Integrated circuit chip heat dissipation fin fixing frame

Abstract

The utility model relates to heat dissipation fin fixing technical field especially relates to a kind of integrated circuit chip heat dissipation fin fixing frame, including fixed frame, connecting frame, heat conducting plate, fin mounting strip, fin gland and connecting locking mechanism;The center of fixed frame is provided with chip accommodating port, and the upper end of fixed frame is provided with connecting frame, and the center of connecting frame is provided with heat dissipation port, and the inside of heat dissipation port is provided with heat conducting plate, and the top of heat conducting plate is provided with fin gland, and the similar surface of fin gland and heat conducting plate is evenly provided with multiple fin mounting strips, and the both sides of multiple fin mounting strips are provided with connecting locking mechanism;The utility model realizes the detachable heat dissipation fin design of the heat conducting plate, fin mounting strip and fin gland composition, so that cleaning dust operation is extremely simple, can be quickly completed fin disassembly, cleaning and installation, greatly shorten equipment maintenance time, improve the use efficiency of equipment.

Description

Technical Field

[0001] This utility model relates to the field of heat sink fixing technology, and in particular to a heat sink fixing bracket for integrated circuit chips. Background Technology

[0002] With the rapid development of modern electronic technology, the performance of integrated circuit chips is constantly improving, and the heat generated during operation is also increasing. Heat dissipation has become a key factor affecting the stability and lifespan of chips. As an important heat dissipation component, heat sinks, combined with mounting brackets, are widely used in the heat dissipation systems of integrated circuit chips.

[0003] Traditional heat sink fin mounting brackets often feature an integrated design between the heat sink fins and the bracket. Due to the narrow gaps between the fins, dust and impurities easily accumulate after a period of use, forming a stubborn layer of dirt. When cleaning, it is difficult to reach deep into the gaps between the fins, making it impossible to effectively remove the dust.

[0004] Therefore, in response to the problem that traditional heat sink fin mounting brackets often use an integrated design for the heat sink fins and the bracket, making it difficult to effectively remove dust, an integrated circuit chip heat sink fin mounting bracket can be designed. By designing the heat sink fins and the bracket as a detachable connection structure, and using components such as fin mounting strips and connecting locking mechanisms, the heat sink fins can be quickly installed and removed, thereby easily solving the above problems. Utility Model Content

[0005] To overcome the shortcomings of traditional heat sink fin mounting brackets, which often use an integrated design between the heat sink fins and the bracket, resulting in narrow gaps between the fins and difficulty in effectively removing dust, this utility model provides a heat sink fin mounting bracket for integrated circuit chips.

[0006] The technical solution is as follows: An integrated circuit chip heat sink fin fixing bracket includes a fixing frame, a connecting frame, a heat-conducting plate, fin mounting strips, a fin cover, and a connecting locking mechanism; the fixing frame has a chip receiving port at its center to accommodate the integrated circuit chip, the upper end of the fixing frame has a connecting frame, the center of the connecting frame has a heat dissipation port corresponding to the chip receiving port, the heat dissipation port has a heat-conducting plate inside to conform to the heat conduction of the integrated circuit chip, the upper part of the heat-conducting plate has a fin cover to fix the heat sink fins in conjunction with the heat-conducting plate, the fin cover and the heat-conducting plate have multiple sets of fin mounting strips evenly arranged on their adjacent surfaces for positioning and fixing the heat sink fins, and both sides of the multiple sets of fin mounting strips have a connecting locking mechanism for connecting the heat-conducting plate and the fin cover.

[0007] Furthermore, mounting holes are provided at the corners of the mounting frame, and lifting and locking grooves corresponding to the heat conduction plate are provided on the four sides of the heat dissipation vent. Adjustment sleeves are provided at the corners of the connecting frame, and adjustment screw holes communicating with the lifting and locking grooves are provided in the center of the adjustment sleeves.

[0008] Furthermore, an adjusting screw is provided inside the adjusting screw hole. The lower end of the adjusting screw passes through the adjusting screw hole and extends into the lifting locking groove. A push plate is provided at the lower end of the adjusting screw, and a screw cap is provided at the upper end of the adjusting screw.

[0009] Furthermore, four sets of connecting strips are arranged around the outer end of the connecting frame, and two sets of connecting buckles are symmetrically arranged at the lower end of each of the four sets of connecting strips. The surface of the fixing frame is provided with connecting buckle holes corresponding to the connecting buckles.

