A polishing and grinding apparatus

Abstract

The utility model provides a kind of grinding and polishing equipment, including machine table and the moving mechanism being set to the top of machine table, and moving structure is connected with grinding head subassembly;Operating platform is provided on machine table, and operating platform is provided with rough grinding module, polishing module, cleaning module and blow-drying module;Moving mechanism, including longitudinal movement module, transverse movement module and vertical movement module connected in turn, grinding head subassembly is installed in vertical movement module, and moving mechanism drives grinding head subassembly to move along set path;Grinding head subassembly includes grinding head support, and first driving structure, pressure maintaining structure and sample support are provided on grinding head support, sample support can lock or loosen sample chuck, and sample chuck is used to load sample to be processed, and first driving structure drives sample support to rotate, and pressure maintaining structure applies set pressure to sample;Rough grinding module and polishing module all include second driving structure and grinding and polishing disc, and second driving structure drives grinding and polishing disc to rotate.

Description

Technical Field

[0001] This utility model belongs to the field of metallographic sample preparation technology, and in particular relates to a grinding and polishing device. Background Technology

[0002] Traditional grinding and polishing techniques typically rely on manual or semi-automatic mechanical systems to complete the task. Metallographic grinding and polishing presents the following problems: 1. Uneven sample surface with crescent-shaped depressions; 2. Low sample surface roughness with scratches; 3. Inability to precisely control the grinding and polishing depth; 4. High skill requirements and high labor intensity for operators; all of which affect the quality and consistency of the samples and the efficiency of sample preparation.

[0003] Therefore, it is necessary to provide a grinding and polishing device to improve the grinding and polishing quality of metallographic samples and increase the sample preparation efficiency. Utility Model Content

[0004] This invention provides a grinding and polishing device that improves the grinding and polishing quality of metallographic samples and increases the efficiency of sample preparation.

[0005] To achieve the above objectives, the present invention provides the following technical solution.

[0006] A grinding and polishing device includes a machine base and a moving mechanism disposed above the machine base, wherein the moving mechanism is connected to a grinding head assembly;

[0007] The machine is equipped with an operating platform, which includes loading and unloading stations, multiple rough grinding stations, polishing stations, cleaning stations, and drying stations. Corresponding to the rough grinding stations, polishing stations, cleaning stations, and drying stations, there are respectively a rough grinding module, a polishing module, a cleaning module, and a drying module.

[0008] The moving mechanism is mounted on the mounting brackets at both ends of the machine base, and includes a longitudinal moving module, a transverse moving module and a vertical moving module connected in sequence. The grinding head assembly is mounted on the vertical moving module, and the moving mechanism drives the grinding head assembly to move along a set path.

[0009] The grinding head assembly includes a grinding head support, on which a first driving structure, a pressure holding structure, and a sample holder are provided. The sample holder can lock or release the sample chuck, and the sample chuck is used to load the sample to be processed. The first driving structure drives the sample holder to rotate, and the pressure holding structure applies a set pressure to the sample.

[0010] The coarse grinding module and the polishing module both include a second drive structure and a grinding and polishing disc. The grinding and polishing disc is equipped with a coarse grinding wheel or polishing cloth. The second drive structure drives the grinding and polishing disc to rotate. The pressure holding structure includes a pressure holding cylinder and a pressure holding disc. The telescopic end of the pressure holding cylinder is connected to a connecting shaft. The connecting shaft passes through the pressure holding disc and connects to the sample holder. The pressure holding disc only allows the connecting shaft to move axially relative to the pressure holding disc. The pressure holding disc is equipped with multiple pressure holding rods corresponding to the sample chuck. When the pressure holding cylinder retracts, it drives the sample holder to move upward relative to the pressure holding disc, so that the pressure holding rods contact the sample on the sample chuck and apply pressure.

[0011] Preferably, the grinding head assembly moves to the coarse grinding station or polishing station for coarse grinding or polishing. While the second driving structure drives the grinding and polishing disc to rotate, the vertical moving module drives the grinding head assembly to move downward. The first driving structure drives the sample holder to rotate. The pressure holding structure applies a set pressure to the sample. The longitudinal moving module and the transverse moving module drive the grinding head assembly to move relative to the grinding and polishing disc along a set path, thereby achieving grinding and polishing of the sample chuck and the grinding and polishing disc on different axes.

