Wafer side clamps

Abstract

The application discloses a wafer side clamping jig, which comprises two driving members, two clamping members and a guide member for guiding the movement of the two clamping members. The two driving members are connected in a cross shape with a rotating point as an axis and can rotate relative to the rotating point. The clamping members are provided with clamping ends for clamping wafers. The driving members can drive the clamping ends of the two clamping members to relatively approach each other to clamp the wafers, or drive the clamping ends of the two clamping members to move away from each other to release the wafers after clamping the wafers. The wafer side clamping jig can solve the technical problem that the two clamping members of a wafer clamping tool are prone to deflection or shaking when moving relative to each other.

Description

Technical Field

[0001] This application belongs to the field of wafer clamping technology, specifically relating to a wafer side clamp. Background Technology

[0002] In the semiconductor manufacturing process, wafers undergo multiple processes such as photolithography, etching, and deposition. Therefore, transfer tools are necessary to transfer and replace wafers between various devices. Existing transfer tools use chucks to pick up the upper surface of the wafer for transfer. However, the drawback is that direct contact between the chuck and the wafer surface can easily leave traces, which can adversely affect the quality of the finished wafer.

[0003] To avoid leaving marks on the wafer surface, a current clamping tool employs two hinged drive components, each connected to one of two clamping components. The opening and closing of the drive components directly moves the two clamping components relative to each other. When wafer transfer is required, the relative rotation of the two drive components moves the two clamping components relative to each other to hold the wafer's outer contour. However, due to the lack of guiding control over the movement trajectory of the clamping components, wobbling or shaking can easily occur during the drive process. This prevents the two clamping ends from maintaining symmetrical and synchronous movement, potentially resulting in one clamping end contacting the wafer first and applying excessive pressure, causing wafer edge cracking or localized deformation. Utility Model Content

[0004] This application provides a wafer side clamp to solve the technical problem that the relative movement of the two clamping parts of a wafer clamping tool is prone to wobble or wobbling.

[0005] The technical solution adopted in this application is as follows: A wafer side clamp includes two driving members, two clamping members, and a guide member for guiding the movement of the two clamping members. The two driving members are connected in a cross shape with a rotation point as the axis and can rotate relative to each other around the rotation point. They drive the clamping members to move through opening and closing actions. The clamping members are provided with clamping ends for clamping the wafer. The driving members can drive the clamping ends of the two clamping members to come closer to each other to clamp the wafer, or after clamping the wafer, drive the clamping ends of the two clamping members to move away from each other to release the wafer.

[0006] The wafer side clamp of this application also includes the following additional technical features: The guide includes two guide cylinders arranged opposite each other, and the two guide cylinders are arranged one-to-one with two clamping components. Each guide cylinder is provided with a guide channel, and the corresponding clamping component is arranged in the guide channel and can move along the axial direction of the guide channel. The clamping end can extend out of the corresponding guide channel to achieve the clamping of the wafer.

[0007] The guide also includes a transition section connecting the two guide cylinders, the transition section having an installation port, and two drive components disposed in the transition section and extending at least partially from the installation port.

[0008] The drive unit includes a connecting section that is rotatably connected to the clamping member and a gripping section for the operator to hold. The connecting section is located in the transition section, and the gripping section extends out of the mounting port.

[0009] The two clamping components are a first clamping component and a second clamping component. The first clamping component is provided with a positioning component that is rotatably connected to the connecting section. There are two positioning components, which are arranged relatively apart to form a receiving groove. The second clamping component is provided with a mounting component that can enter and exit the receiving groove. The mounting component is rotatably connected to the connecting section.

[0010] The first clamping member and the second clamping member are arranged opposite each other in a preset direction. The two driving members are the first driving member and the second driving member, respectively. The gripping section of the first driving member and the gripping section of the second driving member are arranged opposite each other in a preset direction. The gripping section of the first driving member and the first clamping member are on the same side of the preset direction. The connecting section of the first driving member is connected to the positioning member. The gripping section of the second drive member and the second clamping member are on the same side of a preset direction, and the connecting section of the second drive member is connected to the mounting member.

