Novel circulating water tank

Abstract

The utility model belongs to photovoltaic industry machinery technical field discloses novel circulating type water tank. Apply in the silicon chip cleaning, including inlet water tank and spray water tank. Two water tanks can realize the recycling use of cleaning water after application. The backflow chamber and filter bag are arranged in two water tanks to realize the recovery and filtration of water. The utility model has the advantages of simple structure, convenient operation, direct backflow treatment circulating use of water source while water supply, compact overall structure, small space occupation and reduced overall production cost.

Description

Technical Field

[0001] This utility model belongs to the field of mechanical technology in the photovoltaic industry, and relates to a novel circulating water tank. Background Technology

[0002] Currently, the water sources used in silicon wafer cleaning typically involve either directly filling the cleaning tank or using a water tank with a pump. However, the cleaned water is either directly discharged or transferred to a pool for later use. Many workshops cannot afford to set up a dedicated pool, which takes up valuable space, and the water requires separate treatment, hindering timely and efficient recycling. Therefore, there is an urgent need to develop a water source that can simultaneously provide normal water supply for existing silicon wafer cleaning processes and allow for real-time water recycling, thereby saving water and reducing space requirements. Summary of the Invention

[0003] To overcome the shortcomings of existing technologies, this utility model provides a novel circulating water tank with a simple structure and convenient operation. While supplying water, it realizes direct reflux treatment and recycling of water sources. Moreover, the overall structure is compact, occupies little space, and reduces the overall production cost.

[0004] The above-mentioned objective of this utility model is achieved through the following technical solution: A new type of circulating water tank, used in silicon wafer cleaning, includes an inlet water tank and a spray water tank. The two tanks allow for the recycling of cleaning water. Both tanks are equipped with a return chamber and filter bags to achieve water recovery and filtration.

[0005] A water inlet tank includes an inlet tank body, a heating rod is installed at the bottom of the inlet tank body, a return chamber A is installed above the heating rod, one end of the upper part of the return chamber A is connected to a return pipe, and the bottom of the other end of the return chamber A is connected to the bottom of the inlet tank body through a filter bag A; the filter bag A is installed on the bottom surface of the return chamber A through a pressure ring.

[0006] The return pipe is used to connect to the existing cleaning tank to achieve the return of cleaning water.

[0007] A cleaning water pump is installed on the side of the inlet water tank and connected to the outlet of the inlet water tank. The cleaning water pump is installed on the main inlet pipe of the existing cleaning tank.

[0008] A removable baffle is also installed on the side wall of the water inlet tank.

[0009] The inlet water tank is also equipped with a temperature and level sensor, which is inserted from the top of the inlet water tank into the lower part of the tank but does not contact the bottom surface. A level float switch A is also located in the lower part of the inlet water tank.

[0010] The top surface of the water inlet tank is also provided with a top cover A, which is located above the filter bag A in the return chamber A.

[0011] A water inlet drain port is provided on the bottom side of the water inlet tank. The water inlet drain port is connected to the water inlet drain pipe. A pneumatic diaphragm valve A is installed on the water inlet drain pipe.

[0012] An overflow drain pipe A is also connected to the upper side of the water inlet tank.

[0013] A spray tank for providing spray water for silicon wafer cleaning includes a spray tank body, a spray water pump mounted on the spray tank body, the spray water pump being vertically positioned and partially inserted into the spray tank body, the spray water pump being connected to a vertical pump outlet pipe within the spray tank body, and the vertical pump outlet pipe extending out of the top surface of the spray tank body for connection to the spray water inlet pipe of an existing cleaning water tank; a return chamber B is also provided in the upper part of the spray tank body, with a return water inlet on the upper side of the return chamber B for water return, and the bottom of the return chamber B being connected to the bottom of the spray tank body through a filter bag B; the filter bag B is mounted on the bottom surface of the return chamber B by a pressure ring. A filter basket is fitted over the filter bag.

[0014] The return water inlet is used to connect to the existing cleaning tank via pipeline to achieve the return of cleaning water.

[0015] The upper part of the filter basket is set on the bottom surface of the return chamber B via a pressure ring.

[0016] The top surface of the spray box is also equipped with a top cover B, which is located above the filter bag B in the return chamber B.

[0017] The lower part of the spray tank is also equipped with two level switches, namely level float switches B.

[0018] The spray pump is connected to the spray box via a vertical pump mounting base.

[0019] A spray tank drain outlet is provided on the bottom side of the spray tank body. The spray tank drain outlet is connected to the spray tank drain pipe. A pneumatic diaphragm valve B is installed on the spray tank drain pipe.

[0020] An overflow drain pipe B is also connected to the upper side of the spray tank.

