A solution automatic filtering circulating device for PCB chemical copper plating process

CN224853931UActive Publication Date: 2026-10-16深圳市英诺泰克科技有限公司
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Patent Information

Application Number
CN202522495553.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-11-25
Publication Date
2026-10-16
Estimated Expiration
2035-11-25

AI Technical Summary

Technical Problem

[0003]现有的PCB沉铜设备多采用单组过滤组件,更换滤芯时需停机操作,导致沉铜工艺中断,不仅降低生产效率,还可能因溶液静置造成局部浓度不均,引发镀层厚度偏差,因此我们需要提出一种PCB化学沉铜工艺的溶液自动过滤循环装置

Benefits of technology

[0017] 1. This utility model, by setting two sets of symmetrical filter box assemblies and a linkage solenoid valve in conjunction with the liquid delivery assembly, can switch to the other set to continue working when one set of filter box assemblies is under maintenance, avoiding process interruption caused by filter element replacement and effectively improving equipment uptime.

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Abstract

The utility model discloses a kind of solution automatic filtration circulating devices of PCB chemical copper plating process, including main groove, the bottom of main groove is fixedly connected with three-way pipe;Two groups of filter box assemblies are symmetrically installed below main groove, two liquid outlets of three-way pipe are respectively connected with the liquid inlet of two groups of filter box assemblies by pipeline, for filtering liquid that three-way pipe flows out, and solenoid valve is connected in series on three-way pipe and pipeline;By setting two groups of symmetric filter box assemblies and linkage solenoid valve cooperate liquid delivery component, it can switch to another group to continue working when one group of filter box assemblies is maintained, avoid process interruption caused by filter core replacement, effectively improve equipment availability;By the setting of filter bag and filter screen, cooperate the filter plate and conical section design in main groove, realize progressive purification, improve impurity removal rate in solution, significantly reduce PCB via hole blockage risk, while filter box assembly disassembly does not need tool, the advantage that filter core replacement time is shortened.
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Description

Technical Field

[0001] This utility model relates to the field of PCB processing technology, specifically to an automatic filtration and circulation device for a PCB chemical copper plating process. Background Technology

[0002] In the PCB manufacturing process, a copper film needs to be deposited on the surface of a non-conductive substrate or the inner wall of a via through a chemical copper plating process to facilitate subsequent electroplating on the board surface. This allows for the formation of printed circuits through etching or the interconnection of inner and outer layers between multilayer circuit boards. In the PCB chemical copper plating process, the cleanliness of the copper plating solution directly affects the plating quality and the metallization effect of the vias.

[0003] Existing PCB copper plating equipment mostly uses a single set of filter components. When replacing the filter element, the machine needs to be stopped, which interrupts the copper plating process. This not only reduces production efficiency, but may also cause uneven concentration in some areas due to solution settling, resulting in deviations in plating thickness. Therefore, we need to propose an automatic solution filtration and circulation device for the PCB chemical copper plating process. Utility Model Content

[0004] The purpose of this invention is to provide an automatic filtration and circulation device for the solution in the PCB chemical copper plating process. By setting two sets of filter box components in conjunction with solenoid valves, it can realize single-set filtration, single-set standby, or alternating operation modes, achieving the effect of completing the maintenance and replacement of filter components without interrupting the copper plating process, thereby solving the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] An automatic filtration and circulation device for a PCB chemical copper plating process includes a main tank, the bottom of which is fixedly connected to a three-way pipe.

[0007] Two sets of filter box assemblies are symmetrically installed below the main tank. The two outlets of the three-way pipe are connected to the inlets of the two sets of filter box assemblies through pipes to filter the liquid flowing out of the three-way pipe. A solenoid valve is connected in series with the three-way pipe and the pipe.

[0008] The filter box assembly includes a box body, a box cover installed on the top of the box body by a buckle, and filter bags and filter screens slidably inserted into the inside of the box body;

[0009] The liquid delivery assembly, installed on the main tank, is used to transport the solution filtered by the two sets of filter box assemblies back into the main tank.

[0010] Preferably, the liquid conveying assembly includes a spray pipe, which is fixedly installed on the upper part of the inner wall of one side of the main tank. Two sets of liquid inlet pipes are fixedly connected to one side of the spray pipe. One end of each set of liquid inlet pipes passes through the main tank and is connected to a conveying pipe. One end of each set of conveying pipes is fixedly connected to a liquid pump. The liquid inlets of the two sets of liquid pumps are respectively connected to the interior of the two sets of tanks through pipes.

