Film suction mechanism for powder compression molding packaging system, mold device and packaging system

Abstract

The application provides a film suction mechanism, a mold device and a packaging system for a powder compression molding packaging system, and relates to the field of chip packaging. A lower molding insert of the film suction mechanism for the powder compression molding packaging system is installed in a lower vacuum enclosure. A gap between the lower vacuum enclosure and the lower molding insert forms a first suction groove, and the first suction groove is in communication with a first gas path. An outer frame of the lower vacuum enclosure is provided with a second suction groove and a third suction groove. The second suction groove surrounds an outer periphery of an inner cavity, and a bottom wall of the second suction groove is provided with a second suction hole. A plurality of second suction holes are in communication with a second gas path. A plurality of third suction grooves surround between the second suction groove and the inner cavity. A bottom wall of the third suction groove is provided with a third suction hole. A plurality of third suction holes are in communication with a third gas path. The first gas path, the second gas path and the third gas path are independent of each other. The application solves the technical problem of poor suction effect of a plastic packaging mold on a plastic packaging film in the prior art.

Description

Technical Field

[0001] This application relates to the field of chip packaging, and more specifically, to a film suction mechanism, a mold device, and a packaging system for a powder compression molding packaging system. Background Technology

[0002] In the powder compression molding and packaging process, the substrate carrying the chip and the molding film need to be placed in the molding mold in advance. The molding film is located between the powder or liquid molding material and the mold surface of the molding mold to separate the two. After the molding process is completed, the molding material wraps the chip. The molding film plays the role of controlling the surface roughness of the molding material, protecting the mold surface of the molding mold, and assisting in demolding.

[0003] In the prior art, the molding die has several through holes around its perimeter, which are used to adsorb the molding film into the molding die. However, this adsorption method has problems such as uneven molding film, air bubbles between the molding film and the molding die, and poor adsorption stability because the adsorption area of ​​the through holes is small. Utility Model Content

[0004] The purpose of this application is to provide a film suction mechanism, a mold device, and a packaging system for a powder compression molding and packaging system, so as to alleviate the technical problem of poor adsorption effect of the molding die on the molding film in the prior art.

[0005] To solve the above-mentioned technical problems, the technical solution provided by this utility model is as follows: In a first aspect, the film suction mechanism for a powder compression molding and packaging system provided by this utility model includes a lower vacuum enclosure plate and a lower molding insert. The lower vacuum enclosure has an inner cavity, and the lower molding insert is installed in the inner cavity. The gap between the inner wall of the lower vacuum enclosure and the outer wall of the lower molding insert forms a first adsorption groove, and the first adsorption groove is connected to the first gas passage. The outer frame of the lower vacuum enclosure is provided with a second adsorption groove and a plurality of third adsorption grooves. The second adsorption groove surrounds the outer periphery of the inner cavity, and the bottom wall of the second adsorption groove is provided with a plurality of second adsorption holes spaced apart along the extension direction of the second adsorption groove; the plurality of second adsorption holes are all connected to the second gas passage. Multiple third adsorption grooves are arranged around the second adsorption groove and the inner cavity, and are spaced apart; the bottom wall of each third adsorption groove is provided with multiple third adsorption holes spaced apart along the extension direction of the third adsorption groove; the multiple third adsorption holes are all connected to the third gas passage. The first air path, the second air path, and the third air path are independent of each other.

[0006] Furthermore, the second adsorption pore and the third adsorption pore are misaligned.

[0007] Furthermore, the third adsorption tank has a connecting section and multiple extension sections. The connecting section extends circumferentially along the lower vacuum enclosure, and the multiple extension sections are spaced apart circumferentially along the lower vacuum enclosure, and all of them are connected at an angle to the side wall of the connecting section near the second adsorption tank. The third adsorption hole is located in the connecting section; or, the third adsorption hole is located in the extension section; or, the third adsorption hole is located at the connection between the connecting section and the extension section.

[0008] Furthermore, the connecting segment is perpendicularly connected to the extending segment.

[0009] Furthermore, both the lower vacuum enclosure and the lower molded insert are square in shape.

[0010] Furthermore, four third adsorption grooves are provided, and the four third adsorption grooves are respectively located around the lower molded insert.

[0011] Furthermore, the second adsorption hole is provided at the corner of the second adsorption tank.

