Large t deep sintered diamond saw blade
Patent Information
- Application Number
- CN202522502545.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-25
- Publication Date
- 2026-10-16
- Estimated Expiration
- 2035-11-25
AI Technical Summary
[0005]由于大T径深烧结金刚石锯片常用于大型工件的连续切割,若金刚石刀头集聚的热量较多,金刚石刀头的金属胎体易软化,进而导致金刚石颗粒脱落,影响金刚石锯片的使用寿命以及工件的切割效率
1.通过在基体的圆形外周设置凸块,从而增大了金刚石刀头与基体的有效焊接长度,以提高金刚石刀头与基体之间热传递的效率。即当金刚石刀头与工件摩擦产生热量,可及时将金刚石刀头的热量传递至基体中,再由基体通过热传导、热对流等方式对外散发;从而减少金刚石刀头积累的热量,降低金刚石刀头的温度,以充分发挥金刚石刀头的作用,提高金刚石锯片对工件的切割效果,以及延长金刚石锯片的使用寿命;
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Figure CN224855675U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of cutting equipment technology, and in particular to a large T-diameter deep sintered diamond saw blade. Background Technology
[0002] In existing technologies, diamond saw blades generally consist of a matrix and a diamond cutting head. The matrix has a circular outer circumference, and the diamond cutting head is annularly disposed on the outer circumference of the matrix. The diamond cutting head comprises a metal matrix and diamond particles, with the diamond particles distributed within the metal matrix. Under high temperature and pressure conditions, the metal powder of the metal matrix and the diamond particles are sintered and fixed together. This utilizes the ultra-high hardness of diamond to efficiently cut high-hardness materials (such as stone and concrete).
[0003] In diamond saw blades, the matrix has good heat dissipation performance and a large overall area, while the diamond cutting head has poor heat dissipation performance. Therefore, the heat generated by the friction between the diamond cutting head and the workpiece is first transferred to the matrix through the metal matrix, and then dissipated into the air by the matrix through conduction and convection.
[0004] Large T-diameter deep sintered diamond saw blades are specialized saw blades designed for heavy-duty cutting scenarios. The large diameter of the large T-diameter deep sintered diamond saw blade facilitates the cutting of large, high-hardness materials; and the metal matrix in the diamond cutter head is thicker, enabling it to withstand continuous cutting under high loads.
[0005] Since large-diameter, deep-sintered diamond saw blades are often used for continuous cutting of large workpieces, if the diamond cutting head accumulates a lot of heat, the metal matrix of the diamond cutting head is prone to softening, which in turn leads to the diamond particles falling off, affecting the service life of the diamond saw blade and the cutting efficiency of the workpiece. Utility Model Content
[0006] To reduce the temperature of the diamond saw blade during operation, this application provides a large T-diameter deep sintered diamond saw blade.
[0007] This application provides a large T-diameter deep sintered diamond saw blade, which adopts the following technical solution: A large T-diameter deep sintered diamond saw blade includes a substrate and a diamond cutting head. The substrate has a circular outer perimeter, and the diamond cutting head is disposed along the circular outer perimeter of the substrate. The diamond cutting head is welded and fixed to the substrate. The substrate is provided with a protrusion protruding from the circular outer perimeter, and the diamond cutting head is provided with a receiving groove that matches the protrusion. The outer edge of the protrusion is welded and fixed to the sidewall of the receiving groove.
[0008] By adopting the above technical solution, and by setting protrusions on the circular outer periphery of the substrate, the effective welding length between the diamond cutting head and the substrate is increased, thereby improving the efficiency of heat transfer between the diamond cutting head and the substrate. Specifically, when the diamond cutting head generates heat through friction with the workpiece, the heat can be promptly transferred from the diamond cutting head to the substrate, and then dissipated by the substrate through heat conduction and convection. This reduces the heat accumulation on the diamond cutting head, lowers its temperature, fully utilizes the diamond cutting head's capabilities, improves the cutting effect of the diamond saw blade on the workpiece, and extends the service life of the diamond saw blade.
