Chip coating platform with doctor blade

Abstract

The utility model discloses a chip gluing platform with scraper, including operation platform and top plate, and the operation platform upper end fixedly connected with the link plate, and the link plate upper end is fixedly connected with the fender through bolt, and the operation platform is fixedly connected with the link cavity in the link plate one end away, and the link cavity bottom is fixedly connected with the drive motor, and the drive motor output is fixedly connected with the rotating cylinder, and the rotating cylinder bottom side evenly is equipped with the through -hole, and the rotating cylinder upper side is connected with the link sleeve, and the link sleeve upper end is fixedly connected with the rotating table, and the top plate bottom is fixedly connected with the electric push rod, and the electric push rod bottom is fixedly connected with the pressure cover, and the operation platform one side is fixedly connected with the vacuum pump, and the utility model discloses the detachable fender of setting, cooperation and link sleeve link's first scraper, then use detachable second scraper, can be convenient for cleaning rotating table, fender and link plate to separate gluing technology and cleaning technology to reduce the shaking of the coaxial of scraper structure and rotating structure simultaneously improving the gluing stability.

Description

Technical Field

[0001] This utility model relates to the field of chip processing technology, specifically to a chip coating platform with a scraper. Background Technology

[0002] A chip coating platform is a piece of equipment used in the photolithography process of chip manufacturing. It can uniformly coat the wafer surface with photoresist, which can provide assistance for subsequent photolithography, development or etching. Chip coating platforms can be roughly divided into spin coating and spray coating.

[0003] According to Chinese Patent Publication No. CN208712083U, entitled "A Chip Coating Platform with a Scraper," the main components include a glue cup with a glue-coated surface and a scraper unit that rotates around the axis of the glue cup. The scraper unit includes a scraper and a rotating assembly that fixes the scraper. The coating platform also includes a scraper height adjustment device for adjusting the distance between the scraper and the glue surface. The scraper height adjustment device is fixed on the glue cup, and the scraper unit is fixed on the scraper height adjustment device. The back of the scraper is set with a sloped structure at the end near the wall of the glue cup. This sloped structure and the wall of the glue cup together form a notch that allows glue accumulated on the side of the scraper to pass through.

[0004] The aforementioned patent addresses this issue by creating a sloping structure at the end of the scraper blade near the glue cup wall. This sloping structure, together with the glue cup wall, forms a notch that allows glue accumulating on the side of the scraper to pass through. As the scraper rotates, glue accumulates on its side. When the accumulation reaches a certain height, it flows away through the notch, preventing excessive glue buildup and leakage from the glue cup. Furthermore, by replacing sub-blocks of different heights, the distance between the first and second rotating parts can be adjusted, thereby adjusting the distance between the scraper and the glue surface. Simultaneously, because the sub-blocks are block-shaped, they prevent wobbling during rotation of the first and second rotating parts, maintaining operational stability.

[0005] In actual chip coating operations, besides the special design involved in the aforementioned patent, common chip coating processes also have their specific steps. A typical chip wafer is placed at the center of a rotating structure, and then a vacuum pump is turned on to create negative pressure on the rotating platform, further adhering the adhesive to the chip wafer. The workspace is then sealed with a pressure shield, and the rotating stage rotates, causing the chip wafer to rotate as well, thus achieving coating. After coating, the pressure shield needs to be opened, and the rotating structure cleaned. As with the equipment used in the aforementioned patent, a scraper is used to clean the internal structure. However, rotating platforms used for chip wafers need to maintain high dynamic balance accuracy during high-speed rotation. Synchronous rotation of the scraper and the rotating structure disrupts the original mass distribution balance, causing the center of gravity of the rotating stage to shift. This results in additional centrifugal force during rotation, leading to vibration and shaking, increasing wear and tear, and increasing equipment maintenance costs and downtime.

[0006] Therefore, a chip coating platform with a scraper is proposed to address this problem. Utility Model Content

[0007] To address the shortcomings of existing technologies, this invention provides a chip coating platform with a scraper to reduce the shaking and vibration of chip wafers during coating and reduce equipment wear.

