Constant temperature ultrasonic vibration device

Abstract

The utility model discloses a constant temperature ultrasonic vibration device, include: casing, work groove, ultrasonic oscillator, first pressure mechanism, semiconductor refrigeration plate, second pressure mechanism, temperature sensor and heat dissipation fan, be equipped with the placing groove in casing, work groove is placed in the placing groove, ultrasonic oscillator is installed in the bottom of placing groove, first pressure mechanism is connected with electromagnetic heating plate, and first pressure mechanism promotes electromagnetic heating plate and sticks to the outside wall of placing groove, and the hot end of semiconductor refrigeration plate is equipped with radiator, second pressure mechanism is connected with radiator, and second pressure mechanism promotes radiator, so that the cold end of semiconductor refrigeration plate sticks to the outside wall of placing groove, temperature sensor is located on the outside wall of placing groove, heat dissipation fan is installed on the lateral wall of casing, the constant temperature ultrasonic vibration device provided by the utility model adopts the separate structure design, effectively avoids groove volume scale leakage liquid, can replace work groove fast, and continuously handles multiple batches of liquid.

Description

Technical Field

[0001] This utility model relates to the field of experimental instrument technology, and in particular to a constant temperature ultrasonic vibration device. Background Technology

[0002] A water bath constant temperature shaking table, also known as a water bath constant temperature shaker, is an experimental instrument that combines a temperature-controlled constant temperature water bath with a shaker. It is a special constant temperature device with a shaker suitable for experiments in fields such as environmental protection, medical teaching, health and epidemic prevention, drug testing, zoology and botany, marine science and food engineering.

[0003] In terms of structural design, the heating function of existing water bath constant temperature shakers is usually achieved through electric heating rods, while the oscillation function adopts different forms of oscillation structures such as rotary oscillation, reciprocating oscillation, or dual-function oscillation, depending on actual needs. However, long-term practical application has revealed that both the electric heating rod and the temperature sensor are located inside the water bath of the water bath constant temperature shaker. Both are in constant contact with the liquid, and liquid residue easily adheres to their surfaces, making cleaning difficult. Furthermore, the electric heating rod, as a consumable component, is cumbersome to repair in case of subsequent malfunctions due to its built-in installation. Secondly, the sealing at the interface between the electric heating rod, temperature sensor, and water bath is prone to failure over time, leading to the risk of liquid leakage. In addition, the water bath is generally equipped with a drain pipe for easy drainage, but the internal channels of the drain pipe are narrow and difficult to clean thoroughly. Over time, dirt easily accumulates, affecting not only the drainage effect but also potentially impacting the cleanliness of the experimental environment.

[0004] It is evident that existing technologies still need improvement and enhancement. Utility Model Content

[0005] In view of the shortcomings of the prior art, the purpose of this utility model is to provide a constant temperature ultrasonic vibration device, which aims to solve the technical problem that the heating device of the constant temperature oscillator in the prior art adopts an immersion installation structure, thereby causing a series of problems.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: A constant-temperature ultrasonic vibration device, comprising: The housing has a placement slot inside, and an installation cavity is provided between the outer wall of the placement slot and the inner wall of the housing. The working tank is placed inside the placement tank and is used to hold liquid; the outer wall of the working tank is in contact with the inner wall of the placement tank, and the bottom of the working tank is in contact with the inner bottom of the placement tank. An ultrasonic oscillator, installed at the bottom of the placement tank, is used to cause the liquid in the working tank to vibrate. At least one first pressing mechanism is provided in the mounting cavity. The output end of the first pressing mechanism is connected to an electromagnetic heating plate. The first pressing mechanism pushes the electromagnetic heating plate to press against the outer wall of the placement tank so as to indirectly heat the liquid in the working tank through the electromagnetic heating plate. At least one semiconductor cooling plate, and each semiconductor cooling plate has a heat sink at its hot end; At least one second pressing mechanism is provided in the mounting cavity. The output end of one second pressing mechanism is connected to the heat sink of a semiconductor cooling plate. The second pressing mechanism pushes the heat sink so that the cold end of the semiconductor cooling plate is in close contact with the outer wall of the placement tank, so as to indirectly cool the liquid in the working tank through the semiconductor cooling plate. At least one temperature sensor is disposed on the outer wall of the placement tank for indirectly detecting the temperature of the liquid in the working tank; and The cooling fan is mounted on the side wall of the chassis.