[0011] One of the guide channel and the clamping member is provided with a guide protrusion, and the other of the two is provided with a guide groove that mates with the guide protrusion.

[0012] The guide cylinder and the clamping component are arranged in an arc shape, and the arc bending direction of both is the same.

[0013] The clamping end is provided with a clamping groove, which is adapted to the outer contour of the wafer.

[0014] The walls of the clamping groove are equipped with elastic buffers that conform to the outer contour of the wafer.

[0015] Due to the adoption of the above technical solution, the beneficial effects achieved by this application are as follows: 1. This application uses the clamping end of the clamping component to clamp the wafer from the side, eliminating the need to contact the wafer's top surface. This solves the problem of residue left by traditional chuck adsorption methods due to surface contact, effectively protecting the wafer's delicate circuitry or coating and ensuring the quality of the finished wafer. By setting two driving components that are cross-connected around a rotation point, the clamping component moves through opening and closing actions. Combined with the guidance of the guide component, this effectively prevents the clamping component from wobbling or shaking during movement, ensuring synchronous movement of the two clamping ends. This prevents one side of the clamping end from contacting the wafer first and applying excessive pressure, reducing the possibility of wafer edge chipping or localized deformation. Furthermore, it allows for more precise and controllable relative approach and departure of the clamping ends, providing stable clamping force when clamping the wafer and smooth release when releasing it. This improves the safety and reliability of the wafer during transfer and processing, reducing the risk of wafer damage due to improper clamping.

[0016] 2. As a preferred embodiment of this application, by setting two guide cylinders corresponding one-to-one with two clamping members, each clamping member moves along the axial direction of the corresponding guide channel, which can strictly constrain the movement of the clamping members, avoid lateral offset or torsion of the clamping members during movement, ensure that the clamping end always moves along the preset trajectory, accurately points to the wafer to be clamped position, and improve the clamping positioning accuracy.

[0017] Furthermore, the transition section connects the two guide cylinders into one unit, preventing relative displacement or wobbling between them and ensuring the coaxiality and symmetry of the guide channel. This provides fundamental support for the stable movement of the clamping components, especially reducing the impact of structural deformation on clamping accuracy during high-frequency clamping operations. The transition section also provides integrated mounting space for the drive components, allowing them to be positioned between the two guide cylinders. This ensures a more balanced transmission of driving force to the clamping components on both sides, further improving clamping synchronization.

[0018] 3. As a preferred embodiment of this application, by setting the grip section to extend out of the installation port, it is convenient for operators to directly contact and apply force, which conforms to ergonomic design and reduces the difficulty of operation; at the same time, the connecting section is hidden in the transition section, which can avoid the risk of accidental contact caused by the connection part being exposed to the outside, and can also reduce the interference of the external environment on the connection structure, ensuring the long-term stable operation of the drive component.

[0019] Furthermore, the first clamping member forms a receiving groove through two positioning members, and the mounting part of the second clamping member can enter and exit the receiving groove. This can play a positioning and guiding role in the rotational connection between the connecting section and the two clamping members, reduce the radial sway of the connecting part, ensure stable transmission of driving force, and avoid lag or deviation in clamping action. At the same time, it can also constrain the relative positional relationship between the first clamping member and the second clamping member, prevent motion interference between the two during opening and closing, ensure that the clamping end moves towards or away from the wafer synchronously, reduce the risk of wafer damage due to uneven force, and also reduce the overall space occupied by the connecting part, making the fixture structure more compact to adapt to narrow operating spaces.

[0020] Furthermore, by setting two clamping components opposite each other in a preset direction, and two gripping sections opposite each other in a preset direction, and connecting sections connecting the clamping components on the same side as the gripping sections, the force applied by the operator to the gripping sections can be directly transmitted to the clamping components through the connecting sections on the same side. This creates a direct correspondence between the movement direction of the clamping components and the operation direction of the gripping sections. The operator can accurately predict the movement trend of the clamping components through the opening and closing movements of the gripping sections, improving the convenience and accuracy of operation. Especially in high-precision clamping scenarios, it can effectively reduce the probability of misoperation.

