A nozzle structure of a wafer cleaning assembly
Patent Information
- Application Number
- CN202521922178.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-05
- Publication Date
- 2026-10-16
- Estimated Expiration
- 2035-09-05
AI Technical Summary
[0005]但是,在实际实施过程中,发明人发现,该类技术方案中,依照晶圆的清洗参数的不同,比如药液的型号变化、流速的改变等往往会使得药液在喷淋的过程中的表面张力的改变,以及,随着工艺的改变可能也需要引入新的喷头结构等来实现对工艺参数的适配
[0043] To address the issue of incompatibility of existing nozzle connection structures after replacement in current technologies, this solution modifies the end of the support tube in the wafer cleaning assembly by introducing a nozzle diameter-changing structure. This structure, through a first matching structure and a second matching structure, connects and secures the upper support tube and the lower nozzle, respectively, and provides corresponding holes for the liquid delivery tube to pass through, forming a liquid delivery channel. In application, by designing a series of nozzle diameter-changing structures with different diameters, effective adaptation to nozzles of different specifications can be achieved.
Smart Images

Figure CN224854672U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of wafer cleaning head technology, and specifically to a nozzle structure for a wafer cleaning assembly. Background Technology
[0002] Wafer cleaning equipment is one of the key pieces of equipment in the semiconductor manufacturing process. It is mainly used to remove contaminants (such as particles, organic matter, metal ions, and native oxide layers) from the wafer surface, ensuring the yield and performance of the wafer in subsequent processes such as photolithography, etching, and deposition. Typically, the wafer cleaning process includes transferring the wafer to a platform using loading equipment and fixtures, followed by cleaning the wafer surface through processes such as spraying and drying. The wafer cleaning assembly is a device mounted on the machine platform that moves above the wafer under the action of an external mechanical mechanism, spraying the wafer surface with the appropriate cleaning agent. It usually consists of a chemical tank, pump, chemical tubing, nozzles, and additional structural components.
[0003] For example, patent document CN202311734689.6 discloses a wafer cleaning apparatus. This wafer cleaning apparatus includes a wafer stage, a locking assembly, a lifting and rotating arm, a first cleaning assembly, and a second cleaning assembly. The locking assembly is disposed on the wafer stage and is used to lock the wafer. The first cleaning assembly includes a pure water spray pipe, an ozone water spray pipe, and multiple two-fluid nozzles. The pure water spray pipe sprays pure water onto the front side of the wafer, and the ozone water spray pipe sprays ozone water onto the front side of the wafer. The lifting and rotating arm drives the two-fluid nozzles to perform a fan-shaped reciprocating motion, and the two-fluid nozzles spray cleaning fluid onto the front side of the wafer. The second cleaning assembly is disposed within the wafer stage and is used to spray cleaning fluid onto the back side of the wafer. Using the above-mentioned wafer cleaning apparatus effectively improves the cleaning effect on the wafer.
[0004] For example, patent document CN202410009647.4 discloses a single-wafer cleaning device with adjustable nozzle spray angle, including a support platform, a drive mechanism on the outside of the support platform, and a cleaning mechanism located above the support platform. Beneficial effects: The wafer is adsorbed and fixed by multiple suction cups on the fixing component, reducing the damage to the wafer surface caused by hard clamping force. Furthermore, by adjusting the spray angle of the nozzle within the cleaning component, a certain angle is formed with the wafer surface, allowing for better cleaning of surface impurities. The turbulence block within the rinsing component collects the rinsed water. When the nozzle collides with the collected water, it creates a vortex. This vortex, during wafer rotation, forms a backflow that further rinses the wafer surface, improving the quality and intensity of wafer cleaning.
[0005] However, in actual implementation, the inventors discovered that in this type of technical solution, different cleaning parameters of the wafer, such as changes in the type of cleaning solution and flow rate, often lead to changes in the surface tension of the cleaning solution during the spraying process. Furthermore, changes in the process may necessitate the introduction of new nozzle structures to adapt to the process parameters. This results in certain modifications to the nozzle structure, particularly the structure and dimensions at the connection point with the cleaning solution pipe, making the original connection structure prone to incompatibility issues. Utility Model Content
[0006] In view of the above-mentioned problems in the prior art, a nozzle structure for a wafer cleaning assembly is provided.
