A bonding apparatus

Abstract

The application discloses a bonding device and relates to the technical field of semiconductors. The bonding device comprises a base, a detection mechanism and a processing mechanism. The base is connected with a bearing table, and the bearing table is used for placing a wafer to be processed. The detection mechanism is connected to the base and is used for detecting the wafer on the bearing table. The processing mechanism is connected to the base and is used for processing the wafer on the bearing table. The bonding device disclosed by the application can realize in-situ detection of the wafer, improve the detection and processing efficiency of the wafer, and make the structure of the bonding device more compact and reduce space occupation.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, and particularly relates to a bonding device. BACKGROUND

[0002] In the field of die packaging, bonding technology is a key technology for realizing three-dimensional integration and high-density interconnection. The surface quality of a chip before bonding directly affects the reliability of a bonding interface and the yield of a product.

[0003] In the related art, there is a lack of real-time detection of the state of a chip surface after picking up before or after defect identification occurs in bonding. Meanwhile, the process of processing a chip is complex and tedious, which leads to low efficiency of the chip processing process and large space occupation of the device. CONTENT OF THE UTILITY MODEL

[0004] The bonding device provided by the present application can realize in-situ inspection of a die, improve the efficiency of die detection and processing, and make the structure of the bonding device more compact and reduce space occupation.

[0005] The present application provides a bonding device, which comprises a base, a detection mechanism and a processing mechanism. The base is connected with a bearing table, and the bearing table is used for placing a die to be processed. The detection mechanism is connected to the base, and the detection mechanism is used for detecting the die on the bearing table. The processing mechanism is connected to the base, and the processing mechanism is used for processing the die on the bearing table.

[0006] The bonding device provided by the present application comprises a base, and the base is connected with a bearing table. The bearing table is used for placing a die to be processed. Since the detection mechanism is connected to the base and the detection mechanism is used for detecting the die on the bearing table, the position of the die to be processed does not need to be moved after being placed on the bearing table, and the detection mechanism can directly detect the die. Since the processing mechanism is connected to the base and the processing mechanism is used for processing the die on the bearing table, the position of the die does not need to be moved, and the processing mechanism can directly detect the die. With such a structure, the position of the die does not need to be moved, and the die on the bearing table can be detected by the detection mechanism and processed by the processing mechanism, thereby realizing in-situ detection of the die and improving the efficiency of die detection and processing. Since the detection mechanism and the processing mechanism are both arranged on the base, and the base is connected with the bearing table, the structure of the bonding device can be made more compact and the space occupation can be reduced.

[0007] In a possible implementation manner of the present application, the detection mechanism comprises at least two detectors arranged on different sides of the bearing table. The detectors are used for detecting the die, and the processing mechanism processes the die based on the detection results of the detectors.

[0008] In a possible implementation of the present application, the detection mechanism further comprises a mirror connected to the base, and each detector is provided with a corresponding mirror, and the detector acquires the state information of the die through the corresponding mirror.

[0009] In a possible implementation of the present application, the bonding device further comprises a blowing mechanism connected to the base, and the blowing mechanism blows the die on the carrier table based on the detection result of the detection mechanism.

[0010] In a possible implementation of the present application, the blowing mechanism comprises a displacement assembly connected to the base and a blowing piece connected to the displacement assembly, the displacement assembly is used to drive the blowing piece to move relative to the base, and the blowing piece is used to blow the die.

[0011] In a possible implementation of the present application, the displacement assembly comprises a plurality of connection rods connected in sequence, and the connection axes between different connection rods have an included angle; the plurality of connection rods form a mechanical arm, a connection rod at one end of the mechanical arm is connected to the base, and a connection rod at the other end of the mechanical arm is connected to the blowing piece, and the blowing piece rotates relative to the connection rod to face different positions of the carrier table.