[0009] Optionally, the outer periphery of the protrusion has a first arc-shaped edge, the opening direction of the first arc-shaped edge being oriented towards the substrate; correspondingly, the diamond cutting tip has a first sidewall adapted to the first arc-shaped edge.
[0010] By adopting the above technical solution, the first arc-shaped edge of the protrusion is welded and fixed to the first sidewall of the diamond cutter head, which can improve the connection strength and connection stability between the diamond cutter head and the substrate.
[0011] Optionally, the outer periphery of the protrusion also has a second arc-shaped edge, which is symmetrically arranged on both sides of the first arc-shaped edge. The opening direction of the second arc-shaped edge is directed towards the diamond cutting head. One side of the second arc-shaped edge is arc-shapedly connected to the first arc-shaped edge, and the other side of the second arc-shaped edge is arc-shapedly connected to the outer periphery of the circular base. Correspondingly, the diamond cutting head has a second sidewall that is adapted to the second arc-shaped edge.
[0012] By adopting the above technical solution, the connection stability between the diamond tip and the substrate is improved by setting a second arc-shaped edge on the outer periphery of the protrusion.
[0013] Optionally, the protrusion is provided with a through hole.
[0014] By adopting the above technical solution, the through holes on the protrusion can allow air and cooling water to circulate, which is beneficial to the heat dissipation of the diamond cutting tip.
[0015] Optionally, the through hole is a tapered hole.
[0016] By adopting the above technical solution, the through hole is designed as a tapered hole, which facilitates the flow of air and cooling water through the through hole, thereby further improving the heat dissipation effect of the diamond tool tip.
[0017] Optionally, the diamond cutting head includes a metal matrix and diamond particles, wherein the diamond particles are evenly distributed in the metal matrix, and the metal matrix is welded and fixed to the substrate.
[0018] By adopting the above technical solution, diamond particles are evenly distributed in the metal matrix, thereby making the load on the diamond particles more uniform, making the heat generated by the diamond cutting head more uniform, and reducing the local overload heating of the diamond cutting head.
[0019] Optionally, along the thickness direction of the diamond cutting head, multiple layers of diamond particles are spaced apart inside the diamond cutting head. The diamond particles are arranged in a ring array with the center of the matrix as the center point, and the number of rows in the ring array of diamond particles is multiple.
[0020] By adopting the above technical solution, diamond particles are arranged in a ring array with the center of the matrix as the center point, thereby improving the uniformity of diamond particle distribution in the metal matrix.
[0021] Optionally, the diamond particle layer path array is arranged in multiple rows along the thickness direction of the diamond tool.
[0022] By adopting the above technical solution, the uniformity of diamond particle distribution in the metal matrix is improved, thereby ensuring the uniformity of heat generation under load on the diamond cutting head.
[0023] In summary, this application includes at least one of the following beneficial technical effects: 1. By incorporating protrusions on the circular outer periphery of the substrate, the effective welding length between the diamond cutting tip and the substrate is increased, thereby improving the efficiency of heat transfer between the diamond cutting tip and the substrate. Specifically, when the diamond cutting tip generates heat through friction with the workpiece, this heat can be promptly transferred to the substrate, which then dissipates it externally through heat conduction and convection. This reduces the heat accumulation on the diamond cutting tip, lowers its temperature, and allows the diamond cutting tip to perform its function more effectively, improving the cutting effect of the diamond saw blade on the workpiece and extending the service life of the diamond saw blade. 2. The diamond particles are evenly distributed in the metal matrix, so that when the diamond cutter head cuts the workpiece, the load on the diamond particles is more uniform, and the heat generated by the diamond cutter head is more uniform, reducing the possibility of local overload heating of the diamond cutter head; that is, by limiting the positional relationship of the diamond particles, the diamond blade is protected, the function of the diamond blade is fully utilized, the cutting effect of the diamond saw blade is improved, and the service life of the diamond saw blade is extended. 3. When the diamond saw blade rotates to cut the workpiece, the through holes on the block allow air and cooling water to circulate, which is beneficial for the heat dissipation of the diamond cutting head; and designing the through holes as tapered holes is beneficial for air and cooling water to flow through the through holes, thereby further improving the heat dissipation effect of the diamond cutting head. Attached Figure Description
[0024] Figure 1 This is a schematic diagram of the diamond saw blade in Example 1.