[0007] The specific technical solution is as follows:
[0008] A nozzle structure for a wafer cleaning assembly, characterized in that it comprises:
[0009] A cleaning tube, comprising a support tube and a liquid tube coaxially sleeved together;
[0010] The nozzle has a variable diameter structure and is shaped like a hollow cylinder.
[0011] The nozzle is located below the nozzle diameter-changing structure;
[0012] The upper end of the nozzle diameter-changing structure is fixedly connected to the bottom end of the support tube through a first matching structure.
[0013] The bottom end of the nozzle diameter-changing structure is fixedly connected to the nozzle connection part through a second matching structure;
[0014] The liquid medicine tube passes through the central through hole of the nozzle diameter-changing structure and is sealed to the nozzle connection to form a liquid medicine delivery channel.
[0015] On the other hand, the support tube includes a first support tube region and a second support tube region;
[0016] The first support tube area includes a tube wall portion and a fixing portion;
[0017] The pipe wall portion wraps around the outside of the fixed portion;
[0018] The fixing part is wrapped around the outside of the liquid tube;
[0019] The second support tube region is located at the end of the first support tube region;
[0020] The second support pipe area only has the pipe wall portion;
[0021] The first matching structure is formed in the pipe wall portion of the second support pipe region.
[0022] On the other hand, the first matching structure includes a first through hole that is laterally opened on the upper side wall of the nozzle diameter changing structure, and a second through hole that is laterally opened on the bottom end of the support tube.
[0023] The first through hole and the second through hole are positioned to match each other and are fixed by inserting a cylindrical pin.
[0024] On the other hand, the cleaning tube also includes a covering tube;
[0025] The covering tube wraps around the outside of the support tube and covers the first matching structure.
[0026] On the other hand, a diameter-changing kit is provided at the upper end of the nozzle diameter-changing structure;
[0027] The upper end of the variable diameter kit has a sleeve structure, and the inner edge of the sleeve structure protrudes upward and inserts into the second support tube area;
[0028] The width of the inner edge of the sleeve structure matches the internal space of the second support tube region;
[0029] The outer edge of the sleeve structure is U-shaped and snaps into the bottom of the second support tube area.
[0030] On the other hand, a combined nut is provided at the lower end of the nozzle diameter-changing structure;
[0031] The lower end of the combined nut has an inverted U-shaped nozzle cavity, and the upper inner wall of the nozzle cavity has an internal thread.
[0032] The nozzle structure also includes a U-shaped nozzle, the outer wall of which is machined with an external thread that matches the internal thread;
[0033] The inner wall of the U-shaped nozzle is provided with a groove, and the groove is tightly connected to the liquid tube by an interference fit.
[0034] On the other hand, the lower end of the nozzle cavity is also provided with a bead mounting seat;
[0035] The bead insertion mounting base is fitted with an insertion bead and a spring;
[0036] The first end of the spring is connected to the bead;
[0037] The second end of the spring is connected to the bead mounting base;
[0038] The top of the bead mounting base is provided with a limiting groove corresponding to the bead.
[0039] On the other hand, the nozzle has a bead-holding groove corresponding to the part of the bead insertion.
[0040] On the other hand, the specifications of the coated tube include: 8*10, 10*12, 16*19, and 22*25.
[0041] On the other hand, the specifications of the support tube include: 6*8, 8*10, 14*16, and 19*22.
[0042] The above technical solution has the following advantages or beneficial effects:
[0043] To address the issue of incompatibility of existing nozzle connection structures after replacement in current technologies, this solution modifies the end of the support tube in the wafer cleaning assembly by introducing a nozzle diameter-changing structure. This structure, through a first matching structure and a second matching structure, connects and secures the upper support tube and the lower nozzle, respectively, and provides corresponding holes for the liquid delivery tube to pass through, forming a liquid delivery channel. In application, by designing a series of nozzle diameter-changing structures with different diameters, effective adaptation to nozzles of different specifications can be achieved. Attached Figure Description
[0044] Embodiments of the present invention will be described more fully with reference to the accompanying drawings. However, the accompanying drawings are for illustration and explanation only and do not constitute a limitation on the scope of the present invention.
[0045] Figure 1 This is an overall schematic diagram of an embodiment of the present utility model; Detailed Implementation
[0046] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0047] It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments of the present invention can be combined with each other.
[0048] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the present invention.