[0011] Preferably, the bottom of the spray pipe is provided with several sets of spray holes at equal intervals, and a one-way valve is connected in series inside the liquid inlet pipe.

[0012] Preferably, the inner wall of the box is provided with two sets of concave insertion slots symmetrically, the filter bag and the filter screen are respectively inserted into the two sets of concave insertion slots, and the filter bag is located at the liquid inlet of the box, and the top of the filter bag and the filter screen abuts against the bottom of the box cover.

[0013] Preferably, the filter bag is a PP polypropylene filter bag, and the filter screen is an L-shaped sintered stainless steel filter screen.

[0014] Preferably, a support frame is fixedly installed on the top outer wall of the main tank, and a base plate is fixedly installed on the bottom of the support frame. The tank body and the liquid pump are both fixedly installed on the top of the base plate.

[0015] Preferably, the main trough is composed of a rectangular section and a conical section, and a filter plate is installed at the junction of the rectangular section and the conical section to prevent small particulate impurities from being lifted and flowing.

[0016] Compared with the prior art, the beneficial effects of this utility model are:

[0017] 1. This utility model, by setting two sets of symmetrical filter box assemblies and a linkage solenoid valve in conjunction with the liquid delivery assembly, can switch to the other set to continue working when one set of filter box assemblies is under maintenance, avoiding process interruption caused by filter element replacement and effectively improving equipment uptime.

[0018] 2. This utility model achieves progressive purification by setting up filter bags and filter screens, combined with the filter plate and conical section design in the main tank, thereby improving the removal rate of impurities in the solution and significantly reducing the risk of PCB via blockage. It also has the advantages of requiring no tools to disassemble and assemble the filter box components and shortening the filter element replacement time. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural diagram of the present invention viewed from the front;

[0020] Figure 2 This is a side view of the three-dimensional structure of the present invention;

[0021] Figure 3 This is a cross-sectional structural diagram of the present invention;

[0022] Figure 4This is a schematic diagram of the structure of the three-way pipe and two sets of filter boxes of this utility model;

[0023] Figure 5 This is a schematic diagram of the structure of the housing and liquid conveying assembly of this utility model.

[0024] In the diagram: 1. Main tank; 2. T-pipe; 3. Solenoid valve; 4. Filter box assembly; 41. Box body; 42. Box cover; 43. Concave insertion slot; 44. Filter bag; 45. Filter screen; 5. Liquid delivery assembly; 51. Spray pipe; 52. Liquid inlet pipe; 53. Delivery pipe; 54. Liquid pump; 55. Check valve; 6. Base plate; 7. Filter plate. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] Please see Figure 1-5 This utility model provides a technical solution:

[0027] An automatic filtration and circulation device for a PCB chemical copper plating process includes a main tank 1, with a three-way pipe 2 fixedly connected to the bottom of the main tank 1.

[0028] Two sets of filter box assemblies 4 are symmetrically installed below the main tank 1. The two liquid outlets of the three-way pipe 2 are respectively connected to the liquid inlets of the two sets of filter box assemblies 4 through pipes to filter the liquid flowing out of the three-way pipe 2. A solenoid valve 3 is connected in series with the three-way pipe 2 and the pipe.

[0029] The filter box assembly 4 includes a box body 41, a box cover 42 is installed on the top of the box body 41 by a snap fastener, and a filter bag 44 and a filter screen 45 are slidably inserted into the inside of the box body 41.

[0030] The liquid delivery assembly 5 is installed on the main tank 1 and is used to transport the solution filtered by the two sets of filter box assemblies 4 back into the main tank 1.

[0031] By setting up two sets of filter box components 4 in conjunction with solenoid valves 3, a single-set filtration, single-set standby, or alternating operation mode can be achieved, thus achieving the effect of completing filter component maintenance and replacement without interrupting the copper plating process.

