Wafer polishing solution automatic adding device

Abstract

The utility model relates to the technical field of semiconductor processing discloses a kind of wafer grinding fluid automatic adding device, including bottom cylinder, stand, filtering platform, grinding equipment, hopper, spray head, water pump, stock solution valve, recovery liquid valve, bucket, three-way pipe and infusion tube. Bottom cylinder is fixed stand, top is connected filtering platform, is equipped with grinding equipment thereon, is evenly distributed conical hopper, there is detachable metal filter screen, and adjacent two groups of filter screen are connected by handle. Bucket is arranged at one side of bottom cylinder, is connected three-way pipe by pipeline, three-way pipe is through bottom cylinder bottom, is equipped with valve on both sides, is connected water pump in middle section, water pump is connected spray head by infusion tube, and spray head extends to the upper of polishing head. When working, water pump is controlled by valve, and stock solution in bucket or bottom cylinder recovery liquid is selected and pumped, is sprayed to grinding position by spray head. Waste liquid is filtered by hopper and then enters bottom cylinder recovery. The device realizes grinding fluid automatic accurate supply and recycling, improves waste liquid processing efficiency, is convenient to maintain, improves grinding effect and resource utilization rate.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, specifically to an automatic wafer polishing slurry adding device. Background Technology

[0002] In wafer manufacturing, polishing is a crucial step in ensuring the flatness and precision of the wafer surface. The supply volume, precision, and recycling of polishing slurry significantly impact polishing results and production costs. Traditional wafer polishing slurry addition is mostly manual or semi-automated, which has several drawbacks: manual addition makes it difficult to accurately control the amount of polishing slurry used, easily leading to waste due to excessive dosage or affecting polishing quality due to insufficient dosage; semi-automated devices often lack effective filtration and recovery structures, resulting in the direct discharge of waste slurry containing impurities after polishing, which not only pollutes the environment but also wastes resources; some devices have improperly fixed polishing slurry nozzle positions, failing to accurately apply the slurry to the polishing area and affecting polishing efficiency; at the same time, the filter components are inconvenient to install and remove, and maintenance is time-consuming, reducing the overall operating efficiency of the equipment. To solve the above problems and achieve automatic and precise supply, efficient recycling, and convenient maintenance of polishing slurry, this utility model proposes an automatic wafer polishing slurry addition device.

[0003] A search revealed existing technology (application number: CN202411272497.2), which describes "a grinding slurry conveying device." This utility model includes a conveying box, a vertical moving component, a stirring component, and a horizontal moving component. The conveying box includes an inlet and an outlet. The vertical moving component is located inside the conveying box and includes a first moving mechanism and a receiving hopper. The first moving mechanism can drive the receiving hopper to move along the height direction of the conveying box. The top of the receiving hopper is open and connected to the inlet, and the bottom of the receiving hopper has a filter section through which the grinding slurry can pass. The stirring component is located inside the conveying box and includes a drive component, a rotating shaft, and fan blades. The fan blades are located on the outer periphery of the rotating shaft, which extends vertically and is inserted into the receiving hopper from top to bottom. The drive component can drive the rotating shaft to rotate around its own axis. The horizontal moving component includes a base and a second moving mechanism, which can drive the conveying box to move along a first linear direction.

[0004] However, while existing technologies improve overall functionality, facilitate filtration, and enhance the uniformity of grinding fluid distribution, thus improving the overall grinding effect, they still have some shortcomings: the process flow is only a one-way conveying of feed inlet → hopper treatment → outlet discharge, lacking a return interface to the grinding equipment and no return pipe or storage structure for reintroducing used grinding fluid into the device. Therefore, used grinding fluid cannot be recycled back into the device for further processing, failing to form a closed-loop cycle of use, recycling, purification, and reuse. During recycling, impurities intercepted by the filter must be promptly discharged from the device to prevent secondary pollution. However, the device lacks a dedicated impurity collection tank or discharge channel, causing impurities scraped off by the cleaning components to remain in the hopper and re-enter the cycle with the grinding fluid, leading to low efficiency, high cost, and a significant risk of pollution. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing an automatic wafer polishing slurry addition device.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: an automatic wafer polishing slurry adding device, comprising: a base cylinder with a column fixedly installed inside; the column having its top fixedly connected to a filter platform; the filter platform having a circular groove inside fixedly connected to a funnel, and a polishing device on the top of the filter platform for polishing wafers; and a nozzle fixedly connected to a liquid delivery pipe for spraying polishing slurry.

[0007] As a further description of the above technical solution:

[0008] Includes: a water pump with its inlet end fixedly connected to a three-way pipe; a bucket placed on the ground with the bottom connected to the three-way pipe and a liquid injection port on the top; a three-way pipe fixedly attached to the bottom of the base cylinder with raw liquid valves and recovery liquid valves on both sides; and a delivery pipe connected to the output end of the water pump at its bottom.

[0009] As a further description of the above technical solution:

[0010] The bottom of the handle is fixedly connected to the filter screen and can be detachably installed inside the funnel.