[0049] This utility model includes:
[0050] A nozzle structure for a wafer cleaning assembly, such as Figure 1 As shown, it includes:
[0051] The cleaning tube includes a support tube 1 and a liquid tube 2 that are coaxially sleeved together.
[0052] The nozzle diameter-changing structure 3 is in the shape of a hollow cylinder;
[0053] Nozzle 4 is located below nozzle diameter changing structure 3;
[0054] The upper end of the nozzle diameter-changing structure 3 is fixedly connected to the bottom end of the support pipe 1 through the first matching structure 31.
[0055] The bottom end of the nozzle diameter-changing structure 3 is fixedly connected to the nozzle 4 via the second matching structure 32;
[0056] The liquid medicine pipe 2 passes through the central through hole of the nozzle reducing structure 3 and is sealed to the connection of the nozzle 4 to form a liquid medicine delivery channel.
[0057] Specifically, addressing the issue of incompatibility of the original connection structure after nozzle replacement in existing technologies, this solution modifies the end of the support tube in the wafer cleaning assembly by introducing a nozzle diameter-changing structure 3. This structure 3 connects and secures the upper support tube 1 and the lower nozzle 4 via a first matching structure 31 and a second matching structure 32, respectively, and provides corresponding holes for the liquid delivery tube 2 to pass through, forming a liquid delivery channel. In application, by designing a series of nozzle diameter-changing structures 3 with different diameters, effective adaptation to nozzles of different specifications can be achieved.
[0058] Specifically, the wafer cleaning assembly consists of a chemical storage tank, a pump, pipes, nozzles 4, and additional structural components. The pipes consist of at least a support pipe 1 and a chemical solution pipe 2, with the pump and nozzles 4 connected to the two ends of the chemical solution pipe, respectively.
[0059] The second part of the cleaning solution tube is mainly used to transport the corresponding cleaning solution, such as SMP, pure water, SC1, SC2, etc. The cleaning solution tube 2 itself is usually made of PFA material, which is relatively soft and does not bear structural support.
[0060] Therefore, to improve the rigidity of the pipeline and facilitate installation on the corresponding components to prevent sinking, a support pipe 1 with a certain rigidity is set on the outside of the liquid pipe 2. The support pipe 1 is a hollow pipe whose inner diameter matches the outer diameter of the liquid pipe 2. It is made of rigid materials, such as metal or plastic, and is bent into specific shapes according to different pipeline designs. However, this utility model only focuses on the end structure of the support pipe 1, especially the connection part. Other parts only need to meet the relevant design requirements.
[0061] Since the support tube 1 has a certain rigidity, in this embodiment, a nozzle diameter changing structure 3 is installed at the bottom of the support tube 1 through the first matching structure 31. The nozzle diameter changing structure 3 is then connected to the nozzle 4 through the second matching structure 32, thereby achieving matching and suspension of the nozzle 4 below.
[0062] The liquid tube 2 has a fixed diameter. It passes through the nozzle reducing structure 3 and connects to a specific opening on the nozzle 4 to form a liquid cleaning channel. Based on the above design, it is only necessary to control the upper opening of the nozzle 4 to match the liquid tube 2 so that the liquid tube 2 can be inserted into the opening of the nozzle 4 and fixed. The structure and shape of the nozzle 4 itself can be adjusted arbitrarily by making local fine adjustments to the design of the nozzle reducing structure 3. This allows the nozzle 4 to be applied to pipes of different specifications.
[0063] In one embodiment, the support tube 1 includes a first support tube region 11 and a second support tube region 12;
[0064] The first support pipe area 11 includes a pipe wall portion and a fixing portion;
[0065] The pipe wall is partially wrapped around the outside of the fixed part;
[0066] The fixing part is wrapped around the outside of the medicine tube 2;
[0067] The second support tube region 12 is located at the end of the first support tube region 11;
[0068] The second support pipe area 12 only has the pipe wall portion;
[0069] The first matching structure 31 is formed in the pipe wall portion of the second support pipe region 12.
[0070] Specifically, to achieve a better fit, in this embodiment, the end structure of the support tube 1 is adjusted to a first support tube region 11 and a second support tube region 12. The traditional support tube 1 has a complete pipe structure with a certain thickness, equivalent to a portion of the first support tube region 11. The first support tube region 11 includes an outermost pipe wall portion and a relatively inner fixed portion, which contacts the liquid tube 2 and provides support.