[0012] In a possible implementation of the present application, the connection rod connected to the blowing piece is an end rod, the blowing piece is rotationally connected to the end rod, the blowing piece has a blowing side for releasing blowing medium, and the blowing piece rotates relative to the end rod, and the blowing side faces different positions of the carrier table.

[0013] In a possible implementation of the present application, the base comprises a receiving cavity, the bonding device further comprises a lifting mechanism, and the lifting mechanism comprises a first lifting assembly and a second lifting assembly; the first lifting assembly is used to drive the carrier table to enter or exit the receiving cavity; the second lifting assembly is connected to the first lifting assembly, the second lifting assembly is used to align the carrier table with the detection mechanism, and the displacement precision of the second lifting assembly is greater than that of the first lifting assembly.

[0014] In a possible implementation of the present application, the bonding device further comprises a limiting mechanism connected to the carrier table, and the limiting mechanism is used to limit the movement of the die relative to the carrier table.

[0015] In a possible implementation of the present application, the bonding device further comprises a transfer mechanism, and the transfer mechanism comprises a movement assembly and a pick-and-place assembly; the movement assembly is connected to the base, the pick-and-place assembly is connected to the movement assembly, the pick-and-place assembly is used to pick up or release the die, and the movement assembly is used to drive the pick-and-place assembly to move relative to the base. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 A structural schematic diagram of the bonding device provided by the embodiment of the present application is shown;

[0017] Figure 2 A schematic view of a wafer carried by a carrier table of a bonding device according to an embodiment of the present application;

[0018] Figure 3 A schematic view of a wafer picked up from a wafer by a transfer mechanism of a bonding device according to an embodiment of the present application;

[0019] Figure 4 A schematic view of a wafer picked up or placed by a transfer mechanism of a bonding device according to an embodiment of the present application;

[0020] Figure 5 A schematic view of a wafer blown by a blowing mechanism of a bonding device according to an embodiment of the present application.

[0021] Reference signs:

[0022] 1 - base; 11 - carrier table; 2 - detection mechanism; 21 - detector; 22 - mirror; 3 - processing mechanism; 4 - blowing mechanism; 5 - limiting mechanism; 6 - transfer mechanism; 7 - wafer; 8 - wafer. DETAILED DESCRIPTION

[0023] In order to make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the following will further describe the specific technical solutions of the present application with reference to the drawings in the embodiments of the present application. The following embodiments are used to explain the present application, but not to limit the scope of the present application.

[0024] In the embodiments of the present application, the terms "first", "second" are only used for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0025] In addition, in the embodiments of the present application, the orientation terms such as "upper", "lower", "left" and "right" are defined with respect to the orientation of the components shown in the drawings, and it should be understood that these directional terms are relative concepts, which are used for relative description and clarification, and can be changed accordingly according to the change of the orientation of the components placed in the drawings.

[0026] In the embodiments of the present application, unless otherwise specified and limited, the term "connection" should be understood broadly, for example, "connection" can be fixed connection, or detachable connection, or integral; can be directly connected, or indirectly connected through intermediate medium.

[0027] In the embodiments of the present application, the terms "comprising", "containing" or any other variant thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements not only includes those elements, but can also include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without more limitations, the element defined by the phrase "comprising a" does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element.

[0028] In the embodiments of the present application, the words "exemplary" or "for example" are used to mean serving as an example or illustration. Any embodiment or design presented as "exemplary" or "for example" in the embodiments of the present application should not be construed as preferred or advantageous over other embodiments or designs. Rather, the use of "exemplary" or "for example" is intended to present concepts in a concrete manner.

[0029] In the field of die packaging, bonding technology is a key technology to realize three-dimensional integration and high-density interconnection. Among them, the surface quality of the chip before bonding directly affects the reliability of the bonding interface and the yield of the product.

[0030] In the related art, the bonding carrier or die can be pre-set with a groove for defect scanning before bonding, or an ultrasonic scanning microscope combined with fluid immersion imaging detection can be used for defects in the bonding interface.

