Heat dissipation substrate

Abstract

A heat dissipation substrate includes a substrate body having an adhesive surface for connecting with a device unit, and a support unit provided on the adhesive surface, the support unit being configured to protrude from the adhesive surface toward a side close to the device unit in a first direction, and the support unit being integrally formed with the substrate body.

Description

Technical Field

[0001] This application relates to the field of semiconductor assembly technology, and more specifically, to a heat dissipation substrate. Background Technology

[0002] To improve the heat dissipation performance of semiconductor devices, reflow soldering is typically used to mechanically connect the heat sink to the device unit, thereby enabling efficient heat exchange. In this process, the uniformity of the solder layer formed by reflow soldering is a key factor affecting the thermal management efficiency and reliability of the product. Utility Model Content

[0003] The purpose of this invention is to provide a heat dissipation substrate, which improves the uniformity of the solder layer by modifying the structure of the heat dissipation substrate.

[0004] To achieve the above objectives, the present invention provides a heat dissipation substrate, which includes a substrate body having an adhesive surface and a support unit disposed on the adhesive surface. The adhesive surface is used to connect with a device unit. The support unit is configured to protrude from the adhesive surface along a first direction toward the side close to the device unit. The support unit and the substrate body are integrally formed.

[0005] The technical solution in this application improves the uniformity of the weld layer by setting a support unit that protrudes from the adhesive surface.

[0006] Optionally, the support unit includes a support member located between the adhesive surface and the device unit.

[0007] Optionally, the support unit includes at least two support beams protruding from the adhesive surface, wherein the extension directions of the at least two support beams are parallel or intersecting.

[0008] Optionally, the substrate body and the support beam are a one-piece molded structure.

[0009] Optionally, the substrate body has a symmetrical axis and is provided with an extrusion beam that passes through the adhesive surface in its extension direction, and the portion of the extrusion beam located within the adhesive surface serves as a support beam.

[0010] Optionally, the substrate body is provided with multiple adhesive surfaces, and the arrangement direction of the adhesive surfaces is parallel or perpendicular to the extension direction of the support beam.

[0011] Optionally, the substrate body is provided with an anti-overflow portion, which is distributed around the adhesive surface.

[0012] Optionally, the anti-overflow portion protrudes from the adhesive surface, and the distance between the anti-overflow portion and the adhesive surface is smaller than the distance between the support unit and the adhesive surface; or, at least a portion of the anti-overflow portion serves as a support unit.

[0013] Optionally, the adhesive surface is further provided with an adhesive portion, wherein in a first direction, the distance between the adhesive portion and the adhesive surface is greater than the distance between the support beam and the adhesive surface.

[0014] Optionally, the adhesive part includes a wire mesh component disposed on the adhesive surface; the wire mesh component has a clearance groove, and the support beam is located within the clearance groove.

[0015] Optionally, an insulating portion is also provided on a partial surface of the substrate body;

[0016] The device unit has an electrical connector, and in a first direction, the electrical connector forms a projection area on the surface of the substrate body, and the insulating portion at least covers the projection area.

[0017] Optionally, the insulating portion is configured to stop the device unit in a direction parallel to the substrate body.

[0018] Optionally, the substrate body is further provided with a limiting portion, which is provided on the side of the device unit opposite to the insulation, and the limiting portion is configured to stop the device unit in a direction parallel to the substrate body.

[0019] Other features and advantages of this specification will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0020] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of this specification and, together with their description, serve to explain the principles of this specification.

