A shower head dismounting device

Abstract

The application discloses a shower head dismounting device, and relates to the technical field of semiconductor equipment, and aims to solve the technical problem of difficult dismounting of a shower head. The shower head dismounting device comprises a fixing support and an ejection mechanism. The fixing support is suitable for being fixedly connected with the shower head. The ejection mechanism is suitable for abutting against a cover body along the axial direction of the shower head. The ejection mechanism is in transmission connection with the fixing support. When the ejection mechanism rotates relative to the cover body, the fixing support can be pushed to move away from the cover body together with the shower head. The shower head dismounting device is used for conveniently dismounting the shower head.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and in particular to a spray head disassembly device. Background Technology

[0002] As a key core component in semiconductor equipment, the uniform distribution of process gases in many semiconductor manufacturing processes, such as chemical vapor deposition (CVD), physical vapor deposition (PVD), and etching, has a decisive impact on the quality and performance of the final product.

[0003] During the operation of semiconductor equipment, the spray heads are constantly exposed to complex process environments. They may experience performance degradation due to corrosion from process gases and liquids, or wear and blockages from repeated use, failing to meet the precision requirements of uniform gas or liquid distribution in semiconductor manufacturing processes. Therefore, to ensure the normal operation of semiconductor equipment and process quality, it is necessary to disassemble the malfunctioning spray head and replace it with a new one to restore the equipment to its optimal working condition.

[0004] However, since the spray head is usually used with a sealing ring to seal the vacuum chamber of the semiconductor equipment, the spray head is attracted by the vacuum, making it difficult to disassemble and maintain. Utility Model Content

[0005] This application discloses a spray head disassembly device to solve the technical problem of difficult spray head disassembly.

[0006] In a first aspect, this application provides a spray head disassembly device, including a fixed support and an ejection mechanism. The fixed support is adapted to be fixedly connected to the spray head; the ejection mechanism is adapted to abut against the cover along the axial direction of the spray head, the ejection mechanism is rotatably connected to the fixed support, and when the ejection mechanism rotates relative to the fixed support, it can push the fixed support to move the spray head away from the cover.

[0007] Because the ejector mechanism is confined to the cover and rotatably connected to the fixed support and the cover, when the ejector mechanism rotates relative to the cover and the fixed support, it pushes the spray head away from the cover. Therefore, when the spray head needs to be removed, simply fix the fixed support to the spray head, then rotate the ejector mechanism to push the fixed support, moving the spray head away from the cover. This easily removes the spray head from the mounting port without the need for complex tools or cumbersome operations, improving disassembly efficiency. For example, when removing the spray head from a semiconductor device, rotating the ejector mechanism moves the spray head away from the cover, connecting the vacuum chamber to the outside air and breaking the vacuum suction force within the vacuum chamber, making it easier for maintenance personnel to remove the spray head.

[0008] Furthermore, since the cover abuts against the ejection mechanism along the axial direction of the spray head, and the ejection mechanism is rotatably connected to the fixed support, the ejection mechanism in this embodiment acts on the fixed support and the cover. Compared to related technologies, this embodiment transfers the force originally acting on the inner end face of the spray head to the outside of the spray head (i.e., the fixed support and the cover). This avoids damaging the end face of the spray head, thereby preventing particles from being generated inside the spray head and contaminating the vacuum chamber, ensuring high reliability of the semiconductor device.

[0009] In one possible implementation, the fixed support has an internally threaded hole; the ejection mechanism includes a rod with an external thread on its outer circumference, the external thread of the rod being threadedly connected to the internally threaded hole. Thus, through the threaded connection between the external thread of the rod and the internally threaded hole of the fixed support, force can be evenly transmitted to the fixed support when the rod rotates, allowing the fixed support to move smoothly away from the cover. Furthermore, threaded drive is labor-saving; compared to directly pulling out the sprinkler head, moving the sprinkler head by rotating the rod requires only a small torque. This makes disassembling and installing the sprinkler head easier for operators, reducing labor intensity and improving the convenience of maintenance and repair operations.

[0010] In one possible implementation, the ejection mechanism is adapted to be spaced apart from the spray head, that is, the rod and the spray head are located on the outer periphery of the spray head. Since the rod is located on the outer periphery of the spray head, it abuts against the cover but not against the spray head. Thus, even if the rod scratches the cover and generates some particles, because the rod acts on the outer surface of the cover, the particles will not enter the vacuum chamber through the spray holes, thereby ensuring the stable operation of the semiconductor device and improving its reliability.

