Substrate processing chip automatic cleaning device

Abstract

The utility model relates to industrial automation and cleaning technical field discloses a kind of substrate processing chip automatic cleaning device, the utility model includes device box body;Push-pull component is set in device box body inside, including platform, set through device box body middle part;Brushing component is set in device box body inside, including drive motor, set in device box body top side;Dust collection module is set in device box body inside, including blowing component, set in device box body inside side, and located drive motor side, still include adsorption component, set in device box body inside other side, and located drive motor other side, by integration blowing, sweep, suction integrated cleaning system, substrate surface processing chip cleaning problem of not being thoroughly solved is solved. Adopt airflow blowing and rolling brush synergistic effect, can be fully disturbed and peel off attached dust, then by negative pressure adsorption concentrated discharge, improve cleaning efficiency and cleanliness, avoid secondary pollution.

Description

Technical Field

[0001] This utility model relates to the field of industrial automation and cleaning technology, specifically to an automatic cleaning device for substrate processing chips. Background Technology

[0002] In the fields of electronics manufacturing, semiconductor packaging, and precision machining, substrates such as PCBs, ceramic substrates, and metal substrates generate a large amount of fine processing debris during drilling, milling, and cutting processes. This debris includes resin dust, metal shavings, and ceramic particles. If these residues are not removed in a timely and effective manner, they will not only affect the soldering quality and electrical performance of subsequent processes, but may also lead to defects such as short circuits and poor insulation, seriously affecting yield and reliability.

[0003] However, existing cleaning devices mostly employ a single blowing or suction structure, lacking the ability to effectively remove stubborn debris and failing to achieve coordinated "blowing, sweeping, and suction" operations. While some devices are equipped with roller brushes, their layout with airflow and negative pressure systems is often inefficient, leading to dust accumulation and inability to be promptly collected. Furthermore, many devices are complex in structure, bulky, or rely on fully automated transmission systems, resulting in high costs and making them unsuitable for small and medium-sized enterprises. Manual cleaning methods, on the other hand, suffer from high labor intensity and inconsistent cleaning performance. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing an automatic substrate processing chip cleaning device.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: an automatic substrate processing chip cleaning device, comprising a device housing; a push-pull assembly disposed inside the device housing, including a platform, which passes through the middle of the device housing; a brushing assembly disposed inside the device housing, including a drive motor, disposed on one side of the top of the device housing; and a dust suction module disposed inside the device housing, including a blowing assembly disposed on one side of the device housing and located on the side of the drive motor, and also including an adsorption assembly disposed on the other side of the device housing and located on the other side of the drive motor.

[0006] As a further description of the above technical solution:

[0007] The push-pull assembly includes: a slide groove, formed on both sides inside the platform; a sliding plate, disposed inside the device housing and slidably disposed inside the platform; a slider, disposed on both sides of the sliding plate and slidably embedded in the slide groove; a push rod, one end of which is fixedly disposed at one end of the sliding plate and slidably disposed at one end of the platform; and a handle, disposed at the end of the push rod away from the sliding plate.

[0008] As a further description of the above technical solution:

[0009] The brushing assembly includes: a drive wheel, rotatably mounted on one side of the top of the device housing and fixedly connected to the output shaft of the drive motor; a driven wheel, rotatably mounted on one side inside the device housing; a transmission belt, one end of which is sleeved inside the drive wheel and the other end of which is sleeved inside the driven wheel; and a rolling brush, rotatably mounted inside the device housing and coaxially connected to the driven wheel at one end.

[0010] As a further description of the above technical solution:

[0011] The outer rings of the driving wheel and the driven wheel are provided with gear teeth.

[0012] As a further description of the above technical solution:

[0013] The inner ring of the transmission belt is provided with teeth.

[0014] As a further description of the above technical solution:

[0015] The blowing assembly includes: a fan, located at the top of the device housing; an airflow duct, located inside the device housing, with its top connected to the fan outlet sealed duct; an airflow distribution plate, located inside the device housing and situated on one side of the rolling brush; and multiple sets of nozzles arranged at one end of the airflow distribution plate.