[0021] This utility model also includes a PLC control system. The cleaning water pump, spray water pump, level float switch A, level float switch B, heating rod, pneumatic diaphragm valve A, temperature and level sensor, pneumatic diaphragm valve B, and level switch are all connected to the PLC control system. None of them are limited to a specific model; any implementation of their intended function is sufficient.

[0022] The advantages of this utility model compared with the prior art are: The novel circulating water tank provided by this utility model has a simple structure and is easy to operate. While supplying water, it realizes direct return treatment of the recycled water source. Moreover, the overall structure is compact, occupies little space, and reduces the overall production cost. Attached Figure Description

[0023] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0024] Figure 1 This is a structural diagram of the inlet water tank, where Figure A is a 3D view and Figure B is a 3D view of the inlet water tank after removing the water tank baffle.

[0025] Figure 2 This is a 3D view of the spray tank.

[0026] Figure 3 yes Figure 2 AA sectional view.

[0027] In the diagram: 101. Heating rod, 102. Water inlet tank drain, 103. Overflow drain pipe A, 104. Pneumatic diaphragm valve A, 105. Return pipe, 106. Top cover A, 107. Temperature and level sensor, 108. Return chamber A, 109. Pressure ring, 110. Filter bag A, 111. Water inlet tank, 112. Water tank baffle, 201. Overflow drain pipe B, 202. Top cover B, 203. Vertical pump mounting base, 204. Return chamber B, 205. Vertical pump outlet pipe, 206. Pneumatic diaphragm valve B, 207. Level switch, 208. Filter bag B, 209. Filter basket. Detailed Implementation

[0028] The present invention is described in detail below through specific embodiments, but this does not limit the scope of protection of the present invention. Unless otherwise specified, the experimental methods used in the present invention are all conventional methods, and the experimental equipment, materials, reagents, etc. used can all be obtained commercially. Example

[0029] A water inlet tank includes an inlet tank body 111. A heating rod 101 is installed at the bottom of the inlet tank body 111. A reflux chamber A108 is installed above the heating rod 101. The upper part of one end of the reflux chamber A108 is connected to a reflux pipe 105, and the bottom of the other end of the reflux chamber A108 is connected to the bottom of the inlet tank body 111 through a filter bag A110. The filter bag A110 is installed on the bottom surface of the reflux chamber A108 through a pressure ring 109.

[0030] A cleaning water pump is installed on the side of the inlet water tank and is connected to the outlet of the inlet water tank. The cleaning water pump is located on the main inlet pipe.

[0031] A removable water tank baffle 112 is also installed on the side wall of the water inlet tank 111.

[0032] The inlet water tank is also equipped with a temperature and level sensor 107, which is inserted from the top of the inlet water tank body 111 and located in the lower part of the inlet water tank but does not contact the bottom surface. A level float switch A is also installed in the lower part of the inlet water tank.

[0033] The top surface of the water inlet tank 111 is also provided with a top cover A106, which is located above the filter bag A110 in the return chamber A108.

[0034] The bottom side of the water inlet tank 111 is provided with a water inlet tank drain port 102, which is connected to the water inlet tank drain pipe. A pneumatic diaphragm valve A104 is provided on the water inlet tank drain pipe.

[0035] An overflow drain pipe A103 is also connected to the upper side of the water inlet tank 111.

[0036] In the specific operation of the water inlet tank in Example 1, the water source pipe connected to the outside of the water inlet tank supplies water to the water inlet tank. The heating rod 101 heats the water to the temperature required for silicon wafer cleaning. After the temperature and liquid level sensor 107 detects the position, it sends a feedback signal to the PLC control system to ensure that the temperature reaches the required temperature. The water in the water inlet tank is transported to the tank for cleaning the silicon wafers through the cleaning water pump and the main water inlet pipe. The cleaned water can be returned to the return chamber A108 through the return pipe 105. The returned water flows back to the water inlet tank through the filter bag A110. When there is too much returned water, it is discharged through the overflow drain pipe A103. After working for a period of time, the filter bag A110 can be removed and replaced individually through the top cover A106. Example

[0037] A spray tank for providing spray water for silicon wafer cleaning includes a spray tank body, a spray water pump mounted on the spray tank body, the spray water pump being vertically mounted and partially inserted into the spray tank body, the spray water pump being connected to a vertical pump outlet pipe 205 within the spray tank body, the vertical pump outlet pipe 205 extending out of the top surface of the spray tank body for connection to a spray inlet pipe; a return chamber B204 is also provided at the upper part of the spray tank body, a return water inlet is provided on the upper side of the return chamber B204 for return water, the bottom of the return chamber B204 is connected to the bottom of the spray tank body through a filter bag B208; the filter bag B208 is mounted on the bottom surface of the return chamber B204 through a pressure ring 109.

[0038] A filter basket 209 is fitted over the filter bag. The upper part of the filter basket 209 is set on the bottom surface of the return chamber B204 via a pressure ring 109.

