A showerhead assembly, upper electrode, and plasma etching apparatus

Abstract

The utility model provides a kind of shower head assembly, upper electrode and plasma etching equipment, shower head assembly includes shower head and telescopic cover;Spray zone is formed on the body of shower head;Telescopic cover has opposite first end and second end in its telescopic direction, first end is connected with the body of shower head, second end is close to or away from the body of shower head with the telescoping of telescopic cover;Telescopic cover is arranged around spray zone, and first chamber is defined between the body of shower head and second end, the section of first chamber perpendicular to the telescopic direction of telescopic cover decreases in the direction from first end to second end.Shower head assembly is applied to plasma etching equipment, and can reduce the ignition difficulty of plasma etching equipment under the premise of ensuring etching quality.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor manufacturing equipment technology, specifically relating to a spray head assembly, an upper electrode, and a plasma etching device. Background Technology

[0002] Plasma etching equipment is a crucial piece of equipment in semiconductor manufacturing. During operation, process gases are injected into the etching chamber through a spray nozzle on the upper electrode, creating an electric field between the upper and lower electrodes. Electrons within this electric field collide with the process gas molecules within the etching chamber, ionizing them and forming plasma. However, in the initial stages of operation, low pressure, a large chamber volume, and a large distance between the upper and lower electrodes often result in low process gas concentrations and large distances between gas molecules. This prevents sustained collisions and subsequent failures in plasma ignition. Utility Model Content

[0003] The purpose of this invention is to provide a spray head assembly, an upper electrode, and a plasma etching device, which aims to reduce the difficulty of plasma ignition in the initial stage of operation of the plasma etching device.

[0004] To achieve the above objectives, this utility model provides a spray head assembly, comprising:

[0005] A spray head body having a spray zone formed thereon; and,

[0006] A telescopic hood has a first end and a second end opposite to each other in its telescopic direction. The first end is connected to the spray head body, and the second end moves closer to or further away from the spray head body as the telescopic hood extends or retracts. The telescopic hood is arranged around the spray area and defines a first chamber between the spray head body and the second end. The cross section of the first chamber perpendicular to the telescopic direction of the telescopic hood decreases from the first end to the second end.

[0007] Optionally, the telescopic cover includes multiple annular telescopic joints, which are sequentially fitted together, and adjacent telescopic joints are movably connected.

[0008] Optionally, the innermost telescopic joint is connected to the spray head body; or,

[0009] The outermost telescopic joint is connected to the spray head body.

[0010] Optionally, the telescopic cover includes a bellows.

[0011] Optionally, the spray head body includes a spray plate, the spray plate having the spray area, and a spray channel extending through the telescopic cover is formed on the spray area.

[0012] The spray plate includes a plate body and a valve. A through hole is formed on the plate body, extending through the telescopic hood in the telescopic direction. The valve is disposed at the through hole and connected to the plate body. The valve has an airflow port extending through the telescopic hood in the telescopic direction. The airflow port constitutes at least a part of the spray channel, and the end of the airflow port facing the first chamber constitutes the outlet end of the spray channel.

[0013] Optionally, the valve includes a valve seat, blades, and a first drive member. The valve seat is disposed at the through hole and connected to the plate body. The valve seat has an inner hole extending through the telescopic cover in the telescopic direction. There are multiple blades, which are arranged sequentially along the circumference of the inner hole and are movably connected to the valve seat. All the blades surround to form the airflow port. The first drive member is connected to all the blades and is configured to drive the blades to move relative to the valve seat.

[0014] Optionally, the number of blades is 9 to 12.

[0015] Optionally, the valve is detachably connected to the plate.

[0016] Optionally, the spray head assembly further includes a flow monitoring element disposed at the outlet end of the spray channel.

[0017] To achieve the above objectives, the present invention also provides an upper electrode, including a spray head assembly as described in any of the preceding claims.

[0018] To achieve the above objectives, this utility model also provides a plasma etching apparatus, comprising:

[0019] Etching cavity;

[0020] The upper electrode, as described above, is located within the etching cavity; the telescopic cover extends vertically, and the first end is located above the second end; and,

[0021] The second drive element is located at least partially within the etching cavity and connected to the telescopic shield, and is configured to drive the telescopic shield to extend and retract.