[0031] However, the related art lacks real-time detection of defect identification occurring before or after bonding and the surface state of the picked-up chip; at the same time, the process of transporting and processing the chip is complex and tedious, resulting in low efficiency of the chip processing process and large space occupation of the equipment volume.

[0032] The embodiments of the present application provide a bonding device, referring to Figure 1 and Figure 2 The bonding device includes a base 1, a detection mechanism 2 and a processing mechanism 3. The base 1 is connected with a carrying table 11, and the carrying table 11 is used to place a die 7 to be processed. The detection mechanism 2 is connected to the base 1, and the detection mechanism 2 is used to detect the die 7 on the carrying table 11. The processing mechanism 3 is connected to the base 1, and the processing mechanism 3 is used to process the die 7 on the carrying table 11.

[0033] In the embodiments of the present application, the die 7 (Die) can also be referred to as a chip, which refers to an independent small piece cut from a wafer (Wafer), i.e. a bare chip before packaging, and the die 7 can be used for bonding after detection and processing.

[0034] In the embodiment of the present application, the base 1 provides a mounting base for the detection mechanism 2 and the processing mechanism 3 and the carrier table 11, and provides a stability and alignment base for the detection mechanism 2, the processing mechanism 3 and the carrier table 11.

[0035] In the embodiment of the present application, the carrier table 11 is used to carry and fix the die 7, and the carrier table 11 can be a vacuum glass table.

[0036] In the embodiment of the present application, the processing mechanism 3 is used to bond the die 7, and the processing mechanism 3 can be a traditional thermal compression bonding, or can be integrated with a plasma activation module or a local laser annealing device.

[0037] In the embodiment of the present application, the detection mechanism 2 is used to detect defects on the die 7, such as particles, micro-cracks, dirt, etc., and the detection mechanism 2 can generate coordinates of the particles attached to the die 7 after detection, so as to facilitate the next process of the die 7.

[0038] The bonding device of the embodiment of the present application includes a base 1, and the base 1 is connected with a carrier table 11, and the carrier table 11 is used to place a die 7 to be processed. Since the detection mechanism 2 is connected to the base 1, the detection mechanism 2 is used to detect the die 7 on the carrier table 11, so that the die 7 to be processed does not need to be moved after being placed on the carrier table 11, and the detection mechanism 2 can directly detect the die 7. Since the processing mechanism 3 is connected to the base 1, the processing mechanism 3 is used to process the die 7 on the carrier table 11, so that the die 7 does not need to be moved, and the processing mechanism 3 can directly detect the die 7. With such a structure, the die 7 on the carrier table 11 can realize the detection of the detection mechanism 2 and the processing of the processing mechanism 3 without moving the position of the die 7, thereby realizing in-situ detection of the die 7 and improving the detection and processing efficiency of the die 7. Since the detection mechanism 2 and the processing mechanism 3 are both arranged on the base 1, and the base 1 is connected with the carrier table 11, the structure of the bonding device can be more compact, and the space occupation can be reduced.

[0039] In some possible embodiments of the present application, referring to Figure 1 , the detection mechanism 2 includes at least two detectors 21, and the at least two detectors 21 are arranged on different sides of the carrier table 11. The detector 21 is used to detect the die 7, and the processing mechanism 3 processes the die 7 based on the detection results of the plurality of detectors 21.

[0040] In the embodiment of the present application, the detection mechanism 2 includes at least two detectors 21, and the more the number of the detectors 21, the more comprehensive the detection of the die 7 can be.

[0041] For example, in the case that the crystal grain 7 to be processed is in a rectangular structure, the detectors 21 can be six, and the six detectors 21 are respectively arranged towards different six side surfaces of the rectangular crystal grain 7. In this way, each detector 21 can detect the particle adhesion condition of the corresponding surface.