[0007] Furthermore, the placement groove is a rectangular groove, and detection planes are respectively provided at the four edges of the placement groove, with at least one temperature sensor located on one detection plane; the outer surface of the working groove is adapted to the inner surface of the placement groove.

[0008] Furthermore, there are two electromagnetic heating plates and two semiconductor cooling plates. The two electromagnetic heating plates are located on two opposite outer walls of the placement slot, and the two semiconductor cooling plates are located on the other two outer walls of the placement slot.

[0009] Furthermore, the housing includes a shell and a top cover on the top of the shell, and a plurality of first mounting seats are provided inside the shell; the bottom of the placement groove is provided with a plurality of connecting ears corresponding to the positions of the first mounting seats, the connecting ears are installed on the first mounting seats by first screws, and a shock-absorbing pad is provided between the connecting ears and the first mounting seats; the top of the placement groove abuts against the bottom of the top cover.

[0010] Furthermore, the first pressing mechanism includes a base mounted on the housing, several guide columns slidably connected to the base, and a movable plate connected to one end of the multiple guide columns. An electromagnetic heating plate is mounted on the movable plate, and a spring is sleeved on each guide column, with the two ends of the spring abutting against the base and the movable plate respectively.

[0011] Furthermore, the end of the guide post away from the movable plate is provided with a threaded section, on which two locking nuts are screwed.

[0012] Furthermore, the housing is provided with a second mounting base, and the base is provided with a first waist hole. The length direction of the first waist hole is perpendicular to the side wall corresponding to the placement groove. The first waist hole is installed on the second mounting base by a second screw.

[0013] Furthermore, it also includes an air intake grille located on the side wall of the casing, and the radiator is provided with several horizontally arranged heat dissipation fins; the air intake grille is located at one end close to all the heat dissipation fins, and the cooling fan is located at the other end close to all the heat dissipation fins.

[0014] Furthermore, the top of the working groove is provided with a horizontally outwardly extending flange, and there is a gap between the bottom of the flange and the top of the housing; the top of the flange is provided with two symmetrically arranged handles.

[0015] Furthermore, the top of the working groove is provided with a cover, which is used to close the working groove.

[0016] Beneficial effects: This utility model provides a constant temperature ultrasonic vibration device with the following advantages: (1) It adopts a separate design of working tank and placement tank. The electromagnetic heating plate, semiconductor cooling plate, ultrasonic oscillator and temperature sensor are all located on the outer wall of the placement tank. The liquid to be processed is only stored in the working tank and does not come into contact with the components. This avoids the problems of dirt accumulation and difficult cleaning of traditional immersion components and avoids the risk of liquid leakage in the placement tank; (2) The working tank can be quickly replaced without complicated disassembly or long-term cleaning. It can continuously process multiple batches of liquid and improve processing efficiency. Attached Figure Description

[0017] Figure 1 A structural diagram of the constant temperature ultrasonic vibration device provided by this utility model; Figure 2 Explosion of the constant temperature ultrasonic vibration device provided by this utility model Figure 1 ; Figure 3 Explosion of the constant temperature ultrasonic vibration device provided by this utility model Figure 2 ; Figure 4 A cross-sectional view of the constant temperature ultrasonic vibration device provided by this utility model. Figure 5 A structural diagram of the first pressing mechanism in the constant temperature ultrasonic vibration device provided by this utility model; Figure 6 The structural diagram of the second pressing mechanism in the constant temperature ultrasonic vibration device provided by this utility model.