[0021] Figure 1 This is a schematic diagram of the structure of the heat dissipation substrate in the first embodiment of this application;

[0022] Figure 2 This is a schematic diagram of the structure of the heat dissipation substrate in the second embodiment of this application;

[0023] Figure 3 This is a schematic diagram of the structure of the heat dissipation substrate in the third embodiment of this application;

[0024] Figure 4 This is a schematic diagram of the structure of the heat dissipation substrate in the fourth embodiment of this application;

[0025] Figure 5 This is a schematic diagram of the structure of the heat dissipation substrate in the fifth embodiment of this application;

[0026] Figure 6 This is a schematic diagram of the structure of the heat dissipation substrate in the sixth embodiment of this application;

[0027] Figure 7 for Figure 1 A schematic diagram of the structure after the heat dissipation substrate is connected to the device unit;

[0028] Figure 8 for Figure 1 Side view;

[0029] Figure 9 This is a schematic diagram of the structure of the heat dissipation substrate in the seventh embodiment of this application;

[0030] Figure 10 This is a schematic diagram of the structure of the heat dissipation substrate in the eighth embodiment of this application;

[0031] Figure label:

[0032] 1-Heat dissipation substrate; 11-Substrate body; 12-Adhesive surface; 120-Adhesive portion; 13-Extrusion beam; 14-Anti-overflow portion; 121-Wire mesh component; 121a-Allowing groove; 2-Support unit; 21-Support beam; 31-Insulation portion; 32-Extension portion; 4-Limiting portion; 41-First limiting segment; 42-Second limiting segment; 22-Supporting protrusion; 5-Device unit; 6-Electrical connector; 51-First wall portion; 52-Second wall portion; 53-Third wall portion; 54-Fourth wall portion; z-First direction; x-Third direction; y-Third direction; P-Center line of device unit; L1-First axis of symmetry; L2-Second axis of symmetry. Detailed Implementation

[0033] A heat sink for a semiconductor device includes a heat sink section and a heat sink substrate. The heat sink section can be a finned heat sink or a liquid-cooled heat sink. The heat sink substrate is used for mechanical connection with the device unit, thereby transferring heat from the device unit to the heat sink section. The device unit can be a power device or other electronic components. The device unit and the heat sink substrate are mechanically connected using reflow soldering.

[0034] like Figure 1 , Figure 7 and Figure 8 As shown, Figure 1 This is a schematic diagram of the structure of the heat dissipation substrate 1 in the first embodiment of this application. Figure 7 for Figure 1 A schematic diagram of the structure after the heat dissipation substrate 1 is connected to the device unit 5. Figure 8 for Figure 1 Side view.

[0035] The heat dissipation substrate 1 includes a substrate body 11 having an adhesive surface 12, and the adhesive surface 12 is provided with an adhesive portion 120 for connecting to the device unit 5. The adhesive portion 120 is a layered structure made of solder or adhesive. During reflow soldering, the solid adhesive portion 120 is heated into a fluid to bond the device unit 5 disposed on the adhesive portion 120 to the substrate body 11.

[0036] However, some device units 5 exhibit a center of gravity shift due to manufacturing tolerances or design asymmetry. During reflow soldering, the mass concentration area of ​​these device units 5 (i.e., the part closer to the center of gravity) acts on the fluid bonding portion 120, causing the connection distance between the mass concentration area and the bonding surface 12 to be shorter than that of the rest of the device unit 5. This leads to a static tilt of the device unit 5 relative to the bonding surface 12, and this tilt angle is positively correlated with the uniformity of the solder layer formed after reflow of the bonding portion 120.

[0037] In such Figure 1 , Figure 7 and Figure 8 In the example shown, to reduce the tilt angle of the device unit 5, the substrate body 11 is provided with a support unit 2 that corresponds to and is adapted to the adhesive surface 12. The support unit 2 protrudes from the adhesive surface 12 along the first direction z toward the side closer to the device unit 5, thereby forming a stop with the mass concentration area of ​​the device unit 5 in the first direction z. The first direction z can be perpendicular to the adhesive surface 12, or it can be set at an acute angle or an obtuse angle with the adhesive surface 12, which can be selected by those skilled in the art.

[0038] The support unit 2 and the substrate body 11 are integrally formed. "Integral formed structure" means that the substrate body 11 and the support beam 21 are an integral structure without splicing or secondary connection (such as welding, bonding, etc.). This can reduce or avoid local stress concentration at the connection between the support unit 2 and the substrate body 11, and also improve the rigidity of the support unit 2, thereby better supporting the mass concentration area of ​​the device unit 5.