[0042] In the embodiment of the present application, the detector 21 can be a coaxial illumination line array camera or a surface array camera, and in order to clearly detect the condition of the surface of the crystal grain 7, a light source such as a ring-shaped LED lamp can also be arranged near each detector 21.

[0043] In the embodiment of the present application, during the bonding process or after the bonding is completed, if the detector 21 of the crystal grain 7 finds that the crystal grain 7 is warped, the device can automatically compensate the processing force on the other side to ensure the uniformity of the bonding.

[0044] The bonding device of the embodiment of the present application can detect the crystal grain 7 on different sides of the supporting table 11, so as to obtain the data of the crystal grain 7 collected in multiple directions, reduce the detection blind area, and improve the comprehensiveness and accuracy of the detection result. At the same time, when a certain detector 21 is contaminated or fails, the remaining detectors 21 can still provide basic data, maintain the processing flow in combination with the historical detection model, and reduce the risk of device downtime. In addition, since the processing mechanism 3 processes the crystal grain 7 based on the detection results of the multiple detectors 21, the detectors 21 detect from multiple sides of the crystal grain 7, which improves the detection efficiency and shortens the process between the detection and the processing of the crystal grain 7.

[0045] In some possible embodiments of the present application, referring to Figure 1 The detection mechanism 2 further includes a mirror 22 connected with the machine base 1, and each detector 21 is correspondingly provided with a mirror 22, and the detector 21 acquires the state information of the crystal grain 7 through the corresponding mirror 22.

[0046] In the embodiment of the present application, the mirror 22 is used for reflecting the crystal grain 7, the detector 21 corresponds to the mirror 22 one by one, the detection surface of the detector 21 is arranged corresponding to the mirror 22, and the detector 21 detects the state of the crystal grain 7 reflected in the mirror 22.

[0047] For example, in the case that the detector 21 is six, the mirror 22 is correspondingly provided with six, each detector 21 and the mirror 22 are correspondingly arranged one by one, and are respectively arranged corresponding to the six side surfaces of the rectangular crystal grain 7.

[0048] In the embodiment of the present application, the angle of the mirror 22 is adjustable, and the reflected area can be increased by adjusting the angle of the mirror 22, for example, the edge of the crystal grain 7 can be reflected.

[0049] The bonding device of the embodiments of the present application can obtain the state information of the die 7 through the mirror 22. The mirror 22 can obtain the information without directly aiming at the die 7 through the folded light path, thereby reducing the installation space requirement of the detector 21 and making the device structure more compact. Meanwhile, the mirror 22 can reflect the non-directly visible area (such as the edge) of the die 7 to the detector 21 by adjusting the angle, thereby expanding the detection coverage without increasing the number of physical detectors 21.

[0050] In some possible embodiments of the present application, referring to Figure 5 The bonding device further comprises a blowing mechanism 4 connected to the machine base 1. The blowing mechanism 4 blows the die 7 on the carrier table 11 based on the detection result of the detection mechanism 2.

[0051] In the embodiments of the present application, the blowing mechanism 4 usually uses gas to blow the attachments on the die 7. The gas used for blowing is inert gas, such as nitrogen (N2), argon (Ar) or helium (He) and the like.

[0052] The bonding device of the embodiments of the present application has the blowing mechanism 4 connected to the machine base 1. The blowing mechanism 4 blows the die 7 on the carrier table 11 based on the detection result of the detection mechanism 2, thereby cleaning the die 7 without moving the position of the die 7 and improving the efficiency of processing the die 7.

[0053] In some possible embodiments of the present application, the blowing mechanism 4 comprises a displacement assembly and a blowing piece. The displacement assembly is connected to the machine base 1, and the blowing piece is connected to the displacement assembly. The displacement assembly is used to drive the blowing piece to move relative to the machine base 1, and the blowing piece is used to blow the die 7.