[0012] Furthermore, the first air passage, the second air passage, and the third air passage are all located inside the lower vacuum enclosure.

[0013] Secondly, the mold device provided by this utility model includes an upper mold box component, a lower mold box component, and a film suction mechanism for a powder compression molding and packaging system as described in any of the above items; The upper mold box component and the lower mold box component are arranged opposite to each other, and the film suction mechanism for the powder compression molding and packaging system is installed on the surface of the lower mold box component opposite to the upper mold box component.

[0014] Thirdly, the packaging system provided by this utility model includes the mold device as described above.

[0015] Based on the above technical solutions, the technical effects achievable by this utility model can be analyzed as follows: The film suction mechanism for a powder compression molding and packaging system provided by this utility model includes a lower vacuum enclosure and a lower molding insert. The lower vacuum enclosure has an inner cavity, and the lower molding insert is installed in the inner cavity. The gap between the inner wall of the lower vacuum enclosure and the outer wall of the lower molding insert forms a first adsorption groove, which is connected to a first gas path. The outer frame of the lower vacuum enclosure is provided with a second adsorption groove and a plurality of third adsorption grooves. The second adsorption groove surrounds the outer periphery of the inner cavity, and the bottom wall of the second adsorption groove is provided with a plurality of second adsorption holes spaced apart along the extension direction of the second adsorption groove. The plurality of second adsorption holes are all connected to the second gas path. The plurality of third adsorption grooves surround the second adsorption grooves and the inner cavity, and are spaced apart. The bottom wall of each third adsorption groove is provided with a plurality of third adsorption holes spaced apart along the extension direction of the third adsorption groove. The plurality of third adsorption holes are all connected to the third gas path. The first gas path, the second gas path, and the third gas path are independent of each other.

[0016] The lower vacuum enclosure has an inner cavity for placing and fixing the lower molding insert; the lower vacuum enclosure is used in the encapsulation system to cooperate with the upper mold box component to form a sealed cavity after mold closing; the lower molding insert is used in the encapsulation system to carry the molding compound and conduct heat.

[0017] The gap between the lower vacuum enclosure and the lower molding insert forms a first adsorption groove that communicates with a first air path. This first air path connects to an external vacuum pump, enabling vacuuming of the gap between the lower vacuum enclosure and the lower molding insert. The outer frame of the lower vacuum enclosure is provided with a second and a third adsorption groove. The second adsorption hole of the second adsorption groove communicates with the second air path, and the third adsorption hole of the third adsorption groove communicates with the third air path. Both the second and third air paths connect to an external vacuum pump, enabling vacuuming of the second and third adsorption grooves. The first, second, and third adsorption grooves ensure a uniform distribution of the vacuum airflow, thereby enhancing the adsorption effect on the molding film.

[0018] When using the film suction mechanism for the powder compression molding and packaging system, the molding film is placed on the lower vacuum baffle. The second gas path controls the second suction tank to evacuate, fixing the edge of the molding film to the outer frame of the lower vacuum baffle. Then, the third gas path controls the third suction tank to evacuate, causing the molding film to be suctioned and adhered to the bottom wall of the third suction tank, thereby tightening the molding film. Finally, the first gas path controls the first suction tank to evacuate, causing the inner area of ​​the molding film to be suctioned and adhered to the bottom surface of the cavity of the lower molding insert. This completes the molding film suction process.

[0019] The adsorption of the molding film is controlled by three independent air paths: a first air path, a second air path, and a third air path. The first, second, and third adsorption grooves each have a different focus. The second adsorption groove primarily fixes the molding film, the third adsorption groove primarily tensions the molding film, and the first adsorption groove primarily adheres the molding film to the cavity surface of the lower molded insert. These three adsorption grooves are independent yet can be used in conjunction to ensure that the molding film is stably adhered to the cavity surface without displacement during the molding process, remains taut, ensures a smooth and wrinkle-free surface, and adheres tightly to the cavity surface, ensuring the bonding surface is free of bubbles and wrinkles. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 A schematic diagram of the structure of the film suction mechanism for a powder compression molding and packaging system provided in this application embodiment. Figure 1 ; Figure 2 A schematic diagram of the structure of the film suction mechanism for a powder compression molding and packaging system provided in this application embodiment. Figure 2 ; Figure 3 for Figure 2 Cross-sectional view at point AA; Figure 4 This is a schematic diagram of the mold device provided in an embodiment of this application.