[0022] Compared with the prior art, the spray head assembly, upper electrode, and plasma etching equipment of this utility model have the following advantages:

[0023] The aforementioned spray head assembly includes a spray head and a telescopic cover; a spray area is formed on the spray head body; the telescopic cover has a first end and a second end opposite to each other in its telescopic direction, the first end being connected to the spray head body, and the second end moving closer to or further away from the spray head body as the telescopic cover extends and retracts; the telescopic cover is arranged around the spray area and defines a first chamber between the spray head body and the second end, the cross-section of the first chamber perpendicular to the telescopic direction of the telescopic cover decreasing along the direction from the first end to the second end. The spray head assembly is used in a plasma etching apparatus, the plasma etching apparatus including an etching chamber, an upper electrode, a lower electrode, and a second driving member; the upper electrode and the lower electrode are both disposed within the etching chamber and are spaced apart in a top-to-bottom direction, the upper electrode including the spray head assembly, and the telescopic cover extending and retracting in a vertical direction, the second end being located below the first end; the second driving member is at least partially located in the etching chamber and connected to the telescopic cover, the second driving member being configured to drive the telescopic cover to extend and retract. During the operation of the plasma etching equipment, process gas is injected into the etching chamber through the spray zone of the spray head body. The upper electrode and the lower electrode form an electric field to ionize the process gas molecules and form plasma. In the initial stage of operation of the plasma etching equipment, the telescopic cover is extended to increase its interference with the diffusion of process gas molecules and plasma. This reduces the amount of process gas diffusing into the etching chamber outside the first chamber, increases the concentration of process gas accumulated in the first chamber, and thus enables the process gas to continuously form plasma and achieve plasma ignition. After successful plasma ignition, the telescopic shield retracts, reducing its interference with the diffusion of process gas molecules and plasma. This allows the process gas molecules and plasma to diffuse fully within a larger etching cavity, increasing the space for plasma and process gas molecules to move and extending their movement paths. This reduces the impact of plasma or process gas molecules on the telescopic shield, extending its service life. It also reduces the impact of plasma and process gas molecules on the cavity walls of the etching cavity, thereby reducing the problem of particles adhering to the cavity walls of the etching cavity falling off due to impact and causing wafer etching defects.

[0024] Furthermore, the spray head body includes a spray plate having a spray area, and a spray channel extending through the telescopic shroud in the spray area; the spray plate includes a plate body and a valve, and a through hole extending through the telescopic shroud in the plate body; the valve is disposed at the through hole and connected to the plate body, and the valve has an airflow port extending through the telescopic shroud in the telescopic direction; the airflow port constitutes at least a part of the spray channel, and the end of the airflow port facing the first chamber constitutes the outlet end of the spray channel. Thus, when the valve is corroded by the process gas, causing the size of the outlet end of the spray channel to increase and resulting in a change in the flow rate of the process gas, the opening of the valve can be reduced to decrease the size of the airflow port, thereby keeping the size of the outlet end of the spray channel constant, and thus keeping the flow rate of the process gas constant.

[0025] Furthermore, the spray head assembly also includes a flow monitoring element disposed at the outlet end of the spray channel. In practical applications, the flow sensor and the valve are also communicatively connected to a control unit. The control unit is configured to receive the flow rate of the process gas flowing out of the outlet end of the spray channel as monitored by the flow sensor, and control the opening degree of the valve based on the monitored process gas flow rate, so as to intelligently control the size of the outlet end of the spray channel, thereby improving control accuracy and reliability. Attached Figure Description

[0026] The accompanying drawings are provided to better understand this utility model and do not constitute an undue limitation thereof. Wherein:

[0027] Figure 1 This is a schematic diagram of the structure of a spray head assembly according to an embodiment of the present invention. The innermost telescopic joint of the telescopic cover in the figure is connected to the spray head body.

[0028] Figure 2 This is a schematic diagram of the structure of a spray head assembly according to an embodiment of the present invention. The outermost telescopic joint of the telescopic cover in the figure is connected to the spray head body.

[0029] Figure 3 This is a schematic diagram of the structure of the spray head body of the spray head assembly provided according to an embodiment of the present invention;

[0030] Figure 4 This is a schematic diagram of an application scenario of the spray head assembly provided by this utility model according to an embodiment;

[0031] Figure 5 This is a schematic diagram of the valve structure of the spray head assembly provided in one embodiment of the present invention;

[0032] Figure 6 This is a schematic diagram of the valve structure of a spray head assembly according to an embodiment of the present invention. Figure 6 The valve opening is greater than Figure 5 The opening degree of the valve in the middle.