[0012] Preferably, the machine is equipped with a water supply and drainage module, and the water supply pipeline and drainage pipeline of the water supply and drainage module are respectively connected to the rough grinding station and the cleaning station to realize the water supply and drainage of the rough grinding and cleaning processes.

[0013] Preferably, both the coarse grinding module and the polishing module further include a grinding and polishing base plate, a grinding and polishing disc shaft, and a cross roller bearing. The grinding and polishing disc shaft is located at the center of the cross roller bearing, the cross roller bearing is installed on the grinding and polishing base plate, and the grinding and polishing disc is located at the top of the grinding and polishing disc shaft. The second drive structure is connected to the grinding and polishing disc shaft and drives it to rotate the grinding and polishing disc.

[0014] Preferably, the second drive structure includes a second drive motor, a drive wheel, a driven wheel, and a belt. The second drive motor is disposed on the grinding and polishing base plate and connected to the drive wheel. The driven wheel is connected to the grinding and polishing disc shaft. The belt connects the drive wheel and the driven wheel. The second drive motor drives the grinding and polishing disc shaft to rotate through the drive wheel, the driven wheel, and the belt.

[0015] Preferably, the first drive structure is connected to the connecting shaft and drives it to rotate.

[0016] Preferably, the cleaning module includes a cleaning base plate, a cleaning tank, and an ultrasonic generator; the cleaning tank is fixed to the cleaning base plate to contain the cleaning liquid, and the ultrasonic generator is located at the bottom of the cleaning tank to generate ultrasonic waves and transfer ultrasonic energy into the cleaning liquid to form a cavitation effect, thereby achieving cleaning of the sample surface.

[0017] Preferably, the drying module includes a nozzle and a shroud; the nozzle extends into the shroud and bends upward at an angle, and when the grinding head assembly carries the sample into the shroud, the nozzle blows dry the water stains on the surface of the cleaned sample from the bottom of the sample upward at an angle.

[0018] Preferably, the system further includes a host computer and a slave computer. The slave computer is disposed in the machine platform and is connected to the moving mechanism, the first driving structure, the second driving structure, and the pressure holding structure, and controls their operation. The host computer is disposed on the machine platform and is connected to the slave computer for setting control parameters.

[0019] Compared with the prior art, the technical solution of this utility model embodiment has beneficial effects.

[0020] For example, this invention features a moving mechanism that uses longitudinal and transverse moving modules to move the grinding head assembly within a plane, significantly improving the motion stiffness of the grinding head assembly, enhancing the planar accuracy of the metallographic sample surface, and reducing the crescent-shaped depressions on the metallographic sample surface caused by traditional grinding and polishing machines. By changing the axial eccentricity between the grinding head assembly and the polishing disc through translation, the linear velocity angle between each sample and the polishing disc is altered, achieving a continuously varying cross-polishing effect. Simultaneously, a pressure-holding structure ensures that the sample chuck is pressed downwards with constant pressure during high-speed rotation, eliminating polishing scratches and improving the surface roughness and polishing quality of the metallographic sample. The vertical moving module controls the upward and downward movement of the grinding head assembly in the Z-axis direction, precisely controlling the polishing depth of the metallographic sample to meet the polishing requirements of ultra-fine cross-sections. It integrates functions such as rough grinding, polishing, cleaning, drying, and loading / unloading of metallographic samples, improving sample preparation efficiency.

[0021] For example, this invention uses a cross roller bearing capable of withstanding axial and radial loads to be fixedly connected to the polishing disc shaft, eliminating the overturning moment of the polishing disc during the polishing process, ensuring the stability and accuracy of the polishing disc when rotating at high speed, improving the planar accuracy of the metallographic sample surface, and reducing the crescent-shaped depressions on the surface of the metallographic sample caused by traditional polishing machines.

