Dustproof blowing device for semiconductor wire bonding equipment

Abstract

The utility model provides a semiconductor wire bonding equipment dustproof blowing device, including wire bonding equipment main part, the wire bonding equipment main part top is equipped with the positioner, and the positioner is mirror image distribution, and the inboard of positioner is equipped with mounting mechanism, and the end of positioner is equipped with gas supply subassembly, and the inside of mounting mechanism is equipped with dustproof blowing dustproof mechanism, the mounting mechanism includes mounting plate, transverse board, gas distribution pipe and connecting pipe, and the top of mounting plate is equipped with transverse board, and the inside of mounting plate is equipped with gas distribution pipe, and the side of gas distribution pipe is equipped with connecting pipe, and dustproof mechanism includes blowing box one and blowing box two. The utility model discloses a blowing box one and blowing box two that are arranged in dustproof mechanism, can blow from the oblique direction and the vertical direction, form the dustproof area of three -dimensional, form the protection airflow under the continuous blowing effect of blowing box one and blowing box two, block the splash of dust, and then can solve the foreign matter and dust splash in the wire bonding process in the semiconductor package.

Description

Technical Field

[0001] This utility model relates to the technical field of semiconductor wire bonding equipment components, specifically to a dustproof blowing device for semiconductor wire bonding equipment. Background Technology

[0002] Semiconductor wire bonding equipment is a core piece of equipment in the semiconductor packaging process. It is mainly used for conductive connections between chips and substrates / lead frames. In the process of using existing semiconductor wire bonding equipment, the feeding area of ​​the equipment is completely exposed to the air. Dust splashes onto the product surface, affecting the next welding step and even affecting the performance of products such as mobile phone cameras. In particular, gold-copper wire bonding equipment has higher requirements for the cleanliness of the chip surface. The existing workshop environment cannot completely remove and shield dust particles 100%. Operators still face the risk of bringing dust into the semiconductor bonding equipment when they approach it. Manual cleaning is ineffective and full inspection of products is costly.

[0003] In summary, there is a need for a device that can prevent foreign objects and dust from splashing onto the product surface. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a dust-proof blowing device for semiconductor wire bonding equipment, which solves the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: A dustproof blowing device for semiconductor wire bonding equipment includes a wire bonding equipment body. The top of the wire bonding equipment body is provided with an adjustment mechanism, which is distributed in a mirror image. An installation mechanism is provided inside the adjustment mechanism. An air supply component is provided at the end of the adjustment mechanism. A dustproof blowing mechanism is provided inside the installation mechanism. The installation mechanism includes an installation plate, a horizontal plate, an air distribution pipe, and a connecting pipe. The installation plate has a horizontal plate on top, an air distribution pipe inside the installation plate, and a connecting pipe at the edge of the air distribution pipe. The dustproof mechanism includes a blower box one and a blower box two, both of which are located inside the installation plate and are connected to the connecting pipe. Blower boxes one and two have blower nozzles inside, with multiple blower nozzles spaced apart.

[0006] Furthermore, the first blower box is inclined, the second blower box is vertically distributed, and a dustproof area is formed below the first and second blower boxes.

[0007] Furthermore, the dustproof mechanism also includes an electric rod, an adjusting rod, and an adjusting frame. The blower box is rotatably connected to the mounting plate, and an adjusting frame is provided on one side of the blower box. The electric rod is located on the bottom surface of the horizontal plate, and an adjusting rod is provided at the bottom of the horizontal plate. The adjusting rod engages and slides with the adjusting frame.

[0008] Furthermore, the gas supply assembly includes an installation pipe, a gas supply pipe, an air inlet pipe, and a flow meter. The installation pipe is located at the end of the adjustment mechanism, the air inlet pipe is located in the middle of the installation pipe, the flow meter is located at the top of the air inlet pipe, the gas supply pipe is located on the side of the installation pipe, and the end of the gas supply pipe opposite to the installation pipe is connected to the gas distribution pipe.

[0009] Furthermore, the air supply pipes are mirror-distributed on the side of the mounting pipe, and the air supply pipes have a spiral elastic structure.

[0010] Furthermore, the adjustment mechanism includes a mounting block and an electric guide rail. The mounting block is provided with an electric guide rail on its side. The mounting block and the electric guide rail are distributed in a mirror image. The electric guide rail engages and slides with the mounting plate.