[0071] When the first support tube region 11 extends downwards to the second support tube region 12, the outer diameter of the second support tube region 12 remains unchanged while the inner diameter expands, retaining only the tube wall portion. The space removed from the fixed portion is used to allow the nozzle diameter-changing structure 3 to be inserted and fixed through the first matching structure 31. In actual processing, the second support tube region 12 is formed into a cavity region of a certain depth through processes such as cutting. Meanwhile, the tube wall portion and the fixed portion, the first support tube region 11 and the second support tube region 12 are merely distinctions used to describe the aforementioned pipe; in actual products, they may represent the same continuous structure.
[0072] In one embodiment, the first matching structure 31 includes a first through hole laterally opened on the upper sidewall of the nozzle diameter changing structure 3, and a second through hole laterally opened on the bottom end of the support tube 1.
[0073] The positions of the first through hole and the second through hole are matched and fixed by inserting a cylindrical pin 5.
[0074] Specifically, in order to achieve a better fixing effect on the nozzle diameter changing structure 3 and to support the load of the lower nozzle 4, in this embodiment, after the bottom end of the support tube 1 is thinned to form the second support tube region 12, holes are further drilled in the upper side wall of the nozzle diameter changing structure 3 and the tube wall of the second support tube region 12 at the bottom end of the support tube 1 to form a first through hole and a second through hole that match after combination. At the same time, the inner diameter of the second support tube region 12 after thinning is controlled to match the outer diameter of the upper part of the nozzle diameter changing structure 3.
[0075] After the upper end of the nozzle diameter-changing structure 3 is inserted into the second support tube area 12, the first through hole and the second through hole are aligned, and then the cylindrical pin 5 is inserted to fix them.
[0076] There may be multiple pairs of first and second through holes. These pairs of first and second through holes should be arranged as symmetrically as possible to ensure uniform stress distribution.
[0077] In one embodiment, the cleaning tube further includes a covering tube 6;
[0078] The covering tube 6 wraps around the outside of the support tube 1 and covers the first matching structure 31.
[0079] Specifically, to meet the anti-fouling and anti-rust requirements of the wafer cleaning equipment, in this embodiment, a covering tube 6 is also wrapped around the outside of the support tube 1. The covering tube 6 is usually made of a soft and chemically stable material, such as polymer or special rubber, and is not used as a load-bearing structure, but only to be fitted onto the support tube 1 to prevent the support tube 1 from being corroded. At the end of the support tube 1, the covering tube 6 needs to completely cover the area where the first matching structure 31 is located. The material of the covering tube 6 can be set to an elastic material. During installation, the covering tube 6 is pushed upward to expose the second through hole, the cylindrical pin 5 is inserted, and then it is lowered to wrap the tube.
[0080] Common specifications for coated tubes include: 8*10, 10*12, 16*19, 22*25, and specifications for support tubes include: 6*8, 8*10, 14*16, 19*22.
[0081] To achieve better compatibility with nozzles 4 of various sizes, specifications, and assembly methods, this solution sets the nozzle diameter-changing structure 3 as a combination of a diameter-changing kit 33 and a connecting nut 34. The diameter-changing kit 33 is located at the upper end, and the connecting nut 34 is located at the lower end. The two are combined by means of a sliding groove and a snap-fit, or other equivalent technical means, so that the diameter-changing kit 33 and the connecting nut 34 are stably connected in the vertical direction. The sliding groove and snap-fit method is existing technology. It is roughly formed by creating a pair of opposite spiral directions on the lower end face of the diameter-changing kit 33 and the upper end face of the connecting nut 34, which are fixed by snapping. However, other structures, such as limit buckles, can be added as needed, or the diameter-changing kit 33 and the connecting nut 34 can be directly formed by integral welding.
[0082] It should be noted that the diameters of the variable diameter kit 33 and the combined nut 34 will change depending on the size of the medicine tube and nozzle 4 to be matched. They are designed with corresponding gradual transition ends, such as expanding or narrowing at a certain slope from top to bottom. This is a relatively easy design to implement and can be replaced according to actual needs.
[0083] The top of the reducing assembly 33 is used to set the first matching structure 31, and the bottom of the connecting nut 34 is used to set the second matching structure 32. Both are hollow structures, and the hollow part matches the diameter of the medicine tube 2 so that the medicine tube can pass through.