[0018] Reference numerals: 1. Housing; 11. Mounting cavity; 12. Housing; 13. Top cover; 14. First mounting base; 15. Second mounting base; 16. Silicone buffer strip; 2. Placement groove; 21. Detection plane; 22. Connecting ear; 23. First screw; 24. Shock-absorbing pad; 3. Working groove; 31. Flange; 32. Handle; 33. Cover; 33. Through hole; 331. Ultrasonic oscillator; 5. First clamping mechanism; 5. Base; 51. First waist hole; 511. Guide column; 52. Movable plate; 53. Spring; 54. Locking nut; 55. Second screw; 56. Electromagnetic heating plate; 6. Semiconductor cooling plate; 7. Radiator; 71. Heat dissipation fins; 72. Second clamping mechanism; 8. Temperature sensor; 9. Cooling fan; 10. Air inlet grille; 20. Operation panel; 30. Detailed Implementation

[0019] This utility model provides a constant-temperature ultrasonic vibration device. To make the purpose, technical solution, and effects of this utility model clearer and more explicit, the following describes this utility model in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0020] In the description of this utility model, it should be understood that the terms "upper," "lower," "left," and "right," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or a specific orientational structure and operation. Therefore, they should not be construed as limitations on this utility model. Furthermore, "first" and "second" are only for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "multiple" means two or more.

[0021] Please see Figures 1 to 6As shown, this utility model provides a constant temperature ultrasonic vibration device, including: a housing 1, a working tank 3, an ultrasonic oscillator 4, at least one first pressing mechanism 5, at least one semiconductor cooling plate 7, at least one second pressing mechanism 8, at least one temperature sensor 9, and a cooling fan 10; the housing 1 is provided with a placement tank 2, and an installation cavity 11 is provided between the outer wall of the placement tank 2 and the inner wall of the housing 1; the working tank 3 is placed in the placement tank 2 for holding liquid; the outer wall of the working tank 3 is attached to the inner wall of the placement tank 2, and the bottom of the working tank 3 is attached to the inner bottom of the placement tank 2; the ultrasonic oscillator 4 is installed at the bottom of the placement tank 2 for causing the liquid in the working tank 3 to vibrate; each of the first pressing mechanisms 5 is disposed in the installation cavity 11, and the first pressing mechanism 5... An electromagnetic heating plate 6 is connected to the output end. The first pressing mechanism 5 pushes the electromagnetic heating plate 6 to press tightly against the outer wall of the placement tank 2, so as to indirectly heat the liquid in the working tank 3 through the electromagnetic heating plate 6. Each semiconductor cooling plate 7 has a heat sink 71 at its hot end. Each second pressing mechanism 8 is located in the mounting cavity 11. The output end of one second pressing mechanism 8 is connected to the heat sink 71 of one semiconductor cooling plate 7. The second pressing mechanism 8 pushes the heat sink 71 so that the cold end of the semiconductor cooling plate 7 is pressed tightly against the outer wall of the placement tank 2, so as to indirectly cool the liquid in the working tank 3 through the semiconductor cooling plate 7. A temperature sensor 9 is located on the outer wall of the placement tank 2 for indirectly detecting the temperature of the liquid in the working tank 3. A cooling fan 10 is installed on the side wall of the housing 1.

[0022] Before oscillation treatment of the liquid, the liquid to be treated is first placed into the working tank 3, and then the working tank 3 is placed into the placement tank 2 of the casing 1, ensuring that the walls and bottoms of both are in close contact to lay the foundation for heat transfer and vibration conduction. The ultrasonic oscillator 4 is started, and the high-frequency vibration generated by it is transmitted to the working tank 3 through the placement tank 2, causing the liquid in the working tank 3 to vibrate synchronously to meet the experimental requirements for liquid oscillation treatment. During operation, the temperature sensor 9 detects the temperature of the outer wall of the placement tank 2 in real time to indirectly obtain the liquid temperature; when the detected liquid temperature is lower than the target constant temperature value, the electromagnetic heating plate 6 is activated. Due to the action of the first pressing mechanism 5, it is pressed against the outer wall of the placement tank 2, and heat is generated on the side wall of the placement tank 2 through the electromagnetic induction heating principle. This heat is transferred to the working tank 3 and the liquid in the working tank 3 by thermal conduction, thereby heating the liquid. When the detected liquid temperature is higher than the target constant temperature value, under the action of the second pressing mechanism 8, the cold end of the semiconductor cooling plate 7 is in close contact with the outer wall of the placement tank 2, and the cooling energy is conducted to the working tank 3 and its internal liquid through the placement tank 2, so as to achieve rapid cooling of the liquid. Through the dynamic control of heating and cooling, the liquid is always kept within the target constant temperature range.