[0022] For example, this invention uses a splined movable connection between the sample holder and the sample chuck that can withstand radial loads, eliminating the radial gap between the sample holder and the sample chuck during the grinding and polishing process, ensuring the coaxial accuracy of the sample chuck when rotating at high speed, improving the planar accuracy of the metallographic sample surface, and eliminating the crescent-shaped depression phenomenon on the surface of the metallographic sample caused by traditional grinding and polishing machines. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the grinding and polishing equipment in an embodiment of this utility model;

[0024] Figure 2 This is a layout diagram of the upper part of the machine platform in an embodiment of this utility model;

[0025] Figure 3 This is a layout diagram of the lower part of the machine tool in an embodiment of this utility model;

[0026] Figure 4 This is a schematic diagram of the moving mechanism and grinding head assembly in an embodiment of this utility model;

[0027] Figure 5 This is a front view of the moving mechanism and grinding head assembly in an embodiment of this utility model;

[0028] Figure 6 This is a schematic diagram of the grinding head assembly structure in an embodiment of this utility model;

[0029] Figure 7 This is a schematic diagram of the coarse grinding module structure in an embodiment of this utility model;

[0030] Figure 8 This is a schematic diagram of the cleaning module structure in an embodiment of this utility model;

[0031] Figure 9 This is a schematic diagram of the drying module structure in an embodiment of this utility model.

[0032] Explanation of reference numerals in the attached figures:

[0033] 1-Machine base; 11-Mounting bracket; 13-Host computer; 14-Sub-computer;

[0034] 2-Moving mechanism; 21-Longitudinal moving module; 22-Horizontal moving module; 23-Vertical moving module;

[0035] 3-Grinding head assembly; 31-Grinding head support; 32-First drive structure; 33-Pressure holding structure; 34-Sample holder; 35-Sample chuck;

[0036] 4-Operating table; 41-Loading and unloading station; 42-Rough grinding station; 43-Polishing station; 44-Cleaning station; 45-Drying station;

[0037] 5- Coarse grinding module; 51- Second drive structure; 511- Second drive motor; 52- Grinding and polishing disc; 53- Grinding and polishing base plate; 54- Grinding and polishing disc shaft; 55- Crossed roller bearing;

[0038] 6-Polishing module;

[0039] 7-Cleaning module; 71-Cleaning base plate; 72-Cleaning tank; 73-Ultrasonic generator;

[0040] 8-Drying module; 71-Nozzle; 72-Air shroud. Detailed Implementation

[0041] To make the objectives, features, and beneficial effects of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. It is to be understood that the specific embodiments described below are merely for explaining this utility model and are not intended to limit it. Furthermore, the same or similar reference numerals may be used in the drawings to refer to the same or similar elements in different embodiments, and descriptions of the same or similar elements in different embodiments, as well as descriptions of prior art elements, features, effects, etc., may be omitted.

[0042] Reference Figures 1 to 9 This utility model provides a grinding and polishing device.

[0043] Specifically, the grinding and polishing equipment includes a machine base 1 and a moving mechanism 2 disposed above the machine base 1, the moving mechanism 2 being connected to a grinding head assembly 3;

[0044] The machine base 1 is equipped with an operating table 4, which is equipped with a loading and unloading station 41, multiple rough grinding stations 42, polishing stations 43, cleaning stations 44 and drying stations 45; corresponding to the rough grinding station 42, polishing station 43, cleaning station 44 and drying station 45, a rough grinding module 5, a polishing module 6, a cleaning module 7 and a drying module 8 are respectively provided;

[0045] The moving mechanism 2 is mounted on the mounting brackets 11 at both ends of the machine base 1. It includes a longitudinal moving module 21, a transverse moving module 22 and a vertical moving module 23 connected in sequence. The grinding head assembly 3 is mounted on the vertical moving module 23. The moving mechanism 2 drives the grinding head assembly 3 to move along a set path.

[0046] The grinding head assembly 3 includes a grinding head support 31, on which a first driving structure 32, a pressure holding structure 33 and a sample holder 34 are provided. The sample holder 34 can lock or release the sample chuck 35. The sample chuck 35 is used to load the sample to be processed. The first driving structure 32 drives the sample holder 34 to rotate, and the pressure holding structure 33 applies a set pressure to the sample.

[0047] Both the coarse grinding module 5 and the polishing module 6 include a second drive structure 51 and a grinding and polishing disc 52. The grinding and polishing disc 52 is provided with a coarse grinding wheel or polishing cloth. The second drive structure 51 drives the grinding and polishing disc 52 to rotate.