[0033] [The following are explanations of the reference numerals in the attached drawings]: 01-Wafer, 1-Etching cavity, 2-Upper electrode, 3-Lower electrode, 10-Spray head assembly, 100-Spray head body, 110-Base, 120-Spray plate, 121-Plate body, 1211-Through hole, 122-Valve, 1221-Air outlet, 1222-Valve seat, 1223-Blade, 101-Spray area, 102-Second chamber, 200-Telescopic cover, 210-Telescopic joint, 201-First end, 202-Second end, 203-First chamber. Detailed Implementation

[0034] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model. It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Therefore, the drawings only show components related to this utility model and are not drawn according to the actual number, shape, and size of the components in implementation. In actual implementation, the type, quantity, and proportion of each component can be arbitrarily changed, and the component layout may also be more complex.

[0035] Furthermore, while each embodiment described below possesses one or more technical features, this does not imply that users of this utility model must simultaneously implement all technical features in any embodiment, or can only separately implement some or all technical features in different embodiments. In other words, provided it is feasible, those skilled in the art can selectively implement some or all technical features in any embodiment, or selectively implement a combination of some or all technical features in multiple embodiments, based on the disclosure of this utility model and depending on design specifications or implementation requirements, thereby increasing the flexibility in implementing this utility model.

[0036] As used herein, the singular forms “a,” “an,” and “the” include plural objects, and the plural form “multiple” includes two or more objects, unless otherwise expressly indicated. As used herein, the term “or” is generally used to include the meaning of “and / or,” unless otherwise expressly indicated, and the terms “installed,” “connected,” and “linked” should be interpreted broadly, for example, as a fixed connection, a detachable connection, or an integral connection. Connections can be mechanical or electrical. Connections can be direct or indirect through an intermediate medium, and can be internal communication between two elements or an interaction between two elements. Relational terms such as “first,” “second,” etc., are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations, nor do they indicate or imply relative importance or implicitly specify the number of indicated technical features. It should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0037] The purpose of this invention is to provide a spray head assembly that, when applied to plasma etching equipment, can reduce the difficulty of plasma ignition and start-up.

[0038] To make the objectives, advantages, and features of this utility model clearer, the following detailed description is provided in conjunction with the accompanying drawings. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to conveniently and clearly illustrate the objectives of the embodiments of this utility model. The same or similar reference numerals in the drawings represent the same or similar parts.

[0039] Figure 1 and Figure 2 The diagram shows a structural schematic of the spray head assembly 10 provided in different embodiments of the present invention. For example... Figure 1 and Figure 2 As shown, the spray head assembly 10 includes a spray head body 100 and a telescopic cover 200. (As indicated...) Figure 3 As shown, a spray zone 101 is formed on the spray head body 100 (e.g.,Figure 3 (The circular area is shown by the dashed line). The telescopic cover 200 has a first end 201 and a second end 202 opposite to each other in its telescopic direction. The first end 201 is connected to the spray head body 100, and the second end 202 moves with the telescopic cover 200 to move closer to or away from the spray head body 100. The telescopic cover 200 is arranged around the spray area 101 and defines a first chamber 203 between the spray head body 100 and the second end 202. The cross-section of the first chamber 203 perpendicular to the telescopic direction of the telescopic cover 200 decreases from the first end 201 to the second end 202.

[0040] like Figure 4 As shown, the spray head assembly 10 is applied to the plasma etching equipment and can reduce the difficulty of ignition and start-up of the plasma etching equipment 1 while ensuring the etching quality of the wafer 01.

[0041] Specifically, the plasma etching apparatus includes an etching chamber 1, an upper electrode 2, a lower electrode 3, and a second driving member (not shown in the figure). The upper electrode 2 and the lower electrode 3 are both disposed within the etching chamber 1 and are spaced apart from each other in a top-to-bottom direction. The upper electrode 2 includes the spray head assembly 10, and the telescopic cover 200 extends vertically; the second end 202 is located below the first end 201; and the first chamber 203 is formed on the lower side of the spray head body 100 and is part of the etching chamber 1. The second driving member is at least partially disposed within the etching chamber 1 and connected to the telescopic cover 200; the second driving member is configured to drive the telescopic cover 200 to extend or retract.