[0023] After a single liquid treatment is completed, the used old working tank 3 can be directly removed from the placement tank 2 and replaced with a new working tank 3 containing the liquid to be treated, and the next round of treatment can be started. The operation is convenient and efficient.

[0024] With the above setup, the liquid to be processed only needs to be placed in the working tank 3, without direct contact with core components such as the electromagnetic heating plate 6, the semiconductor cooling plate 7, and the temperature sensor 9. After the work is completed, the working tank 3 can be directly removed for individual cleaning or replacement, effectively avoiding the problems of difficult cleaning and easy accumulation of dirt in traditional immersion structures, thus reducing maintenance costs. At the same time, the quick replacement of the working tank 3 eliminates cleaning waiting time, allowing for continuous processing of multiple batches of liquid, improving work efficiency. In addition, the constant temperature ultrasonic vibration device adopts an indirect heating and cooling method. The electromagnetic heating plate 6 and the semiconductor cooling plate 7 are both located in the mounting cavity 11, without direct contact with the liquid, avoiding the risk of interface aging and leakage, and the indirect detection of the temperature sensor 9 also reduces wear and tear, extending the life of the components.

[0025] The liquid in the working tank 3 can be oil, water, organic solvents, etc. Different liquid media can be selected according to different experimental requirements to achieve ultrasonic shaking, stirring, emulsification, cleaning, sterilization and other functions.

[0026] As described above, the electromagnetic heating plate 6 is a mature existing technology, widely used in various scenarios requiring efficient heating. It generally includes an insulating support and an electromagnetic coil wound in a groove of the insulating support. When the electromagnetic coil is energized, it generates an alternating magnetic field. The alternating magnetic field acts on the side wall of the placement tank 2, causing an eddy current effect inside the side wall of the placement tank 2. The eddy currents move at high speed inside the side wall of the placement tank 2 and generate Joule heat. Subsequently, the heat generated by the side wall of the placement tank 2 is transferred to the working tank 3 by thermal conduction through close contact with the outer wall of the working tank 3, and then transferred to the liquid in the tank through the inner wall of the working tank 3, ultimately achieving liquid heating.

[0027] The aforementioned thermoelectric cooling plate 7 is a mature existing technology widely used in precision cooling scenarios. It generally includes a heat insulation pad and a thermoelectric cooling chip housed within the heat insulation pad. A heat sink 71 is mounted on one side of the heat insulation pad, in close contact with the hot end of the thermoelectric cooling chip. An aluminum plate is mounted on the other side of the heat insulation pad, in close contact with the cold end of the thermoelectric cooling chip. When the thermoelectric cooling chip is energized, directional heat transfer occurs based on the Peltier effect, causing the temperature of the cold end of the thermoelectric cooling chip to drop rapidly while the temperature of its hot end rises. Due to its high thermal conductivity, the aluminum plate evenly transfers the cooling energy to the placement tank 2, the working tank 3, and the liquid within the working tank 3, ultimately achieving liquid cooling. The heat sink 71 dissipates heat from the hot end, preventing heat accumulation and thus reducing cooling efficiency.

[0028] The ultrasonic oscillator 4 described above is a mature existing technology. The ultrasonic oscillator 4 employs an ultrasonic piezoelectric ceramic crystal array. Multiple thin piezoelectric ceramic wafers are arranged linearly or in a planar array and fixed to the bottom of the placement tank 2 using high-temperature and vibration-resistant adhesives, ensuring vibration transmission efficiency and long-term stability. When an alternating current is applied to the electrodes of the crystal array, the piezoelectric ceramic wafers undergo periodic mechanical deformation under the influence of the electric field. The synchronous vibration of multiple wafers superimposed to form directional propagating ultrasonic waves.