[0039] In this way, the support unit 2 can limit the minimum connection distance between the device unit 5 and the adhesive surface 12, thereby reducing the tilt angle of the device unit 5 and optimizing the uniformity of the weld layer.

[0040] In actual production, before processing the support unit 2, the average thickness of the weld layer can be estimated, which is also the average distance between the weld layer and the bonding surface 12. The ratio of the distance between the support unit 2 and the bonding surface 12 to the distance between the weld layer and the bonding surface 12 is less than or equal to 3:4. For example, if the average distance between the weld layer and the bonding surface 12 is 0.2 mm, then the distance between the support unit 2 and the bonding surface 12 is 0.15 mm. Within this range, the support unit 2 can effectively support the device unit 5 while ensuring the reliability of the welding between the device unit 5 and the bonding surface 12.

[0041] In one specific embodiment, as... Figures 1 to 7 In the example shown, Figure 2 This is a schematic diagram of the structure of the heat dissipation substrate 1 in the second embodiment of this application; Figure 3This is a schematic diagram of the structure of the heat dissipation substrate 1 in the third embodiment of this application; Figure 4 This is a schematic diagram of the structure of the heat dissipation substrate 1 in the fourth embodiment of this application; Figure 5 This is a schematic diagram of the structure of the heat dissipation substrate 1 in the fifth embodiment of this application; Figure 6 This is a schematic diagram of the structure of the heat dissipation substrate 1 in the sixth embodiment of this application.

[0042] The support unit 2 includes a support member located between the adhesive surface 12 and the device unit 5, thereby providing support for the device unit 5.

[0043] Specifically, the support member may include at least two support beams 21, and the extension directions of the at least two support beams 21 are parallel or intersecting. Specifically, the support beams 21 are elongated structures, and the extension directions of the support beams 21 are all parallel to the bonding surface 12. Moreover, the extension directions of the at least two support beams 21 may be parallel or intersecting, thereby forming a "support surface" by at least two support beams 21 whose extension lines do not overlap.

[0044] It should be noted that the "support surface" is defined by at least three non-collinear support points. A single support beam 21 passes through at least one support point and can stop at least one support point during the tilting of the device unit 5. Thus, the mass-concentrated area of ​​the device unit 5 can be effectively supported during reflow soldering. The support surface and the adhesive surface 12 can be arranged parallel to each other or at an angle, which can be selected by those skilled in the art as needed.

[0045] In some more specific examples, the support beam 21 and the base plate body 11 are formed into a single molded structure by machining. Alternatively, a single molded structure can be formed by extrusion, casting, or other one-time molding methods.

[0046] Machining removes excess material from the blank through processes such as cutting, turning, and milling, gradually forming the substrate body 11 and the support unit 2, thereby creating a seamless interface between the substrate body 11 and the support unit 2 without any welds or other separate connections.

[0047] When machining is used, the machining time of the support beam 21 is short, which can improve the processing efficiency of the heat dissipation substrate 1; at the same time, it can also meet the mass production needs of the heat dissipation substrate 1.

[0048] Of course, in such Figure 6 In the example shown, the support may also include support bumps 22 and support beams 21. Similarly, the support bumps 22 may also be integrally formed with the substrate body 11 by machining. Those skilled in the art can choose for themselves.

[0049] In other examples, the substrate body 11 and the support beam 21 are formed in one piece. This one-piece forming structure can meet the needs of large-scale, mass production of the heat dissipation substrate 1, further reducing processing time and improving production efficiency. Here, "one-piece forming structure" refers to the final structure being formed directly through processes such as extrusion or die casting.

[0050] For example, the substrate body 11 and the support beam 21 can be formed into a one-piece structure by extrusion, which can shorten the processing cycle and meet the needs of mass production of the heat dissipation substrate 1.

[0051] Specifically, the substrate body 11 has a symmetrical structure with a symmetrical axis. The substrate body 11 is provided with an extrusion beam 13. The extrusion beam 13 passes through the adhesive surface 12 in its extension direction. The portion of the extrusion beam 13 located in the adhesive surface 12 serves as a support beam 21.