[0021] 4. As a preferred embodiment of this application, by setting a guide protrusion and a guide groove that cooperates with the guide protrusion, the movement path of the clamping member is further constrained, the stability of the movement of the clamping member is improved, and the mutual support of the contact surfaces of the guide protrusion and the guide groove can disperse the radial load generated by the clamping member when it is under force, reduce the local wear between the guide channel and the clamping member, and reduce the clamping force fluctuation caused by gap wobble, so that the movement of the two clamping members is more synchronized, and further ensures that the wafer is subjected to uniform force.

[0022] 5. As a preferred embodiment of this application, the arc-shaped guide cylinder and the clamping component can form a matching arc-shaped motion trajectory, guiding the clamping component to move precisely along a preset arc-shaped path. This ensures that the clamping end maintains a suitable relative position with the arc-shaped outer contour of the wafer as it approaches or moves away from the wafer, ensuring that the clamping groove can smoothly fit the wafer edge and avoiding local collisions or unstable clamping caused by deviations in the motion trajectory. The consistent bending direction of the guide cylinder and the clamping component makes the guiding effect of the guide cylinder on the clamping component more consistent, reducing the fit gap and motion interference between the two, making the movement of the clamping component smoother and reducing the risk of jamming. Especially in scenarios where wafers at different positions need to be clamped frequently, stable motion accuracy can be maintained.

[0023] 6. In a preferred embodiment of this application, by providing a clamping groove that matches the outer contour of the wafer, the matching clamping groove can increase the contact area with the wafer, thereby reducing pressure, minimizing the impact of clamping on the wafer, and ensuring the performance and quality of the wafer. Furthermore, the matching of the clamping groove with the outer contour of the wafer can better limit the upper and lower positions of the wafer, making the wafer more stable during clamping and less prone to displacement or shaking. It also helps to achieve precise wafer positioning in subsequent processing, handling, and other operations.

[0024] Furthermore, the elastic buffer can absorb the impact force during clamping through its own deformation, avoiding localized stress concentration caused by rigid contact and significantly reducing the risk of wafer cracks and edge chipping due to excessive clamping force. Simultaneously, the elastic buffer can adapt to the slight undulations of the wafer's outer contour, allowing for a tighter fit between the slot wall and the wafer surface, thus ensuring stable wafer clamping. During wafer transfer, the elastic buffer acts as a damper, reducing the transmission of external vibrations to the wafer, minimizing wafer displacement or alignment deviations caused by vibration, and improving process stability. Attached Figure Description

[0025] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings: Figure 1 This is a schematic diagram of the structure of a wafer side clamp according to one embodiment of this application; Figure 2 This is a schematic diagram of the installation of the guide cylinder and the clamping member according to one embodiment of this application; Figure 3 This is a front view of the first clamping member according to one embodiment of this application; Figure 4 This is a left view of the first clamping member according to one embodiment of this application; Figure 5 This is a front view of the second clamping member according to one embodiment of this application; Figure 6 This is a left view of the second clamping member according to one embodiment of this application.

[0026] List of components and reference numerals: 1. Driving component; 11. Connecting section; 12. Grip section; 13. First driving component; 14. Second driving component; 2. Clamping component; 21. Clamping end; 211. Clamping groove; 22. First clamping component; 221. Positioning component; 23. Second clamping component; 231. Mounting component; 24. Guide protrusion; 3. Guide component; 31. Guide cylinder; 311. Guide channel; 312. Guide groove; 32. Transition section; 321. Mounting port. Detailed Implementation

[0027] To more clearly illustrate the overall concept of this application, a detailed explanation is provided below with reference to the accompanying drawings.