[0016] As a further description of the above technical solution:

[0017] The adsorption assembly includes: an adsorption channel, which is located inside the device housing and at the other end of the rolling brush; an adsorption chamber, which is located inside the device housing and has an inlet at one bottom end that communicates with the adsorption channel; and an adsorption pipe, which is located at the top of the device housing and has its bottom end connected to a sealed pipe at the top of the adsorption chamber, and its other end connected to an external vacuum cleaner pipe.

[0018] This utility model has the following beneficial effects:

[0019] 1. By integrating a blowing, sweeping, and suction cleaning system, the problem of incomplete cleaning of processing debris on the substrate surface is effectively solved. The combined action of airflow blowing and rolling brushes can fully agitate and remove attached dust, which is then concentrated and discharged through negative pressure adsorption, improving cleaning efficiency and cleanliness, and avoiding secondary pollution.

[0020] 2. By combining manual push-pull with an automatic cleaning module, it reduces equipment costs and energy consumption while ensuring efficient cleaning. It is particularly suitable for chip removal of precision workpieces such as PCBs and ceramic substrates, and has good practicality and promotion value. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of an automatic chip cleaning device for substrate processing proposed in this utility model.

[0022] Figure 2 This is a half-sectional view of the housing of an automatic chip cleaning device for substrate processing proposed in this utility model;

[0023] Figure 3 This is a schematic diagram of the dust collection module of an automatic chip removal device for substrate processing proposed in this utility model.

[0024] Legend:

[0025] 1. Device housing; 2. Push-pull assembly; 21. Platform; 22. Slide rail; 23. Sliding plate; 24. Slider; 25. Push rod; 26. Handle; 3. Brush assembly; 31. Drive motor; 32. Drive wheel; 33. Driven wheel; 34. Transmission belt; 35. Rolling brush; 4. Dust collection module; 41. Blowing assembly; 411. Fan; 412. Airflow duct; 413. Airflow distribution plate; 414. Nozzle; 42. Adsorption assembly; 421. Adsorption channel; 422. Adsorption chamber; 423. Adsorption pipe. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The utility model will be further described in detail below with reference to the accompanying drawings.

[0028] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0029] Example 1:

[0030] like Figures 1 to 3 As shown, this embodiment provides an automatic substrate processing debris cleaning device, including: a device housing 1; a push-pull assembly 2, disposed inside the device housing 1, including a platform 21, which passes through the middle of the device housing 1; a brushing assembly 3, disposed inside the device housing 1, including a drive motor 31, disposed on one side of the top of the device housing 1; and a dust suction module 4, disposed inside the device housing 1, including a blowing assembly 41, disposed on one side inside the device housing 1 and located on one side of the drive motor 31, and also including an adsorption assembly 42, disposed on the other side inside the device housing 1 and located on the other side of the drive motor 31.

[0031] In this embodiment, the brush assembly 3 and the dust extraction module 4 constitute an automatic cleaning device for substrate processing chips according to this application.

[0032] It should also be noted that the substrate in this application can be a PCB substrate, a ceramic substrate, a glass substrate, etc. Figure 1 In this embodiment, a PCB substrate is used as an example for description. Of course, other types of substrates can also adopt a similar structure, which will not be described in detail below.

[0033] It should also be understood that the drive motor 31 and the fan 411 were purchased from the market and are common knowledge in the field. They are only used and not modified, so the control method and circuit connection will not be described in detail.

[0034] Furthermore, in this embodiment, the device housing 1 has a rectangular structure, is made of high-strength steel, and has good wear resistance and stability. Multiple functional areas are arranged inside. The push-pull assembly 2 includes a platform 21, which is also rectangular. The brushing assembly 3 includes a drive motor 31 to provide power. The dust collection module 4 includes a blowing assembly 41 and an adsorption assembly 42 for blowing and adsorbing processing debris. The push-pull assembly 2 enables the substrate to move, the brushing assembly 3 cleans the substrate surface, and the dust collection module 4 blows and adsorbs processing debris. This provides an efficient substrate processing debris cleaning function, ensuring the cleanliness of the substrate surface and the tidiness of the processing environment.