[0084] In one embodiment, a diameter-changing kit 33 is provided at the upper end of the nozzle diameter-changing structure 3;
[0085] The upper end of the reducing kit 33 has a sleeve structure, and the inner edge of the sleeve structure protrudes upward and inserts into the second support tube area;
[0086] The width of the inner edge of the sleeve structure matches the internal space of the second support tube area;
[0087] The outer edge of the sleeve structure is U-shaped and snaps into the bottom of the second support tube area.
[0088] Specifically, to achieve a better limiting effect, the structure of the variable diameter kit 33 has been optimized to a certain extent in this embodiment. Specifically, the upper end of the variable diameter kit is mainly a sleeve structure, on which the first matching structure 31 is set, that is, the part of the first through hole. When in application, the sleeve structure is inserted upward into the second support tube area 12, so that the first through hole and the second through hole match, and is fixed by the cylindrical pin 5.
[0089] Meanwhile, to prevent the nozzle diameter-changing structure 3 from shaking, the sleeve structure is further processed. The original part that extends upward and is equipped with the first matching structure 31 is used as the inner edge, and the edge part near the outer periphery on the bottom surface of the nozzle diameter-changing structure 3 extends upward to form the outer edge. The diameter difference between the inner edge and the outer edge on the circumference of the bottom surface matches the wall thickness of the second support tube area. When the sleeve structure is inserted upward into the second support tube area 12, the outer edge part will be stuck on the outer wall of the second support tube area 12, reducing shaking.
[0090] In one embodiment,
[0091] A combined nut 34 is provided at the lower end of the nozzle diameter changing structure 3;
[0092] The lower end of the combined nut 34 has an inverted U-shaped nozzle setting cavity, and the upper inner wall of the nozzle setting cavity has an internal thread.
[0093] The nozzle structure also includes a U-shaped nozzle, the outer wall of which is machined with an external thread that matches the internal thread;
[0094] The inner wall of the U-shaped nozzle has a groove, and the groove and the liquid tube are tightly connected by an interference fit.
[0095] Specifically, in order to fix the nozzle 4, in this embodiment, an inverted U-shaped nozzle setting cavity is formed upward by cutting the lower end of the joint nut. The inner diameter of the nozzle setting cavity matches the outer diameter of the upper part of the nozzle 4 used for connection and fixation. An internal thread is machined in the upper half of the nozzle setting cavity by turning threads. The nozzle 4 is fixed to the joint nut 34 by screwing it in.
[0096] For the internal liquid tube 2, the upper part of the nozzle 4, which is used to fix the joint nut 34, extends upward. It is machined into a hollow cylindrical shape with external threads. The hollow part inside can be inserted into the liquid tube 2 by interference fit, and a certain sealing effect is achieved by interference fit. The hollow part is directly connected to the lower flow channel of the nozzle 4, which can realize specific pressurization, special spraying mode, etc.
[0097] In one embodiment, a bead mounting seat is also provided at the lower end of the nozzle cavity;
[0098] The bead inserter is fitted with an insert bead 341 and a spring.
[0099] The first end of the spring is connected to and pushes the bead 341 outward;
[0100] The second end of the spring is connected to the ball bearing mounting base;
[0101] The top of the bead inserter is surrounded by a limiting groove corresponding to the bead inserter.
[0102] The nozzle 4 has a bead-holding groove corresponding to the part where the bead is inserted.
[0103] Specifically, considering that the nozzle 4 is fixed by screwing in, it is prone to loosening and incomplete screwing. To address this issue, in this embodiment, the thread is provided only in the upper half of the cavity of the nozzle, while a spring bead structure is provided in the lower half. A bead-locking groove is also provided at the corresponding position of the nozzle 4, thereby achieving the effect of reminder and auxiliary fixation.
[0104] Specifically, the bead inserter is a semi-embedded cylindrical structure with a diameter appropriately reduced on the side wall to form a limiting groove structure. The bead inserter has a bead 341 and a spring. One end of the spring is connected to the bottom surface of the bead inserter and the other end is connected to the bead 341. Under normal circumstances, the spring is in a compressed state but not fully compressed. It can provide an outward pushing force to the bead 341, but it can also be further compressed.
[0105] The outermost limiting groove of the bead insert mounting base is achieved by bonding a baffle plate. The baffle plate has an opening in the middle, which is slightly smaller than the diameter of the bead insert 341. The protruding part of the bead insert 341 can be adjusted by adjusting the size of the opening.