[0011] In one possible implementation, the ejection mechanism further includes a head connected to the rod and adapted to be positioned on the side of the fixed support opposite to the sprinkler head. This allows maintenance personnel to rotate the rod by turning the head, facilitating the removal of the sprinkler head.

[0012] In one possible implementation, the spray head removal device further includes an ejector base adapted to be mounted on the cover, the ejector base abutting against the ejector mechanism along the axial direction of the spray head. In this way, the ejector force of the rod acts on the ejector base, preventing the rod from scratching the cover and improving the service life of the cover.

[0013] In one possible implementation, the material hardness of the ejector base is greater than that of the cover. Because the ejector base is harder than the cover, wear on the ejector base can be reduced, increasing its service life. Furthermore, particle generation can be reduced, which helps improve the cleanliness of the production workshop.

[0014] In one possible implementation, the ejection mechanism includes a gear for rotating the connecting cover; the fixed support includes a rack that meshes with the gear. This embodiment of the application ensures a stable transmission ratio between the ejection mechanism and the fixed support through the cooperation of the rack and gear. Therefore, when the gear rotates a certain angle, the rack will move a corresponding distance, thus ensuring the accuracy and repeatability of the sprinkler head disassembly.

[0015] In one possible implementation, the sprinkler head disassembly device further includes a guide member, one end of which passes through the fixed support along the axial direction of the sprinkler head, and the other end of which is adapted to be detachably connected to the cover. Thus, the guide member can provide guidance for the movement of the fixed support, which helps improve the stability of the fixed support moving with the sprinkler head and prevents the fixed support from tilting or jamming due to uneven force distribution.

[0016] In one possible implementation, the sprinkler head disassembly device further includes a limiting member, which includes a first limiting portion for fixing to the cover and abutting against the side of the isolation ring disposed between the cover and the sprinkler head that faces away from the cover. Since the first limiting portion abuts against the side of the isolation ring facing away from the cover, it can firmly fix the isolation ring to the cover, preventing the isolation ring from moving with the sprinkler head during operation of the sprinkler head disassembly device, thus avoiding lifting the isolation ring when disassembling the sprinkler head and facilitating subsequent installation of the sprinkler device.

[0017] In one possible implementation, the limiting member further includes a second limiting portion connected to the first limiting portion and adapted to be disposed on the circumferential outer side of the isolation ring. Since the second limiting portion is located on the circumferential outer side of the isolation ring and connected to the first limiting portion, the limiting member can effectively prevent the isolation ring from shifting or rotating in the horizontal direction (i.e., circumferentially).

[0018] In one possible implementation, multiple limiting members are provided, and the multiple limiting members are adapted to be spaced apart circumferentially along the spray head.

[0019] Because multiple limiting components are spaced apart along the circumference of the spray head, the isolation ring can be provided with relatively balanced limiting, which helps to ensure that the isolation ring remains stable during operation and avoids tilting or displacement due to uneven force. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a partial structural diagram of a spray head and a spray head disassembly device in related technologies; Figure 2 A top view of a spray device and a spray head disassembly device provided in an embodiment of this application; Figure 3 Provided for the embodiments of this application Figure 2 A cross-sectional view of the sprinkler system and sprinkler head disassembly device along the AA direction; Figure 4 Provided for the embodiments of this application Figure 3 A partial structural diagram of the spray head disassembly device in the image; Figure 5 Provided for the embodiments of this application Figure 2 Another cross-sectional view of the spray device and spray head disassembly device along the AA direction; Figure 6 Another cross-sectional view of the spray device and spray head disassembly device provided in the embodiments of this application; Figure 7 A top view of another spray device and spray head disassembly device provided in an embodiment of this application; Figure 8 Provided for the embodiments of this application Figure 7 A schematic diagram of the limiting component in the diagram.

[0022] Explanation of reference numerals in the attached figures: 100-Spraying device; 10-Cover body; 11-Mounting port; 20-Spray head; 20A-Panel; 20A1-Step; 20B-Top plate; 20B1-Top screw; 21-Spray section; 22-Connecting section; 30-Sprayer head disassembly device; 31-Fixed support; 311-Rack; 32-Ejection mechanism; 321-Rod; 322-Head; 323-Gear; 324-Connector; 33-Guide; 331-First bolt; 34-First fastener; 35-Ejection base; 351-Receiving groove; 36-Limiting component; 361-First limiting part; 362-Second limiting part; 363-Second fastener; 40 - Isolation ring; 41 - First part; 42 - Second part; 50 - Sealing ring. Detailed Implementation

[0023] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0024] In the description of this application, the terms “center,” “upper,” “lower,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0025] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0026] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "connected" and "linked" should be interpreted broadly, for example, they can refer to a fixed connection, a detachable connection, or an integral connection. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0027] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0028] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0029] Semiconductor equipment refers to the production equipment required for various semiconductor products, such as equipment used in chip manufacturing and packaging processes. For example, semiconductor equipment can include photolithography equipment, etching and deposition equipment, coating equipment, ion implantation equipment, polishing equipment, cleaning equipment, epitaxial equipment, magnetron sputtering equipment, etc.