[0028] Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application may also be implemented in other ways different from those described herein. Therefore, the scope of protection of this application is not limited to the specific embodiments disclosed below. It should be noted that, unless otherwise specified, the embodiments of this application and the features thereof can be combined with each other.

[0029] Furthermore, it should be understood in the description of this application that the terms "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0030] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0031] In this application, unless otherwise expressly specified and limited, the "above" or "below" of the second feature can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. In the description of this specification, references to terms such as "an embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described can be combined in any suitable manner in one or more embodiments or examples.

[0032] like Figure 1 , Figure 2 As shown, a wafer side clamp includes two driving members 1, two clamping members 2, and a guide member 3 for guiding the movement of the two clamping members 2. The two driving members 1 are connected in a cross shape with a rotation point as the axis and can rotate relative to each other around the rotation point. The clamping members 2 are moved by opening and closing actions. The clamping members 2 are provided with clamping ends 21 for clamping the wafer. The driving members 1 can drive the clamping ends 21 of the two clamping members 2 to move closer to each other to clamp the wafer, or after clamping the wafer, drive the clamping ends 21 of the two clamping members 2 to move away from each other to release the wafer.

[0033] This application uses the clamping end 21 of the clamping member 2 to clamp the wafer from the side, without contacting the wafer's upper surface. This solves the problem of leaving marks due to surface contact in traditional chuck adsorption methods, effectively protecting the wafer's precision circuitry or coating and ensuring the quality of the finished wafer. By setting two driving members 1 cross-connected around the rotation point, the clamping member 2 is moved through opening and closing actions. With the guidance of the guide member 3, the clamping member 2 is effectively prevented from swaying or shaking during movement, ensuring that the two clamping ends 21 move synchronously. This prevents one side of the clamping end 21 from contacting the wafer first and applying excessive pressure, reducing the possibility of wafer edge chipping or local deformation. Moreover, it allows for more precise and controllable relative approach and departure of the clamping ends 21, providing stable clamping force when clamping the wafer and smooth release when releasing it. This improves the safety and reliability of the wafer during transfer and processing, reducing the risk of wafer damage due to improper clamping.

[0034] As will be clear to those skilled in the art, in this application, the two drive members 1 are hinged at a rotation point.

[0035] In this application, the guide member 3 can be configured in any of the following embodiments: Implementation method one: such as Figure 1 , Figure 2 As shown, the guide member 3 includes two guide cylinders 31 arranged opposite to each other. The two guide cylinders 31 are arranged one-to-one with the two clamping members 2. Each guide cylinder 31 is provided with a guide channel 311. The corresponding clamping member 2 is arranged in the guide channel 311 and can move along the axial direction of the guide channel 311. The clamping end 21 can extend out of the corresponding guide channel 311 to achieve clamping of the wafer.

[0036] By setting two guide cylinders 31 corresponding to two clamping parts 2 one by one, each clamping part 2 moves along the axial direction of the corresponding guide channel 311, which can strictly constrain the movement of the clamping part 2, avoid the clamping part 2 from lateral displacement or torsion during movement, ensure that the clamping end 21 always moves along the preset trajectory, accurately points to the wafer to be clamped position, and improve the clamping positioning accuracy.

[0037] Implementation Method 2: This implementation method is not illustrated. The guide includes two guide plates arranged opposite to each other. The two guide plates are arranged in a one-to-one correspondence with the two clamping components. One of the guide plates and the clamping components is provided with a T-shaped guide protrusion, and the other is provided with a T-shaped groove.

[0038] As a preferred embodiment of the implementation method, the following is an example: Figure 1 , Figure 2 As shown, the guide member 3 also includes a transition section 32 connecting the two guide cylinders 31. The transition section 32 is provided with an installation port 321. The two drive members 1 are disposed in the transition section 32 and extend at least partially from the installation port 321.