[0011] As a further description of the above technical solution:

[0012] The two ends of the three-way pipe are connected to the bucket and the bottom cylinder respectively, and the water inlet of the water pump is connected to the three-way pipe between the raw liquid valve and the recovery liquid valve.

[0013] As a further description of the above technical solution:

[0014] One end of the nozzle extends to the grinding head in the grinding equipment.

[0015] As a further description of the above technical solution:

[0016] There are four sets of funnels, which are evenly arranged on the filtration platform.

[0017] As a further description of the above technical solution:

[0018] The filter screen has four sets, which are distributed in four funnels, and every two sets of filter screens are connected by a handle.

[0019] This utility model has the following beneficial effects:

[0020] 1. Through the cooperation of water pump, valve, infusion pipe and nozzle, the grinding fluid can be automatically delivered as needed, and the nozzle is precisely aimed at the grinding part, avoiding the dosage deviation caused by manual addition, ensuring stable grinding quality and improving grinding efficiency.

[0021] 2. Waste liquid is quickly filtered through multiple sets of funnels and filter screens and returned to the bottom tank. It can be reused under valve control, reducing waste and pollution. The filter screen can be quickly installed and removed with a handle, reducing maintenance time and costs and improving the overall operating efficiency of the equipment. Attached Figure Description

[0022] Figure 1 This is a three-dimensional structural diagram of an automatic wafer polishing slurry adding device proposed in this utility model;

[0023] Figure 2 This is a partial structural schematic diagram of an automatic wafer polishing slurry adding device proposed in this utility model;

[0024] Figure 3 This is a partial cross-sectional schematic diagram of an automatic wafer polishing slurry adding device proposed in this utility model;

[0025] Legend: 1. Bottom cylinder; 2. Column; 3. Filter platform; 4. Grinding equipment; 5. Funnel; 51. Handle; 52. Filter screen; 6. Nozzle; 7. Water pump; 8. Raw material valve; 9. Recycled liquid valve; 10. Bucket; 11. T-connector; 12. Infusion pipe. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The utility model will be further described in detail below with reference to the accompanying drawings.

[0028] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0029] Example 1:

[0030] like Figures 1 to 3 As shown, this embodiment provides an automatic wafer polishing slurry adding device, including: a base cylinder 1, with a column 2 fixedly installed inside; the top of the column 2 is fixedly connected to a filter platform 3; the filter platform 3 has a circular groove inside that is fixedly connected to a funnel 5, and a polishing device 4 is installed on the top of the filter platform 3 for polishing wafers; and a nozzle 6 is fixedly connected to a liquid delivery pipe 12 for spraying polishing slurry.

[0031] In this embodiment, the filtration component and the recycling component constitute an automatic wafer polishing slurry adding device according to this application.

[0032] It should also be understood that the grinding equipment, water pumps and valves are common knowledge in this field. They are only used and not modified, so the control methods and circuit connections will not be described in detail.

[0033] Furthermore, in this embodiment, when the recovery liquid valve 9 is closed and the raw liquid valve 8 is opened, the water pump 7 and the tank 10 are connected. The water pump 7 is started, allowing the raw liquid inside the tank 10 to be transferred to the nozzle 6 via the infusion pipe 12, continuously spraying grinding fluid onto the grinding head of the grinding equipment 4. The used grinding fluid flows through the grooves on the surface of the filter platform 3 to the funnel 5, and after being filtered by the filter screen 52, it flows to the bottom tank 1 and can be continuously collected. When not in use, the filter screen 52 can be removed by pulling up the handle 51, allowing for efficient replacement and cleaning. When the raw liquid valve 8 is closed and the recovery liquid valve 9 is opened, the water pump 7 and the bottom tank 1 are connected, allowing the use of the filtered grinding fluid, achieving cost savings.

[0034] Specifically, it includes: a water pump 7, with its inlet end fixedly connected to a three-way pipe 11; a bucket 10, set on the ground, with its bottom connected to the three-way pipe 11 and its top having an injection port; a three-way pipe 11, fixedly connected to the bottom of the base cylinder 1, with a raw liquid valve 8 and a recovery liquid valve 9 on both sides; and a delivery pipe 12, with its bottom connected to the output end of the water pump 7.

[0035] In this embodiment, the pump 7 is made of stainless steel, and the water inlet end is fixed through the three-way pipe 11. The tank 10 stores the grinding liquid. The grinding liquid is transported to the nozzle 6 through the three-way pipe 11, the water pump 7 and the delivery pipe 12. The valve controls the liquid flow, thereby realizing the storage, delivery and flow control of the grinding liquid.

[0036] Specifically, the bottom of the handle 51 is fixedly connected to the filter screen 52 and is detachably installed inside the funnel 5.

[0037] In a preferred embodiment, the handle 51 is a U-shaped metal rod, with its bottom welded and fixedly connected to the circular filter screen 52. The filter screen 52 is made of metal and is detachably snapped into place inside the funnel 5. The filter screen 52 filters the liquid flowing into the funnel 5. The handle 51 makes it easy to remove the filter screen 52 to filter impurities and facilitates cleaning or replacement of the filter screen 52.

