A semiconductor discrete device bonder

Abstract

The utility model discloses a kind of semiconductor discrete device bonder, it is related to semiconductor processing technical field.The utility model includes chassis and upper frame;The top of chassis is fixedly connected with horizontal adjusting disc, the top of horizontal adjusting disc is provided with fixed seat, the inside fixed connection of upper frame has bonder main part;Fixed seat includes bottom box, the inside cavity both sides middle part of bottom box is fixedly connected with lug, the inside of bottom box is provided with the slide that penetrates the both sides of bottom box and two lugs, the side of bottom box is provided with the installation port that is linked with slide, the inside fixed connection of installation port has electromagnet, the top of bottom box is fixedly connected with upper cover, the inside sliding connection of bottom box has two symmetrical distribution sliding plates, the inside sliding connection of slide has pull rod, the end of pull rod towards electromagnet is fixedly connected with iron block, the both sides of pull rod are rotatably connected with side rod.The utility model can be adjusted fixed seat, the precise adjustment of the spacing between clamping plate can be realized to adapt to different size semiconductor.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor processing technology, and in particular relates to a semiconductor discrete device bonding machine. Background Technology

[0002] Semiconductor discrete devices are fundamental electronic components in the semiconductor industry. Unlike the "integrated" characteristics of integrated circuits, they have a single and defined electrical function and are widely used in consumer electronics, automotive electronics, industrial control, and new energy fields. In the manufacturing process of semiconductor discrete devices, the bonding process is one of the core steps. This process requires the internal chip and the external lead frame to be electrically connected through metal leads to form a stable current path. The quality of the connection directly determines the conductivity, heat dissipation efficiency, and long-term reliability of the device.

[0003] However, in existing semiconductor discrete device bonding machines, the fixtures used to fix the devices are mostly designed with a fixed structure. The clamping distance and positioning reference of the fixtures cannot be flexibly adjusted. When processing devices of different sizes or different packaging forms, the entire set of fixtures needs to be replaced, which not only increases tooling costs, but also requires machine downtime for fixture disassembly and debugging, affecting production continuity and processing efficiency.

[0004] To address these issues, we provide a semiconductor discrete device bonding machine. Utility Model Content

[0005] The purpose of this utility model is to provide a semiconductor discrete device bonding machine. The machine uses an electromagnet inside the fixed base to drive the pull rod and the side rod to move the sliding plate closer or further apart. The spacing between the clamping plates is adjusted by the slider sliding along the convex groove and the scale on the top cover boss. This solves the problem of poor compatibility of the fixed base of the existing semiconductor discrete device bonding machine.

[0006] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution: This utility model is a semiconductor discrete device bonding machine, including a base frame and an upper frame fixedly connected to the top of the base frame; a horizontal adjustment plate is fixedly connected to the top of the base frame, and a fixing seat for fixing semiconductors is provided on the top of the horizontal adjustment plate; the bonding machine body is fixedly connected inside the upper frame. The mounting base includes a base box. Protrusions are fixedly connected to the center of both sides of the inner cavity of the base box. A sliding track is provided inside the base box, penetrating both sides of the base box and the two protrusions. An installation port communicating with the sliding track is provided on the side of the base box. An electromagnet is fixedly connected inside the installation port. A top cover is fixedly connected to the top of the base box. Two symmetrically distributed sliding plates are slidably connected inside the base box. A pull rod is slidably connected inside the sliding track. An iron block is fixedly connected to one end of the pull rod facing the electromagnet. Side rods are rotatably connected to both sides of the pull rod, and the other ends of the side rods are rotatably connected to the center of opposite sides of the two sliding plates. A vertically penetrating sliding groove is provided inside the sliding plate. A slider is slidably connected inside the sliding groove. An L-shaped clamping plate is fixedly connected to the top of the slider by bolts. A return spring is provided between the sliding plate and the protrusions.

[0007] The present invention is further configured such that the upper cover has two sliding openings inside, and the clamp is slidably connected to the corresponding sliding opening.