[0011] This utility model provides a dust-proof blowing device for semiconductor wire bonding equipment. Compared with the prior art, it has the following advantages: The air blower box 1 and air blower box 2 in the dustproof mechanism can blow air from both oblique and vertical directions to form a three-dimensional dustproof area. Under the continuous blowing action of air blower box 1 and air blower box 2, a protective airflow is formed to block dust splashing, thereby solving the problem of foreign objects and dust splashing during the wire bonding process in semiconductor packaging. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0013] Figure 1 A schematic diagram of the structure of the dust-proof blowing device for semiconductor wire bonding equipment of this utility model is shown; Figure 2 A schematic diagram showing the distribution of the gas supply assembly of this utility model is provided. Figure 3 A schematic diagram showing the distribution of the first and second blower boxes of this utility model is provided. Figure 4 A schematic diagram of the gas supply assembly of this utility model is shown; Figure 5 This utility model illustrates Figure 4 Enlarged structural diagram at point A in the middle; The diagram shows: 1. Main body of the wire bonding equipment; 2. Adjustment mechanism; 21. Mounting block; 22. Electric guide rail; 3. Installation mechanism; 31. Mounting plate; 32. Horizontal plate; 33. Air distribution pipe; 34. Connecting pipe; 4. Air supply assembly; 41. Mounting pipe; 42. Air supply pipe; 43. Air inlet pipe; 44. Flow meter; 5. Dustproof mechanism; 51. Air blower box one; 52. Air blower box two; 53. Air nozzle; 54. Electric rod; 55. Adjusting rod; 56. Adjusting frame. Detailed Implementation

[0014] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model are described clearly and completely. Obviously, the described embodiments are only a part of the embodiments of this utility model, not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0015] To address the technical problems in the background section, the following dust-proof blowing device for semiconductor wire bonding equipment is provided: Combination Figures 1-5 As shown, the dustproof blowing device for semiconductor wire bonding equipment provided by this utility model includes a wire bonding equipment body 1. The top of the wire bonding equipment body 1 is provided with an adjusting mechanism 2 for controlling the movement of the mounting mechanism 3. The adjusting mechanism 2 is mirror-distributed. The mounting mechanism 3 is located inside the adjusting mechanism 2. An air supply component 4 is located at the end of the adjusting mechanism 2. A dustproof blowing mechanism 5 is located inside the mounting mechanism 3. The mounting mechanism 3 includes a mounting plate 31, a horizontal plate 32, an air distribution pipe 33, and a connecting pipe 34. The horizontal plate 32 is located at the top of the mounting plate 31. An air distribution pipe 33 connected to the air supply component 4 is located inside the mounting plate 31. The side of the air distribution pipe 33... The dustproof mechanism 5 includes a connecting pipe 34 and a blower box 51 and a blower box 52. Both blower boxes 51 and 52 are located inside the mounting plate 31 and are connected to the connecting pipe 34. Blower boxes 51 and 52 are equipped with blower nozzles 53 inside. Multiple blower nozzles 53 are spaced apart. The arrangement of multiple blower nozzles 53 can ensure that the blowing completely covers the product surface. Blower boxes 51 and 52 can blow air onto the feeding area of ​​the wire bonding equipment body 1 through the spaced blower nozzles 53 to achieve the purpose of dust blocking and prevention. As an improvement to the above solution, the first blower box 51 is inclined and the second blower box 52 is vertically distributed. A dustproof area is formed below the first blower box 51 and the second blower box 52. By cooperating with the inclined first blower box 51 and the vertically arranged second blower box 52, a three-dimensional dustproof area can be formed. Under the synergistic effect of airflow, the dustproof dead angles of the dustproof area are reduced, which helps to improve the dustproof effect of the blower on semiconductor wire bonding equipment. In this embodiment, the dustproof mechanism 5 also includes an electric rod 54, an adjusting rod 55, and an adjusting frame 56. The blower box 51 is rotatably connected to the mounting plate 31. The adjusting frame 56 is provided on the side of the blower box 51. The electric rod 54 is located on the bottom surface of the horizontal plate 32. The adjusting rod 55 is located at the bottom of the horizontal plate 32. The adjusting rod 55 engages and slides with the adjusting frame 56. By engaging and sliding with the adjusting rod 55 and the adjusting frame 56, the blowing angle of the blower box 51 can be changed under the drive of the electric rod 54, thereby improving the dustproof adaptability and usage flexibility of the device. like Figures 1-4 As shown, based on the above implementation plan, this implementation plan further provides the following: To further expand the applicability of this device, the following design is provided in this implementation plan: The air supply assembly 4 includes an installation pipe 41, an air supply pipe 42, an air inlet pipe 43, and a flow meter 44. The installation pipe 41 is located at the end of the adjustment mechanism 2. The air inlet pipe 43 is located in the middle of the installation pipe 41. The installation pipe 41 is used to connect with an external air supply device. The flow meter 44 is located at the top of the air inlet pipe 43. The flow meter 44 can monitor the air flow to ensure the blowing effect. The air supply pipe 42 is located on the side of the installation pipe 41. The end of the air supply pipe 42 away from the installation pipe 41 is connected to the air distribution pipe 33. As an improvement to the above solution, the air supply pipe 42 is distributed in a mirror image on the side of the mounting pipe 41. The air supply pipe 42 has a spiral elastic structure. The spiral elastic structure of the air supply pipe 42 facilitates the horizontal adjustment of the position in conjunction with the mounting mechanism 3. In this embodiment, the adjustment mechanism 2 includes a mounting block 21 and an electric guide rail 22. The mounting block 21 is provided with an electric guide rail 22 on its side. The mounting block 21 and the electric guide rail 22 are mirror images of each other. The electric guide rail 22 engages and slides with the mounting plate 31. Through the mirror image electric guide rail 22, the mounting plate 31 can be controlled to move horizontally. At the same time, the dustproof mechanism 5 moves together, so that the dustproof blowing device can be adapted to different specifications of material belts, and the relative position of the air outlet and the material belt can be adjusted to avoid dustproof dead angles or airflow interference caused by changes in material belt specifications.