[0035] Specifically, the push-pull assembly 2 includes: a slide groove 22, which is formed on both sides inside the platform 21; a sliding plate 23, which is disposed inside the device housing 1 and slidably disposed inside the platform 21; a slider 24, which is disposed on both sides of the sliding plate 23 and slides inside the slide groove 22; a push rod 25, which is fixedly disposed at one end of the sliding plate 23 and slides at one end of the platform 21; and a handle 26, which is disposed at the end of the push rod 25 away from the sliding plate 23.

[0036] In this embodiment, the groove 22 is used for sliding the sliding plate 23. The sliding plate 23 is used to place the substrate. The push rod 25 is used to push the sliding plate 23. The operator holds the handle 26 and pushes the push rod 25, causing the sliders 24 on both sides of the sliding plate 23 to slide within the groove 22, thus moving the sliding plate 23. This provides a stable substrate push-pull function, ensuring smooth movement of the substrate.

[0037] Example 2:

[0038] Based on Embodiment 1, in order to provide an efficient substrate surface cleaning function, a brush assembly 3 is provided inside the device housing 1.

[0039] Specifically, the brush assembly 3 includes: a drive wheel 32, which is rotatably disposed on one side of the top of the device housing 1 and is fixedly connected to the output shaft of the drive motor 31; a driven wheel 33, which is rotatably disposed on one side inside the device housing 1; a transmission belt 34, one end of which is sleeved in the drive wheel 32 and the other end of which is sleeved in the driven wheel 33; and a rolling brush 35, which is rotatably disposed inside the device housing 1 and one end of which is coaxially connected to the driven wheel 33.

[0040] In a preferred embodiment, the drive wheel 32 has a circular structure. The driven wheel 33 has a circular structure. The transmission belt 34 is used to transmit power. The rolling brush 35 has a cylindrical structure and is made of highly elastic brush material, used to clean the substrate surface. When the drive motor 31 is started, the drive wheel 32 rotates, which drives the driven wheel 33 to rotate via the transmission belt 34. The bottom of the driven wheel 33 drives the rolling brush 35 to rotate, cleaning the substrate surface. This provides an efficient substrate surface cleaning function, ensuring the cleanliness of the substrate surface.

[0041] Example 3:

[0042] Based on Example 2, in order to achieve the blowing and adsorption of processing chips, the device housing 1 is equipped with a blowing component 41 and an adsorption component 42.

[0043] Specifically, the blowing assembly 41 includes: a fan 411, which is disposed on the top of the device housing 1; an airflow duct 412, which is disposed inside the device housing 1 and whose top is connected to the air outlet sealing duct of the fan 411; an airflow distribution plate 413, which is disposed inside the device housing 1 and located on one side of the rolling brush 35; and multiple sets of nozzles 414, which are arranged at one end of the airflow distribution plate 413.

[0044] The system includes a blower 411 for providing airflow, an airflow duct 412 for conveying airflow, an airflow distribution plate 413 for evenly distributing airflow, and nozzles 414 for evenly spraying airflow onto the substrate surface. When the blower 411 is activated, airflow enters the airflow distribution plate 413 through the airflow duct 412, and then is evenly sprayed onto the substrate surface through multiple sets of nozzles 414, agitating machining chips. This provides efficient airflow agitation, ensuring uniform agitation of machining chips.

[0045] Specifically, the adsorption component 42 includes: an adsorption channel 421, which is opened inside the device housing 1 and located at the other end of the rolling brush 35; an adsorption chamber 422, which is set inside the device housing 1 and has an inlet at one bottom end that communicates with the adsorption channel 421; and an adsorption pipe 423, which is set at the top of the device housing 1 and has its bottom end connected to the sealed pipe at the top of the adsorption chamber 422, and its other end connected to an external vacuum cleaner pipe.

[0046] In this embodiment, the adsorption channel 421 is sloped to allow machining chips to enter. The adsorption chamber 422 temporarily stores machining chips and has a door on one side for cleaning residual chips. The adsorption pipe 423 transports the machining chips to an external vacuum cleaner. When the external vacuum cleaner is activated, suction draws the machining chips from the adsorption channel 421 into the adsorption chamber 422, and then transports them to the external vacuum cleaner via the adsorption pipe 423. This provides efficient adsorption, ensuring effective collection and processing of machining chips.