[0008] The present invention is further provided in that the top of the upper cover is provided with a protrusion that fits against the sides of the two sliding ports, and a ruler is fixedly connected to the top of the protrusion.

[0009] The present invention is further configured such that the cross-section of the slide groove is convex, and the slider is adapted to the slide groove.

[0010] The present invention is further configured such that the bottom of the sliding plate has two parallel slots, both sides of the protrusion are fixedly connected to a stabilizing shaft, and the stabilizing shaft is located inside the corresponding slot, and the reset spring is movably sleeved on the outside of the corresponding stabilizing shaft.

[0011] The present invention is further configured such that rubber pads are fixedly connected to the corresponding sides of the two clamping plates.

[0012] The present invention is further configured such that the bottom of the bottom box has two slag leakage ports respectively connected to the slide groove, the bottom of the bottom box has two parallel slide seats fixedly connected, and the center block is fixedly connected at the center of the bottom of the bottom box.

[0013] The present invention is further configured such that the transverse adjustment plate includes a base plate fixedly connected to the top of the base frame, the top of the base plate is fixedly connected to two slide rails and two mounting seats, and the two mounting seats slide on the outside of the two slide rails respectively. The two mounting seats are rotatably connected to an adjusting screw, and the center block is threadedly sleeved on the outside of the adjusting screw. The top of the base plate is fixedly connected to an adjusting motor, and the adjusting screw is fixedly connected to the output end of the adjusting motor.

[0014] The present invention is further configured such that a controller is fixedly connected to the outside of the upper frame.

[0015] This utility model has the following beneficial effects: 1. This utility model uses an electromagnet inside the fixed base to attract an iron block and move a pull rod. This, along with a side rod, pushes two sliding plates closer together. Simultaneously, with the help of a slider sliding along a convex groove and a ruler on the top cover for positioning, the spacing between the clamping plates can be precisely adjusted to accommodate semiconductors of different sizes.

[0016] 2. This utility model uses the adjusting motor of the horizontal adjusting plate to drive the adjusting screw to rotate in the mounting base. Combined with the threaded engagement between the bottom center block of the fixed base and the adjusting screw, and the sliding guide of the bottom slide block of the fixed base along the top slide rail of the base plate, it can realize the automatic horizontal position adjustment of the fixed base and the semiconductor, effectively ensuring that the semiconductor can be accurately aligned with the working end of the bonding machine body, and further improving the accuracy and efficiency of the bonding operation. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below.

[0018] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0019] Figure 2 This is a schematic diagram of the structure of the horizontal adjustment plate and the fixing base of this utility model.

[0020] Figure 3 This is a schematic diagram of the structure of the bottom box of this utility model.

[0021] Figure 4 This is a schematic diagram of the bottom structure of the base box of this utility model.

[0022] Figure 5 This is a schematic diagram of the structure of the top cover of this utility model.

[0023] Figure 6 This is a schematic diagram of the internal structure of the bottom box of this utility model.

[0024] Figure 7 This is a schematic diagram of the structure of the sliding plate of this utility model.

[0025] The attached diagram lists the components represented by each number as follows: 100. Base frame; 200. Lateral adjustment plate; 201. Base plate; 202. Slide rail; 203. Mounting base; 204. Adjusting screw; 205. Adjusting motor; 300. Fixed base; 301. Base box; 301a. Protrusion; 301b. Slide rail; 301c. Mounting port; 301d. Slag leakage port; 302. Top cover; 302a. Sliding port; 302b. Boss; 302c. Scale; 303, sliding plate; 303a, slide groove; 303b, slot; 304, slider; 305, clamping plate; 305a, rubber pad; 307, pull rod; 308, iron block; 309, side rod; 310, electromagnet; 311, stabilizing shaft; 312, return spring; 313, slide block; 314, center block; 400, upper frame; 500, bonding machine body; 600, controller. Detailed Implementation