[0030] The semiconductor device includes a housing and a spray device. The housing contains a chamber, and the housing has an opening communicating with the chamber. The spray device is mounted on the housing. For example, the spray device can cover the opening of the housing, thereby forming a vacuum chamber suitable for accommodating a wafer. Alternatively, the spray device can be mounted within the chamber of the housing and connected to an external gas source via a pipe.

[0031] The core function of the spray device is to uniformly disperse and distribute process gases (such as reactive gases in the etching process and precursor gases in the deposition process) to ensure that the gases cover the wafer surface with a stable and uniform flow field, thereby ensuring key process indicators such as etching rate consistency and thin film deposition uniformity.

[0032] For example, in photolithography equipment, a spray device is used to deliver an inert, clean gas (such as nitrogen) to the exposure area, forming a stable airflow barrier. This prevents particles from the outside air from entering the exposure area and contaminating the wafer or lens, and also avoids organic vapors from photoresist from adhering to the lens surface and affecting imaging accuracy. For example, in etching and deposition equipment, the gas sprayed by the spray device can cover the wafer surface with a uniform flow field, avoiding uneven etching rates due to local gas concentration differences and ensuring consistent etching across the entire wafer.

[0033] Understandably, the presence of impurities during semiconductor manufacturing can severely impact chip performance and reliability. Vacuum chambers effectively reduce airborne impurities (such as dust, moisture, and oxygen), preventing them from contacting semiconductor materials and devices, and avoiding the introduction of additional impurities during manufacturing, thus ensuring the high quality and consistency of semiconductor devices. Furthermore, some semiconductor manufacturing processes, such as physical vapor deposition (PVD), chemical vapor deposition (CVD), and etching, require specific gas environments and pressure conditions. Vacuum chambers can precisely control internal gas composition, pressure, and temperature parameters, providing a stable and repeatable environment for these processes. This facilitates high-precision thin-film deposition and precise etching, ensuring that the dimensional accuracy and performance specifications of semiconductor devices meet requirements.

[0034] However, during the operation of semiconductor equipment, the spray heads of the spray system are exposed to a complex process environment for extended periods. They may experience performance degradation due to corrosion from process gases and liquids, or wear and blockages from repeated use, failing to meet the precision requirements of uniform gas or liquid distribution in semiconductor manufacturing processes. Therefore, to ensure the normal operation and process quality of semiconductor equipment, it is necessary to disassemble the malfunctioning spray head and replace it with a new one to restore the semiconductor equipment to its optimal working condition.

[0035] However, related technologies typically use sealing rings to seal the gap between the spray head and the cover to ensure a high level of sealing performance of the vacuum chamber. As a result, when removing the spray head, it tends to adhere to the cover under the vacuum force of the vacuum chamber, making it difficult for maintenance personnel to remove the spray head.

[0036] To facilitate maintenance personnel in maintaining the sprinkler system Figure 1 A partial structural schematic diagram of the spray head and spray head disassembly device in the related art is shown below. Please refer to [link / reference]. Figure 1 In related technologies, the spray head 20 includes a detachably connected panel 20A and an upper plate 20B. At least a portion of the panel 20A surrounds the upper plate 20B. The panel 20A has spray holes that communicate with a vacuum chamber. A stepped step 20A1 is provided on the inner wall of the panel 20A. A threaded set screw 20B1 is threaded onto the upper plate 20B, with one end of the set screw 20B1 abutting against the stepped step 20A1. Thus, when the set screw 20B1 is rotated, the threaded connection causes the upper plate 20B to move away from the panel 20A, allowing the spray holes to communicate with the outside air, breaking the vacuum suction force, and facilitating the disassembly of the spray head 20 by maintenance personnel.