[0042] Those skilled in the art will understand that in the plasma etching apparatus, the upper electrode 2 and the lower electrode 3 are used to form an electric field. Process gas is injected into the etching chamber 1 via the spray zone 101 of the spray head body 100. The process gas molecules ionize under the influence of the electric field to form plasma.

[0043] In this embodiment of the invention, during the initial operation of the plasma etching equipment, the telescopic cover 200 is in an extended state. The process gas is first sprayed into the first chamber 203 via the spray zone 101 of the spray head body 100, and then diffuses from the first chamber 203 to the area of ​​the etching chamber 1 located outside the telescopic cover 120. The extended telescopic cover 200 hinders the diffusion of the process gas from the first chamber 203 to the area of ​​the etching chamber 1 other than the first chamber 203. As a result, more of the process gas is retained in the first chamber 203, making the concentration of the process gas in the first chamber 203 sufficiently high. Therefore, the process gas molecules in the first chamber 203 can continuously ionize under the action of the electric field, making it easier to achieve plasma ignition.

[0044] It is easy to understand that before the plasma ignition is successful, the telescopic cover 200 can be extended and retracted multiple times according to the actual situation until the length of the telescopic cover 200 is suitable for plasma ignition.

[0045] After successful plasma ignition, the retraction of the telescopic shield 200 is controlled to reduce its obstruction of the diffusion of process gas and plasma from the first chamber 203 to areas of the etching chamber 1 other than the first chamber 203. This allows the process gas and plasma to diffuse fully within the etching chamber 1, reducing the impact of process gas molecules and plasma on the chamber walls. Consequently, it reduces the likelihood of particles adhering to the chamber walls of the etching chamber 1 detaching due to impact and falling onto the wafer 01 being etched within the etching chamber 1, causing wafer etching defects and improving the wafer etching quality. Furthermore, the retraction of the telescopic shield 200 also reduces the impact of process gas and plasma on the telescopic shield 200, extending its service life.

[0046] It should be noted that the minimum area of ​​the cross-section of the first chamber 203 perpendicular to the telescopic cover 200 is not less than the area of ​​the wafer 01. When the wafer 01 is placed in the etching chamber 1, the wafer 01 is supported on the upper end surface of the lower electrode 3, and the wafer 01 is located within the projection range of the first chamber 203 on the lower electrode 3.

[0047] The structure of the spray head assembly 10 will be further described below.

[0048] In optional embodiments, such as Figure 1 and Figure 2As shown, the spray head body 100 includes a base 110 and a spray plate 120. The base 110 and the spray plate 120 are arranged along the telescopic direction of the telescopic cover 200 and are connected to each other. The base 110 and the spray plate 120 enclose a second chamber 102, which is located on the side of the spray plate 120 opposite to the first chamber 203. A spray area 101 is formed on the spray plate 120, and a spray channel (not shown in the figure) extending through the telescopic direction of the telescopic cover 200 is formed on the spray area 101. The spray channel connects the second chamber 102 and the first chamber 203. Thus, the process gas is delivered to the second chamber 102 by any suitable means and then sprayed into the etching chamber 1 through the spray channel.

[0049] The first end 201 of the telescopic cover 200 can be connected to at least one of the base 110 and the spray plate 120.

[0050] Preferably, the telescopic cover 200 is detachably connected to the spray head body 100, so that the telescopic cover 200 can be replaced as needed.

[0051] In some embodiments, such as Figure 1 and Figure 2 As shown, the telescopic cover 200 includes multiple annular telescopic joints 210, which are sequentially sleeved and adjacent telescopic joints 210 are movably connected so that adjacent telescopic joints 210 can move along the telescopic direction of the telescopic cover 200. That is, the telescopic cover 200 is telescopically extended or retracted by the relative movement of adjacent telescopic joints 210.

[0052] The two adjacent telescopic joints 210 are referred to as the first telescopic joint and the second telescopic joint (not labeled in the figure). When the telescopic cover 200 is in the extended state, the first telescopic joint is partially closer to the spray head body 100 than the second telescopic joint. In some cases, such as Figure 1 As shown, the first telescopic joint is sleeved on at least a portion of the outer peripheral surface of the second telescopic joint, that is, the telescopic joint 210 closest to the spray head body 100 is on the outermost side. Therefore, in this scenario, the outermost telescopic joint 210 is connected to the spray head body 100. In other cases, such as Figure 2As shown, the second telescopic joint is sleeved on at least a portion of the outer peripheral surface of the first telescopic joint, such that the telescopic joint 210 closest to the spray head body 100 is the innermost, and the innermost telescopic joint 210 is connected to the spray head 110. It can be understood that "inner" and "outer" here are based on the telescopic joint 210 relative to the axis of the spray head body 100; specifically, the telescopic joint 210 closer to the axis of the spray head body 100 is inner, and the telescopic joint 210 farther from the axis of the spray head body 100 is outer.