[0052] exist Figure 1 and Figure 2 In the example shown, the substrate body 11 is rectangular and has a first axis of symmetry L1 extending along a second direction x and a second axis of symmetry L2 extending along a third direction y. The substrate body 11 is provided with two parallel extrusion beams 13, which extend in the same direction as one axis of symmetry. Figure 1 In this configuration, the compression beams 13 are all arranged parallel to the first axis of symmetry L1. Figure 2 In the middle, the extrusion beam 13 is set parallel to the second axis of symmetry L2.

[0053] The two ends of the extrusion beam 13 extend to the corresponding edges of the substrate body 11. The extrusion beam 13 passes through the adhesive surface 12 in its extending direction, and the portion of the extrusion beam 13 located within the adhesive surface 12 serves as the aforementioned support beam 21.

[0054] In this embodiment, such as Figure 1 As shown, the substrate body 11 is provided with multiple adhesive surfaces 12, and the arrangement direction of the adhesive surfaces 12 is parallel to the extension direction of the extrusion beams 13, thereby maintaining the consistency of the spacing of the support beams 21 located within each adhesive surface 12. Of course, it can also be as follows... Figure 2 As shown, the arrangement direction of the adhesive surfaces 12 is perpendicular to the extension direction of the extrusion beams 13. This allows the spacing between the extrusion beams 13 to be adjusted according to the layout requirements of each adhesive surface 12, thereby adjusting the spacing between the support beams 21 corresponding to each adhesive surface 12.

[0055] Of course, in such Figures 3 to 5 In the example shown, in addition to extrusion molding, the support beam 21 and the substrate body 11 can also be processed by die casting, forging and other processes to form a one-piece structure.

[0056] When using processes such as die casting, the beam structure can be machined only within the area of ​​the bonding surface 12. Specifically, for example... Figure 3 As shown, the support beams 21 can be arranged in parallel; or they can be arranged as follows: Figure 4 As shown, the support beams 21 are arranged intersecting each other in their extending directions. The arrangement of the support beams 21 intersecting in their extending directions can be such that one end of the support beams 21 intersects while the other end is spaced apart; or it can be such that the support beams 21 intersect in the middle. Furthermore, it can also be arranged as follows... Figure 5 As shown, when three or more support beams 21 are provided, the support beams 21 can also form a closed structure.

[0057] The specific layout can be selected by those skilled in the art based on actual needs, with the aim of forming the aforementioned "support surface".

[0058] For other embodiments of this application, please refer to [link / reference]. Figures 1 to 7 The substrate body 11 is provided with an anti-overflow portion 14. The anti-overflow portion 14 is distributed around the bonding surface 12. By providing the anti-overflow portion 14, the bonding portion 120 can be prevented from overflowing to the outside of the bonding surface 12 during reflow soldering. The anti-overflow portion 14 can be a groove or an annular dam, etc. The anti-overflow portion 14 can be processed by coating or etching, etc., which can be selected by those skilled in the art as needed.

[0059] When the spill prevention portion 14 is a dam structure, it protrudes from the adhesive surface 12. The support unit 2 can be located inside the spill prevention portion 14, and in the direction perpendicular to the adhesive surface 12, the distance between the support unit 2 and the adhesive surface 12 is greater than the distance between the spill prevention portion 14 and the adhesive surface 12. This ensures that the support unit 2 forms a stop in the mass concentration area of ​​the device unit 5. Alternatively, at least a portion of the spill prevention portion 14 can serve as the support unit 2. This allows the support unit 2 to integrate spill prevention functionality, which can be selected by those skilled in the art.

[0060] The structure of the adhesive portion 120 and the support unit 2 will be described in detail below. In the aforementioned embodiments, in the first direction z, the distance between the adhesive portion 120 and the adhesive surface 12 is greater than the distance between the support beam 21 and the adhesive surface. The surface of the support beam 21 away from the substrate body 11 is located within the adhesive portion 120, and the adhesive portion 120 can cover the support beam 21. This ensures the reliability of the connection between the adhesive portion 120 and the device unit 5, and avoids the occurrence of incomplete connections.