[0032] In an optional embodiment: the liquid delivery assembly 5 includes a spray pipe 51, which is fixedly installed above the inner wall of one side of the main tank 1. Two sets of liquid inlet pipes 52 are fixedly connected to one side of the spray pipe 51. One end of each set of liquid inlet pipes 52 passes through the main tank 1 and is connected to a delivery pipe 53. One end of each set of delivery pipes 53 is fixedly connected to a liquid pump 54. The inlets of the two sets of liquid pumps 54 are respectively connected to the interior of the two sets of tanks 41 through pipes.

[0033] It should be noted that the solenoid valve 3 and the liquid pump 54 are linked for control. When a single solenoid valve 3 is opened, the corresponding liquid pump 54 starts, and when the other solenoid valve 3 is closed, the liquid pump 54 stops. By setting an independent liquid pump 54 corresponding to each group of filter box components 4, the directional delivery of the filtered solution is realized. With the pipeline design of the delivery pipe 53 and the liquid inlet pipe 52, the "non-stop maintenance" function is realized.

[0034] In an optional embodiment: the bottom of the spray pipe 51 is provided with several sets of spray holes at equal intervals, and a one-way valve 55 is connected in series inside the liquid inlet pipe 52.

[0035] It should be noted that by setting equidistant spray holes at the bottom of the spray pipe 51, the return solution can be evenly sprayed onto the surface of the copper immersion liquid in the main tank 1. At the same time, a one-way valve 55 is connected in series in the inlet pipe 52 to prevent the solution from flowing back and ensure that the filtered solution flows back to the main tank 1 in one direction.

[0036] In an optional embodiment: two sets of concave insertion slots 43 are symmetrically provided on the inner wall of the housing 41. The filter bag 44 and the filter screen 45 are respectively inserted into the two sets of concave insertion slots 43, and the filter bag 44 is located at the liquid inlet of the housing 41. The top of the filter bag 44 and the filter screen 45 abut against the bottom of the housing cover 42.

[0037] It should be noted that by setting a concave insertion groove 43, the filter bag 44 and the filter screen 45 are slidably inserted and fixed by the bottom of the box cover 42. At the same time, the installation order of the filter bag 44 on the liquid inlet side is clearly defined, which achieves the effect of convenient disassembly and assembly of the filter assembly and ensures a reasonable filtration order (first the filter bag conducts preliminary interception and then the filter screen conducts fine filtration).

[0038] In an optional embodiment: the filter bag 44 is a PP polypropylene filter bag, and the filter screen 45 is a 316L plate-shaped stainless steel sintered filter screen.

[0039] It should be noted that by selecting chemically resistant PP polypropylene material to make filter bags 44, the initial interception by the PP polypropylene filter bags can effectively intercept larger copper residues of 10-20μm; then, fine filtration is carried out by 316L stainless steel sintered filter mesh, which can withstand the acid and alkali corrosion of copper immersion solution and filter out fine copper powder impurities of 5-10μm, thus achieving the effect of adapting to the characteristics of copper immersion process solution and extending the service life of filter components.

[0040] In an optional embodiment: a support frame is fixedly installed on the top outer wall of the main tank 1, and a base plate 6 is fixedly installed on the bottom of the support frame. The tank 41 and the liquid pump 54 are both fixedly installed on the top of the base plate 6.

[0041] It should be noted that by setting up a top support frame and a bottom plate 6 to form a stable support structure, the box 41 and the liquid pump 54 are integrated and installed on the bottom plate 6, which achieves the effect of reducing the load-bearing pressure of the main tank 1 and ensuring the overall structural stability of the equipment.

[0042] In an optional embodiment: the main channel 1 is composed of a rectangular section and a conical section, and a filter plate 7 is installed at the junction of the rectangular section and the conical section to prevent small particulate impurities from being lifted and flowing.

[0043] It should be noted that by designing the main tank 1 as a rectangular section (copper plating reaction zone) and a conical section (impurity deposition zone), and installing a filter plate 7 at the junction, it can not only prevent impurities raised during the copper plating process from entering the reaction zone, but also guide the impurities to gather at the bottom of the conical section, thereby reducing the risk of impurities clogging the PCB board vias and improving the uniformity of the copper plating layer.