[0106] When the nozzle 4 is screwed into the connecting nut 34, the insert bead 341 is pressed back towards the insert bead mounting seat. When the nozzle 4 is screwed into place, the insert bead locking groove will align with the insert bead 341, allowing the insert bead to pop out and strike the baffle to provide a certain vibration and sound as a reminder, while the protruding part will lock into the insert bead locking groove. When the nozzle 4 tends to rotate outward due to factors such as movement and vibration, the protruding insert bead 341 will provide a certain resistance to the insert bead locking groove to limit it. However, if torque is further applied to rotate the nozzle 4 outward during disassembly, the insert bead 341 will retract back to the insert bead mounting seat.
[0107] The above are merely preferred embodiments of the present utility model and are not intended to limit the implementation methods and protection scope of the present utility model. Those skilled in the art should realize that any equivalent substitutions and obvious changes made based on the description and illustrations of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A nozzle structure for a wafer cleaning assembly, characterized in that, include: A cleaning tube, comprising a support tube and a liquid tube coaxially sleeved together; The nozzle has a variable diameter structure and is shaped like a hollow cylinder. The nozzle is located below the nozzle diameter-changing structure; The upper end of the nozzle diameter-changing structure is fixedly connected to the bottom end of the support tube through a first matching structure. The bottom end of the nozzle diameter-changing structure is fixedly connected to the nozzle connection part through a second matching structure; The liquid medicine tube passes through the central through hole of the nozzle diameter-changing structure and is sealed to the nozzle connection to form a liquid medicine delivery channel.
2. The nozzle structure according to claim 1, characterized in that, The support tube includes a first support tube region and a second support tube region; The first support tube area includes a tube wall portion and a fixing portion; The pipe wall portion wraps around the outside of the fixed portion; The fixing part is wrapped around the outside of the liquid tube; The second support tube region is located at the end of the first support tube region; The second support pipe area only has the pipe wall portion; The first matching structure is formed in the pipe wall portion of the second support pipe region.
3. The nozzle structure according to claim 1, characterized in that, The first matching structure includes a first through hole laterally opened on the upper side wall of the nozzle diameter changing structure, and a second through hole laterally opened at the bottom end of the support tube; The first through hole and the second through hole are positioned to match each other and are fixed by inserting a cylindrical pin.
4. The nozzle structure according to claim 3, characterized in that, The cleaning tube also includes a covering tube; The covering tube wraps around the outside of the support tube and covers the first matching structure.
5. The nozzle structure according to claim 2, characterized in that, The upper end of the nozzle diameter-changing structure is provided with a diameter-changing kit; The upper end of the variable diameter kit has a sleeve structure, and the inner edge of the sleeve structure protrudes upward and inserts into the second support tube area; The width of the inner edge of the sleeve structure matches the internal space of the second support tube region; The outer edge of the sleeve structure is U-shaped and snaps into the bottom of the second support tube area.
6. The nozzle structure according to claim 1, characterized in that, A combined nut is provided at the lower end of the nozzle diameter-changing structure; The lower end of the combined nut has an inverted U-shaped nozzle cavity, and the upper inner wall of the nozzle cavity has an internal thread. The nozzle structure also includes a U-shaped nozzle, the outer wall of which is machined with an external thread that matches the internal thread; The inner wall of the U-shaped nozzle is provided with a groove, and the groove is tightly connected to the liquid tube by an interference fit.
7. The nozzle structure according to claim 6, characterized in that, The lower end of the nozzle cavity is also provided with a bead mounting seat; The bead insertion mounting base is fitted with an insertion bead and a spring; The first end of the spring is connected to the bead; The second end of the spring is connected to the bead mounting base; The top of the bead mounting base is provided with a limiting groove corresponding to the bead.
8. The nozzle structure according to claim 7, characterized in that, The nozzle has a bead-holding groove corresponding to the part of the bead to be inserted.
9. The nozzle structure according to claim 4, characterized in that, The specifications of the coated tubes include: 8*10, 10*12, 16*19, and 22*25.
10. The nozzle structure according to claim 1, characterized in that, The specifications of the support tubes include: 6*8, 8*10, 14*16, and 19*22.
Citation Information
Patent Citations
Wafer cleaning method
CN117423644B
Single wafer cleaning device with adjustable spray angle of spray head
CN117976573A