[0037] However, when the setter 20B1 acts on the inner wall of the stepped step 20A1, the wall surface of the stepped step 20A1 is easily scratched by the setter 20B1, resulting in fine particles. These particles can easily enter the vacuum chamber through the spray holes, thus affecting the overall performance and reliability of the semiconductor equipment. For example, in thin film deposition processes, particles entering the vacuum chamber become impurity sources for thin film growth, altering the structure and properties of the film. For example, particles falling on the wafer surface can affect the accuracy of pattern transfer during photolithography, etching, and other processes, leading to defects on the wafer and reducing wafer yield and performance.

[0038] Based on this Figure 2 This paper shows a top view of a spray device and a spray head disassembly device provided in an embodiment of this application. Figure 3 The embodiments provided in this application are shown. Figure 2 Please refer to the sectional view of the spray system and spray head disassembly device along the AA direction. Figure 2and Figure 3 The spraying device 100 includes a cover 10 and a spray head 20. The cover 10 is fixedly connected to the housing. Optionally, the cover 10 can be fixedly connected to the housing by means of bonding, threaded connection, welding, snap-fit, etc. Optionally, the cover 10 can also be integrally formed with the housing, that is, the cover 10 and the housing are a single structural component.

[0039] Additionally, a mounting port 11 is formed on the cover 10, which communicates with the vacuum chamber. A spray head 20 is disposed at the mounting port 11, so that the spray head 20 can spray the wafer or other processing objects in the vacuum chamber through the mounting port 11.

[0040] In one possible structural design, the spray head 20 may include a spray section 21 and a connecting section 22. The spray section 21 is disposed within the mounting port 11, and the cover 10 is arranged circumferentially around the spray section 21. The spray section 21 has multiple spray nozzles communicating with the vacuum chamber. The connecting section 22 is disposed on the end face of the cover 10 and connected to the cover 10, with the connecting section 22 and the cover 10 arranged axially along the mounting port 11. Thus, with the connecting section 22 of the spray head 20 connected to the end of the cover 10, the spray head 20 can be connected to the cover 10 along the axial direction of the mounting port 11 via a connector. This avoids the spray head 20 being connected to the cover 10 along the radial direction of the mounting port 11, which would cause the connector to bear a large shear force under the vacuum force of the vacuum chamber, thereby improving the connection strength between the spray head 20 and the cover 10.

[0041] Figure 4 The embodiments provided in this application are shown. Figure 3 Please refer to the structural diagram of the spray head disassembly device. Figure 3 and Figure 4 The spray head disassembly device 30 is installed on the spray device 100 to disassemble the spray head 20 mounted on the cover 10. The disassembly device includes a fixed support 31 and an ejection mechanism 32. The fixed support 31 is adapted to be fixedly connected to the spray head 20. Optionally, the fixed support 31 can be detachably fixed to the spray head 20 by means of threaded connection or snap-fit. Thus, when it is necessary to disassemble the spray head 20, the fixed support 31 can be installed on the spray head 20, and after disassembly, the fixed support 31 can be removed.

[0042] Furthermore, the ejector mechanism 32 is confined to the cover 10 and rotatably connected to the cover 10, meaning that the ejector mechanism 32 can rotate relative to the cover 10. The ejector mechanism 32 is adapted to abut against the cover 10 along the axial direction of the spray head 20. The ejector mechanism 32 is rotatably connected to the fixed support 31, and when the ejector mechanism 32 rotates relative to the cover 10, it can push the fixed support 31 to move the spray head 20 away from the cover 10.

[0043] Since the ejector mechanism 32 is confined to the cover 10 and rotatably connected to the fixed support 31 and the cover 10, when the ejector mechanism 32 rotates relative to the cover 10 and the fixed support 31, the spray head 20 moves away from the cover 10. Therefore, when it is necessary to disassemble the spray head 20, simply fix the fixed support 31 to the spray head 20, and then rotate the ejector mechanism 32 to move the spray head 20 away from the cover 10, thus easily removing the spray head 20 from the mounting port 11 without the need for complex tools or cumbersome operations, improving disassembly efficiency. For example, when it is necessary to disassemble the spray head 20 of a semiconductor device, rotating the ejector mechanism 32 can move the spray head 20 away from the cover 10, thereby connecting the vacuum chamber to the outside air, breaking the vacuum suction force in the vacuum chamber, and facilitating the disassembly of the spray head 20 by maintenance personnel.

