A high-speed punch forming device for diode pins

Abstract

The utility model relates to diode field especially relates to a diode pin high -speed punch forming device. The utility model discloses workbench, feeding device, punch and guide rail, the guide rail sets up on workbench, the feeding device sets up in the starting end of guide rail, punch sets up in the middle part of guide rail, the feeding device includes the row of hopper and arrangement wheel, the arrangement hopper sets up in the top of arrangement wheel, and the arrangement wheel sets up in the upper surface of guide rail starting end. Double even material board structure and broken line seam make bulk diode be forced to disperse into single column flow before entering arrangement wheel, and effectively avoid the stacking, material jam problem that traditional vibration dish is easy to produce. Broken line seam and the vertical alignment of arrangement wheel groove ensure that every groove only embeds a diode, promotes the continuity of feeding, reduces the number of times of shutdown adjustment due to material break.

Description

Technical Field

[0001] This utility model relates to the field of diodes, and in particular to a high-speed stamping and forming device for diode leads. Background Technology

[0002] In the field of electronic component manufacturing, the stamping of diode leads is a critical process to ensure the electrical performance and mechanical reliability of devices. Traditional diode lead stamping equipment often uses a vibratory feeder combined with a linear feeder to arrange bulk diodes one by one onto a track through mechanical vibration, and then form them using a stamping die. However, the vibratory feeder relies on high-frequency vibration to arrange the material, but diodes are prone to stacking and jamming during vibration, especially at high speeds. Uneven material flow can cause supply interruptions, requiring frequent shutdowns for adjustments, thus limiting production efficiency. The groove design of traditional arranging wheels is often straight or simple arc-shaped. During the transfer process, diodes are prone to displacement due to inertia or track deviation, resulting in multiple components embedded in a single groove or no load, causing waste of raw materials and die wear in the stamping process. Utility Model Content

[0003] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: This utility model provides a high-speed stamping forming device for diode pins, including a worktable, a feeding device, a stamping device, and a guide rail; the guide rail is disposed on the worktable, and the feeding device is disposed at the starting end of the guide rail; the stamping device is disposed in the middle of the guide rail; the feeding device includes a hopper and a arranging wheel, the hopper is disposed on the top of the arranging wheel, and the arranging wheel is disposed on the upper surface of the starting end of the guide rail.

[0004] Furthermore, the hopper includes a material distribution plate with zigzag seams, and the outer circumference of the arranging wheel is uniformly provided with grooves; when the zigzag seams are close to the top of the arranging wheel and the grooves are located directly below the zigzag seams, a diode can be precisely embedded in the grooves.

[0005] Furthermore, the material distribution plate is provided in two parts, which are respectively connected to two clamping plates, and adjustment seats are provided on both sides of the clamping plates.

[0006] Furthermore, the feeding device also includes a feeding disc, which is disposed at the starting end of the hopper arrangement via a chute.

[0007] Furthermore, a drive chain is provided in the middle of the guide track, and a carrier block is provided on the drive chain.

[0008] The beneficial effects of this utility model are as follows: The dual-plate structure and zigzag seam of this invention force the bulk diodes to flow in a single column before entering the arranging wheel, effectively avoiding the stacking and jamming problems that are common in traditional vibratory feeders. The vertical alignment of the zigzag seam with the groove of the arranging wheel ensures that only one diode is embedded in each groove, improving the continuity of material supply and reducing the number of downtime adjustments due to material interruption.

[0009] The groove on the outer circumference of the arrangement wheel is machined according to the size of the diode body, and the distance error between it and the lower edge of the fold line is controlled within ±0.05mm. When the groove rotates to be directly below the fold line, the diode is accurately embedded due to gravity and the limiting effect of the groove sidewall, reducing the loss caused by mis-punching of the stamping die. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 for Figure 1 A partial structural diagram at point A in the middle; Figure 3 for Figure 1 A schematic diagram of the partial structure at point B in the middle.

[0011] Explanation of reference numerals in the attached drawings: 1. Workbench; 2. Feeding device; 3. Stamping device; 4. Guide rail; 201. Arranged hoppers; 202. Arranged wheels; 2011. Material distribution plate; 2012. Folded seam; 2021. Groove; 2013. Clamping plate; 2014. Adjusting seat; 203. Feeding tray; 204. Slide groove; 401. Drive chain; 402. Carrier block. Detailed Implementation

[0012] The present invention will be further described in detail below with reference to the accompanying drawings.

[0013] This invention provides a high-speed stamping forming device for diode leads, including a worktable 1, a feeding device 2, a stamping device 3, and a guide rail 4. The guide rail 4 is disposed on the worktable 1, and the feeding device 2 is disposed at the starting end of the guide rail 4. The stamping device 3 is disposed in the middle of the guide rail 4. The feeding device 2 includes a hopper 201 and a arranging wheel 202. The hopper 201 is disposed on top of the arranging wheel 202, and the arranging wheel 202 is disposed on the upper surface of the starting end of the guide rail 4. The worktable 1 serves as the basic support platform of the device, providing a stable mounting reference for the feeding device 2, the stamping device 3, and the guide rail 4. The feeding device 2 is responsible for orderly conveying bulk diodes to the guide rail 4, and the stamping device 3 performs high-speed stamping forming of the diode leads in the middle of the guide rail 4. The three components work together to achieve continuous production.