[0010] Furthermore, the edge of the heat-conducting plate extends into the interior of the lifting locking groove, and fin slots are provided at the center of the fin mounting strips on the fin cover and the heat-conducting plate.

[0011] Furthermore, the connecting locking mechanism includes two sets of strip-shaped connecting seats, which are symmetrically arranged along both sides of the surface of the heat-conducting plate. Support rods are provided above both ends of the two sets of strip-shaped connecting seats, and locking screws are provided at the upper ends of the four sets of support rods.

[0012] Furthermore, each corner of the fin cover has a corresponding locking screw connection hole, the upper end of the locking screw extends through the connection hole to the top of the fin cover, and the upper end of each of the four sets of locking screws is fitted with a locking nut.

[0013] The beneficial effects are as follows: Compared to traditional heat sink fin mounting brackets, which often feature an integrated design with narrow gaps between fins, making dust removal difficult, this application significantly improves heat conduction and dissipation efficiency by using an adjustable-height heat-conducting plate that fits tightly against the chip and incorporating large-area heat sink fins. This effectively reduces chip temperature, ensuring chip stability and lifespan during high-performance operation. The detachable heat sink fin design, consisting of the heat-conducting plate, fin mounting strips, and fin caps, simplifies dust removal, allowing for quick disassembly, cleaning, and installation of the fins, greatly reducing equipment maintenance time and improving equipment efficiency. The engineering plastic connecting and fixing frames eliminate the risk of short circuits, enhancing equipment safety. The adjustable height of the heat-conducting plate allows it to accommodate integrated circuit chips of varying thicknesses, expanding the bracket's applicability and meeting diverse production needs. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural diagram of the integrated circuit chip heat sink fin mounting bracket of this utility model; Figure 2 This is a three-dimensional structural diagram of the fixed frame of this utility model; Figure 3 This is a three-dimensional structural diagram of the connecting frame of this utility model; Figure 4 This is a three-dimensional structural diagram of the heat-conducting plate and fin cover combination of this utility model.

[0015] Explanation of reference numerals in the attached drawings: 1. Fixing frame; 101. Chip receiving port; 102. Connecting slot; 103. Mounting hole; 2. Connecting frame; 201. Heat dissipation port; 202. Lifting locking groove; 203. Connecting strip; 204. Connecting buckle; 205. Adjusting sleeve; 206. Adjusting screw hole; 207. Adjusting screw; 208. Push plate; 209. Tightening cap; 3. Heat-conducting plate; 4. Fin mounting strip; 401. Fin slot; 5. Fin cover; 501. Connecting hole; 6. Connecting locking mechanism; 601. Strip-shaped connecting seat; 602. Support rod; 603. Locking screw; 604. Locking nut. Detailed Implementation

[0016] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments.

[0017] Example: Figures 1-4 As shown, an integrated circuit chip heat sink fin mounting bracket includes a fixing frame 1, a connecting frame 2, a heat-conducting plate 3, fin mounting strips 4, fin caps 5, and a connecting locking mechanism 6. The fixing frame 1 has a chip receiving port 101 for accommodating the integrated circuit chip at its center. The upper end of the fixing frame 1 is provided with the connecting frame 2. The center of the connecting frame 2 has a heat dissipation port 201 corresponding to the chip receiving port 101. The heat dissipation port 201 is provided with a heat-conducting plate 3 that is in contact with the integrated circuit chip for heat conduction. The heat dissipating plate 3 is provided with a fin cap 5 above the heat dissipating plate 3 for fixing the heat dissipation fins. Multiple sets of fin mounting strips 4 for positioning and fixing the heat dissipation fins are evenly provided on the surfaces of the fin cap 5 and the heat dissipating plate 3. The multiple sets of fin mounting strips 4 are provided with a connecting locking mechanism 6 for connecting the heat dissipating plate 3 and the fin cap 5 on both sides.

[0018] Mounting holes 103 are provided at the corners of the mounting frame surface. The side walls of the heat dissipation vent 201 are provided with lifting and locking grooves 202 corresponding to the heat conduction plate 3. Adjusting sleeves 205 are provided at the corners of the connecting frame 2 surface. The center of the adjusting sleeve 205 is provided with an adjusting screw hole 206 that connects to the lifting and locking groove 202. The mounting frame is connected to the integrated circuit board through the mounting holes 103. The setting of the lifting and locking groove 202, adjusting sleeve 205, and adjusting screw hole 206 provides a structural basis for the height adjustment of the heat conduction plate 3. In actual use, the position of the heat conduction plate 3 can be flexibly adjusted according to the different thicknesses of the integrated circuit chip or the installation requirements.