[0048] During operation, the grinding head assembly 3 moves to the loading / unloading station 41 to lock or release the sample chuck 35 to achieve loading / unloading. The grinding head assembly 3 moves to the cleaning station 44 or the drying station 45 to achieve sample cleaning or drying. When the grinding head assembly 3 moves to the coarse grinding station 42 or the polishing station 43 for coarse grinding or polishing, the second drive structure 51 drives the grinding and polishing disc 52 to rotate while the vertical moving module 23 drives the grinding head assembly 3 to move downward. The first drive structure 32 drives the sample holder 34 to rotate. The pressure holding structure 33 applies a set pressure to the sample. The longitudinal moving module 21 and the transverse moving module 22 drive the grinding head assembly 3 to move relative to the grinding and polishing disc 52 along a set path to achieve grinding and polishing of the sample chuck 35 and the grinding and polishing disc 52 on different axes.

[0049] The sample chuck 35 is not coaxial with the polishing disc 52. By changing the eccentric distance between the axes of the grinding head assembly 3 and the polishing disc 52 through translation, the angle between the linear velocity of each sample and the polishing disc 52 is changed, achieving a continuously changing cross-polishing effect. At the same time, a pressure-holding structure 33 is adopted to ensure that the sample chuck 35 is pressed downward and the pressure is constant when rotating at high speed, eliminating polishing scratches and improving the surface roughness and polishing quality of the metallographic sample. The vertical movement module 23 controls the rise and fall of the grinding head assembly 3 in the Z-axis direction, which can precisely control the polishing depth of the metallographic sample and meet the polishing requirements of ultra-fine cross sections.

[0050] Specifically, the sample holder 34 can be connected to the sample chuck 35 via a spline to lock or release the sample chuck 35. Alternatively, other existing structures can be used to lock or release the sample chuck 35. No restrictions are imposed here.

[0051] Specifically, the coarse grinding wheel of the coarse grinding module 5 is attached to the grinding and polishing disc 52; the polishing cloth of the polishing module 6 is attached to the grinding and polishing disc 52.

[0052] Specifically, there are two coarse grinding stations 42, and each coarse grinding station 42 is equipped with a coarse grinding module 5. The coarse grinding wheels of the two coarse grinding modules 5 have different mesh sizes, so as to achieve grinding of samples with different particle sizes.

[0053] Specifically, a polishing fluid bottle is also provided on the grinding head support 31 to deliver polishing fluid in real time during the sample polishing process.

[0054] In some embodiments, the machine 1 is provided with a water supply and drainage module 12. The water supply pipeline and the drainage pipeline of the water supply and drainage module 12 are respectively connected to the coarse grinding station 42 and the cleaning station 44 to realize the water supply and drainage of the coarse grinding and cleaning processes.

[0055] Specifically, during the rough grinding process, cooling water is supplied through the water supply pipeline to cool the grinding disc 52 and the sample.

[0056] In some embodiments, both the coarse grinding module 5 and the polishing module 6 further include a grinding and polishing base plate 53, a grinding and polishing disc shaft 54, and a cross roller bearing 55. The grinding and polishing disc shaft 54 ​​is disposed at the center of the cross roller bearing 55, the cross roller bearing 55 is mounted on the grinding and polishing base plate 53, and the grinding and polishing disc 52 is disposed at the top of the grinding and polishing disc shaft 54. The second drive structure 51 is connected to the grinding and polishing disc shaft 54 ​​and drives it to rotate the grinding and polishing disc 52.

[0057] Specifically, the diameter of the polishing disc shaft 54 ​​is 1 / 2 to 4 / 5 of the diameter of the polishing disc. The large-diameter polishing disc shaft 54 ​​provides stable support for the polishing disc 52. The crossed roller bearing 55 can withstand axial and radial loads. The crossed roller bearing 55 bears the axial and radial loads of the polishing disc 52 during polishing to ensure the dynamic stiffness and motion accuracy of the polishing disc 52 when rotating at high speed.

[0058] In some embodiments, the second drive structure 51 includes a second drive motor 511, a drive wheel (not shown), a driven wheel (not shown), and a belt (not shown). The second drive motor 511 is disposed on the grinding and polishing base plate 53 and connected to the drive wheel. The driven wheel is connected to the grinding and polishing disc shaft 54. The belt connects the drive wheel and the driven wheel. The second drive motor 511 drives the grinding and polishing disc shaft 54 ​​to rotate through the drive wheel, the driven wheel, and the belt.