[0029] It should be noted that the constant-temperature ultrasonic vibration device also includes a controller installed in the mounting cavity 11 and an operation panel 30 installed on the side wall of the housing 1. The electromagnetic heating plate 6, the semiconductor cooling plate 7, the ultrasonic oscillator 4, and the cooling fan 10 are electrically connected to the controller. The controller, operation panel 30, and their circuit connections are existing technologies. The controller includes a microprocessor, an integrated power module, a power drive circuit, and a multi-channel communication interface. The controller receives real-time data from the temperature sensor 9, compares it with the target parameters set on the operation panel 30, and outputs control signals according to a preset algorithm. This controls the operating parameters of the electromagnetic heating plate 6 and the semiconductor cooling plate 7 to maintain a constant temperature, and controls the operating parameters of the ultrasonic oscillator 4 to meet the oscillation intensity requirements. Simultaneously, it controls the start / stop and speed of the cooling fan 10. In addition, the controller has built-in protection logic. When abnormal conditions such as over-temperature or over-current are detected, it can automatically cut off the power supply to the relevant components and trigger an alarm to ensure the safe operation of the equipment. The controller is not shown in the attached drawings.

[0030] In a preferred embodiment, see [reference] Figure 2 , 3The placement tank 2 is a rectangular tank, and the outer surface of the working tank 3 is adapted to the inner surface of the placement tank 2 to ensure that after the working tank 3 is placed, the outer wall can fully fit the inner wall (including the four side walls and the inner bottom) of the placement tank 2, which can ensure efficient transmission of vibration energy and uniform temperature transmission. Specifically, the placement tank 2 is made of sheet material with magnetic and thermal conductivity, and can be processed by stamping, stretching, bending and welding. The working tank 3 is made of sheet material with thermal conductivity, and can be processed by stamping, stretching, bending and welding. The four edges of the placement tank 2 are respectively provided with detection planes 21, and at least one temperature sensor 9 is set on one detection plane 21. Specifically, the temperature sensor 9 is a patch temperature sensor 9, which is in close contact with the detection plane 21 of the placement tank 2 by plane bonding, which greatly increases the contact area between the temperature sensor 9 and the placement tank 2, and can quickly and accurately capture the temperature change of the placement tank 2, thereby indirectly reflecting the temperature of the liquid in the working tank 3. In this embodiment, four patch-type temperature sensors are respectively installed on the four detection planes 21 of the placement slot 2. Each temperature sensor 9 is fixed with high-temperature resistant thermally conductive adhesive to ensure seamless contact with the detection plane 21. In practical applications, the controller will collect the detection values ​​of the four temperature sensors 9 in real time, calculate and take the average value of the four temperature values ​​as the final liquid temperature reference value through the built-in algorithm, so as to avoid the error caused by local thermal disturbance of a single sensor.

[0031] In a preferred embodiment, see [reference] Figure 3 The electromagnetic heating plate 6 and the semiconductor cooling plate 7 are both configured in pairs. The two electromagnetic heating plates 6 are located on two opposite outer walls of the placement tank 2, and the two semiconductor cooling plates 7 are located on the other two outer walls of the placement tank 2. During operation, the first pressing mechanism 5 pushes the corresponding electromagnetic heating plate 6 to press tightly against the outer wall of the placement tank 2, ensuring that the placement tank 2 can generate heat. The second pressing mechanism 8 pushes the corresponding semiconductor cooling plate 7 to press tightly against the outer wall of the placement tank 2, ensuring that the cold energy is quickly conducted to the placement tank 2. The use of symmetrical semiconductor cooling plates 7 and symmetrical electromagnetic heating plates 6 to form a surrounding temperature control structure can evenly transfer heat or cold energy from all sides of the placement tank 2, effectively avoiding local temperature differences in the liquid in the working tank 3, and further improving the uniformity and stability of the device's liquid temperature control.

