Multi-device stacked package structure

Abstract

The application relates to a multi-device laminated packaging structure, which comprises a packaging substrate, a first composite substrate, a second composite substrate and a packaging frame; the packaging frame is arranged on the top of the packaging substrate; the top surface of the packaging substrate is suitable for mounting a plurality of high-power chip devices; the first composite substrate and the second composite substrate are both located on the inner side of the packaging frame; the first composite substrate is located above the packaging substrate, and a first preset distance is arranged between the first composite substrate and the packaging substrate; the second composite substrate is located above the first composite substrate, and a second preset distance is arranged between the second composite substrate and the first composite substrate; the side of the first composite substrate away from the packaging substrate and the side of the second composite substrate facing the packaging substrate are both suitable for mounting small-signal chip devices; the inside of the packaging frame is provided with a first packaging layer, and the first packaging layer wraps the first composite substrate, the second composite substrate, the high-power chip devices and the small-signal chip devices.

Description

Technical Field

[0001] This application relates to the field of chip packaging technology, and in particular to a multi-device stacked packaging structure. Background Technology

[0002] Semiconductor power components are core components of electronic power systems, responsible for efficient control and conversion of electrical energy. Packaging semiconductor power components offers advantages such as superior heat dissipation, high mechanical strength and stability, strong resistance to electromagnetic interference, and good process adaptability, leading to their widespread application.

[0003] The most common substrate packaging structure revolves around a metal substrate, insulating layer, and circuit layer plane, integrating all high-power chip devices and all small-signal chip devices on the same substrate and in the same plane, and then filling and packaging the devices. However, this design results in a large overall package structure area and volume, which may become a design and usage bottleneck in certain scenarios. Summary of the Invention

[0004] In view of this, this application proposes a multi-device stacked packaging structure.

[0005] According to one aspect of this application, a multi-device stacked packaging structure is provided, comprising: a packaging substrate, a first composite substrate, a second composite substrate, and a packaging frame; The packaging frame is positioned on top of the packaging substrate; The top surface of the packaging substrate is suitable for mounting multiple high-power chip devices, and both the first composite substrate and the second composite substrate are located inside the packaging frame. The first composite substrate is located above the packaging substrate and there is a first preset distance between the first composite substrate and the packaging substrate. The second composite substrate is located above the first composite substrate and there is a second preset distance between the second composite substrate and the first composite substrate. Both the side of the first composite substrate facing away from the packaging substrate and the side of the second composite substrate facing the packaging substrate are suitable for mounting small signal chip devices. The packaging frame has a first packaging layer inside, and the first packaging layer encapsulates a first composite substrate, a second composite substrate, a high-power chip device, and a small-signal chip device.

[0006] In one possible implementation, the first composite substrate, the second composite substrate, and the packaging substrate are arranged in parallel to each other.

[0007] In one possible implementation, a connecting partition is provided on the inner side of the packaging frame; A connecting partition is disposed on the top of the first composite substrate, and the sidewall of the second composite substrate is connected to the connecting partition.

[0008] In one possible implementation, a lead separator is provided on the outside of the package holder, and the lead separator is disposed on the top of the package substrate; A second encapsulation layer is provided on the inner side of the lead separator, and the leads on the encapsulation substrate pass through the second encapsulation layer.

[0009] In one possible implementation, the main body of the packaging frame is a cuboid structure, and the main body of the connecting partition is a rectangular plate structure.

[0010] In one possible implementation, mounting portions protrude from both sides of the packaging substrate.

[0011] In one possible implementation, both the first encapsulation layer and the second encapsulation layer are made of EP adhesive.

[0012] Beneficial Effects: This application performs multi-directional stacked packaging of chip devices on a packaging substrate. The packaging substrate is divided into three layers from the original single metal substrate. The packaging substrate is used to integrate and mount high-power chip devices (top-side), the top of the first composite substrate integrates small-signal chip devices, and the bottom of the second composite substrate integrates small-signal chip devices. The first and second composite substrates are stacked sequentially on top of the packaging substrate, and their relative positions are staggered, thus minimizing the overall area and volume of the component. The first and second packaging layers effectively cover and protect the high-power chip devices, small-signal chip devices, and various inter-board leads, preventing short circuits and external environmental corrosion. The partitioned design of the high-power chip devices and small-signal chip devices in this application balances heat dissipation and weight requirements. Through multi-dimensional synergistic optimization of materials, processes, and structures, it achieves the goal of component miniaturization and lightweighting. The layered design supports high-density integration and is suitable for complex circuit applications.