[0039] The transition section 32 connects the two guide cylinders 31 into one unit, avoiding relative displacement or wobbling between them. This ensures the coaxiality and symmetry of the guide channel 311, providing fundamental support for the stable movement of the clamping member 2. Especially in high-frequency clamping operations, it reduces the impact of structural deformation on clamping accuracy. The transition section 32 provides integrated installation space for the drive member 1, allowing the two drive members 1 to be positioned in the middle of the two guide cylinders 31. This ensures a more balanced transmission of driving force to the clamping members 2 on both sides, further improving clamping synchronization.

[0040] Furthermore, such as Figure 1 , Figure 2 As shown, the drive unit 1 includes a connecting section 11 that is rotatably connected to the clamping member 2 and a gripping section 12 for the operator to hold. The connecting section 11 is located in the transition section 32, and the gripping section 12 extends out of the mounting port 321.

[0041] By setting the grip section 12 to extend out of the mounting port 321, it is easy for operators to directly contact and apply force, which conforms to the ergonomic design and reduces the difficulty of operation; at the same time, the connecting section 11 is hidden in the transition section 32, which can avoid the risk of accidental contact caused by the connection part being exposed to the outside, and can also reduce the interference of the external environment on the connection structure, ensuring the long-term stable operation of the drive component 1.

[0042] As a preferred embodiment of embodiment 1, the two clamping members 2 are a first clamping member 22 and a second clamping member 23. The first clamping member 22 is provided with a positioning member 221 that is rotatably connected to the connecting section 11. There are two positioning members 221, which are arranged at intervals to form a receiving groove. The second clamping member 23 is provided with a mounting member 231 that can enter and exit the receiving groove. The mounting member 231 is rotatably connected to the connecting section 11.

[0043] The first clamping member 22 forms a receiving groove through two positioning members 221. The mounting member 231 of the second clamping member 23 can enter and exit the receiving groove. It can position and guide the rotational connection between the connecting section 11 and the two clamping members 2, reduce the radial sway of the connection part, ensure stable transmission of driving force, and avoid lag or deviation in clamping action. At the same time, it can also constrain the relative positional relationship between the first clamping member 22 and the second clamping member 23, prevent motion interference between the two during opening and closing, ensure that the clamping end 21 moves towards or away from the wafer synchronously, reduce the risk of wafer damage due to uneven force, and reduce the overall space occupied by the connection part, making the fixture structure more compact to adapt to narrow operating spaces.

[0044] In specific example 1, the connection between clamping member 2 and connecting segment 11 can be configured in any of the following examples: Example 1: such as Figure 1 , Figure 2As shown, the first clamping member 22 and the second clamping member 23 are arranged opposite to each other in a preset direction. The two driving members 1 are the first driving member 13 and the second driving member 14, respectively. The gripping section 12 of the first driving member 13 and the gripping section 12 of the second driving member 14 are arranged opposite to each other in a preset direction. The gripping section 12 of the first driving member 1 and the first clamping member 22 are on the same side of the preset direction. The connecting section 11 of the first driving member 1 is connected to the positioning member 221. The gripping section 12 of the second drive member 14 and the second clamping member 23 are on the same side of the preset direction, and the connecting section 11 of the second drive member 14 is connected to the mounting member 231.

[0045] The default direction is Figure 2 The vertical direction in the middle.

[0046] Furthermore, the connecting section 11 of the first driving member 13 is provided with a positioning groove (not shown in the figure), the positioning groove is provided with two oppositely arranged groove walls (not shown in the figure), the groove walls are provided with a rotating shaft, the positioning member 221 is provided with a connecting groove that cooperates with the rotating shaft, and the two positioning members 221 are provided in the positioning groove.

[0047] Two clamping parts 2 are set opposite each other in a preset direction, and two gripping sections 12 are set opposite each other in a preset direction. A connecting section 11 connects the clamping parts 2 set on the same side as the gripping sections 12, so that the force applied by the operator to the gripping sections 12 can be directly transmitted to the clamping parts 2 through the connecting section 11 on the same side. This makes the movement direction of the clamping parts 2 and the operation direction of the gripping sections 12 correspond intuitively. The operator can accurately predict the movement trend of the clamping parts 2 through the opening and closing action of the gripping sections 12, which improves the convenience and accuracy of operation. Especially in high-precision clamping scenarios, it can effectively reduce the probability of misoperation.