[0032] In a preferred embodiment, see [reference] Figure 3 , 4The housing 1 includes a housing 12 and a top cover 13 located on the top of the housing 12. Specifically, the top cover 13 is fixedly connected to the housing 12 by fasteners, wherein the fasteners are screws. The housing 12 is provided with a plurality of first mounting seats 14. The bottom of the placement slot 2 is provided with a plurality of connecting ears 22 corresponding to the positions of the first mounting seats 14. The connecting ears 22 are mounted on the first mounting seats 14 by first screws 23, and a shock-absorbing pad 24 is provided between the connecting ears 22 and the first mounting seats 14. In this embodiment, four first mounting seats 14 are provided to ensure the stability of the placement slot 2 installation. By providing shock-absorbing pads 24, the vibration generated when the ultrasonic oscillator 4 is working can be absorbed, avoiding the vibration from being transmitted to the housing 12 and causing resonance noise. At the same time, the vibration can reduce the loosening effect of the first screws 23 at the connection part.

[0033] The top of the placement groove 2 abuts against the bottom of the upper cover 13 to limit the vertical displacement of the placement groove 2 and ensure the relative position stability of the placement groove 2 and related components inside the housing 12. Preferably, the bottom of the upper cover 13 is provided with a raised silicone buffer strip 16 around the circumference. The silicone buffer strip 16 abuts against the placement groove 2 to improve the sealing of the top of the placement groove 2 and to buffer vibration and prevent vibration from being transmitted to the upper cover 13.

[0034] Preferably, the bottom of the housing 12 is provided with shock-absorbing feet.

[0035] In a preferred embodiment, see [reference] Figure 5 The first pressing mechanism 5 includes a base 51 mounted on the housing 12, several guide posts 52 slidably connected to the base 51, and a movable plate 53 connected to one end of the guide posts 52. An electromagnetic heating plate 6 is mounted on the movable plate 53. A spring 54 is sleeved on each guide post 52, and the two ends of the spring 54 abut against the base 51 and the movable plate 53, respectively. The sliding fit between the guide post 52 and the base 51 restricts the movement direction of the movable plate 53, ensuring that the movable plate 53 drives the electromagnetic heating plate 6 to move only in the direction close to or away from the outer wall of the placement groove 2. Combined with the elastic force generated by the spring 54, the movable plate 53 is continuously pushed, so that the electromagnetic heating plate 6 is tightly attached to the outer wall of the placement groove 2. Even if the placement groove 2 vibrates due to the action of the ultrasonic oscillator 4, the spring 54 can compensate for the gap in real time through its own expansion and contraction, maintaining a stable contact state.

[0036] Further, see Figure 5The guide post 52 has a threaded section at the end away from the movable plate 53, and two locking nuts 55 are screwed onto the threaded section. By screwing in or out the locking nuts 55, the extension length of the guide post 52 relative to the base 51 (i.e., the distance between the movable plate 53 and the base 51) can be adjusted, thereby adjusting the elastic force of the spring 54 and ensuring that the movable plate 53 pushes the electromagnetic heating plate 6 tightly against the outer wall of the placement groove 2; in addition, the use of double locking nuts 55 has an anti-loosening function and effectively resists the risk of loosening caused by ultrasonic vibration.

[0037] Furthermore, see Figure 4 , 5 The housing 12 is provided with a second mounting base 15, and the base 51 is provided with a first waist hole 511. The length direction of the first waist hole 511 is perpendicular to the side wall corresponding to the placement groove 2. The first waist hole 511 is installed on the second mounting base 15 by a second screw 56. When installing the electromagnetic heating plate 6, a locking nut 55 is pre-screwed in so that the elongation of the guide post 52 is less than the preset length value. Then, the base 51 is pushed to move towards the placement groove 2. The second screw 56 slides relative to the first waist hole 511. After the electromagnetic heating plate 6 contacts the side wall of the placement groove 2, the second screw 56 is tightened to lock the base 51 onto the second mounting seat 15. Then, the previously screwed-in locking nut 55 is slightly unscrewed. Under the elastic force of the spring 54, the guide post 52 pushes the movable plate 53 forward, causing the electromagnetic heating plate 6 to fit tightly against the side wall of the placement groove 2, ensuring the required fit for heating the placement groove 2. Finally, another locking nut 55 is screwed into the threaded section of the guide post 52 and tightened together with the first locking nut 55. The double locking nut 55 locking structure locks the elongation of the guide post 52, ensuring the long-term stability of the fit of the electromagnetic heating plate 6.