[0047] In actual use, the user first places the processed substrate on the sliding plate 23, then holds the handle 26 and pushes it to the other side of the device housing 1. The sliders 24 on both sides of the sliding plate 23 slide in the groove 22. At the same time, the user starts the drive motor 31, which drives the drive wheel 32 to rotate. The drive wheel 32 meshes with the driven wheel 33 for transmission. The bottom of the driven wheel 33 drives the transmission belt 34 to rotate. The transmission belt 34 synchronously drives the rolling brush 35 to rotate and clean the substrate surface. The user also starts the fan 411, which blows air from the airflow pipe 412 into the airflow distribution plate 413. Then, the airflow is evenly sprayed from multiple sets of nozzles 414 onto the impurities on the substrate surface. Next, the user starts the external vacuum cleaner. The impurities on the substrate surface are blown away by the nozzles 414 and then swept into the adsorption channel 421 by the rolling brush 35. The external vacuum cleaner generates suction to adsorb the impurities into the adsorption chamber 422, and then enters the storage part of the vacuum cleaner through the adsorption pipe 423.

[0048] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An automatic chip cleaning device for substrate processing, characterized in that: Includes the device housing (1); A push-pull assembly (2) is set inside the device housing (1), including a platform (21) that passes through the middle of the device housing (1); The brushing assembly (3) is located inside the device housing (1) and includes a drive motor (31) located on one side of the top of the device housing (1). The dust collection module (4) is located inside the device housing (1), including a blowing component (41) located on one side inside the device housing (1) and on the side of the drive motor (31), and also includes an adsorption component (42) located on the other side inside the device housing (1) and on the other side of the drive motor (31).

2. The automatic chip cleaning device for substrate processing according to claim 1, characterized in that: The push-pull assembly (2) includes: a slide (22) formed on both sides inside the platform (21); The sliding plate (23) is set inside the device housing (1) and is slidably set inside the platform (21); The slider (24) is set on both sides of the sliding plate (23) and slides inside the groove (22); The push rod (25) is fixed at one end of the sliding plate (23) and slides at one end of the platform (21); A grip (26) is located at the end of the push rod (25) away from the sliding plate (23).

3. The automatic chip cleaning device for substrate processing according to claim 1, characterized in that: The brushing assembly (3) includes: a drive wheel (32), which is rotatably disposed on one side of the top of the device housing (1) and is fixedly connected to the output shaft of the drive motor (31); Driven wheel (33) is rotatably mounted inside one side of the device housing (1); The drive belt (34) is fitted at one end inside the drive pulley (32) and at the other end inside the driven pulley (33); A rolling brush (35) is rotatably mounted inside the device housing (1), and one end is coaxially connected to the driven wheel (33).

4. The automatic chip cleaning device for substrate processing according to claim 3, characterized in that: The outer rings of the driving wheel (32) and the driven wheel (33) are provided with gear teeth.

5. The automatic chip cleaning device for substrate processing according to claim 3, characterized in that: The inner ring of the transmission belt (34) is provided with teeth.

6. The automatic chip cleaning device for substrate processing according to claim 1, characterized in that: The blowing assembly (41) includes a fan (411) disposed on the top of the device housing (1); An airflow duct (412) is installed inside the device housing (1), and its top is connected to the sealed duct of the air outlet of the fan (411). An airflow distribution plate (413) is installed inside the device housing (1) and located on one side of the rolling brush (35); Multiple sets of nozzles (414) are provided and arranged at one end of the airflow distribution plate (413).

7. The automatic chip cleaning device for substrate processing according to claim 1, characterized in that: The adsorption assembly (42) includes an adsorption channel (421) which is opened inside the device housing (1) and located at the other end of the rolling brush (35); The adsorption chamber (422) is located inside the device housing (1), and an inlet is opened at one bottom end, which is connected to the adsorption channel (421). The adsorption pipe (423) is set at the top of the device box (1), and its bottom is connected to the top of the adsorption chamber (422) with a sealed pipe, and its other end is connected to an external dust collection device pipe.

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