[0025] Figure 2 yes Figure 1 Enlarged view of point A in the middle.
[0026] Figure 3 This is a schematic diagram illustrating the connection between the substrate and the diamond cutting tip in Example 1.
[0027] Figure 4 This is a schematic diagram of the diamond particle distribution in the diamond particle layer in Example 1.
[0028] Figure 5 This is a cross-sectional view of the diamond cutting head in the thickness direction in Example 1.
[0029] Figure 6 This is a schematic diagram of the protrusion structure in Example 2.
[0030] Figure 7 This is a cross-sectional view of the protrusion in Embodiment 2.
[0031] Explanation of reference numerals in the attached drawings: 1. Substrate; 11. First mounting hole; 12. Second mounting hole; 13. Separating groove; 14. Circular hole groove; 15. Protrusion; 151. First arc-shaped edge; 152. Second arc-shaped edge; 153. Through hole; 2. Diamond cutting tip; 21. Metal matrix; 22. Diamond particles; 23. Receiving groove; 24. First sidewall; 25. Second sidewall; 26. Diamond particle layer. Detailed Implementation
[0032] The following is in conjunction with the appendix Figure 1 Section 7 provides further details regarding this application.
[0033] This application discloses a large T-diameter deep sintered diamond saw blade. (Refer to...) Figure 1 The large T-diameter deep sintered diamond saw blade consists of a matrix 1 and a diamond cutting head 2. Large T-diameter deep sintered diamond saw blades can be used for cutting stone and concrete.
[0034] Reference Figure 1 The base 1 has a first mounting hole 11 and a second mounting hole 12. The first mounting hole 11 is located at the center point of the base 1, and the second mounting holes 12 are arranged around it. In this embodiment, there are four second mounting holes 12. The diamond saw blade is fixed to the cutting device through the first mounting holes 11 and the second mounting holes 12.
[0035] Reference Figure 1 and Figure 2The substrate 1 has a circular outer periphery, and a plurality of partition grooves 13 are provided on the circular outer periphery of the substrate 1. The partition grooves 13 are arranged in a ring at intervals on the circular outer periphery of the substrate 1. The substrate 1 also has a circular hole groove 14, which is provided at the bottom of the partition grooves 13 and is connected to the partition grooves 13.
[0036] Reference Figure 1 and Figure 2 The diamond cutting head 2 is disposed along the outer circumference of the base 1 and between adjacent dividing grooves 13. The diamond cutting head 2 is welded and fixed to the base 1. The base 1 has a protrusion 15 protruding from the outer circumference and disposed between adjacent dividing grooves 13. The diamond cutting head 2 has a receiving groove 23 that matches the protrusion 15, and the outer edge of the protrusion 15 is welded and fixed to the side wall of the receiving groove 23.
[0037] Reference Figure 2 and Figure 3 The protrusion 15 has a first arc-shaped edge 151 and a second arc-shaped edge 152 on its outer periphery. The opening direction of the first arc-shaped edge 151 faces the base 1. The second arc-shaped edge 152 is symmetrically arranged on both sides of the first arc-shaped edge 151, and the opening direction of the second arc-shaped edge 152 faces the diamond tip 2. One side of the second arc-shaped edge 152 is arc-shapedly connected to the first arc-shaped edge 151, and the other side of the second arc-shaped edge 152 is arc-shapedly connected to the outer periphery of the circular base 1. Correspondingly, the diamond tip 2 has a first sidewall 24 that matches the first arc-shaped edge 151, and a second sidewall 25 that matches the second arc-shaped edge 152.