[0059] In some embodiments, the pressure holding structure 33 includes a pressure holding cylinder 331 and a pressure holding plate 332. The telescopic end of the pressure holding cylinder 331 is connected to a connecting shaft (not shown). The connecting shaft passes through the pressure holding plate 332 and connects to the sample holder 34. The pressure holding plate 332 only allows the connecting shaft to move relative to the pressure holding plate shaft 332. A plurality of pressure holding rods 333 are provided on the pressure holding plate 332 corresponding to the sample chuck 35. When the pressure holding cylinder 331 retracts, it drives the sample holder 34 to move upward relative to the pressure holding plate 332, so that the pressure holding rods 333 contact the sample on the sample chuck 35 and apply pressure. The first drive structure 32 connects to the connecting shaft and drives it to rotate.

[0060] Specifically, the pressure holding rod 333 can be configured as a spring pressure rod. By controlling the upward stroke of the pressure holding plate 332, the compression stroke of the pressure holding rod 333 can be controlled, thereby controlling the pressure applied by the pressure holding rod 333. The pressure holding rod 333 can also be configured as other structures that can control the applied pressure, which are not limited here.

[0061] Specifically, the connection method of the pressure-holding cylinder 331, the pressure-holding plate 332, and the pressure-holding rod 333 can be referred to the existing patent with publication number CN214923096U, entitled "A Loading Mechanism for an Intelligent Automatic Metallographic Grinding and Polishing Machine".

[0062] Specifically, the first drive structure 32 has the same structure as the second drive structure 51, which will not be described in detail here.

[0063] In some embodiments, the cleaning module 7 includes a cleaning base plate 71, a cleaning tank 72, and an ultrasonic generator 73. The cleaning tank 72 is fixed on the cleaning base plate 71 to contain the cleaning liquid, and the ultrasonic generator 73 is disposed at the bottom of the cleaning tank 72 to generate ultrasonic waves and transfer ultrasonic energy into the cleaning liquid to form a cavitation effect, thereby achieving the cleaning of the sample surface.

[0064] In some embodiments, the drying module 8 includes a nozzle 81 and a shroud 82; the nozzle 81 extends into the shroud 82 and bends upward at an angle. When the grinding head assembly 3 drives the sample into the shroud 82, the nozzle 81 blows the water stains on the surface of the cleaned sample from the bottom of the sample upward at an angle.

[0065] In some embodiments, the system further includes a host computer 13 and a slave computer 14. The slave computer 14 is disposed in the machine base 1 and is connected to the moving mechanism 2, the first driving structure 32, the second driving structure 51, and the pressure holding structure 33 and controls their operation. The host computer 13 is disposed on the machine base 1 and is connected to the slave computer 14 for setting control parameters.

[0066] The operation method of the grinding and polishing equipment of this utility model includes the following steps:

[0067] The path for the moving mechanism 2 to drive the grinding head assembly 3 to move is set according to the grinding and polishing requirements of the sample, and the control parameters are set.

[0068] The moving mechanism 2 drives the grinding head assembly 3 to the loading and unloading station 41, and retrieves the sample chuck 35 carrying the sample from the loading and unloading station 9 and locks it.

[0069] The moving mechanism 2 drives the grinding head assembly 3 to move to the coarse grinding station 42. The second driving structure 51 of the coarse grinding module 5 drives the grinding and polishing disc 52 to rotate. At the same time, the vertical moving module 23 drives the grinding head assembly 3 to move downward. The first driving structure 32 drives the sample holder 34 to rotate. The pressure holding structure 33 applies a set pressure to the sample. The longitudinal moving module 21 and the transverse moving module 22 drive the grinding head assembly 3 to move relative to the grinding and polishing disc 52 along a set path. The sample chuck 35 drives the grinding of the sample and the grinding and polishing disc 52 to be on different axes.

[0070] The moving mechanism 2 drives the grinding head assembly 3 to the cleaning station 44 to complete the cleaning, and then moves it to the drying station 45 to complete the drying of the sample.

[0071] The moving mechanism 2 drives the grinding head assembly 3 to move to other coarse grinding stations 42, and repeats the above grinding, cleaning and drying steps to perform grinding and post-grinding cleaning and drying;

[0072] The moving mechanism 2 drives the grinding head assembly 3 to the polishing station 43. The second driving structure 51 of the polishing module 6 drives the polishing disc 52 to rotate. At the same time, the vertical moving module 23 drives the grinding head assembly 3 to move downward. The first driving structure 32 drives the sample holder 34 to rotate. The pressure holding structure 33 applies a set pressure to the sample. The longitudinal moving module 21 and the transverse moving module 22 drive the grinding head assembly 3 to move relative to the polishing disc 52 along a set path. The sample chuck 35 drives the polishing of the sample and the polishing disc 52, which are not on the same axis.

