A heat dissipation structure for a computing chip

Abstract

The utility model discloses a kind of heat dissipation structures for computing power chip, comprising: radiator assembly: including 3D_VC, heat dissipation fin, the 3D_VC is composed of VC uniform temperature plate and multiple heat pipes fixed on VC uniform temperature plate, heat pipe is hollow and internal chamber is communicated with VC uniform temperature plate, multiple the heat pipe is respectively embedded heat dissipation fin and welded;Radiator box body: radiator assembly is installed in the radiator box body, the bottom surface of the radiator box body is sealed and is provided with multiple heat conduction blocks, the inner surface of the heat conduction block is close to VC uniform temperature plate;The side surface of the radiator box body is open, opening is externally provided with air inlet fan, air outlet fan, the air inlet fan is located in the heat dissipation fin side, the air outlet fan is located in the heat dissipation fin side of the other side. Chip is separated from the inside of this heat dissipation structure, and the radiator in contact with chip uses air cooling, without air medium flowing through chip, not only can effectively radiate chip, but also can prevent dust accumulation in computing power equipment inside.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, and more specifically to a heat dissipation structure for computing chips. Background Technology

[0002] Current status of heat dissipation technology: (1) Traditional open-type air cooling has a heat density limit of 500W. With the continuous increase in power consumption of computing chips, the traditional fan air cooling technology has reached a bottleneck and can no longer adapt to the higher power consumption conditions. On the other hand, the air will bring in dust, and the accumulation of dust is not conducive to heat dissipation and affects the long service life of the device. Utility Model Content

[0003] In order to overcome the above-mentioned defects of the prior art, the present invention provides a heat dissipation structure for computing chips.

[0004] The technical solution of this utility model is as follows: A heat dissipation structure for computing chips, comprising: Heat sink assembly: includes 3D_VC and heat sink fins. The 3D_VC consists of a VC vapor chamber and multiple heat pipes fixed to the VC vapor chamber. The heat pipes are hollow and their internal chambers are connected to the VC vapor chamber. The multiple heat pipes are respectively embedded in the heat sink fins and welded together. Radiator housing: The radiator assembly is installed inside the radiator housing. Multiple heat-conducting blocks are sealed on the bottom surface of the radiator housing, and the inner surface of the heat-conducting blocks is in close contact with the VC heat spreader. The radiator housing has an opening on its side, and an intake fan and an exhaust fan are installed outside the opening. The intake fan is located next to the heat dissipation fins on one side, and the exhaust fan is located next to the heat dissipation fins on the other side.

[0005] A baffle plate is installed between the air intake fan and the air outlet fan.

[0006] The heat pipe and the VC vapor chamber contain a certain amount of phase change fluid.

[0007] The radiator housing is made of thermally conductive material, and an auxiliary heat pipe is installed between the VC vapor chamber plate and the bottom surface of the radiator housing to enhance heat conduction.

[0008] The radiator housing is equipped with a baffle plate and several air guide mounting columns. The air guide mounting columns are set in the direction of the wind, which can facilitate the smooth flow of air and also serve as mounting columns for the radiator housing cover.

[0009] The technical effects and advantages of this utility model are as follows: The chip is separated from the internal heat dissipation structure. The heat sink in contact with the chip uses air cooling, eliminating the need for air to flow through the chip. This not only effectively dissipates heat from the chip but also prevents dust from accumulating inside the computing device. On the chip heat dissipation side, a combination of 3D_VC and fins is used. 3DVC integrates the base plate and heat pipe, optimizes the circulation efficiency of the phase change fluid, and accelerates the heat transfer to the fins. Setting up deflectors and several air guide columns can improve convective heat dissipation efficiency. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram showing the product after the cap has been opened. Figure 3 This is a top view of the radiator housing; Figure 4 for Figure 3 AA section view; Figure 5 This is a schematic diagram of the heat sink assembly; Figure 6 This is a 3D view of the heat sink assembly. Detailed Implementation