[0014] The hopper 201 includes a material distribution plate 2011 with zigzag slits 2012. The arranging wheel 202 has evenly spaced grooves 2021 on its outer periphery. When the zigzag slits 2012 are close to the top of the arranging wheel 202, and the grooves 2021 are directly below the zigzag slits 2012, a diode 5 can be precisely embedded in the groove 2021. The material distribution plate 2011 forces the bulk diodes to fall in a single row onto the top of the arranging wheel 202 through the zigzag slits 2012, causing the diodes to fall onto the top of the arranging wheel 202. When the arranging wheel 202 rotates until the grooves 2021 align with the zigzag slits 2012, the diodes embed themselves into the grooves 2021 due to gravity, achieving precise pickup of individual components.

[0015] Two equalizing plates 2011 are provided, each connected to a clamping plate 2013. Adjustment seats 2014 are provided on both sides of the clamping plate 2013. The two equalizing plates 2011 form a symmetrical structure through the clamping plate 2013, and their spacing can be adjusted by the adjustment seats 2014 to accommodate diode bodies of different diameters. The spring pre-tightening mechanism 2015 of the adjustment seat 2014 ensures that the equalizing plate 2011 remains stable during adjustment, preventing diode jamming due to excessive gap. The feeding device 2 also includes a feeding tray 203, which is located at the starting end of the arranging hopper 201 via a slide 204. The feeding tray 203 is used to hold bulk diodes, which are continuously conveyed to the top of the arranging hopper 201 via the slide 204. The inclined design of the slide 204 utilizes gravity to allow the diodes to slide naturally to the folded seam 2012 of the equalizing plate 2011, achieving automatic, unpowered feeding. A drive chain 401 is provided in the middle of the guide rail 4, and a carrier block 402 is provided on the drive chain 401. The drive chain 401 is driven by a servo motor 403 and synchronized with the main shaft of the stamping device 3 through gears to ensure precise coordination between the feeding action and the stamping action. The carrier block 402 has a positioning groove 4021 on its surface that matches the diode pin. After the arrangement wheel 202 transfers the diode to the carrier block 402, the carrier block 402 moves with the chain 401 to the bottom of the stamping device 3 to complete the stamping of the pin.

[0016] Working principle: Bulk diodes are first poured into the feed tray 203, and then slide naturally to the top of the hopper 201 by gravity through the inclined design of the chute 204. Two equalizing plates 2011, through the symmetrical structure formed by the clamping plate 2013, force the diodes to shunt current. The special path of the zigzag seam 2012 forces the diodes to fall in a single row, avoiding stacking or side-by-side flow. The spring preload mechanism of the adjusting seat 2014 can adjust the spacing of the equalizing plates according to the diameter of the diode body, ensuring that components of different specifications can be accurately shunt current.

[0017] The arranging wheel 202 is driven by a servo motor and rotates at a speed synchronized with the main shaft of the stamping device. When the groove 2021 on the outer circumference of the arranging wheel rotates to directly below the zigzag seam 2012, a single diode is embedded in the groove due to gravity. The diode embedded in the groove rotates with the arranging wheel to the starting end of the guide rail 4, at which point the carrier block 402 on the drive chain 401 reaches the receiving position. A positioning groove matching the diode pin is formed on the surface of the carrier block, and the component is transferred from the arranging wheel to the carrier block by mechanical limiting, and moves with the chain. The drive chain is driven by a servo motor and meshes with the main shaft of the stamping device through gears to realize the synchronization of the feeding action and the stamping action.

[0018] When the carrier block carrying the diode moves below the stamping device 3, the stamping die quickly presses down to precisely stamp the leads. The stamping force and stroke are preset according to the diode specifications to ensure that parameters such as lead length and bending angle meet the requirements. After stamping, the carrier block continues to move with the chain, conveying the finished diode to the next process or collection device.

[0019] During the process, the feed tray continuously replenishes material through the chute, and the arranging wheel and drive chain rotate synchronously, forming a continuous production cycle. When it is necessary to switch diode specifications, only the spacing of the equalizing plate needs to be adjusted and the arranging wheel of the corresponding size needs to be replaced.

[0020] Through the above specific embodiments, those skilled in the art can easily implement this utility model. However, it should be understood that this utility model is not limited to the specific embodiments described above. Based on the disclosed embodiments, those skilled in the art can arbitrarily combine different technical features to achieve different technical solutions.

Claims

1. A high-speed stamping forming apparatus for diode leads, characterized in that: It includes a worktable (1), a feeding device (2), a stamping device (3), and a guide rail (4); the guide rail (4) is set on the worktable (1), and the feeding device (2) is set at the starting end of the guide rail (4); the stamping device (3) is set in the middle of the guide rail (4); the feeding device (2) includes an arranging hopper (201) and an arranging wheel (202), the arranging hopper (201) is set on the top of the arranging wheel (202), and the arranging wheel (202) is set on the upper surface of the starting end of the guide rail (4).

2. The diode lead high-speed stamping forming device according to claim 1, characterized in that: The hopper (201) includes a material distribution plate (2011), on which a zigzag seam (2012) is provided. The outer periphery of the arranging wheel (202) is uniformly provided with grooves (2021). When the zigzag seam (2012) is close to the top of the arranging wheel (202) and the groove (2021) is located directly below the zigzag seam (2012), a diode (5) can be precisely embedded in the groove (2021).

3. The diode lead high-speed stamping forming apparatus according to claim 2, characterized in that: The material distribution plate (2011) is provided in two pieces, which are respectively connected to two clamping plates (2013). Adjustment seats (2014) are provided on both sides of the clamping plates (2013).

4. A high-speed stamping forming apparatus for diode leads according to claim 1, 2 or 3, characterized in that: The feeding device (2) also includes a feeding tray (203), which is located at the starting end of the hopper (201) via a chute (204).

5. The diode lead high-speed stamping forming apparatus according to claim 1, characterized in that: A drive chain (401) is provided in the middle of the guide rail (4), and a carrier block (402) is provided on the drive chain (401).

Images