[0013] Other features and aspects of this application will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0014] The accompanying drawings, which are included in and form part of this specification, illustrate exemplary embodiments, features, and aspects of this application together with the specification and serve to explain the principles of this application.

[0015] Figure 1 A cross-sectional view (AA) of a multi-device stacked package structure according to an embodiment of this application is shown. Figure 2 This is a BB cross-sectional view of a multi-device stacked package structure according to an embodiment of this application; Figure 3 This diagram shows the main structure of the multi-device stacked packaging structure according to an embodiment of this application. Figure 4The three-view diagram shows a multi-device stacked package structure according to an embodiment of this application.

[0016] The package includes a packaging substrate 100, a first composite substrate 200, a second composite substrate 300, a first packaging layer 400, a packaging frame 500, a connecting partition 510, a lead wire partition 520, a second packaging layer 600, a high-power chip device 110, and a small-signal chip device 310. Detailed Implementation

[0017] Various exemplary embodiments, features, and aspects of the present invention will now be described in detail with reference to the accompanying drawings. The same reference numerals in the drawings denote elements that have the same or similar functions. Although various aspects of the embodiments are shown in the drawings, they are not necessarily drawn to scale unless specifically indicated otherwise.

[0018] It should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model or simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0019] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0020] The term “exemplary” as used herein means “serving as an example, embodiment, or illustration.” Any embodiment illustrated herein as “exemplary” is not necessarily to be construed as superior to or better than other embodiments.

[0021] Furthermore, to better illustrate this utility model, numerous specific details are provided in the following detailed embodiments. Those skilled in the art should understand that this utility model can be implemented even without certain specific details. In some instances, methods, means, components, and circuits well-known to those skilled in the art have not been described in detail, in order to highlight the main points of this utility model.

[0022] Figure 1 A cross-sectional view (AA) of a multi-device stacked package structure according to an embodiment of this application is shown. Figure 2This is a BB cross-sectional view of a multi-device stacked package structure according to an embodiment of this application; Figure 3 This diagram shows the main structure of the multi-device stacked packaging structure according to an embodiment of this application. Figure 4 Three views are shown of a multi-device stacked package structure according to an embodiment of this application. For example... Figure 1 As shown, this multi-device stacked packaging structure includes: a packaging substrate 100, a first composite substrate 200, a second composite substrate 300, and a packaging frame 500; the packaging frame 500 is disposed on top of the packaging substrate 100; the top surface of the packaging substrate 100 is suitable for mounting multiple high-power chip devices 110; the first composite substrate 200 and the second composite substrate 300 are both located inside the packaging frame 500; the first composite substrate 200 is located above the packaging substrate 100, and a first preset distance is provided between the first composite substrate 200 and the packaging substrate 100; the second composite substrate 300... The composite substrate 300 is located above the first composite substrate 200, and a second preset distance is provided between the second composite substrate 300 and the first composite substrate 200; both the side of the first composite substrate 200 away from the packaging substrate 100 and the side of the second composite substrate 300 facing the packaging substrate 100 are suitable for mounting small signal chip devices 310; the packaging frame 500 has a first packaging layer 400 inside, and the first packaging layer 400 wraps the first composite substrate 200, the second composite substrate 300, all high power chip devices 110 and all small signal chip devices 310.

