Wire surface encapsulation correction structure

Abstract

The utility model relates to the packaging technical field, concretely is the deviation rectifying structure of metal wire surface packaging. The deviation rectifying structure of metal wire surface packaging, include: metal wire bonder, the metal wire bonder includes the machine table, the bonding platform is arranged on the machine table, and is along the direction displacement close to the welding nozzle of metal wire bonder, a plurality of for placing the carrier of waiting packaging product, a plurality of the carrier is linear array and is arranged on the bonding platform. The utility model has the beneficial effect that: through setting up a plurality of linear array arrangement's carrier on the bonding platform, and cooperate controllable displacement structure of platform, realized the continuous transmission of waiting packaging MOS tube, makes every MOS tube can steadily enter the bonding station, improves the automation degree and the welding efficiency of bonding process.

Description

TECHNICAL FIELD

[0001] The utility model relates to the packaging technical field, concretely is the deviation rectifying structure of metal wire surface packaging. BACKGROUND

[0002] In the packaging process of MOS tube and other semiconductor devices, in order to realize the electrical connection between the device and the packaging substrate, the source pad and the gate pad of the MOS tube are usually connected with the pin of the packaging substrate through the welding wire, at present, the industry generally adopts ultrasonic metal wire bonder to carry out welding operation, and the precise connection of welding wire is completed through the high-precision welding nozzle and CCD visual identification system, however, in the traditional bonding process, the device to be packaged is usually transmitted one by one through a single carrier, lacks continuity and high efficiency, leads to low production efficiency, and it is difficult to meet the large-scale automated production demand. SUMMARY

[0003] The utility model provides the deviation rectifying structure of metal wire surface packaging to solve the problem that the device to be packaged is usually transmitted one by one through a single carrier in the traditional bonding process, lacks continuity and high efficiency, leads to low production efficiency, and it is difficult to meet the large-scale automated production demand in the prior art.

[0004] The technical scheme for solving the above technical problem of the utility model is as follows: the deviation rectifying structure of metal wire surface packaging, comprising: Metal wire bonder, the metal wire bonder includes machine table; Bonding platform, the bonding platform is arranged on the machine table and is displaced along the direction close to the welding nozzle of the metal wire bonder; A plurality of carriers for placing the product to be packaged, a plurality of the carriers are linear array and are arranged on the bonding platform; Guide jig, the guide jig is detachably arranged on the top of the carrier, the guide jig includes baffle and at least two openings, at least two the opening is side by side and is arranged in the inside of baffle, wherein each the opening corresponds to a welding wire.

[0005] The utility model has the advantages of: 1)、Through setting multiple carriers arranged in linear array on the bonding platform, and cooperating with the controllable displacement structure of the platform, the continuous transmission of the MOS tubes to be packaged is realized, so that each MOS tube can stably enter the bonding station, and the automation degree and wire bonding efficiency of the bonding process are improved, secondly, the guide jig is detachably arranged on the top of the carrier, and two openings corresponding to the source pad and the packaging substrate pin and the gate pad and the packaging substrate pin are arranged in the baffle of the jig, so that the non-wire bonding area is effectively shielded, only the pad and pin positions are exposed, so that the recognition accuracy of the pad by the CCD vision system of the bonding machine is improved, the interference of unnecessary structures is reduced, in addition, the preset opening directly forms the wire bonding path, the real-time calculation and reaction time of the CCD system is reduced, and the bonding efficiency is further optimized.

[0006] On the basis of the above technical scheme, the utility model still can make improvement as follows.

[0007] Further, the bonding platform comprises a linear module and a support, and the linear module is located below the welding nozzle of the wire bonding machine and fixed on the machine table.

[0008] Further, the support is fixed on the moving end of the linear module.

[0009] Further, each carrier comprises a bearing block and a containing groove, and the containing groove is arranged in the interior of the bearing block.

[0010] Further, four corner regions of the top of the bearing block are all provided with positioning holes.

[0011] Further, the bottom of the baffle is all fixedly connected with positioning pins in four corner regions.

[0012] The beneficial effects of the above further scheme are that the positioning pins are inserted into the positioning holes to realize the detachability of the baffle, facilitate the installation of the baffle, and the baffle can also be replaced according to the layout of the wire bonding position. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 It is a schematic diagram of the overall structure of the utility model; Figure 2 It is a schematic diagram of the local structure of another perspective of the utility model; Figure 3 It is a schematic diagram of the carrier and the guide jig of the utility model.