[0026] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0027] Example 1 Please see Figures 1 to 7 This utility model is a semiconductor discrete device bonding machine, including a base frame 100 and an upper frame 400 fixedly connected to the top of the base frame 100; a horizontal adjustment plate 200 is fixedly connected to the top of the base frame 100, and a fixing seat 300 for fixing semiconductors is provided on the top of the horizontal adjustment plate 200; a bonding machine body 500 is fixedly connected inside the upper frame 400; the horizontal adjustment plate 200 and the fixing seat 300 cooperate to drive the semiconductor to achieve horizontal position adjustment, so that the semiconductor can be accurately aligned with the working end of the bonding machine body 500, thereby improving the accuracy of the bonding operation; The mounting base 300 includes a base box 301. Protrusions 301a are fixedly connected to the center of both sides of the inner cavity of the base box 301. A slide rail 301b is formed inside the base box 301, penetrating both sides of the base box 301 and the two protrusions 301a. An installation port 301c, communicating with the slide rail 301b, is formed on the side of the base box 301. An electromagnet 310 is fixedly connected inside the installation port 301c. A top cover 302 is fixedly connected to the top of the base box 301. Two symmetrically distributed sliding plates 303 are slidably connected inside the base box 301. A pull rod 307 is slidably connected inside the slide rail 301b. An iron block 308 is fixedly connected to one end of the pull rod 307 facing the electromagnet 310. Side rods 309 are rotatably connected to both sides of the pull rod 307, and the other ends of the side rods 309 are rotatably connected to the center of the opposite side of the two sliding plates 303. The sliding plate 303 has a through-groove 303a inside, and a slider 304 is slidably connected inside the groove 303a. The top of the slider 304 is fixedly connected to an L-shaped clamping plate 305 by bolts. A return spring 312 is provided between the sliding plate 303 and the protrusion 301a. When the electromagnet 310 is energized, it attracts the iron block 308, which can drive the pull rod 307 to move along the slide 301b. The side rod 309 pushes the two sliding plates 303 closer together, which, together with the L-shaped clamping plate 305, achieves rapid clamping of the semiconductor. After the power is turned off, under the restoring force of the return spring 312, the two sliding plates 303 move away from each other, which drives the clamping plate 305 to release the semiconductor and achieve reset. The slider 304 can slide along the groove 303a to adjust the position of the clamping plate 305, adapting to semiconductors of different sizes and improving the versatility of the fixing base 300.

[0028] Specifically, the upper cover 302 has two sliding openings 302a inside, and the clamping plate 305 is slidably connected to the corresponding sliding opening 302a. The sliding opening 302a can guide the sliding direction of the clamping plate 305 and improve the clamping stability of the semiconductor. Furthermore, the top of the upper cover 302 is provided with a boss 302b that fits against the sides of the two sliding ports 302a. A scale 302c is fixedly connected to the top of the boss 302b. The boss 302b can fit against the semiconductor to position the semiconductor. The scale 302c can visually display the sliding distance of the clamping plate 305 along the sliding port 302a, which makes it easy for the operator to accurately adjust the distance between the two clamping plates 305. The cross-section of the slide groove 303a is convex, and the slider 304 is adapted to the slide groove 303a. The bottom of the sliding plate 303 has two parallel slots 303b. Both sides of the protrusion 301a are fixedly connected to the stabilizing shaft 311, and the stabilizing shaft 311 is located inside the corresponding slot 303b. The return spring 312 is movably sleeved on the outside of the corresponding stabilizing shaft 311. The stabilizing shaft 311 provides installation positioning for the return spring 312 to prevent the return spring 312 from bending, shifting or falling off during the extension and retraction process. Rubber pads 305a are fixedly connected to the corresponding sides of the two clamping plates 305. The rubber pads 305a are soft and elastic, which can prevent the clamping plates 305 from directly and rigidly contacting the semiconductor surface, preventing the semiconductor surface from being scratched or damaged, and protecting the integrity of the semiconductor device. At the same time, the rubber pads 305a can increase the friction with the semiconductor surface, improve the clamping force of the clamping plates 305 on the semiconductor, prevent the semiconductor from slipping due to vibration during the bonding process, and ensure bonding accuracy and quality. The bottom of the base box 301 has two slag discharge ports 301d that are respectively connected to the slide groove 303a. The bottom of the base box 301 is fixedly connected to two parallel slide seats 313. The center block 314 is fixedly connected to the center of the bottom of the base box 301. The slag discharge ports 301d can discharge the dust, debris and other impurities accumulated inside the slide groove 303a to the outside of the base box 301 in a timely manner, so as to avoid the accumulation of impurities from hindering the sliding of the slider 304 and ensuring the smooth operation of the fixed seat 300. The external fixed connection of the mounting frame 400 is a controller 600, which can realize centralized control of various components of the bonding machine.