[0008] The technical solution adopted by this utility model to solve the technical problem is as follows: a chip coating platform with a scraper, including an operating table and a top plate. A connecting plate is fixedly connected to the upper end of the operating table, and a baffle is fixedly connected to the upper end of the connecting plate by bolts. A connecting cavity is fixedly connected to the end of the operating table away from the connecting plate. A drive motor is fixedly connected to the bottom end of the connecting cavity. A rotating cylinder is fixedly connected to the output end of the drive motor. Through holes are evenly opened on the bottom side of the rotating cylinder. A connecting sleeve is sleeved on the upper side of the rotating cylinder. A rotating platform is fixedly connected to the upper end of the connecting sleeve. An electric push rod is fixedly connected to the bottom end of the top plate. A pressure cover is rotatably connected to the bottom end of the electric push rod through a bearing. A vacuum pump is fixedly connected to one side of the operating table. A pipe is fixedly connected to one end of the vacuum pump. One end of the pipe is fixedly connected to the connecting cavity and communicates with it internally. Adsorption holes are evenly opened on the upper end of the rotating platform. A clamp is fixedly connected to each of the four mutually distant sides of the connecting sleeve. A first scraper is fixedly connected to the clamp by bolts. The first scraper contacts the upper end of the connecting plate and the inner side of the baffle.

[0009] As a preferred technical solution of this utility model, two far apart slots are provided on the outer side of the upper end of the baffle frame. A clip is engaged in the slot, and a vertical rod is fixedly connected to the center of the bottom end of the clip. A second scraper is fixedly connected to the bottom end of the vertical rod. The second scraper contacts the upper surface of the rotating platform. By setting the detachable clip, vertical rod and second scraper, the upper surface of the rotating platform can be cleaned.

[0010] As a preferred technical solution of this utility model, the inner sides of both ends of the card strip are rotatably embedded with a slider, and the slider contacts the side of the card groove near the center. By setting the slider, the friction force when placing the card strip is reduced.

[0011] As a preferred technical solution of this utility model, a fixed sleeve is sleeved on the outer side of the baffle frame. Two positive and negative motors are fixedly connected to the side of the fixed sleeve away from the center. A bidirectional screw is fixedly connected to the output end of the positive and negative motors. Clamping plates are threaded to both sides of the bidirectional screw. An auxiliary rod is inserted into the clamping plate and fixedly connected to the inner side of the baffle frame. By setting the positive and negative motors to drive the bidirectional screw to rotate, the four clamping plates can be moved relative to each other, so that the chip wafer is aligned with the adsorption hole and the chip wafer is pulled by negative pressure.

[0012] As a preferred technical solution of this utility model, an electric telescopic rod is fixedly connected to the eccentric side of the bottom end of the pressure cover, and a pressure ball is fixedly connected to the bottom end of the electric telescopic rod. The pressure ball is moved down by the electric telescopic rod, so that the chip wafer is tightly attached to the rotary table.

[0013] This utility model has the following advantages: by setting a detachable baffle, cooperating with the first scraper connected to the connecting sleeve, and then using the detachable second scraper, it is easy to clean the rotating table, baffle and connecting plate, thereby separating the glue application process from the cleaning process, improving the stability of glue application, and reducing the shaking caused by the coaxiality of the scraper structure and the rotating structure. Attached Figure Description

[0014] Figure 1 This is a three-dimensional cross-sectional view of a chip coating platform with a scraper according to a preferred embodiment of the present invention.

[0015] Figure 2 This is a side cross-sectional view of a preferred embodiment of the present invention, showing a chip coating platform with a scraper.

[0016] Figure 3 This is a three-dimensional structural diagram of the first scraper of a chip coating platform with a scraper according to a preferred embodiment of the present invention.

[0017] Explanation of reference numerals in the attached drawings: 1. Operating platform; 2. Top plate; 3. Connecting plate; 4. Baffle frame; 5. Connecting cavity; 6. Rotating cylinder; 7. Connecting sleeve; 8. Rotating table; 9. Electric push rod; 10. Pressure cover; 11. Vacuum pump; 12. Adsorption hole; 13. Jacket; 14. First scraper; 15. Slot; 16. Locking strip; 17. Vertical rod; 18. Second scraper; 19. Electric telescopic rod; 20. Fixed sleeve; 21. Bidirectional screw; 22. Clamping plate; 23. Sliding ball. Detailed Implementation

[0018] The present invention will be further described below with reference to the accompanying drawings.