[0053] In an alternative embodiment, the telescopic cover 200 is made of a bellows.

[0054] In some embodiments, the spray plate is a plate-shaped structure on which the spray channels (not shown in the figure) are formed.

[0055] Those skilled in the art will understand that, in some cases, the process gas is corrosive and can corrode the wall of the spray channel, causing the size of the spray channel to increase, which in turn causes changes in the flow rate of the process gas flowing into the etching chamber 1 through the spray channel, resulting in changes in the etching rate and a decrease in etching stability.

[0056] In view of this, further improvements, such as Figures 1 to 3 As shown, the spray plate 120 includes a plate body 121 and a valve 122. A through hole 1211 extending through the telescopic cover 200 is formed on the plate body 121. The valve 122 is disposed at the through hole 121 and has an airflow port 1221 extending through the telescopic cover 200. The airflow port 1221 constitutes at least a portion of the spray channel, and the end of the airflow port 1221 facing the first chamber 203 constitutes the outlet end of the spray channel. Thus, when the wall of the airflow port 1221 is etched by the process gas, causing the diameter of the airflow port 1221 to increase, the diameter of the airflow port 1221 can be reduced by controlling the opening of the valve 1222 until the diameter of the airflow port 1221 returns to its pre-etching diameter.

[0057] To achieve the objective of "the end of the airflow port 1221 facing the first chamber 203 constituting the outlet end of the spray channel", the valve 122 is disposed on the surface of the plate 121 facing the first chamber 203, such that the spray channel includes the airflow port 1221 and the through hole 1211, or the valve 122 is at least partially disposed within the through hole 1211, but the end of the valve 122 facing the first chamber 203 protrudes from the surface of the plate 121 facing the first chamber 203, or the end of the valve 122 facing the first chamber 203 is flush with the surface of the plate 121 facing the first chamber 203.

[0058] Furthermore, preferably, the shape of the gas flow port 1221 should be as close to circular as possible. This is because the closer the shape of the gas flow port 1221 is to a circle, the less resistance the process gas flowing through it encounters, and the more stable the molecular flow state, which helps maintain the etching stability of the plasma etching equipment.

[0059] To make the shape of the airflow port 1221 approximately circular, such as Figure 5 and Figure 6 As shown, the preferred valve 1122 includes a valve seat 1222, blades 1223, and a first drive member (not shown in the figure). The valve seat 1222 is disposed at the through hole 1211 and connected to the plate 121. The valve seat 1222 has an inner hole (not labeled in the figure) extending through the telescopic cover 200 in the telescopic direction. Multiple blades 1223 are arranged sequentially along the circumference of the inner hole and are movably connected to the valve seat 1222, allowing them to move relative to the valve seat 1222 in a direction close to or away from the axis of the inner hole. All the blades 1223 surround to form the airflow port 1221, and the diameter of the airflow port 1221 changes with the movement of the blades 1223 relative to the valve seat 11222. Specifically, the diameter of the airflow port 1221 increases as the blades 1223 move relative to the valve seat 1222 along an axis away from the inner bore, and decreases as the blades 1223 move relative to the valve seat 1222 along an axis closer to the inner bore. The first drive member is connected to all the blades 1223 and is configured to drive all the blades 1223 to move relative to the valve seat 1222 to achieve the change in the diameter of the airflow port 11221.

[0060] Thus, when the blade 1223 is corroded, causing the diameter of the airflow port 11221 to increase, the diameter of the airflow port 1221 can be reduced by controlling the first driving member to drive the blade 1223 to move relative to the valve seat 122 along the axis close to the inner hole.

[0061] It is easy to understand that the more blades 1223 there are, the closer the shape of the airflow port 1221 will be to a circle. However, too many blades 1223 increase the manufacturing difficulty and cost of the valve 122. In practice, the number of blades 1223 can be set to 9 to 12.

[0062] It should be noted that the more detailed assembly relationship of the valve seat 1222, the blade 1223, and the first driving component is known to those skilled in the art and will not be elaborated here.