[0044] Furthermore, since the cover 10 abuts against the ejection mechanism 32 along the axial direction of the spray head 20, and the ejection mechanism 32 is rotatably connected to the fixed support 31, the ejection mechanism 32 in this embodiment acts on the fixed support 31 and the cover 10. Compared to related technologies, this embodiment transfers the force originally acting on the inner end face 20 of the spray head to the outside of the spray head 20 (i.e., on the fixed support 31 and the cover 10). This avoids damaging the end face of the spray head 20, thereby preventing particles from being generated inside the spray head and contaminating the vacuum chamber, ensuring high reliability of the semiconductor device.

[0045] In some embodiments, please continue reading Figure 3 and Figure 4 The fixed support 31 is provided with an internal threaded hole. The ejection mechanism 32 includes a rod 321, the outer periphery of which is provided with an external thread, and the external thread of the rod 321 is threadedly connected to the internal threaded hole. When the rod 321 rotates relative to the cover 10, the rod 321 can abut against the cover 10, so that the fixed support 31 moves away from the cover 10 under the action of the threaded connection, thereby driving the spray head 20 to move away from the cover 10.

[0046] Thus, through the threaded connection between the external thread of the rod 321 and the internal threaded hole of the fixed support 31, the force can be evenly transmitted to the fixed support 31 when the rod 321 rotates, allowing the fixed support 31 to move smoothly away from the cover 10. Furthermore, threaded drive is labor-saving; compared to directly pulling out the sprinkler head 20, moving the sprinkler head 20 by rotating the rod 321 requires only a small torque. This makes disassembling and installing the sprinkler head 20 easier for operators, reducing labor intensity and improving the convenience of maintenance and repair operations.

[0047] To facilitate maintenance personnel in rotating the rod 321, please refer to some embodiments of this application. Figure 2 and Figure 3 The ejection mechanism 32 also includes a head 322, which is connected to the rod 321 and is adapted to be located on the side of the fixed support 31 away from the spray head 20.

[0048] Optionally, the head 322 can be a regular hexagon, which is suitable for use with a wrench or socket for rotational tightening. Optionally, the head 322 can also be circular, and a hexagonal countersunk hole, a cross countersunk hole, a square countersunk hole, etc., can be provided on the end face of the head 322 opposite to the rod 321. This application does not limit this.

[0049] The head 322 can be integrally formed with the rod 321, meaning the head 322 and the rod 321 are a single structural component. For example, this integral structural component can be a hexagonal head bolt, countersunk head bolt, square head bolt, T-slot bolt, etc., and this application does not limit this. The head 322 can also be fixedly connected to the rod 321 by means of bonding, threaded connection, welding, snap-fit, etc., and this application also does not limit this.

[0050] In some embodiments of this application, the ejection mechanism 32 is spaced apart from the spray head 20. That is, the rod 321 is disposed on the outer periphery of the spray head 20 so that when the rod 321 acts on the cover 10, the rod 321 is not obstructed by the spray head 20 and can directly abut against the cover 10.

[0051] Since the rod 321 is located on the outer periphery of the spray head 20, it abuts against the cover rather than directly against the spray head 20. Therefore, even if the rod 321 scratches the cover 10 and generates particles, these particles will not enter the vacuum chamber through the spray holes because the rod 321 acts on the outer surface of the cover 10. This ensures the stable operation of the semiconductor device and improves its reliability. Compared to related technologies, this application shifts the force-bearing point, transferring the force originally acting on the stepped step 20A1 to the outer wall of the cover 10, thereby avoiding scratching the end face of the spray head 20 at the stepped step 20A1.

[0052] Please refer to some embodiments of this application. Figure 3 As shown, the spray head disassembly device 30 also includes an ejector base 35, which is disposed on the cover 10 and abuts against the rod 321 along the axial direction of the spray head 20.

[0053] Optionally, the ejector base 35 may include, but is not limited to, a detachable connection to the cover 10 via a snap-fit ​​or threaded connection.

[0054] Optionally, the ejector base 35 may be provided only on the cover 10 and not connected to the cover 10. For example, the cover 10 may have a mounting groove on the side facing the fixed support 31, and the ejector base 35 may be fitted into the mounting groove. In this way, the ejector base 35 can be installed by simply placing it into the mounting groove, which facilitates the disassembly and installation of the spray head disassembly device 30.

[0055] Optionally, the ejector base 35 can be a regular three-dimensional structure. For example, the ejector base 35 can be a cylinder, cube, cuboid, triangular prism, etc., and this application does not limit it in this respect. Optionally, the ejector base 35 can be an irregular three-dimensional structure. For example, the ejector base 35 can be a combination of a cylinder and a cube, a combination of a polyhedron and a cylinder, a combination of a triangular prism and a polyhedron, etc., and this application does not limit it in this respect.