[0014] In the drawings, the components represented by each reference numeral are listed as follows: 100, wire bonder, 101, machine, 200, bonding platform, 201, linear module, 202, support, 300, carrier, 301, bearing block, 302, containing groove, 400, guide jig, 401, baffle, 402, opening, 500, positioning hole, 600, positioning pin. DETAILED DESCRIPTION

[0015] The principles and features of the present application are described below in conjunction with the accompanying drawings, and the examples are only used to explain the present application and not to limit the scope of the present application.

[0016] In the packaging process of MOS tubes and other semiconductor devices, in order to realize the electrical connection between the device and the packaging substrate, the source pad and the gate pad of the MOS tube are usually connected with the pins of the packaging substrate through soldering wires. At present, the industry generally uses ultrasonic wire bonder to perform soldering operation, and the precise connection of the soldering wire is completed through the high-precision soldering nozzle and the CCD visual recognition system. However, in the traditional bonding process, the packaged devices are usually transmitted one by one through a single carrier, which lacks continuity and efficiency, resulting in low production efficiency and difficulty in meeting the large-scale automated production demand. To solve the above problems, the present application provides a wire surface packaging deviation correction structure.

[0017] The present application provides the following preferred embodiments As shown in Figure 1 , Figure 2 and Figure 3 , the wire surface packaging deviation correction structure comprises: The wire bonder 100 comprises a machine 101; A bonding platform 200 is arranged on the machine 101 and is displaced in the direction of the soldering nozzle of the wire bonder 100; A plurality of carriers 300 for placing packaged products are arranged in a linear array on the bonding platform 200; A guide jig 400 is detachably arranged on the top of the carrier 300, and the guide jig 400 comprises a baffle 401 and at least two openings 402. The at least two openings 402 are arranged side by side in the interior of the baffle 401, and each opening 402 corresponds to a soldering wire. Through setting multiple carriers 300 arranged in linear array on the bonding platform 200 and cooperating with the controllable displacement structure of the platform, the continuous transmission of the MOS tubes to be packaged is realized, so that each MOS tube can stably enter the bonding station, and the automation degree and wire bonding efficiency of the bonding process are improved.

[0018] In the embodiment, as shown in Figure 1 , Figure 2 and Figure 3 , the bonding platform 200 comprises a linear module 201 and a support 202.

[0019] In the embodiment, as shown in Figure 1 , Figure 2 and Figure 3 , each carrier 300 comprises a bearing block 301 and a containing groove 302.

[0020] In the embodiment, as shown in Figure 1 , Figure 2 and Figure 3 , the top of the bearing block 301 is provided with four positioning holes 500 at the corner regions, and the bottom of the baffle 401 is fixedly connected with four positioning pins 600 at the corner regions.

[0021] The specific working process of the utility model is as follows: Through setting multiple carriers 300 arranged in linear array on the support 202 and cooperating with the controllable displacement structure of the linear module 201, the continuous transmission of the MOS tubes to be packaged is realized, so that each MOS tube can stably enter the bonding station, and the automation degree and wire bonding efficiency of the bonding process are improved.

[0022] The above merely describes preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A wire surface encapsulation correction structure, characterized in that, include: A wire bonding machine, the wire bonding machine comprising a machine base; A bonding platform is mounted on the machine base and moves along the direction of the welding nozzle of the wire bonding machine; Multiple carriers for placing products to be packaged, the multiple carriers being arranged in a linear array and positioned on a bonding platform; A guide fixture is detachably mounted on the top of a carrier. The guide fixture includes a baffle and at least two openings, which are arranged side by side inside the baffle. Each opening corresponds to a welding wire.

2. The wire surface encapsulation correction structure according to claim 1, characterized in that, The bonding platform includes a linear module and a support. The linear module is located below the welding nozzle of the wire bonding machine and is fixed on the machine base.

3. The wire surface encapsulation correction structure according to claim 2, characterized in that, The support is fixed to the moving end of the linear module.

4. The wire surface encapsulation correction structure according to claim 3, characterized in that, Each of the carriers includes a support block and a receiving slot, the receiving slot being formed inside the support block.

5. The wire surface encapsulation correction structure according to claim 4, characterized in that, Positioning holes are provided in the four corner areas at the top of the support block.

6. The wire surface encapsulation correction structure according to claim 5, characterized in that, The four corner areas at the bottom of the baffle are all fixedly connected with positioning pins.

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