[0022] icon: 100 - Lower vacuum enclosure; 110 - First adsorption tank; 120 - Second adsorption tank; 121 - Second adsorption hole; 130 - Third adsorption tank; 131 - Third adsorption hole; 132 - Connecting section; 133 - Extension section; 200- Lower molded insert; 300 - Upper mold box component; 400 - Lower mold box component; 500 - Plastic-sealed products; 600 - Plastic sealing film. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0024] In the description of this application, it should be noted that the terms "inner" and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0025] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "setup" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0026] Example 1 During the packaging process, the substrate carrying the chip and the molding film 600 need to be placed into the molding mold in advance. The molding film 600 is located between the molding material and the mold surface of the molding mold, separating the two. After the molding process is completed, the molding material will wrap the chip. The molding film 600 plays the role of controlling the surface roughness of the molding material, protecting the mold surface, and assisting in product demolding. During the molding process, the molding film 600 covers the mold surface. Before adding molding material to the mold, it is necessary to ensure that the film can adhere well to the mold surface to avoid problems such as air bubbles between the film and the mold surface, uneven film application, and film displacement during encapsulation. Then, powdered or liquid molding material is filled into the mold surface and the mold is closed. After the molding step is completed, the mold is opened, and the molded substrate is fixed by the clamps on the mold. The molding film 600 is adsorbed onto the mold surface by the vacuum negative pressure on the mold. During the mold opening process, the product and the molding film 600 are separated. After the mold is opened, the vacuum negative pressure environment of the molding film 600 can be controlled to be broken by the equipment. The molded product and the molding film 600 can be removed manually or by a robot to complete one molding cycle. In the prior art, the molding die has several through holes around its perimeter, which are used to adsorb the molding film 600 into the molding die. However, this adsorption method has problems such as unevenness of the molding film 600, air bubbles between the molding film 600 and the molding die, and poor adsorption stability because the adsorption area of ​​the through holes is small.

[0027] In view of this, see Figures 1 to 3 The film suction mechanism for a powder compression molding and packaging system provided in this embodiment includes a lower vacuum enclosure 100 and a lower molding insert 200. The lower vacuum enclosure 100 has an inner cavity, and the lower molding insert 200 is installed in the inner cavity. The gap between the inner wall of the lower vacuum enclosure 100 and the outer wall of the lower molding insert 200 forms a first adsorption groove 110, which is connected to a first gas path. The outer frame of the lower vacuum enclosure 100 is provided with a second adsorption groove 120 and a plurality of third adsorption grooves 130, and the second adsorption groove 120 surrounds the inner cavity. The bottom wall of the second adsorption tank 120 is provided with a plurality of second adsorption holes 121 spaced apart along the extension direction of the second adsorption tank 120; the plurality of second adsorption holes 121 are all connected to the second gas path; a plurality of third adsorption tanks 130 surround the second adsorption tank 120 and the inner cavity and are spaced apart; the bottom wall of each third adsorption tank 130 is provided with a plurality of third adsorption holes 131 spaced apart along the extension direction of the third adsorption tank 130; the plurality of third adsorption holes 131 are all connected to the third gas path; the first gas path, the second gas path and the third gas path are independent of each other.

[0028] Specifically, the lower vacuum enclosure 100 and the lower molding insert 200 are connected by screws. This film-suction mechanism for a powder compression molding and packaging system is used in the mold assembly of a powder or liquid molding compound compression molding and packaging system. During the molding compound compression molding and packaging process, a vacuum negative pressure is applied, and the film-suction mechanism for a powder compression molding and packaging system is used to flatly and firmly adhere the molding film 600 covering the lower molding insert 200 to the bottom surface of the cavity of the lower molding insert 200, thereby meeting the molding requirements.

[0029] The lower vacuum enclosure 100 has an inner cavity for placing and fixing the lower molding insert 200; wherein the lower vacuum enclosure 100 is used in the encapsulation system to cooperate with the upper mold box component 300 to form a sealed cavity after mold closing; the lower molding insert 200 is used in the encapsulation system to carry the molding compound and conduct heat.