[0073] The moving mechanism 2 drives the grinding head assembly 3 to the loading and unloading station 9, the vertical moving module 23 drives the grinding head assembly 3 to move downward, and the grinding head assembly 3 releases the sample chuck 35 to realize unloading.

[0074] Specifically, the longitudinal moving module 21 and the transverse moving module 22 drive the grinding head assembly 3 to move relative to the grinding and polishing disc 52 along the circumference of the grinding and polishing disc 52.

[0075] In some embodiments, there are two rough grinding stations 42, namely a first rough grinding station and a second rough grinding station, and the operation method further includes the following steps:

[0076] The moving mechanism 2 drives the grinding head assembly 3 to the first coarse grinding station for the first grinding;

[0077] The moving mechanism 2 drives the grinding head assembly 3 to the cleaning station 44 to complete the cleaning, and then moves it to the drying station 45 to complete the drying of the sample.

[0078] The moving mechanism 2 drives the grinding head assembly 3 to the second coarse grinding station for a second grinding, and repeats the cleaning and drying steps to complete the cleaning and drying after grinding.

[0079] In summary, the polishing equipment provided by this utility model features a moving mechanism 2. Through a longitudinal moving module 21 and a transverse moving module 22, the grinding head assembly 3 moves within a plane, significantly improving the motion rigidity of the grinding head assembly 3, enhancing the planar accuracy of the metallographic sample surface, and reducing the crescent-shaped depressions on the metallographic sample surface caused by traditional polishing machines. By changing the axial eccentricity between the grinding head assembly 3 and the polishing disc 52 through translation, the angle of linear velocity between each sample and the polishing disc 52 is altered, achieving a continuously varying cross-polishing effect. Simultaneously, a pressure-holding structure 33 ensures that the sample chuck 35 is pressed downwards with constant pressure during high-speed rotation, eliminating polishing scratches and improving the surface roughness and polishing quality of the metallographic sample. The vertical moving module 23 controls the upward and downward movement of the grinding head assembly 3 in the Z-axis direction, precisely controlling the polishing depth of the metallographic sample to meet the polishing requirements of ultra-fine cross-sections. The equipment integrates functions such as rough grinding, polishing, cleaning, drying, and loading / unloading of metallographic samples, improving sample preparation efficiency.

[0080] Furthermore, this utility model employs a cross roller bearing 55 capable of withstanding axial and radial loads, which is fixedly connected to the polishing disc 52 via the polishing disc shaft 54. This eliminates the overturning torque of the polishing disc 52 during the polishing process, ensuring the stability and accuracy of the polishing disc 52 during high-speed rotation. This improves the planar accuracy of the metallographic sample surface and reduces the crescent-shaped depressions on the metallographic sample surface caused by traditional polishing machines.

[0081] Furthermore, this utility model adopts a spline movable connection between the sample holder 34 and the sample chuck 35 that can withstand radial loads, eliminating the radial gap between the sample holder 34 and the sample chuck 35 during the grinding and polishing process, ensuring the coaxial accuracy of the sample chuck 35 during high-speed rotation, improving the planar accuracy of the metallographic sample surface, and eliminating the crescent-shaped depression phenomenon on the surface of the metallographic sample caused by traditional grinding and polishing machines.

[0082] Although specific embodiments have been described above, these embodiments are not intended to limit the scope of this utility model disclosure, even when only a single embodiment is described with respect to a particular feature. The feature examples provided in this utility model disclosure are intended to be illustrative and not limiting, unless otherwise stated. In practice, one or more technical features of the dependent claims may be combined with the technical features of the independent claims as needed and where technically feasible, and may be derived from the technical features of the respective independent claims in any suitable manner rather than solely by the specific combinations listed in the claims.