[0044] Working principle:

[0045] When the device is working, impurities in the copper immersion solution in the main tank 1 accumulate at the bottom conical section under the action of gravity, passing through the filter plate 7. The solution is then diverted to two sets of filter box assemblies 4 via the three-way pipe 2. At this time, by controlling the on / off state of the solenoid valve 3, one set of filter boxes can be selected to operate: when one set of filter boxes is running, the corresponding solenoid valve 3 opens, and the solution first enters the PP filter bag 44 inside the box 41 to intercept larger copper residues. Then, it passes through the 316L stainless steel filter screen 45 for further filtration of fine copper powder and other impurities. The filtered clear liquid is then discharged from the liquid... Pump 54 pumps the solution into spray pipe 51 through delivery pipe 53 and inlet pipe 52, and finally returns it evenly to the rectangular section of main tank 1 through spray holes. One-way valve 55 can prevent backflow of solution. When a certain set of filter box assembly 4 needs to be maintained, the corresponding solenoid valve 3 is closed and its liquid pump 54 is turned off, and the other set of filter box assembly 4 can continue to work, realizing maintenance without stopping the machine. The filter plate 7 in main tank 1 can block impurities from being lifted, and together with the deposition effect of the conical section, further improves the cleanliness of the solution and ensures the stability of PCB chemical copper plating process.

[0046] The control method in this application is through a controller. The controller's control circuit can be implemented by a person skilled in the art through simple programming and is common knowledge in the field. Furthermore, since this application is mainly used to protect the structure, shape, and their combination, this application will not explain the control method and circuit connection in detail.

[0047] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An automatic solution filtration and circulation device for PCB chemical copper plating process, characterized in that, Includes a main channel (1), and a three-way pipe (2) is fixedly connected to the bottom of the main channel (1); Two sets of filter box assemblies (4) are symmetrically installed below the main tank (1). The two outlets of the three-way pipe (2) are respectively connected to the inlet of the two sets of filter box assemblies (4) through pipes to filter the liquid flowing out of the three-way pipe (2). A solenoid valve (3) is connected in series between the three-way pipe (2) and the pipe. The filter box assembly (4) includes a box body (41), a box cover (42) is installed on the top of the box body (41) by a buckle, and a filter bag (44) and a filter screen (45) are slidably inserted into the inside of the box body (41); The liquid delivery assembly (5) is installed on the main tank (1) and is used to transport the solution filtered by the two sets of filter box assemblies (4) back into the main tank (1).

2. The automatic solution filtration and circulation device for PCB chemical copper plating process according to claim 1, characterized in that: The liquid conveying assembly (5) includes a spray pipe (51), which is fixedly installed on the upper side of the inner wall of one side of the main tank (1). Two sets of liquid inlet pipes (52) are fixedly connected to one side of the spray pipe (51). One end of each set of liquid inlet pipes (52) passes through the main tank (1) and is connected to a conveying pipe (53). One end of each set of conveying pipes (53) is fixedly connected to a liquid pump (54). The inlets of the two sets of liquid pumps (54) are connected to the interior of the two sets of tanks (41) through pipes.

3. The automatic solution filtration and circulation device for PCB chemical copper plating process according to claim 2, characterized in that: The bottom of the spray pipe (51) is provided with several sets of spray holes at equal intervals, and a one-way valve (55) is connected in series inside the liquid inlet pipe (52).

4. The automatic solution filtration and circulation device for PCB chemical copper plating process according to claim 1, characterized in that: The inner wall of the box (41) is symmetrically provided with two sets of concave insertion slots (43). The filter bag (44) and the filter screen (45) are respectively inserted into the two sets of concave insertion slots (43), and the filter bag (44) is located at the liquid inlet of the box (41). The top of the filter bag (44) and the filter screen (45) abut against the bottom of the box cover (42).

5. The automatic solution filtration and circulation device for PCB chemical copper plating process according to claim 1, characterized in that: The filter bag (44) is a PP polypropylene filter bag, and the filter screen (45) is a 316L plate-shaped stainless steel sintered filter screen.

6. The automatic solution filtration and circulation device for PCB chemical copper plating process according to claim 2, characterized in that: A support frame is fixedly installed on the top outer wall of the main tank (1), and a base plate (6) is fixedly installed at the bottom of the support frame. The box body (41) and the liquid pump (54) are both fixedly installed on the top of the base plate (6).

7. The automatic solution filtration and circulation device for PCB chemical copper plating process according to claim 1, characterized in that: The main channel (1) is composed of a rectangular section and a conical section. A filter plate (7) is installed at the junction of the rectangular section and the conical section to prevent small particulate impurities from being lifted and flowing.