[0038] See above. Figure 6 The structure of the second pressing mechanism 8 is similar to that of the first pressing mechanism 5. For details, please refer to the first pressing mechanism 5 described above. The structure and working principle of the second pressing mechanism 8 will not be repeated here.

[0039] In a preferred embodiment, see [reference] Figure 1 , 23. It also includes an air intake grille 20 located on the side wall of the housing 1. The radiator 71 has several horizontally arranged heat dissipation fins 72. The air intake grille 20 is located at one end close to all the heat dissipation fins 72, and the cooling fan 10 is located at the other end close to all the heat dissipation fins 72. In this embodiment, there are two air intake grilles 20 and two cooling fans 10, with the two air intake grilles 20 located on the same side wall of the housing 12, and the two cooling fans 10 correspondingly located on the other opposite side wall of the housing 12, forming a symmetrical airflow channel with the air intake grilles 20. During operation, external cold air can simultaneously enter the housing 1 through the two air intake grilles 20, flowing directly to the heat dissipation fins 72 of the radiator 71, and passing evenly along the gaps between the horizontally distributed heat dissipation fins 72, so that the heat transferred from the hot end of the semiconductor cooling plate 7 to the radiator 71 can quickly exchange heat with the cold air; after the heat exchange is completed, the hot air will be promptly extracted from the outside of the housing 1 by the cooling fan 10, improving the heat dissipation efficiency inside the housing 12 and preventing the accumulation of hot air inside the housing 1, which would lead to a decrease in heat dissipation efficiency.

[0040] In a preferred embodiment, see [reference] Figure 2 , 4 The top of the working slot 3 is provided with a horizontally outwardly extending flange 31. There is a gap between the bottom of the flange 31 and the top of the housing 1 to prevent the vibration of the working slot 3 from being transmitted to the housing 1. The top of the flange 31 is provided with two symmetrically arranged handles 32, which facilitates the quick removal or placement of the working slot 3, and is especially suitable for scenarios where different working slots 3 are frequently switched.

[0041] Further, see Figure 2 The top of the working tank 3 is provided with a cover 33, which is used to seal the working tank 3. The sealing structure can reduce the convection exchange between the working tank 3 and the outside air. The cover 33 can reduce the rate of heat or cold loss in the tank and help maintain the temperature stability in the tank. In addition, it can also prevent external dust and impurities from falling into the working tank 3. Especially in scenarios such as cleaning and sample processing where the cleanliness of the tank environment is required, it can ensure that the processed object is not contaminated and improve the quality of operation.

[0042] Preferably, the cover 33 can be made of transparent material, allowing direct observation of the working status inside the working groove 3.

[0043] Preferably, see Figure 2The cover 33 may be provided with a through hole 331. If flasks, test tubes, or other containers need to be placed in the working tank 3, the mouth of the container extends out of the working tank 3 through the through hole 331. By providing the through hole 331, the container is limited, which can prevent the container from shaking or tipping over in the working tank 3 during ultrasonic vibration, ensuring that the container is stably in the ultrasonic action area, and improving the uniformity and reliability of the material processing effect in the container. In practical applications, the shape, size, and position of the through hole 331 can be flexibly opened according to specific experimental needs, and this embodiment does not limit this.

[0044] It is understood that those skilled in the art can make equivalent substitutions or changes based on the technical solution and inventive concept of this utility model, and all such substitutions or changes should fall within the protection scope of the appended claims of this utility model.