[0029] The operation process of this embodiment is as follows: When processing semiconductors, if the semiconductor size does not match the initial distance between the clamping plates 305, first loosen the bolts on the top of the slider 304, push the slider 304 to slide along the U-shaped slide groove 303a. When sliding, refer to the scale 302c on the top boss 302b of the upper cover 302 to determine that the distance between the two clamping plates 305 is compatible with the semiconductor size. Then tighten the bolts to fix the slider 304 to complete the clamping plate position adjustment. Next, through the controller 600 outside the upper frame 400, energize the electromagnet 310 in the mounting port 301c on the side of the bottom box 301. The electromagnet 310 attracts the iron block 308 at the end of the pull rod 307, driving the pull rod 307 along the slide 301 that runs through both sides of the bottom box 301 and the boss 301a. As the lever 307 moves, the side rods 309 on both sides rotate synchronously, pushing the two sliding plates 303 closer together. The sliding plates 303 drive the top clamping plate 305 to slide along the sliding opening 302a of the upper cover 302 until the rubber pads 305a on the opposite side of the clamping plate 305 adhere to the semiconductor surface and continuously clamp the semiconductor. After the bonding machine body 500 is started and the bonding operation is completed, the power supply of the electromagnet 310 is cut off by the controller 600. The attraction force of the electromagnet 310 on the iron block 308 disappears, the reset spring 312 elastically resets and pushes the two sliding plates 303 away from each other. The side rods 309 drive the lever 307 and the iron block 308 to reset along the slide 301b. The clamping plate 305 separates synchronously with the sliding plate 303, and the semiconductor can be removed.

[0030] Example 2 Please see Figure 1 and Figure 2Based on the first specific embodiment, the lateral adjustment plate 200 includes a base plate 201 fixedly connected to the top of the base frame 100. Two slide rails 202 and two mounting seats 203 are fixedly connected to the top of the base plate 201. The two mounting seats 313 slide outside the two slide rails 202 respectively. Adjusting screws 204 are rotatably connected inside the two mounting seats 203. The center block 314 is threadedly sleeved on the outside of the adjusting screws 204. An adjusting motor 205 is fixedly connected to the top of the base plate 201. The adjusting screws 204 are fixedly connected to the output end of the adjusting motor 205. The slide rails 202 cooperate with the mounting seats 313 of the fixed seat 300 to provide precise guidance for the lateral movement of the fixed seat 300. The adjusting motor 205 can drive the adjusting screws 204 to rotate automatically. Through the threaded cooperation between the adjusting screws 204 and the center block 314, the fixed seat 300 can move automatically laterally along the slide rails 202.

[0031] The operation process of this embodiment is as follows: When it is necessary to adjust the lateral position of the semiconductor, the controller 600 starts the adjustment motor 205 of the lateral adjustment disk 200. The adjustment motor 205 is fixed to the top of the base plate 201. The output end of the adjustment motor 205 drives the adjustment screw 204 to rotate stably inside the two mounting seats 203. The two mounting seats 203 are fixed to the top of the base plate 201. Since the center block 314 at the bottom of the fixed seat 300 is threaded onto the outside of the adjustment screw 204, the rotation of the adjustment screw 204 will drive the center block 314 to move laterally, causing the entire fixed seat 300 to move synchronously. At this time, the two slides 313 at the bottom of the fixed seat 300 slide along the two slide rails 202 at the top of the base plate 201 respectively, so that the semiconductor is aligned with the working end of the bonding machine body 500. Then the adjustment motor 205 is turned off, the adjustment screw 204 stops rotating, and the lateral position adjustment of the semiconductor is completed.