[0061] In a specific example, such as Figure 8 As shown. The adhesive part 120 includes solder paste. At this time, the adhesive part 120 includes a screen mesh 121, which is disposed on the adhesive surface 12. The screen mesh 121 has a relief groove 121a, and the support beam 21 is located in the relief groove 121a.

[0062] The screen mesh 121 can be a steel mesh or other mesh structure compatible with solder paste. When printing solder paste on the adhesive surface 12, in order to avoid interference between the support beam 21 and the screen mesh 121, the screen mesh 121 is provided with a relief groove 121a. The relief groove 121a extends along the first direction z, and its size in this direction is compatible with the size of the support beam 21 in this direction, thereby allowing the support beam 21 to be avoided and preventing interference between the screen mesh 121 and the support beam 21.

[0063] In some other embodiments of this application, the insulating portion 31 of the heat dissipation substrate 1 is also improved. Specifically, the insulating portion 31 is provided on a partial surface of the substrate body 11.

[0064] Specifically, please combine Figure 9 , Figure 10 To understand; Figure 9 This is a schematic diagram of the structure of the heat dissipation substrate 1 in the seventh embodiment of this application; Figure 10 This is a schematic diagram of the structure of the heat dissipation substrate 1 in the eighth embodiment of this application.

[0065] An insulating portion 31 is also provided on a portion of the surface of the substrate body 11 where the adhesive surface 12 is provided. The device unit 5 has a plurality of electrical connectors 6 that enable electrical connection to external devices. In the first direction z, the electrical connectors 6 form a projection area on the surface of the substrate body 11, and the insulating portion 31 at least covers the projection area.

[0066] In this embodiment, the insulating portion 31 is disposed on a partial surface of the substrate body 11, which can reduce the area of ​​the insulating portion 31 and achieve weight reduction and cost reduction of the heat dissipation substrate 1.

[0067] The insulating part 31 can be formed by spraying or coating an insulating material. The insulating material can be selected from materials such as ink, thereby achieving insulation adaptation between the heat dissipation substrate 1 and the device unit 5.

[0068] Of course, the insulating part 31 can also be processed by printing. For example, a steel mesh is provided at a predetermined position on a local surface of the substrate body 11, and an insulating material is printed inside the steel mesh. Then, it is baked and cured to form an insulating part 31 that is integral with the substrate body 11.

[0069] In an alternative embodiment, the insulating portion 31 is configured to stop the device unit 5 in a direction parallel to the substrate body 11.

[0070] In this embodiment, the insulating portion 31 has a certain thickness in the first direction z, so that it can stop against the side of the substrate body 11. In this way, during the soldering process, the insulating portion 31 can play a certain limiting function for the device unit 5, reducing or avoiding the offset of the device unit 5 relative to the bonding surface 12.

[0071] Specifically, such as Figure 9 and Figure 10 As shown, the device unit 5 has a first wall portion 51 and a third wall portion 53 arranged opposite each other along a second direction x, and a second wall portion 52 and a fourth wall portion 54 arranged opposite each other along a third direction y. In the example shown, one end of the electrical connector 6 of the device unit 5 is disposed on the fourth wall portion 54, and the other end extends along the third direction y to the outside of the substrate body 11 for connection with external devices. The insulating portion 31 is disposed at a corresponding position on the substrate body 11 and can abut against the fourth wall portion 54 in the third direction y, thereby forming a stop for the device unit 5 in the third direction y.

[0072] In one alternative embodiment, the insulating portion 31 is provided with at least one extension 32, which protrudes from the insulating portion 31 along a third direction y and extends a certain distance toward the second wall portion 52 to stop with the first wall portion 51 and / or the third wall portion 53 of the device unit 5 along the second direction x.

[0073] In such Figure 10 In the example shown, corresponding to a single device unit 5, the insulating portion 31 is provided with two extension portions 32. The two extension portions 32 are arranged opposite to each other along the second direction x. The device unit 5 is located between the two extension portions 32. The first wall portion 51 and the third wall portion of the device unit 5 can abut against the extension portion 32 on the corresponding side.