Claims

1. A grinding and polishing device, characterized in that, It includes a machine base and a moving mechanism disposed above the machine base, the moving mechanism being connected to a grinding head assembly; The machine platform is equipped with an operating table, which includes loading and unloading stations, multiple rough grinding stations, polishing stations, cleaning stations, and drying stations. Corresponding to the rough grinding, polishing, cleaning, and drying stations are respectively equipped with rough grinding modules, polishing modules, cleaning modules, and drying modules. A moving mechanism, mounted on mounting brackets at both ends of the machine platform, includes a longitudinal moving module, a transverse moving module, and a vertical moving module connected in sequence. The grinding head assembly is mounted on the vertical moving module, and the moving mechanism drives the grinding head assembly to move along a set path. The grinding head assembly includes a grinding head support, on which a first driving structure, a pressure holding structure, and a sample holder are provided. The sample holder can lock or release the sample chuck, which is used to load the sample to be processed. The first driving structure drives the sample holder to rotate, and the pressure holding structure applies a set pressure to the sample. Both the coarse grinding module and the polishing module include a second driving structure and a polishing disc. The polishing disc is equipped with a coarse grinding wheel or polishing cloth. The second driving structure drives the polishing disc to rotate. The pressure holding structure includes a pressure holding cylinder and a pressure holding plate. The telescopic end of the pressure holding cylinder is connected to a connecting shaft. The connecting shaft passes through the pressure holding plate and connects to the sample holder. The pressure holding plate only allows the connecting shaft to move axially relative to the pressure holding plate. Multiple pressure holding rods are provided on the pressure holding plate corresponding to the sample chuck. When the pressure holding cylinder retracts, it causes the sample holder to move upward relative to the pressure holding plate, so that the pressure holding rods contact the sample on the sample chuck and apply pressure.

2. The grinding and polishing equipment according to claim 1, characterized in that, The grinding head assembly moves to the coarse grinding station or polishing station for coarse grinding or polishing. While the second driving structure drives the grinding and polishing disc to rotate, the vertical moving module drives the grinding head assembly to move downward. The longitudinal moving module and the transverse moving module drive the grinding head assembly to move relative to the grinding and polishing disc along a set path, thereby realizing the grinding and polishing of the sample chuck and the grinding and polishing disc on different axes.

3. The grinding and polishing equipment according to claim 1, characterized in that, The machine is equipped with a water supply and drainage module. The water supply pipeline and drainage pipeline of the water supply and drainage module are respectively connected to the rough grinding station and the cleaning station to realize the water supply and drainage of the rough grinding and cleaning processes.

4. The grinding and polishing equipment according to claim 1, characterized in that, Both the coarse grinding module and the polishing module include a grinding and polishing base plate, a grinding and polishing disc shaft, and a cross roller bearing. The grinding and polishing disc shaft is located at the center of the cross roller bearing, the cross roller bearing is installed on the grinding and polishing base plate, and the grinding and polishing disc is located at the top of the grinding and polishing disc shaft. The second drive structure is connected to the grinding and polishing disc shaft and drives it to rotate the grinding and polishing disc.

5. The grinding and polishing equipment according to claim 4, characterized in that, The second drive structure includes a second drive motor, a drive wheel, a driven wheel, and a belt. The second drive motor is mounted on the polishing base plate and connected to the drive wheel. The driven wheel is connected to the polishing disc shaft. The belt connects the drive wheel and the driven wheel. The second drive motor drives the polishing disc shaft to rotate through the drive wheel, the driven wheel, and the belt.

6. The grinding and polishing equipment according to claim 1, characterized in that, The first drive structure connects to the connecting shaft and drives it to rotate.

7. The grinding and polishing equipment according to claim 1, characterized in that, The cleaning module includes a cleaning base plate, a cleaning tank, and an ultrasonic generator. The cleaning tank is fixed to the cleaning base plate to contain the cleaning liquid. The ultrasonic generator is located at the bottom of the cleaning tank to generate ultrasonic waves and transfer the ultrasonic energy into the cleaning liquid to form a cavitation effect, thereby achieving the cleaning of the sample surface.

8. The grinding and polishing equipment according to claim 1, characterized in that, The drying module includes a nozzle and a shroud; the nozzle extends into the shroud and bends upward at an angle. When the grinding head assembly carries the sample into the shroud, the nozzle blows the water stains on the surface of the cleaned sample from the bottom of the sample upward at an angle.

9. The grinding and polishing equipment according to claim 1, characterized in that, It also includes a host computer and a slave computer. The slave computer is disposed in the machine platform and is connected to the moving mechanism, the first driving structure, the second driving structure and the pressure holding structure and controls their operation. The host computer is disposed on the machine platform and is connected to the slave computer for setting control parameters.

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