[0023] It should be noted that this application performs multi-directional stacked packaging of chip devices on the packaging substrate 100. The packaging substrate 100 is originally a single metal substrate, which is divided into three pieces according to different performance and design requirements. Among them, the packaging substrate 100 is used to integrate and mount high-power chip devices 110 (top-facing), the top of the first composite substrate integrates small-signal chip devices 310 (top-facing), and the bottom plate of the second composite substrate 300 integrates small-signal chip devices 310 (bottom-facing). The packaging frame 500 is suitable for mounting and fixing the first composite substrate 200 and the second composite substrate 300. The first composite substrate 200 and the second composite substrate 300 are sequentially stacked on top of the packaging substrate 100, and their relative positions are staggered, which maximizes the reduction of the overall area and volume of the component. The packaging frame 500 is suitable for isolating and protecting the internal first composite substrate 200, second composite substrate 300, high-power chip device 110, small-signal chip device 310, and first packaging layer 400, and provides packaging filling space for the first packaging layer 400. This application uses a partitioned design for the high-power chip device 110 (e.g., high-power dissipation semiconductor chip, high-power transistor, etc.) and the small-signal chip device 310 (e.g., small-signal low-power IC, etc.) to balance heat dissipation and weight requirements, and achieves the purpose of component miniaturization and lightweighting through multi-dimensional synergistic optimization of materials, processes, and structures. The multi-device stacked packaging structure supports high-density integration through layered design, is suitable for complex circuit applications, and simplifies the maintenance and upgrade process.

[0024] In one possible implementation, the first composite substrate 200, the second composite substrate 300, and the packaging substrate 100 are arranged parallel to each other. Furthermore, small-signal chip devices 310 are integrated on the sides of the first composite substrate 200 and the second composite substrate 300 that face each other, which minimizes the amount of packaging material required, thereby optimizing the overall structure and ensuring minimal weight.

[0025] Furthermore, the first composite substrate 200, the second composite substrate 300, and the packaging substrate 100 all form rectangular plate structures. The first composite substrate 200 and the second composite substrate 300 are substrates made of various materials such as insulators, for example, FR4 PCB boards.

[0026] In one possible implementation, a connecting partition 510 is provided on the inner side of the packaging frame 500; the connecting partition 510 is disposed on the top of the first composite substrate 200, and the sidewall of the second composite substrate 300 is fixedly connected to the connecting partition 510. It should be noted that the connecting partition 510 is used to support and fix the second composite substrate 300, ensuring that the second composite substrate 300 is stably disposed above the first composite substrate 200.

[0027] In one possible implementation, the main body of the connecting partition 510 is a rectangular plate structure. This facilitates standardized production and assembly, optimizes space utilization, and ensures the regularity of the lead layout and the stability of signal transmission. The connecting partition 510 is arranged perpendicularly to the first composite substrate 200 and the second composite substrate 300. The connecting partition 510 is vertically arranged on the top surface of the first composite substrate 200. Under the action of the connecting partition 510, the first encapsulation layer 400 is divided into two parts.

[0028] In one possible implementation, the main body of the packaging frame 500 is a cuboid structure with cavities open at both ends. The bottom surface of the packaging frame 500 is fixed to the packaging substrate 100 by adhesive bonding. The two sides of the width of the first composite substrate 200 are fixedly connected to the inner sidewalls of the two sides of the width of the packaging frame 500 by adhesive bonding. The two sides of the width of the second composite substrate 300 are fixedly connected to the inner sidewalls of the two sides of the width of the packaging frame 500 by adhesive bonding. The one side of the length of the first composite substrate 200 is fixed to the inner wall of the one side of the length of the packaging frame 500 by adhesive bonding. The one side of the length of the second composite substrate 300 is fixed to the inner wall of the one side of the length of the packaging frame 500 by adhesive bonding. The other side of the length of the second composite substrate 300 is fixed to the sidewall of the connecting partition 510 by adhesive bonding. The second composite substrate 300 is effectively supported by the connecting partition 510 and the packaging frame 500.

[0029] In one possible implementation, such as Figure 3 As shown, a lead separator 520 is provided on the outer side of the package holder 500, and the lead separator 520 is disposed on the top of the package substrate 100. Furthermore, the main body of the lead separator 520 is a plate-like structure with a Π-shaped cross-section. The open end of the lead separator 520 is connected to the outer wall of the package holder 500, and the inner side of the lead separator 520 (within the space enclosed by the lead separator 520 and the package holder 500) is filled with a second encapsulation layer 600. The I / O leads 320 on the package substrate 100 extend outwards through the second encapsulation layer 600. The second encapsulation layer 600 is suitable for encapsulating the I / O leads 320 on the package substrate 100 and ensuring their electrical connection to external devices.

[0030] Preferably, the packaging frame 500, the connecting partition 510 and the lead wire partition 520 are integrally formed.