[0054] In the embodiments of the present application, the displacement assembly can be a linear motor, a mechanical arm or a servo drive, and the displacement assembly drives the blowing piece to move.

[0055] In the embodiments of the present application, the displacement assembly can realize the accurate positioning of the blowing piece in the three-dimensional space through a multi-axis linear motion mechanism. The multi-axis of the displacement assembly can include at least three axes, and the three axes have an included angle therebetween. For example, the displacement assembly adopts a high-precision linear motor or a ball screw module, and each axis is independently driven.

[0056] In another embodiment, the movement of the blowing piece driven by the displacement assembly can be rotary motion. The rotary motion of the displacement assembly realizes the full-angle orientation of the blowing piece through a multi-degree-of-freedom joint or a servo rotary platform.

[0057] In the embodiments of the present application, the blowing piece can be a nozzle or an air flow generator, which is used to blow air flow. The path and pressure of the blown air flow can be adjusted according to the attached particles on the surface of the die 7.

[0058] In the embodiments of the present application, the displacement assembly can be a three-axis precision slide and the displacement assembly, and the precision of the three-axis precision slide can be controlled within 1 micrometer. The rotary joint of the displacement assembly can be 180 degrees rotatable, and the gas injection angle of the blowing member can be dynamically adjusted according to the particle coordinates detected by the detector 21. The nitrogen pressure (such as 0.1 MPa to 0.3 MPa), the injection distance (such as 0.5 mm to 1 mm), and the pulse frequency (such as 50 Hz to 100 Hz) can be intelligently optimized.

[0059] In the bonding device of the embodiments of the present application, the displacement assembly is connected to the base 1, and the blowing member is connected to the displacement assembly. The blowing member can move relative to the base 1 with the displacement assembly. The bearing table 11 is arranged on the base 1, and the blowing member can move relative to the bearing table 11. In this way, the blowing member can blow and clean the die 7 on the bearing table 11 by moving. The position and direction of the blowing member can be adjusted according to the detection data of the detection mechanism 2, so as to realize full-area coverage blowing of the surface or the bonding area of the die 7 and reduce the problem of blowing dead angle.

[0060] In some possible embodiments of the present application, the displacement assembly includes a plurality of sequentially hinged connecting rods, and the hinge axes between different connecting rods have an included angle. The plurality of connecting rods form a mechanical arm. The connecting rod at one end of the mechanical arm is connected to the base 1, and the connecting rod at the other end of the mechanical arm is hinged to the blowing member. The blowing member rotates relative to the connecting rod to face different positions of the bearing table 11.

[0061] In the embodiments of the present application, the displacement assembly is a mechanical arm formed by a plurality of sequentially hinged connecting rods. The number of the connecting rods can be adjusted according to the required size. The hinge axes between different connecting rods have an included angle, and the included angle of the axes between different connecting rods can be adjusted, so as to realize the movement of the mechanical arm.

[0062] In the embodiments of the present application, the blowing member is hinged to the connecting rod at the other end of the mechanical arm. The blowing member can realize 360° self-rotation through a micro stepping motor or a piezoelectric ceramic driver, so as to realize the adjustable direction of the airflow blown by the blowing member.

[0063] For example, the hinged connecting rod is unfolded from the folded state, the blowing member at the end of the mechanical arm moves to the vicinity of the die 7, and the blowing member can blow the die 7. The parameters of the die 7 are detected in real time by the detector 21, the mechanical arm dynamically adjusts the angles of the joints, and the blowing member maintains a stable distance from the surface of the die 7. The blowing member can rotate by 360° to blow the die 7 at different angles.

[0064] The bonding device of the embodiment of the present application, the displacement assembly includes a plurality of sequentially hinged connecting rods, one end of the mechanical arm is connected with the base 1, since the displacement assembly is composed of a plurality of sequentially hinged connecting rods with an included angle of the hinge axis, the mechanical arm can realize flexible movement of the end connected with the blowing member at multiple angles, the blowing member can change the angle and position, so that the blowing member can cover any position on the surface of the die 7, improve the flexibility of blowing the die 7, and also improve the effect of blowing the die 7 by the blowing member.