[0074] In such Figure 9 and Figure 10 In the example shown, the substrate body 11 is provided with a plurality of device units 5 spaced apart along the second direction x, and the electrical connectors 6 of each device unit 5 are all provided on the fourth wall portion 54. The insulating portion 31 extends along the second direction x and covers the projection area of ​​each device unit 5. An extension portion 32 is provided between two adjacent device units 5. Thus, in the second direction x, one side of the extension portion 32 can stop one of the two adjacent device units 5 along the second direction x, and the other side can stop the other of the two adjacent device units 5. Therefore, one extension portion 32 can limit the positioning of two device units 5, thereby improving the space utilization of the heat dissipation substrate 1.

[0075] In this embodiment, the extension 32 and the insulation 31 can respectively limit and stop the device unit 5 on one side of the third direction y and both sides of the second direction x, which can further ensure the accuracy of the welding of the device unit 5.

[0076] In another implementation, please continue to see Figure 9 and Figure 10In the third direction y, the substrate body 11 is also provided with a limiting portion 4, which is provided on the side of the device unit 5 away from the insulating portion 31. The limiting portion 4 has a first limiting segment 41, which is opposite to the insulating portion 31 in the third direction y, and can abut against the second wall portion 52 of the corresponding device unit 5 in the third direction y.

[0077] In this way, the limiting part 4 cooperates with the insulating part 31 to stop the device unit 5 on both sides of the third direction y, thereby ensuring the installation accuracy of the device unit 5 in the third direction.

[0078] In such Figure 9 In this configuration, the limiting part 4 can be disposed on the center line P of the device unit 5, or it can be arranged at intervals from the extension line of the center line P of the device unit 5. The center line P of the device unit 5 extends along the third direction y and passes through the midpoint of the device unit 5 in the second direction x.

[0079] It could also be, such as Figure 10 As shown, the limiting portion 4 also includes a second limiting segment 42, which is located outside the first wall portion 51 and extends in the third direction y toward the insulating portion 31. The second limiting segment 42 can abut against the first wall portion 51 and / or the third wall portion 53 of the device unit 5 in the second direction x. Thus, the device unit 5 can be stopped in the second direction x.

[0080] At this time, the first limiting segment 41 is spaced apart from the center line P of the second wall portion 52 and is positioned closer to the corner of the device unit 5. The second limiting segment 42 is located at one end of the first limiting segment 41, thereby the limiting part 4 component can form a stop on the device unit 5 in the second direction x and the third direction y.

[0081] When multiple device units 5 are provided, Figure 10 In this configuration, two adjacent device units 5 can be adapted to the same limiting part 4. At this time, the portion of the first limiting segment 41 of the limiting part 4 extending along the second direction x can abut against one of the two adjacent device units 5 along the third direction y, and the remaining portion can abut against the other of the two adjacent device units 5 along the third direction y.

[0082] At this time, the second limiting segment 42 is located in the middle of the first limiting segment 41 and is located between two adjacent device units 5 along the second direction x. It can stop the two device units 5 along the second direction x, thereby further improving the space utilization efficiency of the heat dissipation substrate 1 while ensuring the stopping effect.

[0083] Compared with related technologies, the advantages of this application are:

[0084] First, in the technical solution of this application, by setting the support unit 2, the minimum size of the weld layer formed after the adhesive part 120 is reflow soldered in the direction perpendicular to the substrate body 11 can be limited, thereby improving the uniformity of the weld layer.

[0085] Secondly, the integral molding of the support unit 2 with the substrate body 11 improves the structural strength and support stability of the support unit 2.

[0086] Third, the support unit 2 adopts the structure of support beam 21, which improves the processing efficiency of heat dissipation substrate 1 and facilitates the mass production of the substrate.

[0087] Fourth, the substrate body 11 is partially provided with an insulating part 31, which can reduce the weight and cost of the substrate body 11.

[0088] Fifth, the insulating part 31 can abut against the side of the device unit 5, thereby limiting the device unit 5, improving the functional integration of the insulating part 31, and also benefiting the installation accuracy of the device unit 5.