[0031] In one possible implementation, mounting portions 140 protrude from both sides of the packaging substrate 100. The main body of the mounting portion 140 is a triangular plate-like structure, and the mounting portion 140 has mounting holes 141 for mounting the packaging substrate 100 to the mounting position. Furthermore, the packaging substrate 100 and the mounting portion 140 are integrally formed. The triangular plate-like structure of the mounting portion 140 and the mounting holes 141 facilitate quick and stable mounting to the mounting position, improving the mechanical stability and vibration resistance of the packaging substrate 100. The integral molding design of the packaging substrate 100 and the mounting portion 140 simplifies the manufacturing process, reduces production costs, and enhances the overall structural strength and reliability.

[0032] In one possible implementation, both the first encapsulation layer 400 and the second encapsulation layer 600 are made of EP adhesive. EP adhesive has excellent insulation, high temperature resistance, and chemical protection properties, and can effectively encapsulate and protect high-power chip devices, small-signal chip devices, and various inter-board leads, preventing short circuits and external environmental corrosion.

[0033] The first encapsulation layer 400 fills the interior of the encapsulation frame 500 and covers the top of the encapsulation substrate 100, the first composite substrate 200, the second composite substrate 300, the high-power chip device 110, the small-signal chip device 310, the inter-board leads 120 between the first composite substrate 200 and the encapsulation substrate 100, the board leads 130 between the second composite substrate 300 and the encapsulation substrate 100, and the board leads 330 between the first composite substrate 200 and the second composite substrate 300. Simultaneously, the first encapsulation layer 400 covers the I / O leads 210 on the first composite substrate 200 used for connection to external devices. A lead separator 520 is disposed on the top of the encapsulation substrate 100. Combined with the second encapsulation layer 600, this achieves orderly penetration and management of the I / O leads 320, reduces the risk of electromagnetic interference, and improves the electrical performance and long-term durability of the overall encapsulation structure.

[0034] The various embodiments of the present invention have been described above. These descriptions are exemplary and not exhaustive, nor are they limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen to best explain the principles, practical application, or improvement of the technology in the market, or to enable others skilled in the art to understand the embodiments disclosed herein.

Claims

1. A multi-device stacked packaging structure, characterized in that, include: Packaging substrate, first composite substrate, second composite substrate and packaging frame; The packaging frame is disposed on top of the packaging substrate; The top surface of the packaging substrate is suitable for mounting multiple high-power chip devices, and both the first composite substrate and the second composite substrate are located inside the packaging frame. The first composite substrate is located above the packaging substrate and there is a first preset distance between the first composite substrate and the packaging substrate; the second composite substrate is located above the first composite substrate and there is a second preset distance between the second composite substrate and the first composite substrate. Both the side of the first composite substrate facing away from the packaging substrate and the side of the second composite substrate facing the packaging substrate are suitable for mounting small signal chip devices. The packaging frame has a first packaging layer inside, and the first packaging layer encapsulates the first composite substrate, the second composite substrate, the high-power chip device, and the small-signal chip device.

2. The multi-device stacked packaging structure according to claim 1, characterized in that, The first composite substrate, the second composite substrate, and the packaging substrate are arranged parallel to each other.

3. The multi-device stacked packaging structure according to claim 1, characterized in that, The inner side of the packaging frame is provided with a connecting partition; The connecting partition is located on top of the first composite substrate, and the sidewall of the second composite substrate is connected to the connecting partition.

4. The multi-device stacked packaging structure according to claim 1, characterized in that, The outer side of the packaging frame is provided with a lead wire partition, which is disposed on the top of the packaging substrate; The inner side of the lead separator is provided with a second encapsulation layer, and the leads on the encapsulation substrate extend outward through the second encapsulation layer.

5. The multi-device stacked packaging structure according to claim 3, characterized in that, The main body of the packaging frame is a cuboid structure, and the main body of the connecting partition is a rectangular plate structure.

6. The multi-device stacked packaging structure according to claim 1, characterized in that, The packaging substrate has mounting portions protruding from both sides, which are suitable for mounting the packaging substrate at the installation position.

7. The multi-device stacked packaging structure according to claim 4, characterized in that, Both the first encapsulation layer and the second encapsulation layer are made of EP adhesive.

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