[0063] Preferably, the valve 122 is detachably connected to the plate 121. This allows the valve 122 to be replaced when the blade 1223 is severely corroded, making it impossible to maintain the diameter of the airflow port 1221 by adjusting the opening of the valve 122, without replacing the entire spray plate 120, thus reducing maintenance costs.

[0064] Preferably, the spray head assembly 10 further includes a flow monitoring element (not shown in the figure), which is disposed at the outlet end of the spray channel. The flow monitoring element is communicatively connected to an external control unit, which is also communicatively connected to the first drive member. The flow monitoring element is configured to monitor the flow rate of the process gas flowing out from the outlet end of the spray channel, and the control unit is configured to receive the monitoring result of the flow monitoring element and control the first drive member to drive the blade 1223 to move according to the monitoring result of the flow monitoring element, so as to realize the intelligent control of the valve 122.

[0065] Furthermore, a second objective of this utility model is to provide an upper electrode, which is the aforementioned upper electrode 2.

[0066] Furthermore, a third objective of this invention is to provide a plasma etching apparatus, comprising the etching chamber 1, the upper electrode 2, the lower electrode 3, and the second driving component. The relative positions of the etching chamber 1, the upper electrode 2, the lower electrode 3, and the second driving component are as described above and will not be repeated here. In an embodiment of this invention, the second driving component may be a cylinder, and the free end of the piston of the cylinder may be connected to the second end 202 of the telescopic cover 200.

[0067] While the present invention has been disclosed above, it is not limited thereto. Those skilled in the art can make various modifications and variations to the present invention without departing from its spirit and scope. Therefore, if such modifications and variations fall within the scope of the claims of the present invention and their equivalents, the present invention also intends to include such modifications and variations.

Claims

1. A spray head assembly, characterized in that, include: A spray head body having a spray zone formed thereon; and, A telescopic hood has a first end and a second end opposite to each other in its telescopic direction. The first end is connected to the spray head body, and the second end moves closer to or further away from the spray head body as the telescopic hood extends or retracts. The telescopic hood is arranged around the spray area and defines a first chamber between the spray head body and the second end. The cross section of the first chamber perpendicular to the telescopic direction of the telescopic hood decreases from the first end to the second end.

2. The spray head assembly according to claim 1, characterized in that, The telescopic cover includes multiple annular telescopic joints, which are sequentially nested together, and adjacent telescopic joints are movably connected.

3. The spray head assembly according to claim 2, characterized in that, The innermost telescopic joint is connected to the spray head body; or, The outermost telescopic joint is connected to the spray head body.

4. The spray head assembly according to claim 1, characterized in that, The telescopic cover includes a bellows.

5. The spray head assembly according to claim 1, characterized in that, The spray head body includes a spray plate, the spray plate has the spray area, and a spray channel extending through the telescopic cover is formed on the spray area. The spray plate includes a plate body and a valve. A through hole is formed on the plate body, extending through the telescopic hood in the telescopic direction. The valve is disposed at the through hole and connected to the plate body. The valve has an airflow port extending through the telescopic hood in the telescopic direction. The airflow port constitutes at least a part of the spray channel, and the end of the airflow port facing the first chamber constitutes the outlet end of the spray channel.

6. The spray head assembly according to claim 5, characterized in that, The valve includes a valve seat, blades, and a first drive member. The valve seat is disposed at the through hole and connected to the plate body. The valve seat has an inner hole extending through the telescopic cover in the telescopic direction. There are multiple blades, which are arranged sequentially along the circumference of the inner hole and are movably connected to the valve seat. All the blades surround to form the airflow port. The first drive member is connected to all the blades and is configured to drive the blades to move relative to the valve seat.

7. The spray head assembly according to claim 6, characterized in that, The number of blades is 9 to 12.

8. The spray head assembly according to claim 5, characterized in that, The valve is detachably connected to the plate.

9. The spray head assembly according to claim 5, characterized in that, The spray head assembly also includes a flow monitoring element, which is disposed at the outlet end of the spray channel.

10. An upper electrode, characterized in that, Includes the spray head assembly as described in any one of claims 1-9.

11. A plasma etching apparatus, characterized in that, include: Etching cavity; The upper electrode as described in claim 10 is located within the etching cavity; the telescopic cover extends in a vertical direction, and the first end is located above the second end; and, The second drive element is located at least partially within the etching cavity and connected to the telescopic shield, and is configured to drive the telescopic shield to extend and retract.

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