[0089] Sixth, the insulating part 31 is provided with an extension part 32, which is adapted to the insulating part 31 to achieve more directions of stopping the device unit 5 and further improve the installation accuracy of the device unit 5.

[0090] Seventh, the substrate body 11 is also provided with a limiting part 4, which can be adapted to the insulating part 31 to further ensure the installation accuracy of the device unit 5.

[0091] This article uses specific examples to illustrate the principles and implementation methods of this utility model. The above description of the implementation methods is only for the purpose of helping to understand the core idea of ​​this utility model. It should be noted that relational terms such as "first" and "second" are only used to distinguish one component from another that has the same name, and do not necessarily require or imply any such actual relationship or order between these components.

[0092] The foregoing embodiments are merely illustrative. Those skilled in the art can make various improvements and modifications to this invention without departing from its principles, and these improvements and modifications also fall within the scope of the claims. Furthermore, those skilled in the art can combine the embodiments in part or in whole, and all technical solutions derived from such combinations fall within the scope of this patent.

Claims

1. A heat dissipation substrate, characterized in that, The substrate body (11) includes an adhesive surface (12) and a support unit (2) disposed on the adhesive surface (12), the adhesive surface (12) being used to connect with the device unit (5); the support unit (2) is configured to protrude from the adhesive surface (12) along a first direction toward the side close to the device unit (5), and the support unit (2) and the substrate body (11) are integrally formed.

2. The heat dissipation substrate according to claim 1, characterized in that, The support unit (2) includes a support member located between the adhesive surface (12) and the device unit (5).

3. The heat dissipation substrate according to claim 2, characterized in that... The support unit (2) includes at least two support beams (21), and the extension directions of the at least two support beams (21) are parallel or intersecting.

4. The heat dissipation substrate according to claim 3, characterized in that, The substrate body (11) and the support beam (21) are a one-piece molded structure.

5. The heat dissipation substrate according to claim 3, characterized in that, The substrate body (11) is provided with an extrusion beam (13), which passes through the adhesive surface (12) in its extending direction, and the portion of the extrusion beam (13) located within the adhesive surface (12) serves as the support beam (21).

6. The heat dissipation substrate according to claim 5, characterized in that, The substrate body (11) is provided with a plurality of adhesive surfaces (12), and the arrangement direction of the adhesive surfaces (12) is parallel or perpendicular to the extension direction of the extrusion beam (13).

7. The heat dissipation substrate according to claim 3, characterized in that, The adhesive surface (12) is further provided with an adhesive portion (120), and in a first direction, the distance between the adhesive portion (120) and the adhesive surface (12) is greater than the distance between the support beam (21) and the adhesive surface (12).

8. The heat dissipation substrate according to claim 7, characterized in that, The adhesive part (120) includes a wire mesh component (121); the wire mesh component (121) has a relief groove (121a), and the support beam (21) is located in the relief groove (121a).

9. The heat dissipation substrate according to any one of claims 1-8, characterized in that, The substrate body (11) is provided with an anti-overflow portion (14), which is distributed around the adhesive surface (12).

10. The heat dissipation substrate according to claim 9, characterized in that, The spill prevention part (14) protrudes from the adhesive surface (12), and the distance between the spill prevention part (14) and the adhesive surface (12) is smaller than the distance between the support unit (2) and the adhesive surface (12); or, at least a portion of the spill prevention part (14) serves as the support unit (2).

11. The heat dissipation substrate according to any one of claims 1-8, characterized in that, The substrate body (11) is further provided with an insulating portion (31); the device unit (5) has an electrical connector (6), which forms a projection area on the substrate body (11) in a first direction, and the insulating portion (31) at least covers the projection area.

12. The heat dissipation substrate according to claim 11, characterized in that, The insulating portion (31) is configured to stop the device unit (5) in a direction parallel to the substrate body (11).

13. The heat dissipation substrate according to claim 12, characterized in that, The substrate body (11) is further provided with a limiting part (4), which is provided on the side of the device unit (5) opposite to the insulating part (31) and is configured to stop the device unit (5) in a direction parallel to the substrate body (11).

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