[0048] Those skilled in the art will understand that the rotatable connection between the connecting segment 11 and the positioning element 221 can also be achieved by rotatably connecting the connecting segment 11 to any one of the positioning elements 221.

[0049] Example 2: This example 2 is not illustrated. The difference from Example 1 is that the gripping section of the first driving member and the first clamping member are on the same side of the preset direction, and the connecting section of the first driving member is connected to the mounting member. The gripping section of the second drive member and the second clamping member are on the same side of a preset direction, and the connecting section of the second drive member is connected to the positioning member.

[0050] In Embodiment 1, the guiding arrangement of the guide channel 311 can be any one of the following embodiments: Example 2: As Figure 2 As shown, one of the guide channel 311 and the clamping member 2 is provided with a guide protrusion 24, and the other is provided with a guide groove 312 that cooperates with the guide protrusion 24.

[0051] By setting the guide protrusion 24 and the guide groove 312 that cooperates with the guide protrusion 24, the movement path of the clamping member 2 is further constrained, the stability of the movement of the clamping member 2 is improved, and the mutual support of the contact surfaces of the guide protrusion 24 and the guide groove 312 can disperse the radial load generated by the clamping member 2 when it is under force, reduce the local wear between the guide channel 311 and the clamping member 2, and reduce the clamping force fluctuation caused by gap wobble, so that the movement of the two clamping members 2 is more synchronized, and further ensures the uniform force on the wafer.

[0052] Example 3: This example 3 is not illustrated. Multiple balls are provided in the guide channel. Two balls are symmetrically arranged along the axial direction of the guide channel to form a ball group. The ball groups are arranged at intervals along the circumference of the guide channel. The balls are connected to the clamping member by rolling friction.

[0053] As a preferred embodiment of the following implementation method, such as Figure 1 , Figure 2 As shown, the guide cylinder 31 and the clamping member 2 are arranged in an arc shape, and the arc curvature of both is consistent. Furthermore, one of the guide channel 311 and the clamping member 2 is provided with a guide protrusion 24, and the other is provided with a guide groove 312 that mates with the guide protrusion 24. The guide protrusion 24 and the guide groove 312 are arranged in an arc shape, and the arc curvature of both is consistent.

[0054] The arc-shaped guide cylinder 31 and the clamping member 2 can form a matching arc-shaped motion trajectory, guiding the clamping member 2 to move precisely along the preset arc-shaped path. This ensures that the clamping end 21 maintains a suitable relative position with the arc-shaped outer contour of the wafer as it approaches or moves away from the wafer, ensuring that the clamping groove 211 can smoothly fit the edge of the wafer and avoid local collisions or unstable clamping caused by deviations in the motion trajectory. The consistent bending direction of the guide cylinder 31 and the clamping member 2 makes the guiding effect of the guide cylinder 31 on the clamping member 2 more consistent, reducing the gap and motion interference between the two, making the movement of the clamping member 2 smoother and reducing the risk of jamming. Especially in scenarios where wafers at different positions need to be clamped frequently, it can maintain stable motion accuracy.

[0055] As a preferred embodiment of this application, such as Figure 1 , Figure 2 , Figure 4 , Figure 6 As shown, the clamping end 21 is provided with a clamping groove 211, which is adapted to the outer contour of the wafer.

[0056] By adapting the clamping groove 211 to the outer contour of the wafer, the clamping groove 211 increases the contact area with the wafer, thereby reducing pressure and minimizing the impact of clamping on the wafer, ensuring wafer performance and quality. Furthermore, the adaptation of the clamping groove 211 to the outer contour of the wafer allows for better upper and lower limit positioning of the wafer, making it more stable during clamping and less prone to displacement or wobbling. This also facilitates precise wafer positioning during subsequent processing and handling operations.