[0019] Please refer to the following: Figure 1-3The chip coating platform with a scraper shown includes an operating table 1 and a top plate 2. A connecting plate 3 is fixedly connected to the upper end of the operating table 1. A retaining frame 4 is fixedly connected to the upper end of the connecting plate 3 by bolts. By setting the connecting plate 3 and the retaining frame 4, it is easy to remove the retaining frame 4 and facilitate cleaning. A connecting cavity 5 is fixedly connected to the end of the operating table 1 away from the connecting plate 3. A drive motor is fixedly connected to the bottom end of the connecting cavity 5. The drive motor drives the rotating cylinder 6 to rotate, which enables the connecting sleeve 7 and the rotating table 8 to rotate, and drives the chip wafer located on the rotating table 8 to rotate stably. The output end of the drive motor is fixedly connected to the rotating cylinder 6. The connecting cavity 5 is rotatably connected to the rotating cylinder 6 through a bearing. The bottom side of the rotating cylinder 6 has through holes evenly opened. The connecting sleeve 7 is sleeved on the upper side of the rotating cylinder 6. The upper end of the connecting sleeve 7 is fixedly connected to the rotating table 8. An electric push rod 9 is fixedly connected to the bottom end of the top plate 2. The extension of the electric push rod 9 drives the pressure cover 10 to move downward, promoting... The pressure cover 10 and the baffle frame 4 are closed to facilitate stable coating of the chip wafer. The bottom end of the electric push rod 9 is rotatably connected to the pressure cover 10 through a bearing. A vacuum pump 11 is fixedly connected to one side of the operating table 1. A pipe is fixedly connected to one end of the vacuum pump 11. One end of the pipe is fixedly connected to the connecting cavity 5 and communicates with it internally. The upper end of the rotating table 8 is evenly provided with adsorption holes 12. The vacuum pump 11, in conjunction with the vacuum generator, makes the adsorption holes 12 negative pressure, thereby adsorbing the chip wafer and facilitating stable coating. The four sides of the connecting sleeve 7 that are far apart from each other are fixedly connected with a clamp 13. The clamp 13 is fixedly connected to a first scraper 14 by bolts. The first scraper 14 contacts the upper end of the connecting plate 3 and the inner side of the baffle frame 4. When it is necessary to clean the internal structure of the baffle frame 4, the drive motor on the bottom side of the connecting cavity 5 can rotate to drive the connecting sleeve 7, the clamp 13 and the first scraper 14 to rotate, which can achieve the effect of cleaning the baffle frame 4 and the upper end of the connecting plate 3.

[0020] The upper outer side of the baffle frame 4 has two far apart slots 15, and a clip 16 is engaged in the slots 15. A vertical rod 17 is fixedly connected to the center of the bottom end of the clip 16. A second scraper 18 is fixedly connected to the bottom end of the vertical rod 17. The second scraper 18 is in contact with the upper surface of the rotating table 8. The second scraper 18 is fixedly installed on the upper side of the baffle frame 4. The upper sides of the second scraper 18 have openings to facilitate cleaning the upper surface of the rotating table 8.

[0021] Among them, the inner sides of both ends of the card strip 16 are fitted with sliding balls 23, which are in contact with the side of the card slot 15 near the center. By setting the sliding balls 23, the friction of the card strip 16 when it is put into the card slot 15 can be reduced.

[0022] The baffle frame 4 is fitted with a fixed sleeve 20. Two forward and reverse motors are fixedly connected to the side of the fixed sleeve 20 away from the center. The output end of the forward and reverse motors is fixedly connected to a bidirectional screw 21. Both sides of the bidirectional screw 21 are threaded with clamping plates 22. An auxiliary rod is inserted into the clamping plate 22 and fixedly connected to the inside of the baffle frame 4. By driving the bidirectional screw 21 to rotate through the forward and reverse motors, the clamping plate 22 can move relative to each other and guide the chip wafer to the center point, thereby ensuring the stability of the chip wafer during the coating process.

[0023] Among them, an electric telescopic rod 19 is fixedly connected to the eccentric side of the bottom end of the pressure cover 10, and a pressure ball is fixedly connected to the bottom end of the electric telescopic rod 19. The extension of the electric telescopic rod 19 causes the pressure ball to press down on the chip wafer, and makes the chip wafer fit tightly against the adsorption hole 12, and then the adsorption hole 12 stably adsorbs the chip wafer.