[0011] The technical solutions in the embodiments of this utility model will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model. Example 1

[0012] like Figures 1-6 The heat dissipation structure shown is for a computing chip and includes: Heat sink assembly: includes 3D_VC and heat sink fins 11. The 3D_VC consists of a VC vapor chamber 12 and multiple heat pipes 13 fixed to the VC vapor chamber. The heat pipes 13 are hollow and their internal chambers are connected to the VC vapor chamber. The multiple heat pipes 13 are respectively embedded in the heat sink fins and welded. Radiator housing 2: The radiator assembly is installed inside the radiator housing. Multiple heat-conducting blocks 3 are sealed on the bottom surface of the radiator housing. The inner surface of the heat-conducting blocks is in close contact with the VC heat spreader. The heat sink housing has an opening on its side, and an intake fan 41 and an exhaust fan 42 are provided outside the opening. The intake fan 41 and the exhaust fan 42 can be installed on the side of the heat sink housing or on other external brackets. The intake fan is located next to the heat sink fins on the left side, and the exhaust fan is located next to the heat sink fins on the right side.

[0013] Furthermore, a baffle 5 is provided between the intake fan and the exhaust fan, and the baffle 5 can be installed on the radiator housing.

[0014] Furthermore, the heat pipe and the VC vapor chamber contain a certain amount of phase change liquid.

[0015] Furthermore, the radiator housing is made of a thermally conductive material, and an auxiliary heat pipe 6 is installed between the VC vapor chamber plate and the bottom surface of the radiator housing to facilitate enhanced heat conduction.

[0016] Furthermore, the radiator housing is equipped with a baffle plate 71 and several air guide mounting columns 72. The air guide mounting columns are set in the direction of the wind, which can facilitate the smooth flow of air and also serve as mounting columns for the radiator housing cover 21. Example 2

[0017] The heat sink housing 2 is embedded into the outer shell of the computing chip device, and the heat-conducting block is in close contact with the chip that needs to be cooled.

[0018] The fan is turned on, and the heatsink begins to work. The heat from the chip is transferred to the air inside the heat sink housing 2 via the copper heatsink block, 3D_VC, and fins, and then blown out by the fan.

[0019] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A heat dissipation structure for a computing chip, characterized in that, include: Heat sink assembly: includes 3D_VC and heat sink fins. The 3D_VC consists of a VC vapor chamber and multiple heat pipes fixed to the VC vapor chamber. The heat pipes are hollow and their internal chambers are connected to the VC vapor chamber. The multiple heat pipes are respectively embedded in the heat sink fins and welded together. Radiator housing: The radiator assembly is installed inside the radiator housing. Multiple heat-conducting blocks are sealed on the bottom surface of the radiator housing, and the inner surface of the heat-conducting blocks is in close contact with the VC heat spreader. The radiator housing has an opening on the side, and an intake fan and an exhaust fan are installed outside the opening. The intake fan is located next to the heat dissipation fins on one side, and the exhaust fan is located next to the heat dissipation fins on the other side.

2. The heat dissipation structure for a computing chip according to claim 1, characterized in that: A baffle plate is installed between the air intake fan and the air outlet fan.

3. The heat dissipation structure for a computing chip according to claim 1, characterized in that: The heat pipe and the VC vapor chamber contain a certain amount of phase change fluid.

4. The heat dissipation structure for a computing chip according to claim 1, characterized in that: The radiator housing is made of thermally conductive material, and an auxiliary heat pipe is installed between the VC vapor chamber plate and the bottom surface of the radiator housing to enhance heat conduction.

5. A heat dissipation structure for a computing chip according to claim 1, characterized in that: The radiator housing is equipped with a baffle plate and several air guide mounting columns. The air guide mounting columns are set in the direction of the wind, which can facilitate the smooth flow of air and also serve as mounting columns for the radiator housing cover.

Images