[0065] In some possible embodiments of the present application, the connecting rod connected with the blowing member is an end rod, the blowing member is rotationally connected with the end rod, the blowing member has a blowing side for releasing blowing medium, and the blowing member rotates relative to the end rod, and the blowing side faces different positions of the supporting table 11.

[0066] In the embodiment of the present application, the end rod is the last connecting rod of the mechanical arm, and is connected with the blowing member, and is used for accurately guiding the blowing medium to the surface of the die 7.

[0067] In the embodiment of the present application, the blowing side can be a multi-hole nozzle or a slit type outlet, the structure is optimized through fluid simulation to ensure that the airflow is concentrated and uniform. The blowing side can be configured with an adjustable flow guide plate, and the inclination angle (such as 30° to 90°) is changed to adapt to different pollution types, such as vertical blowing to remove particles and oblique blowing to reduce displacement of the die 7.

[0068] In the embodiment of the present application, the path and pressure of the nitrogen gas blown by the blowing member can be adjusted according to the different particles attached to the die 7 detected by the detector 21. For example, in the case that the detector 21 detects that a group of particles is attached to the die 7, the blowing member can perform regional coverage scanning on the die 7 through 0.2 megapascal (MPa) fan-shaped diffusion mode of nitrogen gas, and the grid spacing of the regional coverage scanning can be 50 micrometers (um); in the case that the detector 21 detects that particles with a size less than 0.5 um are attached to the die 7, the blowing member can perform vertical jet blowing through 0.3 MPa continuous nitrogen flow; in the case that the detector 21 detects that particles with a size greater than 1 um are attached to the die 7, the blowing member can perform blowing through 0.25 MPa pulse type nitrogen flow in a spiral approaching path.

[0069] The bonding device of the embodiment of the present application, since the blowing member is rotationally connected with the end rod, the angle of the blowing side can be flexibly adjusted, the blowing of different regions of the die 7 on the supporting table 11 is realized, such as the edge, groove or complex structure region of the die 7, and the cleaning blind area is reduced; since the blowing side of the blowing member can release blowing medium, the stability of the airflow or cleaning agent jet can be maintained while the angle is adjusted, and the stability of blowing the die 7 is improved.

[0070] In some possible embodiments of this application, the base 1 includes a receiving cavity, and the bonding device further includes a lifting mechanism, which includes a first lifting component and a second lifting component; the first lifting component is used to drive the bearing platform 11 into or out of the receiving cavity; the second lifting component is connected to the first lifting component, and the second lifting component is used to drive the bearing platform 11 to align with the detection mechanism 2, and the displacement accuracy of the second lifting component is greater than that of the first lifting component.

[0071] In this embodiment of the application, the receiving cavity is used to accommodate the carrier stage 11 and the die 7. The receiving cavity can be a real cavity to reduce the contamination of the die 7 by the environment, such as dust and humidity.

[0072] In this embodiment, the first lifting component is used to drive the support platform 11 into or out of the receiving cavity to achieve large stroke movement, and can be driven by a ball screw and a servo motor.

[0073] In this embodiment, the second lifting component can be a piezoelectric ceramic micro-motion platform to achieve sub-micron level alignment.

[0074] In this embodiment, the first lifting component moves the support platform 11 into the receiving cavity; the second lifting component, based on the feedback from the detection mechanism 2, finely adjusts the position of the support platform 11 to achieve bonding face alignment; after the die 7 is processed, the first lifting component moves the support platform 11 out of the receiving cavity.