[0039] The top surface of the spray box is also equipped with a top cover B202, which is located above the filter bag B208 in the return chamber B204.

[0040] The lower part of the spray tank is also equipped with two level switches 207, which are level float switches B.

[0041] The spray pump 209 is connected to the spray box via the vertical pump mounting base 203.

[0042] A spray tank drain outlet is provided on the bottom side of the spray tank body. The spray tank drain outlet is connected to the spray tank drain pipe. A pneumatic diaphragm valve B206 is installed on the spray tank drain pipe.

[0043] An overflow drain pipe B201 is also connected to the upper side of the spray tank.

[0044] In the specific operation of the spray tank in Example 2, water is supplied to the spray tank via an external water source pipe. The water is then pumped by the spray pump 209 and delivered to the desired spraying location via the vertical pump outlet pipe 205. The sprayed water flows back to the return chamber B204 of the spray tank via a water pipe and a return port. The returned water flows back into the spray tank through the filter bag B202. When there is excessive returned water, it is discharged through the overflow drain pipe B201. The water level is indicated by the level switch 207 set in the spray tank. After a period of operation, the filter bag B208 can be individually removed and replaced via the top cover B202.

[0045] The embodiments described above are merely preferred embodiments of this utility model, and not all feasible embodiments of this utility model. For those skilled in the art, any obvious modifications made without departing from the principles and spirit of this utility model should be considered to be included within the scope of protection of the claims of this utility model.

Claims

1. A novel circulating water tank, characterized in that, The application is used in silicon wafer cleaning, including an inlet water tank and a spray water tank; the inlet water tank includes an inlet tank body (111), a heating rod (101) is set at the bottom of the inlet tank body (111), a return chamber A (108) is set above the heating rod (101), one end of the return chamber A (108) is connected to the return pipe (105) at the top, and the other end of the return chamber A (108) is connected to the bottom of the inlet tank body (111) through a filter bag A (110); the filter bag A (110) is set on the bottom surface of the return chamber A (108) through a pressure ring (109).

2. The novel circulating water tank as described in claim 1, characterized in that, A cleaning water pump is installed on the side of the inlet water tank, and the cleaning water pump is connected to the outlet of the inlet water tank.

3. The novel circulating water tank as described in claim 1, characterized in that, The water inlet tank is also equipped with a temperature and liquid level sensor (107). The temperature and liquid level sensor (107) is inserted from the top of the water inlet tank (111) and is located in the lower part of the water inlet tank but does not contact the bottom surface. The water inlet tank is also equipped with a liquid level float switch A in the lower part.

4. A novel circulating water tank as described in claim 1, characterized in that, The top surface of the water inlet tank (111) is also provided with a top cover A (106), which is located above the filter bag A (110) in the return chamber A (108).

5. A novel circulating water tank as described in claim 1, characterized in that, The bottom side of the water inlet tank (111) is provided with a water inlet tank drain outlet (102), which is connected to the water inlet tank drain pipe. A pneumatic diaphragm valve A (104) is provided on the water inlet tank drain pipe. An overflow drain pipe A (103) is also connected to the upper side of the water inlet tank (111).

6. A novel circulating water tank as described in claim 1, characterized in that, The spray tank includes a spray tank body, on which a spray water pump is installed. The spray water pump is vertically installed and partially inserted into the spray tank body. The spray water pump is connected to the vertical pump outlet pipe (205) inside the spray tank body. The vertical pump outlet pipe (205) extends out of the top surface of the spray tank body and is used to connect with the spray inlet pipe. A return chamber B (204) is also provided at the top of the spray tank body. A return water port is provided on the upper side of the return chamber B (204) for returning water. The bottom of the return chamber B (204) is connected to the bottom of the spray tank body through a filter bag B (208). The filter bag B (208) is installed on the bottom surface of the return chamber B (204) through a pressure ring (109).

7. A novel circulating water tank as described in claim 6, characterized in that, A filter basket (209) is fitted over the outside of the filter bag; the upper part of the filter basket (209) is set on the bottom surface of the return chamber B (204) through a pressure ring (109).

8. A novel circulating water tank as described in claim 6, characterized in that, The top surface of the spray box is also provided with a top cover B (202), which is located above the filter bag B (208) in the return chamber B (204).

9. A novel circulating water tank as described in claim 6, characterized in that, The lower part of the spray tank is also equipped with two level switches (207), which are level float switches B.

10. A novel circulating water tank as described in claim 6, characterized in that, A spray tank drain outlet is provided on the bottom side of the spray tank body. The spray tank drain outlet is connected to the spray tank drain pipe. A pneumatic diaphragm valve B (206) is provided on the spray tank drain pipe. An overflow drain pipe B (201) is also connected to the upper side of the spray tank.

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