Claims

1. A constant-temperature ultrasonic vibration device, characterized in that, include: The housing (1) has a placement groove (2) inside, and an installation cavity (11) is provided between the outer wall of the placement groove (2) and the inner wall of the housing (1). The working tank (3) is placed inside the placement tank (2) and is used to hold liquid; the outer wall of the working tank (3) is attached to the inner wall of the placement tank (2), and the bottom of the working tank (3) is attached to the inner bottom of the placement tank (2); An ultrasonic oscillator (4) is installed at the bottom of the placement tank (2) to cause the liquid in the working tank (3) to vibrate. At least one first pressing mechanism (5) is provided in the mounting cavity (11). The output end of the first pressing mechanism (5) is connected to an electromagnetic heating plate (6). The first pressing mechanism (5) pushes the electromagnetic heating plate (6) to stick tightly to the outer wall of the placement tank (2) so as to indirectly heat the liquid in the working tank (3) through the electromagnetic heating plate (6). At least one semiconductor cooling plate (7), and each semiconductor cooling plate (7) has a heat sink (71) at its hot end; At least one second pressing mechanism (8) is provided in the mounting cavity (11). The output end of one second pressing mechanism (8) is connected to the heat sink (71) of a semiconductor cooling plate (7). The second pressing mechanism (8) pushes the heat sink (71) so that the cold end of the semiconductor cooling plate (7) is in close contact with the outer wall of the placement groove (2) so as to indirectly cool the liquid in the working tank (3) through the semiconductor cooling plate (7). At least one temperature sensor (9) is disposed on the outer wall of the placement tank (2) for indirectly detecting the temperature of the liquid in the working tank (3); and A cooling fan (10) is installed on the side wall of the casing (1).

2. The constant-temperature ultrasonic vibration device according to claim 1, characterized in that, The placement groove (2) is a rectangular groove, and detection planes (21) are provided at the four edges of the placement groove (2). At least one temperature sensor (9) is located on one detection plane (21); the outer surface of the working groove (3) is adapted to the inner surface of the placement groove (2).

3. The constant-temperature ultrasonic vibration device according to claim 2, characterized in that, The electromagnetic heating plate (6) and the semiconductor cooling plate (7) are both set in pairs. The two electromagnetic heating plates (6) are located on the two outer side walls of the placement groove (2) respectively; the two semiconductor cooling plates (7) are located on the other two outer side walls of the placement groove (2) respectively.

4. The constant-temperature ultrasonic vibration device according to claim 2, characterized in that, The housing (1) includes a housing (12) and a top cover (13) on the top of the housing (12). The housing (12) is provided with a plurality of first mounting seats (14). The bottom of the placement groove (2) is provided with a plurality of connecting ears (22) corresponding to the positions of the first mounting seats (14). The connecting ears (22) are mounted on the first mounting seats (14) by first screws (23), and shock-absorbing pads (24) are provided between the connecting ears (22) and the first mounting seats (14). The top of the placement groove (2) abuts against the bottom of the top cover (13).

5. The constant-temperature ultrasonic vibration device according to claim 4, characterized in that, The first pressing mechanism (5) includes a base (51) on the housing (12), a number of guide posts (52) slidably connected to the base (51), and a movable plate (53) connected to one end of the multiple guide posts (52). An electromagnetic heating plate (6) is installed on the movable plate (53). A spring (54) is sleeved on each guide post (52), and the two ends of the spring (54) abut against the base (51) and the movable plate (53) respectively.

6. The constant-temperature ultrasonic vibration device according to claim 5, characterized in that, The guide post (52) has a threaded section at the end away from the movable plate (53), and two locking nuts (55) are screwed onto the threaded section.

7. The constant-temperature ultrasonic vibration device according to claim 5, characterized in that, The housing (12) is provided with a second mounting base (15), and the base (51) is provided with a first waist hole (511). The length direction of the first waist hole (511) is perpendicular to the side wall corresponding to the placement groove (2). The first waist hole (511) is installed on the second mounting base (15) by a second screw (56).

8. The constant-temperature ultrasonic vibration device according to claim 1, characterized in that, It also includes an air intake grille (20) on the side wall of the casing (1), and the radiator (71) is provided with several horizontally arranged heat dissipation fins (72); the air intake grille (20) is located at one end close to all the heat dissipation fins (72), and the cooling fan (10) is located at the other end close to all the heat dissipation fins (72).

9. The constant-temperature ultrasonic vibration device according to claim 1, characterized in that, The top of the working groove (3) is provided with a horizontally outwardly extending flange (31), and there is a gap between the bottom of the flange (31) and the top of the housing (1); the top of the flange (31) is provided with two symmetrically arranged handles (32).

10. The constant-temperature ultrasonic vibration device according to claim 1, characterized in that, The top of the working groove (3) is provided with a cover (33), which is used to close the working groove (3).

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