[0030] The first adsorption groove 110 formed by the gap between the lower vacuum enclosure 100 and the lower molding insert 200 is connected to the first air passage. The first air passage is used to connect with an external vacuum pump, enabling vacuuming of the gap between the lower vacuum enclosure 100 and the lower molding insert 200. The outer frame of the lower vacuum enclosure 100 is provided with a second adsorption groove 120 and a third adsorption groove 130. The second adsorption hole 121 of the second adsorption groove 120 is connected to the second air passage, and the third adsorption hole 131 of the third adsorption groove 130 is connected to the third air passage. Both the second and third air passages are used to connect with an external vacuum pump, enabling vacuuming of the second adsorption groove 120 and the third adsorption groove 130. The first adsorption groove 110, the second adsorption groove 120, and the third adsorption groove 130 can make the vacuum airflow evenly distributed, thereby enhancing the adsorption effect on the plastic sealant 600.

[0031] When using the film suction mechanism for the powder compression molding and packaging system, the molding film 600 is placed on the lower vacuum baffle 100. The second gas path controls the second suction tank 120 to evacuate, so that the edge of the molding film 600 is fixed on the outer frame of the lower vacuum baffle 100. Then, the third gas path controls the third suction tank 130 to evacuate, so that the molding film 600 is suctioned and adhered to the bottom wall of the third suction tank 130, thereby tensioning the molding film 600. Finally, the first gas path controls the first suction tank 110 to evacuate, so that the inner area of ​​the molding film 600 is suctioned and adhered to the bottom surface of the cavity of the lower molding insert 200. This completes the suction process of the molding film 600.

[0032] The adsorption of the molding film 600 is controlled by three independent air paths: a first air path, a second air path, and a third air path. The first adsorption groove 110, the second adsorption groove 120, and the third adsorption groove 130 have different focuses. The second adsorption groove 120 primarily fixes the molding film 600, the third adsorption groove 130 primarily tensions the molding film 600, and the first adsorption groove 110 primarily adheres the molding film 600 to the cavity surface of the lower molding insert 200. The first adsorption groove 110, the second adsorption groove 120, and the third adsorption groove 130 are independent yet can be used in conjunction. This ensures that the molding film 600 is stably adhered to the cavity surface without displacement during the molding process, remains taut, ensures a smooth and wrinkle-free surface, and adheres tightly to the cavity surface, ensuring that the bonding surface of the molding film 600 is free of bubbles and wrinkles.

[0033] The following provides a detailed description of the structure and shape of the film suction mechanism used in powder compression molding and packaging systems: In the optional embodiment of this utility model, the second adsorption hole 121 and the third adsorption hole 131 are misaligned.

[0034] Specifically, the misalignment setting refers to the relative positions of the gaps between the second adsorption pore 121 and the two adjacent third adsorption pores 131.

[0035] The second adsorption hole 121 and the third adsorption hole 131 are staggered, which allows the second adsorption hole 121 and the third adsorption hole 131 to adsorb the plastic sealant 600 at different positions, thereby making the plastic sealant 600 flatter.

[0036] In the optional embodiment of this utility model, the third adsorption tank 130 has a connecting section 132 and a plurality of extension sections 133. The connecting section 132 extends circumferentially along the lower vacuum enclosure 100, and the plurality of extension sections 133 are spaced apart circumferentially along the lower vacuum enclosure 100, and all of them are connected at an angle to the side wall of the connecting section 132 near the second adsorption tank 120. The third adsorption hole 131 is provided in the connecting section 132; or, the third adsorption hole 131 is provided in the extension section 133; or, the third adsorption hole 131 is provided at the connection between the connecting section 132 and the extension section 133.

[0037] Specifically, in this embodiment, the third adsorption groove 130 is comb-shaped, which increases the area of ​​the third adsorption groove 130, thereby increasing the area of ​​the plastic sealant 600 that can be adsorbed and improving the effect of tensioning the plastic sealant 600. In this embodiment, the third adsorption hole 131 is located at the connection between the connecting section 132 and the extension section 133, so that the entire third adsorption groove 130 is simultaneously evacuated, thereby improving efficiency and adsorption effect.

[0038] The extension section 133 and the connecting section 132 are connected at an angle, which increases the area of ​​the third adsorption tank 130.

[0039] In the optional solution provided by this utility model embodiment, the connecting segment 132 and the extension segment 133 are vertically connected.

[0040] Specifically, the ends of both the extension segment 133 and the connecting segment 132 are curved to avoid dead angles.

[0041] The connecting segment 132 is perpendicular to the extension segment 133, which facilitates processing.