[0016] Working principle and usage process of this utility model: When using: First, the dustproof blowing device is installed in the material pulling area of ​​the semiconductor wire bonding equipment. During the water intake operation of the semiconductor wire bonding equipment, the air supply component 4 is connected to the external air supply device to send air into the dustproof mechanism 5. At this time, the blowing box 1 51 and the blowing box 2 52 blow air from the oblique and vertical directions through multiple blowing nozzles 53 set at intervals to form a three-dimensional dustproof area. In this way, through continuous blowing, a protective airflow is formed. The continuous airflow can block the splashing of dust, which solves the problem of foreign objects and dust splashing onto the product surface in the wire bonding process of semiconductor packaging, which is extremely difficult to control. During use: When the dustproof blower is in use, the electric rod 54 in the dustproof mechanism 5 can change the blowing angle of the blower box 51 by engaging the sliding adjustment rod 55 and the adjustment frame 56. In conjunction with the electric guide rail 22, it drives the installation mechanism 3 and the dustproof mechanism 5 to move horizontally, thereby greatly improving the dustproof adaptability and usage flexibility.

[0017] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0018] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the various embodiments of this utility model.

Claims

1. A dust-proof blowing device for semiconductor wire bonding equipment, characterized in that: The device includes a wire bonding equipment body (1), the top of which is provided with an adjustment mechanism (2), the adjustment mechanism (2) is distributed in a mirror image, the inner side of the adjustment mechanism (2) is provided with an installation mechanism (3), the end of the adjustment mechanism (2) is provided with an air supply component (4), and the installation mechanism (3) is provided with a dustproof mechanism (5) for dustproof blowing. The installation mechanism (3) includes an installation plate (31), a horizontal plate (32), an air distribution pipe (33), and a connecting pipe (34). The installation plate (31) has a horizontal plate (32) on top, an air distribution pipe (33) inside the installation plate (31), and a connecting pipe (34) on the side of the air distribution pipe (33). The dustproof mechanism (5) includes a blower box one (51) and a blower box two (52). Both blower box one (51) and blower box two (52) are located inside the installation plate (31). Both blower box one (51) and blower box two (52) are connected to the connecting pipe (34). Blower nozzles (53) are provided inside blower box one (51) and blower box two (52). Multiple blower nozzles (53) are spaced apart.

2. The dustproof blowing device for semiconductor wire bonding equipment according to claim 1, characterized in that: The first blower box (51) is inclined, and the second blower box (52) is vertically distributed. A dustproof area is formed below the first blower box (51) and the second blower box (52).

3. The dust-proof blowing device for semiconductor wire bonding equipment according to claim 1, characterized in that: The dustproof mechanism (5) also includes an electric rod (54), an adjusting rod (55), and an adjusting frame (56). The blower box (51) is rotatably connected to the mounting plate (31). The side of the blower box (51) is provided with an adjusting frame (56). The electric rod (54) is located on the bottom surface of the horizontal plate (32). The bottom of the horizontal plate (32) is provided with an adjusting rod (55). The adjusting rod (55) and the adjusting frame (56) engage and slide.

4. The dust-proof blowing device for semiconductor wire bonding equipment according to claim 1, characterized in that: The gas supply assembly (4) includes an installation pipe (41), a gas supply pipe (42), an air inlet pipe (43), and a flow meter (44). The installation pipe (41) is located at the end of the adjustment mechanism (2). The air inlet pipe (43) is located in the middle of the installation pipe (41). The flow meter (44) is located at the top of the air inlet pipe (43). The gas supply pipe (42) is located on the side of the installation pipe (41). The end of the gas supply pipe (42) away from the installation pipe (41) is connected to the gas distribution pipe (33).

5. The dustproof blowing device for semiconductor wire bonding equipment according to claim 4, characterized in that: The gas supply pipe (42) is mirrored on the side of the mounting pipe (41), and the gas supply pipe (42) has a spiral elastic structure.

6. The dust-proof blowing device for semiconductor wire bonding equipment according to claim 1, characterized in that: The adjustment mechanism (2) includes a mounting block (21) and an electric guide rail (22). The mounting block (21) is provided with an electric guide rail (22) on its side. The mounting block (21) and the electric guide rail (22) are mirror images of each other. The electric guide rail (22) engages and slides with the mounting plate (31).

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