[0075] In the bonding equipment of this application embodiment, since the base 1 is provided with a receiving cavity, the first lifting component is used to drive the carrier platform 11 into or out of the receiving cavity. Therefore, the first lifting component can realize the rapid batch loading and unloading of the die 7 workpiece. Since the second lifting component has higher displacement accuracy than the first lifting component, it can make the die 7 aligned with the detection mechanism 2 through high-precision fine adjustment when the first lifting component moves the carrier platform 11 into the receiving cavity, thereby improving the accuracy of the bonding process.

[0076] In some possible embodiments of this application, reference is made to Figure 1 The bonding equipment also includes a limiting mechanism 5, which is connected to the support platform 11 and is used to limit the movement of the die 7 relative to the support platform 11.

[0077] In this embodiment, the limiting mechanism 5 can be fixed to the edge or bottom of the support platform 11, and the limiting of the grain 7 can be achieved by mechanical clamping, negative pressure adsorption or electromagnetic fixation.

[0078] In the bonding equipment of this application embodiment, since the limiting mechanism 5 is connected to the support platform 11, it can simultaneously maintain the stability of the die 7 when the lifting mechanism adjusts the position of the support platform 11, reducing the displacement of the die 7 caused by mechanical vibration or inertia; at the same time, the limiting mechanism 5 forms a physical constraint on the die 7, reducing the offset or slippage of the die 7 relative to the support platform 11 during movement, purging or bonding, thereby improving processing accuracy and process consistency.

[0079] In some possible embodiments of this application, reference is made to Figure 3 and Figure 4 The bonding equipment also includes a transfer mechanism 6, which includes a motion component and a pick-and-place component. The motion component is connected to the base 1, and the pick-and-place component is connected to the motion component. The pick-and-place component is used to pick up or release the die 7, and the motion component is used to drive the pick-and-place component to move relative to the base 1.

[0080] In the embodiments of this application, reference is made to Figure 3 and Figure 4 The pick-and-place assembly is used to remove the die 7 from the wafer 8. The motion assembly drives the pick-and-place assembly to move the die 7 onto the support stage 11. After the die 7 is processed, the pick-and-place assembly removes the die 7 from the support stage 11. The motion assembly drives the pick-and-place assembly to move to the storage location or perform other processing.

[0081] In this embodiment of the application, the motion component can be a motor and a lead screw, or it can be a robotic arm. The pick-and-place component can pick up and place the crystal 7 by means of negative pressure adsorption or clamping.

[0082] The bonding device of this application embodiment, since the transfer mechanism 6 adopts a combination structure of motion component and pick-and-place component, can realize efficient and automated transfer of die 7 in the device, improve loading and unloading efficiency and operation continuity; since the pick-and-place component is used to pick up or release die 7, it can reduce the risk of contamination caused by manual intervention, and can also be compatible with die 7 devices of different sizes and thicknesses.

[0083] It should be added that a control component is also included. The control component is electrically connected to the detection mechanism 2, the processing mechanism 3, the purging mechanism 4, and the transfer mechanism 6. The detector 21 sends the coordinates of the defect located on the grain 7 to the control component. The control component transforms the wireless coordinates from the local coordinate system of the grain 7 to the global coordinate system of the purging component, and then plans the path and the angle of the purging component. That is, it plans the movement path of the purging component driven by the displacement component to the defect of the grain 7, as well as the angle and air pressure of the purging component for purging the grain 7.