[0042] In the optional embodiment of this utility model, both the lower vacuum enclosure 100 and the lower molded insert 200 are square.

[0043] Specifically, both the lower vacuum enclosure 100 and the lower molded insert 200 are rectangular, and their length directions are consistent.

[0044] The lower vacuum enclosure 100 and the lower molding insert 200 have the same shape, which makes it easy to place the lower molding insert 200 inside the lower vacuum enclosure 100.

[0045] In the optional solution provided by this utility model embodiment, four third adsorption grooves 130 are provided, and the four third adsorption grooves 130 are respectively located around the lower molded insert 200.

[0046] Specifically, the four third adsorption tanks 130 are located on the top surface of the four sides of the lower vacuum enclosure 100.

[0047] The third adsorption tank 130 is provided with four tanks to tighten the plastic sealant 600 around its perimeter and increase the tension.

[0048] In the optional solution provided by this utility model embodiment, a second adsorption hole 121 is provided at the corner of the second adsorption groove 120.

[0049] Specifically, a second adsorption hole 121 must be provided at the corner of the second adsorption tank 120, and the second adsorption hole 121 is provided at intervals at other positions of the second adsorption tank 120.

[0050] The corner of the second adsorption groove 120 is opposite to the corner of the plastic sealant 600. The second adsorption hole 121 is provided at the corner to adsorb the corner of the plastic sealant 600, so as to avoid the corner of the plastic sealant 600 not being adsorbed properly.

[0051] In the optional solution provided by this utility model embodiment, the first air passage, the second air passage and the third air passage are all located inside the lower vacuum enclosure 100.

[0052] Specifically, the film suction mechanism for the powder compression molding and packaging system also includes quick-change connectors, and the first air path, the second air path and the third air path are all connected to quick-change connectors; the quick-change connectors are connected to air pipes, and the air pipes are connected to external vacuum equipment.

[0053] The first, second, and third air passages are located in the lower vacuum enclosure 100 to avoid adding more parts.

[0054] Example 2 The mold device provided in this embodiment of the present invention includes the film suction mechanism for the powder compression molding and packaging system described in Embodiment 1, and therefore also includes all the beneficial effects of Embodiment 1, which will not be repeated here.

[0055] In the optional solutions provided by the embodiments of this utility model, see Figure 4 The mold assembly includes an upper mold box component 300 and a lower mold box component 400; the upper mold box component 300 and the lower mold box component 400 are arranged opposite to each other, and a film suction mechanism for the powder compression molding and packaging system is installed on the surface of the lower mold box component 400 opposite to the upper mold box component 300.

[0056] Specifically, the lower molding insert 200, the lower vacuum enclosure 100, and the other plate-like parts in the lower mold box component 400 are connected as a whole by screws. The upper mold box component 300 and the lower mold box component 400 can move relative to each other. After they move away from each other, the mold device is in the open state; after they move closer to each other, the mold device is in the closed state. The operating sequence of the mold device is as follows: when the mold device is in the open state, the plastic-sealed product 500 is placed on the upper mold box component 300 by hand or by a robot. The upper mold box component 300 has a gripper mechanism that can hook the plastic-sealed product 500 to prevent it from falling off. The molding film 600 is placed on the lower vacuum plate 100 manually or by a robotic arm. The lower vacuum plate 100 has three independent adsorption channels: a first adsorption channel 110, a second adsorption channel 120, and a third adsorption channel 130. The three adsorption channels correspond to three gas channels and can be controlled independently by the equipment. The equipment first evacuates the second adsorption channel 120 to fix the outermost ring of the molding film 600 to the lower vacuum plate 100. Then, the equipment evacuates the third adsorption channel 130 to attract the molding film 600 and adhere it to the bottom surface of the third adsorption channel 130, thereby tightening the molding film 600. Finally, the equipment evacuates the first adsorption channel 110 to attract the inner area of ​​the molding film 600 and adhere it to the bottom surface of the cavity. At this point, the adsorption process of the film coating is completed. Then, powdered or liquid molding material is placed on the molding film 600 in the cavity, and the mold is closed to begin molding. After the plastic seal is formed, the mold is opened, and the sealed product 500 and the sealing film 600 are removed manually or by a robotic arm. This process is repeated to continue the next cycle.