[0038] The implementation principle of a large T-diameter deep sintered diamond saw blade in this application embodiment is as follows: Reference Figure 2 and Figure 3 By setting protrusions 15 on the outer periphery of the base 1, the effective welding length between the diamond tip 2 and the base 1 is increased, thereby improving the efficiency of heat transfer between the diamond tip 2 and the base 1.
[0039] Reference Figure 2 and Figure 3 When the diamond cutting head 2 generates heat through friction with the workpiece, the heat can be transferred to the base 1 in a timely manner, and then dissipated to the outside by the base 1 through heat conduction, heat convection and other means. This reduces the heat accumulated in the diamond cutting head 2, lowers the temperature of the diamond cutting head 2, so as to give full play to the function of the diamond cutting head 2, improve the cutting effect of the diamond saw blade on the workpiece, and extend the service life of the diamond saw blade.
[0040] Reference Figure 2 and Figure 3The first arc-shaped edge 151 of the protrusion 15 is welded and fixed to the first sidewall 24 of the diamond cutter head 2, and the second arc-shaped edge 152 of the protrusion 15 is welded and fixed to the second sidewall 25 of the diamond cutter head 2; this can reduce stress concentration at the welding position and improve the connection strength and connection stability between the diamond cutter head 2 and the substrate 1.
[0041] Reference Figure 2 and Figure 3 Meanwhile, the first arc-shaped edge 151 of the protrusion 15 is welded and fixed to the first side wall 24 of the diamond cutter head 2, and the second arc-shaped edge 152 of the protrusion 15 is welded and fixed to the second side wall 25 of the diamond cutter head 2. When the diamond cutter head 2 cuts the workpiece, it is beneficial to the transmission of force between the diamond cutter head 2 and the base 1, and improves the cutting stability of the diamond cutter head 2.
[0042] Furthermore, when the diamond cutting head 2 is sintered and then placed in a tumbler for grinding, the diamond cutting head 2 has an arc-shaped first sidewall 24 and a second sidewall 25, which is beneficial for grinding.
[0043] Reference Figure 4 and Figure 5 The diamond cutting head 2 includes a metal matrix 21 and diamond particles 22. The diamond particles 22 are evenly distributed in the metal matrix 21, and the metal matrix 21 is welded and fixed to the base 1.
[0044] Reference Figure 4 and Figure 5 Specifically, along the thickness direction of the diamond cutting head 2, multiple layers of diamond particles 26 are spaced apart inside the diamond cutting head 2. The diamond particles 22 are arranged in a ring array around the center of the substrate 1, forming the diamond particle layer 26. The number of rows in the ring array of diamond particles 22 is multiple. Along the thickness direction of the diamond cutting head, the diamond particle layer 26 is arranged in multiple rows. In this embodiment, by limiting the position of the diamond particles 22, the uniformity of the distribution of the diamond particles 22 in the metal matrix 21 is improved.
[0045] Workers can first cool the diamond particles 22 and the metal powder of the metal matrix 21 in layers, thereby achieving a uniform distribution of the diamond particles 22 in the metal matrix 21. Specifically, after filling a layer of metal powder into the mold, workers can use a template with precision holes to place the diamond particles 22 one by one into predetermined positions, and then fill the diamond particles 22 with metal powder; thus achieving the purpose of uniformly distributing the diamond particles 22 in the metal matrix 21.
[0046] In the prior art, the metal powder of the metal matrix 21 and the diamond particles 22 are mechanically mixed and then directly filled into the mold, resulting in most of the diamond particles 22 being randomly distributed in the metal powder. After the diamond beads are sintered, the diamond particles 22 are randomly and disorderly distributed in the metal matrix 21. Because the diamonds are randomly distributed in the metal matrix 21, "rich areas" and "poor areas" of diamond particles 22 easily appear in the metal matrix 21. This results in uneven load distribution on different diamond particles 22, causing different heat generation in different areas of the diamond cutting head 2. The diamond cutting head 2 is prone to localized overload heating, leading to localized failure. Therefore, this application makes further improvements to the diamond cutting head 2.