[0038] Example 2:

[0039] Based on Example 1, in order to improve the utilization efficiency of the grinding fluid, a recycling device is arranged in the bottom cylinder 1;

[0040] Specifically, the two ends of the three-way pipe 11 are connected to the barrel 10 and the bottom cylinder 1 respectively, and the water inlet of the water pump 7 is connected to the three-way pipe 11 between the raw liquid valve 8 and the recovery liquid valve 9.

[0041] In this embodiment, by controlling the raw liquid valve 8 and the recovery liquid valve 9, the water pump 7 selectively extracts the raw liquid in the tank 10 or the recovery liquid in the bottom tank 1, thereby realizing the recycling of the grinding liquid or the use of new raw liquid and improving resource utilization.

[0042] Specifically, one end of the nozzle 6 extends to the grinding head in the grinding equipment 4.

[0043] With this configuration, nozzle 6 can precisely spray the polishing slurry onto the contact area between the polishing head and the wafer, ensuring that the polishing slurry directly acts on the polishing area and improves the polishing effect.

[0044] Example 3:

[0045] Based on Example 2, in order to improve filtration efficiency and simultaneously disassemble the filter device, a filtration mechanism is arranged on the filtration platform 3.

[0046] Specifically, there are four sets of funnels 5, and the funnels 5 are evenly arranged on the filter platform 3.

[0047] The waste liquid after grinding flows into the bottom cylinder 1 through four sets of funnels 5 on the filtration platform 3, which can speed up the collection of waste liquid, avoid liquid accumulation, and improve filtration efficiency.

[0048] Specifically, there are four sets of filter screens 52, which are distributed in four sets of funnels 5, and every two sets of filter screens 52 are connected by handles 51.

[0049] In this embodiment, four sets of filter screens 52 simultaneously filter the waste liquid in four sets of funnels 5. Two sets of filter screens 52 can be removed at the same time through the handle 51, which improves the filtration area and efficiency, and facilitates the simultaneous loading and unloading of multiple sets of filter screens 52, enabling batch maintenance.

[0050] In actual use, when the recovery liquid valve 9 is closed and the raw liquid valve 8 is opened, the water pump 7 and the tank 10 are connected. Starting the water pump 7 allows the raw liquid inside the tank 10 to be transferred to the nozzle 6 via the infusion pipe 12, continuously spraying grinding fluid onto the grinding head of the grinding equipment 4. The used grinding fluid flows through the grooves on the surface of the filter platform 3 to the funnel 5, and after being filtered by the filter screen 52, it flows to the bottom tank 1. This process allows for continuous collection. When not in use, the filter screen 52 can be removed by pulling up the handle 51 for efficient replacement and cleaning. When the raw liquid valve 8 is closed and the recovery liquid valve 9 is opened, the water pump 7 and the bottom tank 1 are connected, allowing the use of the filtered grinding fluid and achieving cost savings.

[0051] It should be noted that all electrical components mentioned in this article are connected to an external main controller and 220V AC mains power. The main controller can be a conventional known device that can be controlled by a computer or other means. The detailed description of known functions and known components is omitted in the specific implementation of this disclosure. In order to ensure the compatibility of the device, the operating methods used are consistent with the parameters of commercially available instruments.

[0052] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An automatic wafer polishing slurry adding device, characterized in that: include: The bottom cylinder (1) has a column (2) fixedly installed inside it; The column (2) is fixedly connected to the filter platform (3) at the top; The filter platform (3) has a circular groove inside that is fixedly connected to the funnel (5), and a grinding device (4) is provided on the top of the filter platform (3) for grinding wafers; The nozzle (6) is fixedly connected to the infusion tube (12) and is used to spray out the grinding fluid; The water pump (7) is fixedly connected to the inlet end of the tee pipe (11); A bucket (10) is set on the ground, with a three-way pipe (11) connected to the bottom and an injection port on the top; A three-way pipe (11) is fixed to the bottom of the bottom cylinder (1), and a raw liquid valve (8) and a recovery liquid valve (9) are provided on both sides. The infusion tube (12) is connected at its bottom to the output end of the water pump (7); The bottom of the handle (51) is fixedly connected to the filter screen (52) and can be detachably installed inside the funnel (5).

2. The automatic wafer polishing slurry adding device according to claim 1, characterized in that: The two ends of the three-way pipe (11) are connected to the bucket (10) and the bottom cylinder (1) respectively, and the water inlet of the water pump (7) is connected to the three-way pipe (11) between the raw liquid valve (8) and the recovery liquid valve (9).

3. The automatic wafer polishing slurry adding device according to claim 1, characterized in that: One end of the nozzle (6) extends to the grinding head in the grinding equipment (4).

4. The automatic wafer polishing slurry adding device according to claim 1, characterized in that: There are four sets of funnels (5), and the funnels (5) are evenly arranged on the filter platform (3).

5. The automatic wafer polishing slurry adding device according to claim 1, characterized in that: The filter screen (52) is provided in four sets, and is distributed in four sets of funnels (5), and every two sets of filter screens (52) are connected by handles (51).

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