[0019] Furthermore, an adjusting screw 207 is provided inside the adjusting screw hole 206. The lower end of the adjusting screw 207 extends through the adjusting screw hole 206 into the lifting locking groove 202. A push plate 208 is provided at the lower end of the adjusting screw 207, and a cap 209 is provided at the upper end of the adjusting screw 207. By rotating the cap 209, the adjusting screw 207 pushes the push plate 208 downward along the adjusting screw hole 206, causing the push plate 208 to move up and down in the lifting locking groove 202, thereby driving the heat-conducting plate 3 to achieve height adjustment.

[0020] Four sets of connecting strips 203 are arranged around the outer end of the connecting frame 2. Two sets of connecting buckles 204 are symmetrically arranged at the lower end of each of the four sets of connecting strips 203. The surface of the fixing frame 1 is provided with connecting buckle holes 102 corresponding to the connecting buckles 204. Through the cooperation of the connecting strips 203, connecting buckles 204 and connecting buckle holes 102, the quick assembly and disassembly of the connecting frame 2 and the fixing frame 1 are realized. Both the connecting frame 2 and the mounting frame are made of engineering plastic to avoid conductive short circuits when in contact with integrated circuits.

[0021] The edge of the heat-conducting plate 3 extends into the lifting locking groove 202. The fin mounting strips 4 on the fin cover 5 and the heat-conducting plate 3 are both provided with fin slots 401. The fin slots 401 of the heat dissipation strips provide a precise positioning and fixing structure for the top and bottom of the heat dissipation fins, so that the heat dissipation fins can be quickly and accurately installed between the heat-conducting plate 3 and the fin cover 5.

[0022] The connecting locking mechanism 6 includes two sets of strip-shaped connecting seats 601. The two sets of strip-shaped connecting seats 601 are symmetrically arranged along the two sides of the surface of the heat-conducting plate 3. Support rods 602 are provided above both ends of the two sets of strip-shaped connecting seats 601. Locking screws 603 are provided at the upper ends of the four sets of support rods 602. Through the combination of strip-shaped connecting seats 601, support rods 602 and locking screws 603, a reliable connection is provided between the fin cover 5 and the heat-conducting plate 3. The symmetrically arranged strip-shaped connecting seats 601 and support rods 602 can evenly distribute the locking force, ensuring that the fin cover 5 and the heat-conducting plate 3 are tightly connected, so that the heat dissipation fins are firmly fixed between the two.

[0023] Each corner of the fin cover 5 has a corresponding locking screw 603 connecting hole 501. The upper end of the locking screw 603 extends through the connecting hole 501 to the top of the fin cover 5. The upper ends of the four sets of locking screws 603 are fitted with locking nuts 604. By tightening or loosening the locking nuts 604, the degree of compression between the fin cover 5 and the heat conduction plate 3 can be precisely controlled, which can ensure that the heat dissipation fins are firmly fixed and facilitate quick disassembly when cleaning or replacing the fins.

[0024] During the operation, the worker first fixes the fixing frame 1 to the designated position on the circuit board by screwing it through the mounting hole 103, ensuring that the integrated circuit chip is located in the chip receiving port 101. Then, a heat dissipation medium is coated on the chip surface. According to the chip thickness, the nut 209 is rotated to push the push plate 208 at the lower end of the adjusting screw 207 to move in the lifting locking groove 202, so that the heat conduction plate 3 is in contact with the chip surface to ensure heat conduction efficiency. Then, the bottom of the heat dissipation fin is inserted into the fin slot 401 of the fin mounting strip 4. Next, the fin cover 5 is covered, and the locking screw 603 passes through the connecting hole 501. At this time, the top of the heat dissipation fin engages with the fin slot 401 of the fin mounting strip 4 at the bottom of the fin cover 5. Finally, the locking nut 604 is tightened to complete the installation.

[0025] During cleaning, loosen the locking nut 604 to remove the fin cover 5, and directly pull out the heat sink fins for individual cleaning or replacement.

[0026] Its working principle is as follows: the heat dissipation fins and the fixing frame are detachably connected through the fin slot 401 and the connecting locking mechanism 6, breaking the traditional integrated structure and solving the problem of cleaning dead corners. The adjusting screw 207 pushes the heat conduction plate 3 to move in the lifting locking groove 202 to adapt to chips of different thicknesses and ensure that the heat conduction plate 3 is always in close contact with the chip surface. The symmetrically distributed strip connecting seat 601 and support rod 602 make the locking force evenly transmitted, avoiding fin deformation or local loosening.