[0047] Reference Figure 4 and Figure 5 In this embodiment, the diamond particles 22 are evenly distributed within the metal matrix 21. This ensures a more uniform load on the diamond particles 22 when the diamond saw head 2 cuts the workpiece, resulting in more even heat distribution and reducing localized overheating. In other words, by defining the positional relationship of the diamond particles 22, the diamond blade is protected, its function is fully utilized, the cutting effect of the diamond saw blade is improved, and its service life is extended.
[0048] Example 2 The difference between Example 2 and Example 1 is as follows: Reference Figure 6 and Figure 7 In this embodiment, the protrusion is provided with a through hole 153, which is a tapered hole.
[0049] The implementation principle of a large T-diameter deep sintered diamond saw blade in this application embodiment is as follows: Reference Figure 6 and Figure 7 When the diamond saw blade rotates to cut the workpiece, the through hole 153 on the block allows air and cooling water to circulate, which is beneficial to the heat dissipation of the diamond cutter head 2. Designing the through hole 153 as a tapered hole is beneficial to the flow of air and cooling water through the through hole 153, thereby further improving the heat dissipation effect of the diamond cutter head 2.
[0050] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.
Claims
1. A large T-diameter deep sintered diamond saw blade, characterized in that: The device includes a substrate (1) and a diamond cutting head (2). The substrate (1) has a circular outer periphery, and the diamond cutting head (2) is arranged along the circular outer periphery of the substrate (1). The diamond cutting head (2) is welded and fixed to the substrate (1). The substrate (1) is provided with a protrusion (15) protruding from the circular outer periphery. The diamond cutting head (2) is provided with a receiving groove (23) that matches the protrusion (15). The outer edge of the protrusion (15) is welded and fixed to the side wall of the receiving groove (23).
2. The large T-diameter deep sintered diamond saw blade according to claim 1, characterized in that: The outer periphery of the protrusion (15) has a first arc-shaped edge (151), the opening direction of the first arc-shaped edge (151) is set towards the base (1); correspondingly, the diamond tip (2) has a first sidewall (24) adapted to the first arc-shaped edge (151).
3. The large T-diameter deep sintered diamond saw blade according to claim 2, characterized in that: The outer periphery of the protrusion (15) also has a second arc-shaped edge (152), which is symmetrically arranged on both sides of the first arc-shaped edge (151). The opening direction of the second arc-shaped edge (152) is directed toward the diamond cutter head (2). One side of the second arc-shaped edge (152) is arc-shapedly connected to the first arc-shaped edge (151), and the other side of the second arc-shaped edge (152) is arc-shapedly connected to the outer periphery of the circular base (1). Correspondingly, the diamond cutter head (2) has a second sidewall (25) that is adapted to the second arc-shaped edge (152).
4. The large T-diameter deep sintered diamond saw blade according to claim 1, characterized in that: The protrusion (15) is provided with a through hole (153).
5. The large T-diameter deep sintered diamond saw blade according to claim 4, characterized in that: The through hole (153) is a tapered hole.
6. The large T-diameter deep sintered diamond saw blade according to claim 1, characterized in that: The diamond cutting head (2) includes a metal matrix (21) and diamond particles (22). The diamond particles (22) are evenly distributed in the metal matrix (21), and the metal matrix (21) is welded and fixed to the substrate (1).
7. The large T-diameter deep sintered diamond saw blade according to claim 6, characterized in that: Along the thickness direction of the diamond cutting head (2), multiple layers of diamond particles (26) are spaced apart inside the diamond cutting head (2). The diamond particles (22) are arranged in a ring array with the center of the matrix (1) as the center point to form the diamond particle layer (26). The number of rows of the ring array of diamond particles (22) is multiple.
8. The large T-diameter deep sintered diamond saw blade according to claim 7, characterized in that: The diamond particle layer (26) is arranged in multiple rows along the thickness direction of the diamond tool.