[0057] Example 3 The packaging system provided in this embodiment includes the mold device described in Embodiment 2, and therefore also possesses all the beneficial effects of Embodiment 2, which will not be repeated here.

[0058] In the optional solution provided by this utility model embodiment, the packaging system includes an upper platform and a lower platform of the molding press, the upper mold box component 300 is connected to the upper platform of the molding press, and the lower mold box component 400 is connected to the lower platform of the molding press.

[0059] Specifically, the upper mold box component 300 is connected to the upper platen of the molding press by screws, and the lower mold box component 400 is connected to the lower platen of the molding press by screws. Furthermore, the packaging system also includes a robotic arm for transferring the molding product 500, thereby increasing the automation level of the packaging system.

[0060] The upper and lower platforms of the molding press work together to control the opening and closing of the upper mold box component 300 and the lower mold box component 400.

[0061] It should be noted that, where there is no conflict, the features in the embodiments of this application can be combined with each other.

[0062] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A film suction mechanism for a powder compression molding and packaging system, characterized in that, include: Lower vacuum enclosure (100) and lower molded insert (200); The lower vacuum enclosure (100) has an inner cavity, and the lower molding insert (200) is installed in the inner cavity. The gap between the inner wall of the lower vacuum enclosure (100) and the outer wall of the lower molding insert (200) forms a first adsorption groove (110), and the first adsorption groove (110) is connected to the first gas passage. The outer frame of the lower vacuum enclosure (100) is provided with a second adsorption groove (120) and a plurality of third adsorption grooves (130). The second adsorption groove (120) surrounds the outer periphery of the inner cavity, and the bottom wall of the second adsorption groove (120) is provided with a plurality of second adsorption holes (121) spaced apart along the extension direction of the second adsorption groove (120); the plurality of second adsorption holes (121) are all connected to the second gas passage. Multiple third adsorption grooves (130) surround the second adsorption groove (120) and the inner cavity, and are spaced apart; the bottom wall of each third adsorption groove (130) is provided with multiple third adsorption holes (131) spaced apart along the extension direction of the third adsorption groove (130); the multiple third adsorption holes (131) are all connected to the third gas passage. The first air path, the second air path, and the third air path are independent of each other.

2. The film suction mechanism for a powder compression molding and packaging system according to claim 1, characterized in that, The second adsorption pore (121) and the third adsorption pore (131) are misaligned.

3. The film suction mechanism for a powder compression molding and packaging system according to claim 1, characterized in that, The third adsorption tank (130) has a connecting section (132) and a plurality of extension sections (133). The connecting section (132) extends circumferentially along the lower vacuum enclosure (100), and the plurality of extension sections (133) are spaced apart circumferentially along the lower vacuum enclosure (100), and all of them are connected at an angle to the side wall of the connecting section (132) near the second adsorption tank (120). The third adsorption hole (131) is provided in the connecting section (132); or, the third adsorption hole (131) is provided in the extension section (133); or, the third adsorption hole (131) is provided at the connection between the connecting section (132) and the extension section (133).

4. The film suction mechanism for a powder compression molding and packaging system according to claim 3, characterized in that, The connecting segment (132) is perpendicularly connected to the extending segment (133).

5. The film suction mechanism for a powder compression molding and packaging system according to claim 1, characterized in that, Both the lower vacuum enclosure (100) and the lower molded insert (200) are square.

6. The film suction mechanism for a powder compression molding and packaging system according to claim 5, characterized in that, There are four third adsorption grooves (130), and the four third adsorption grooves (130) are respectively located around the lower molding insert (200).

7. The film suction mechanism for a powder compression molding and packaging system according to claim 5, characterized in that, The second adsorption hole (121) is provided at the corner of the second adsorption tank (120).

8. The film suction mechanism for a powder compression molding and packaging system according to any one of claims 1-7, characterized in that, The first air passage, the second air passage and the third air passage are all located inside the lower vacuum enclosure (100).

9. A mold-making device, characterized in that, It includes an upper mold box component (300), a lower mold box component (400), and a film suction mechanism for a powder compression molding and packaging system as described in any one of claims 1-8; The upper mold component (300) and the lower mold component (400) are arranged opposite to each other, and the film suction mechanism for the powder compression molding and packaging system is installed on the surface of the lower mold component (400) opposite to the upper mold component (300).

10. A packaging system, characterized in that, Includes the mold apparatus as described in claim 9.

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