[0024] Working principle: First, the chip wafer is placed on the rotary table 8. The fixing sleeve 20 is installed first, and then the forward and reverse motors are started to rotate the bidirectional screw 21. Then, the clamping plate 22 moves relative to each other and clamps the chip wafer, so that the chip wafer is at the adsorption hole 12. Then, the vacuum pump 11 is started to create a negative pressure state inside the baffle frame 4. Then, the fixing sleeve 20 is removed, and then the frozen nitrogen is used for purging. Further, the adhesive is adsorbed by the suction tube or other traction mechanism and then transferred to the chip wafer. Then, the electric push rod 9 extends, and the pressure cover 10 moves down to contact the inside of the baffle frame 4. Then, the drive motor on the bottom side of the connecting cavity 5 drives the rotating cylinder 6, the connecting sleeve 7, the rotary table 8 and the chip wafer to rotate, thereby realizing a stable adhesive coating process. After the chip wafer is coated with adhesive, the baffle frame 4 can be removed, and the first scraper 14 and the second scraper 18 can be installed. Then, with the cooperation of the drive motor, the baffle frame 4 and the internal structure of the baffle frame 4 can be cleaned.

[0025] The above are merely preferred embodiments of this utility model. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of this utility model, and these improvements and modifications should also be considered within the scope of protection of this utility model.

[0026] All other parts of this utility model that are not described in detail belong to the prior art, and therefore will not be described in detail here.

[0027] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A chip coating platform with a scraper, comprising an operating table (1) and a top plate (2), characterized in that, A connecting plate (3) is fixedly connected to the upper end of the operating platform (1). A retaining frame (4) is fixedly connected to the upper end of the connecting plate (3) by bolts. A connecting cavity (5) is fixedly connected to the end of the operating platform (1) away from the connecting plate (3). A drive motor is fixedly connected to the bottom end of the connecting cavity (5). A rotating cylinder (6) is fixedly connected to the output end of the drive motor. Through holes are evenly opened on the bottom side of the rotating cylinder (6). A connecting sleeve (7) is sleeved on the upper side of the rotating cylinder (6). A rotating table (8) is fixedly connected to the upper end of the connecting sleeve (7). An electric push rod (9) is fixedly connected to the bottom end of the top plate (2). The bottom end of the electric push rod (9) is rotatably connected to a pressure cover (10) via a bearing. A vacuum pump (11) is fixedly connected to one side of the operating table (1). A pipe is fixedly connected to one end of the vacuum pump (11). One end of the pipe is fixedly connected to the connecting cavity (5) and communicates with the inside. Adsorption holes (12) are evenly opened on the upper end of the rotating table (8). A jacket (13) is fixedly connected to the four sides of the connecting sleeve (7) that are far apart from each other. A first scraper (14) is fixedly connected to the jacket (13) by bolts. The first scraper (14) contacts the upper end of the connecting plate (3) and the inner side of the baffle (4).

2. The chip coating platform with a scraper as described in claim 1, characterized in that, Two far apart slots (15) are opened on the outer side of the upper end of the baffle (4). A clip (16) is engaged in the slot (15). A vertical rod (17) is fixedly connected to the center of the bottom end of the clip (16). A second scraper (18) is fixedly connected to the bottom end of the vertical rod (17). The second scraper (18) is in contact with the upper surface of the rotating table (8).

3. The chip coating platform with a scraper as described in claim 2, characterized in that, The inner sides of both ends of the card strip (16) are fitted with sliding balls (23), and the sliding balls (23) are in contact with the side of the card slot (15) near the center.

4. The chip coating platform with a scraper as described in claim 3, characterized in that, A fixing sleeve (20) is fitted on the outside of the baffle (4). Two positive and negative motors are fixedly connected to the side of the fixing sleeve (20) away from the center. A bidirectional screw (21) is fixedly connected to the output end of the positive and negative motors. A clamping plate (22) is threaded on both sides of the bidirectional screw (21). An auxiliary rod is inserted into the clamping plate (22), and the auxiliary rod is fixedly connected to the inside of the baffle (4).

5. A chip coating platform with a scraper as described in claim 1, characterized in that, An electric telescopic rod (19) is fixedly connected to the eccentric side of the bottom end of the pressure cover (10), and a pressure ball is fixedly connected to the bottom end of the electric telescopic rod (19).

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