[0057] As a preferred embodiment 5 under embodiment 3 (not shown in the figure), the wall of the clamping groove is provided with an elastic buffer (not shown in the figure) that fits the outer contour of the wafer.

[0058] Elastic buffers can absorb impact forces during clamping through their own deformation, avoiding localized stress concentration caused by rigid contact and significantly reducing the risk of wafer cracks and edge chipping due to excessive clamping force. Simultaneously, the elastic buffer can adapt to the slight undulations of the wafer's outer contour, achieving a tighter fit between the slot wall and the wafer surface, thus ensuring stable wafer clamping. During wafer transfer, the elastic buffer acts as a damper, reducing the transmission of external vibrations to the wafer, minimizing wafer displacement or alignment deviations caused by vibration, and improving process stability.

[0059] For any parts not mentioned in this application, existing technologies may be used or referenced.

[0060] The various embodiments in this specification are described in a progressive manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.

[0061] The above description is merely an embodiment of this application and is not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.

Claims

1. A wafer side clamp, characterized in that, The device includes two driving members, two clamping members, and a guide member for moving the two clamping members. The two driving members are connected in a cross shape with a rotation point as the axis and can rotate relative to each other around the rotation point. They drive the clamping members to move through opening and closing actions. The clamping members are provided with clamping ends for clamping wafers. The driving members can drive the clamping ends of the two clamping members to come closer to each other to clamp the wafer, or after clamping the wafer, drive the clamping ends of the two clamping members to move away from each other to release the wafer.

2. The wafer side clamp according to claim 1, characterized in that, The guide includes two guide cylinders arranged opposite each other, and the two guide cylinders are arranged one-to-one with the two clamping members. Each guide cylinder is provided with a guide channel, and the corresponding clamping member is arranged in the guide channel and can move along the axial direction of the guide channel. The clamping end can extend out of the corresponding guide channel to clamp the wafer.

3. A wafer side clamp according to claim 2, characterized in that, The guide also includes a transition section connecting the two guide cylinders, the transition section having an installation port, and the two drive components being disposed in the transition section and extending at least partially from the installation port.

4. A wafer side clamp according to claim 3, characterized in that, The drive component includes a connecting section rotatably connected to the clamping component and a gripping section for an operator to hold. The connecting section is disposed in the transition section, and the gripping section extends out of the mounting port.

5. A wafer side clamp according to claim 4, characterized in that, The two clamping members are a first clamping member and a second clamping member. The first clamping member is provided with a positioning member that is rotatably connected to the connecting section. There are two positioning members, which are arranged at intervals to form a receiving groove. The second clamping member is provided with a mounting member that can enter and exit the receiving groove. The mounting member is rotatably connected to the connecting section.

6. A wafer side clamp according to claim 5, characterized in that, The first clamping member and the second clamping member are arranged opposite to each other in a preset direction. The two driving members are the first driving member and the second driving member. The gripping section of the first driving member and the gripping section of the second driving member are arranged opposite to each other in the preset direction. The gripping section of the first driving member and the first clamping member are on the same side of the preset direction. The connecting section of the first driving member is connected to the positioning member. The gripping section of the second driving member and the second clamping member are on the same side of the preset direction, and the connecting section of the second driving member is connected to the mounting member.

7. A wafer side clamp according to claim 2, characterized in that, One of the guide channel and the clamping member is provided with a guide protrusion, and the other of the two is provided with a guide groove that cooperates with the guide protrusion.

8. A wafer side clamp according to claim 2, characterized in that, The guide cylinder and the clamping member are arranged in an arc shape, and the arc bending direction of both is the same.

9. A wafer side clamp according to claim 1, characterized in that, The clamping end is provided with a clamping groove, which is adapted to the outer contour of the wafer.

10. A wafer side clamp according to claim 9, characterized in that, The clamping groove wall is provided with an elastic buffer that fits the outer contour of the wafer.

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