[0032] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

Claims

1. A semiconductor discrete device bonding machine, comprising a base frame (100) and an upper frame (400) fixedly connected to the top of the base frame (100); characterized in that: The top of the base frame (100) is fixedly connected to a horizontal adjustment plate (200), and the top of the horizontal adjustment plate (200) is provided with a fixing seat (300) for fixing semiconductors. The inside of the upper frame (400) is fixedly connected to a bonding machine body (500). The mounting base (300) includes a base box (301). Both sides of the inner cavity of the base box (301) are fixedly connected to protrusions (301a). The interior of the base box (301) has a slide rail (301b) that penetrates both sides of the base box (301) and the two protrusions (301a). The side of the base box (301) has an installation port (301c) that communicates with the slide rail (301b). An electromagnet (310) is fixedly connected inside the installation port (301c). A top cover (302) is fixedly connected to the top of the base box (301). Two symmetrically distributed sliding plates (303) are slidably connected inside the base box (301). The inner surface of the slide rail (301b)... A pull rod (307) is slidably connected to the part. An iron block (308) is fixedly connected to one end of the pull rod (307) facing the electromagnet (310). Side rods (309) are rotatably connected to both sides of the pull rod (307), and the other ends of the side rods (309) are rotatably connected to the middle of the opposite side of two sliding plates (303). A vertically penetrating groove (303a) is opened inside the sliding plate (303). A slider (304) is slidably connected inside the groove (303a). An L-shaped clamp (305) is fixedly connected to the top of the slider (304) by bolts. A return spring (312) is provided between the sliding plate (303) and the protrusion (301a).

2. The semiconductor discrete device bonding machine according to claim 1, characterized in that, The upper cover (302) has two sliding openings (302a) inside, and the clamp (305) is slidably connected to the corresponding sliding opening (302a).

3. A semiconductor discrete device bonding machine according to claim 2, characterized in that, The top of the cover (302) is provided with a boss (302b) that fits against the sides of the two sliding ports (302a), and a scale (302c) is fixedly connected to the top of the boss (302b).

4. A semiconductor discrete device bonding machine according to claim 1, characterized in that, The cross-section of the groove (303a) is convex, and the slider (304) is adapted to the groove (303a).

5. A semiconductor discrete device bonding machine according to claim 1, characterized in that, The bottom of the sliding plate (303) has two parallel slots (303b). The two sides of the protrusion (301a) are fixedly connected to the stabilizing shaft (311), and the stabilizing shaft (311) is located inside the corresponding slot (303b). The reset spring (312) is movably sleeved on the outside of the corresponding stabilizing shaft (311).

6. A semiconductor discrete device bonding machine according to claim 1, characterized in that, Rubber pads (305a) are fixedly connected to the corresponding sides of the two clamps (305).

7. A semiconductor discrete device bonding machine according to claim 1, characterized in that, The bottom of the bottom box (301) has two slag outlets (301d) that are respectively connected to the slide groove (303a). The bottom of the bottom box (301) has two parallel slide blocks (313) fixedly connected. The bottom center of the bottom of the bottom box (301) has a center block (314) fixedly connected.

8. A semiconductor discrete device bonding machine according to claim 7, characterized in that, The horizontal adjustment plate (200) includes a base plate (201) fixedly connected to the top of the base frame (100). The top of the base plate (201) is fixedly connected to two slide rails (202) and two mounting seats (203). The two sliding seats (313) slide outside the two slide rails (202) respectively. The two mounting seats (203) are rotatably connected to an adjusting screw (204). The center block (314) is threaded onto the outside of the adjusting screw (204). The top of the base plate (201) is fixedly connected to an adjusting motor (205). The adjusting screw (204) is fixedly connected to the output end of the adjusting motor (205).

9. A semiconductor discrete device bonding machine according to claim 1, characterized in that, The upper shelf (400) is externally fixedly connected to a controller (600).

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