[0084] This application provides a bonding device, with reference to... Figures 1 to 5The transfer mechanism 6 uses a pick-and-place component to pick up the crystal 7 and a motion component to transport the crystal 7 to the support platform 11. The negative pressure limiting mechanism 5 picks up the crystal 7 and limits its position. The first lifting component moves the support platform 11 into the receiving cavity of the base 1. The second lifting component adjusts the support platform 11 to align with the detection mechanism 2. The detection mechanism 2 includes six detectors 21 located on different sides of the crystal 7. The six detectors 21 detect the six sides of the crystal 7 through a reflector 22. The detectors 21 capture and pick up defects (particles, microcracks, dirt, etc.) on different surfaces and edges of the crystal 7 in real time. The control component uses the data detected by the six detectors 21 to control the displacement component to adjust the position and angle, aligning the blowing side of the purging component with the defective area on the crystal 7. The control component controls the parameters of the purging component to optimize only the nitrogen pressure, spray distance, and pulse frequency for defects. The purging unit blows away the defect locations of the grain 7. After the purging action is completed, the detector 21 performs a second scan on the grain 7. Based on the scan results of the second detection by the detector 21, it is determined whether to bond the grain 7 or discard it. If the second detection result indicates that particles still exist on the surface of the grain 7, the nitrogen pressure and frequency of the purging unit are increased to remove them again. If defects are still detected in the grain 7 after the second purging, the grain is discarded and the defect characteristics are recorded. If the second detection result indicates that there are no defects on the surface of the grain 7, bonding can be performed.

[0085] The sequence numbers of the embodiments in this application are for descriptive purposes and do not represent the superiority or inferiority of the embodiments. The above are merely preferred embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made based on the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A bonding apparatus, characterized in that, include: A base is connected to a support platform, which is used to place the grains to be processed; A testing mechanism, connected to the base, is used to test the grains on the carrier stage; A processing mechanism, connected to the base, is used to process the grains on the support platform.

2. The bonding apparatus according to claim 1, characterized in that, The detection mechanism includes at least two detectors, which are disposed on different sides of the support stage. The detectors are used to detect the grains, and the processing mechanism processes the grains based on the detection results of the multiple detectors.

3. The bonding apparatus according to claim 2, characterized in that, The detection mechanism also includes a reflector connected to the base. Each detector is equipped with a corresponding reflector, and the detector obtains the state information of the crystal through the corresponding reflector.

4. The bonding apparatus according to any one of claims 1 to 3, characterized in that, It also includes a purging mechanism connected to the base, which purifies the grains on the carrier platform based on the detection results of the detection mechanism.

5. The bonding apparatus according to claim 4, characterized in that, The purging mechanism includes a displacement component and a purging element. The displacement component is connected to the base, and the purging element is connected to the displacement component. The displacement component is used to drive the purging element to move relative to the base, and the purging element is used to purge the grains.

6. The bonding apparatus according to claim 5, characterized in that, The displacement assembly includes a plurality of sequentially hinged connecting rods, and the hinge axes between different connecting rods have an included angle; The multiple connecting rods form a robotic arm. The connecting rod at one end of the robotic arm is connected to the base, and the connecting rod at the other end of the robotic arm is hinged to the purging member. The purging member rotates relative to the connecting rod to different positions on the support platform.

7. The bonding apparatus according to claim 6, characterized in that, The connecting rod of the purging component is an end rod, and the purging component is rotatably connected to the end rod. The purging component has a purging side for releasing the purging medium. The purging component rotates relative to the end rod, and the purging side faces different positions on the support platform.

8. The bonding apparatus according to any one of claims 1 to 3, characterized in that, The base includes a receiving cavity, and the bonding device further includes a lifting mechanism, the lifting mechanism comprising: The first lifting assembly is used to drive the support platform into or out of the receiving cavity; The second lifting component is connected to the first lifting component. The second lifting component is used to drive the support platform to align with the detection mechanism, and the displacement accuracy of the second lifting component is greater than that of the first lifting component.

9. The bonding apparatus according to any one of claims 1 to 3, characterized in that, It also includes a limiting mechanism connected to the support platform, which is used to limit the movement of the grain relative to the support platform.

10. The bonding apparatus according to any one of claims 1 to 3, characterized in that, It also includes a transfer mechanism, which includes a motion component and a pick-and-place component. The motion component is connected to the base, and the pick-and-place component is connected to the motion component. The pick-and-place component is used to pick up or release the die, and the motion component is used to drive the pick-and-place component to move relative to the base.

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