[0027] Its beneficial effects are significant. Through the adjustable-height heat-conducting plate 3 closely adhering to the chip and the setting of large-area heat dissipation fins, the heat conduction and dissipation efficiency is significantly improved, effectively reducing the chip temperature and ensuring the stability and lifespan of the chip during high-performance operation. The detachable heat dissipation fin design, composed of heat-conducting plate 3, fin mounting strip 4, and fin cover 5, makes dust cleaning extremely simple, allowing for quick disassembly, cleaning, and installation of the fins, greatly shortening equipment maintenance time and improving equipment utilization efficiency. The connecting frame 2 and fixing frame 1 made of engineering plastic material eliminate the risk of conductive short circuits at the source, enhancing the safety of equipment operation. The adjustable height of heat-conducting plate 3 allows it to adapt to integrated circuit chips of different thicknesses, expanding the applicability of the mounting bracket and meeting diverse production needs.

Claims

1. A heat sink mounting bracket for an integrated circuit chip, comprising a mounting frame (1); characterized in that, It also includes a connecting frame (2), a heat-conducting plate (3), fin mounting strips (4), fin caps (5) and a connecting locking mechanism (6); the center of the fixed frame (1) is provided with a chip receiving port (101) for accommodating integrated circuit chips, the upper end of the fixed frame (1) is provided with a connecting frame (2), the center of the connecting frame (2) is provided with a heat dissipation port (201) corresponding to the chip receiving port (101), the heat dissipation port (201) is provided with a heat-conducting plate (3) for heat conduction of integrated circuit chips, the upper part of the heat-conducting plate (3) is provided with a fin cap (5) for fixing heat dissipation fins in conjunction with the heat-conducting plate (3), the fin cap (5) and the heat-conducting plate (3) are evenly provided with multiple sets of fin mounting strips (4) for positioning and fixing heat dissipation fins, and the two sides of the multiple sets of fin mounting strips (4) are provided with a connecting locking mechanism (6) for connecting the heat-conducting plate (3) and the fin cap (5).

2. The integrated circuit chip heat sink mounting bracket according to claim 1, characterized in that, Mounting holes (103) are provided at the corners of the mounting frame, and lifting locking grooves (202) corresponding to the heat conduction plate (3) are provided on the four sides of the heat dissipation port (201). Adjustment sleeves (205) are provided at the corners of the connecting frame (2), and adjustment screw holes (206) connecting the lifting locking grooves (202) are provided in the center of the adjustment sleeves (205).

3. The integrated circuit chip heat sink fin holder according to claim 2, characterized in that, An adjusting screw (207) is provided inside the adjusting screw hole (206). The lower end of the adjusting screw (207) passes through the adjusting screw hole (206) and extends into the lifting locking groove (202). A push plate (208) is provided at the lower end of the adjusting screw (207), and a screw cap (209) is provided at the upper end of the adjusting screw (207).

4. The integrated circuit chip heat sink mounting bracket according to claim 1, characterized in that, The outer end of the connecting frame (2) is surrounded by four sets of connecting strips (203), and the lower end of each of the four sets of connecting strips (203) is symmetrically provided with two sets of connecting buckles (204). The surface of the fixing frame (1) is provided with connecting buckle holes (102) corresponding to the connecting buckles (204).

5. The integrated circuit chip heat sink mounting bracket according to claim 2, characterized in that, The edge of the heat-conducting plate (3) extends into the interior of the lifting locking groove (202), and the fin mounting strip (4) on the surface of the fin cover (5) and the heat-conducting plate (3) are both provided with fin slots (401).

6. The integrated circuit chip heat sink fin holder according to claim 5, characterized in that, The connecting locking mechanism (6) includes two sets of strip connecting seats (601). The two sets of strip connecting seats (601) are symmetrically arranged along the two sides of the surface of the heat-conducting plate (3). Support rods (602) are provided above both ends of the two sets of strip connecting seats (601). Locking screws (603) are provided at the upper ends of the four sets of support rods (602).

7. The integrated circuit chip heat sink fin holder according to claim 6, characterized in that, The corners of the fin cover (5) are all provided with corresponding locking screws (603) connecting holes (501). The upper end of the locking screw (603) extends through the connecting hole (501) to the top of the fin cover (5). The upper ends of the four sets of locking screws (603) are all fitted with locking nuts (604).

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