, The second connector includes a second connector (304) fixedly connected to one end of the support plate (303). Two second clamping plates (305) are fixedly installed on the side of the second connector (304) near the second bearing plate (307). A fourth hand-tightening bolt (309) is provided between the two second clamping plates (305). A second connecting plate (306) is sleeved on the outer surface of the fourth hand-tightening bolt (309). One side of the second connecting plate (306) is fixedly connected to the second bearing plate (307).

6. The semiconductor cleaning apparatus according to claim 5, characterized in that, The second clamping plate (305) is far from the second connecting seat (304) and has an arc-shaped corner near its inner side. The second connecting plate (306) also has an arc-shaped corner near its inner side near the second connecting seat (304).

7. The semiconductor cleaning apparatus according to claim 2, characterized in that, A support rod (102) is inserted through the inner wall of the support tube (101). A first connecting seat (2) is fixedly connected to the bottom end of the support rod (102). Several first through holes (106) are opened on the support rod (102). A first hand-tightening bolt (107) is threaded on the support tube (101). One end of the first hand-tightening bolt (107) is inserted into one of the first through holes (106).

8. The semiconductor cleaning apparatus according to claim 7, characterized in that, The first connector includes two first clamping plates (201) fixedly connected to the first connecting seat (2), and a second hand-tightening bolt (202) is provided between the two first clamping plates (201). The outer surface of the second hand-tightening bolt (202) is fitted with a first connecting plate (203), and the first connecting plate (203) is fixedly connected to the first bearing plate (204).

9. The semiconductor cleaning apparatus according to claim 8, characterized in that, The top of the first connecting plate (203) near the first connecting seat (2) is arc-shaped, and the top of the first clamping plate (201) away from the first connecting seat (2) is also arc-shaped.

10. The semiconductor cleaning apparatus according to claim 9, characterized in that, A lifting ring (105) is fixedly installed on the top of the support tube (101), and mounting plates (103) are fixedly installed on both sides of the support tube (101). Mounting holes (104) are provided on the mounting plates (103).

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