[0056] Since the ejector base 35 needs to withstand a large force from the rod 321, when the ejector base 35 is damaged due to wear, only the ejector base 35 needs to be replaced, without replacing or disassembling the cover 10. This not only reduces maintenance costs but also improves maintenance efficiency.

[0057] The ejector base 35 is made of a material with a harder hardness than the cover 10. For example, the cover 10 can be made of polytetrafluoroethylene (PTFE), nickel-based alloys, aluminum alloys, etc., and this application does not limit this. The ejector base 35 can be made of stainless steel, silicon carbide, zirconium oxide, etc., and this application does not limit this. Because the ejector base 35 is made of a material with a harder hardness than the cover 10, wear on the ejector base 35 can be reduced, its service life can be increased, and particle generation can be reduced, which is beneficial to improving the cleanliness of the production workshop.

[0058] In one possible structural design, the ejector base 35 can be a block or plate structure. Optionally, the block or plate structure can be provided with a receiving groove 351 suitable for accommodating a portion of the rod 321. Since the rod 321 provides a certain supporting function when it abuts against the cover 10, and needs to bear the weight of the spray head 20 as well as various stresses that may be generated during operation, this embodiment of the application reduces the risk of bending due to bearing large stresses and improves the service life of the rod 321 by placing a portion of the rod 321 in the receiving groove 351. Optionally, the block or plate structure may not have the receiving groove 351, and this application does not limit this.

[0059] In another possible structural design, the ejector base 35 can be a layered structure covering the cover 10, and the material hardness of the layered structure can be greater than that of the cover 10.

[0060] Figure 5 The embodiments provided in this application are shown. Figure 1 Please refer to another sectional view of the spray system and spray head disassembly device along the AA direction. Figure 5 In some other embodiments of this application, the cover 10 includes a receiving groove 351 suitable for accommodating a portion of the rod 321. This reduces the risk of the rod 321 bending due to excessive stress and improves its service life.

[0061] In one possible structural design, the fixed support 31 is located on the side of the spray head 20 away from the cover 10. Specifically, the fixed support 31 is located on the side of the connecting part 22 away from the cover 10. In this way, the fixed support 31 and the connecting part 22 can be directly fixed together by a connector arranged along the extension direction of the internal thread hole. This reduces the shear force on the connector when the fixed support 31 moves the spray head 20, compared to the connector extending in other directions, thereby reducing the risk of bending and deformation of the connector and improving the service life of the spray device 100. In another possible structural design, the fixed support 31 can also be located on the outer periphery of the spray head 20.

[0062] Please refer to some embodiments of this application. Figure 2 and Figure 5 The spray head disassembly device 30 also includes a guide member 33. One end of the guide member 33 passes through the fixed support 31 along the axial direction of the spray head 20, and the other end of the guide member 33 can be detachably connected to the cover 10. For example, the guide member 33 can be a bolt, screw, etc., and this application does not limit it.

[0063] For example, such as Figure 2 As shown, the guide member 33 is a first bolt 331. Two first bolts 331 can be provided. The first bolts 331 pass through the fixed support 31 along the axial direction of the spray head 20 and connect to the cover 10. The two first bolts 331 are located on opposite sides of the head 322. Thus, when the fixed support 31 moves with the spray head 20, the guide member 33 can provide guidance for the fixed support 31, which helps improve the stability of the fixed support 31 moving with the spray head 20 and prevents the fixed support 31 from tilting or jamming due to uneven force distribution.

[0064] In some embodiments of this application, the fixing support 31 is adapted to be detachably connected to the spray head 20. Specifically, the fixing support 31 can be detachably connected to the connecting part 22. Optionally, the fixing support 31 can be fixedly connected to the connecting part 22 by means of screw connection, snap-fit, bolt connection, etc.

[0065] Among them, such as Figure 2and Figure 4 As shown, the spray head disassembly device 30 also includes a first fastener 34, through which the fixing support 31 is detachably connected to the connecting part 22. Exemplarily, the first fastener 34 can be a bolt, screw, or snap-fit ​​structure, etc., and this application is not limited thereto. Furthermore, one or more first fasteners 34 can be provided; for example, such as... Figure 2 As shown, the first fastener 34 can be provided in two, three, four, or five, etc., and this application does not limit this. Thus, when the sprinkler head 20 needs to be disassembled, the fixing support 31 can be installed on the sprinkler head 20. After disassembly, the fixing support 31 can be directly removed, improving maintenance efficiency. Furthermore, the fixing support 31 is also connected to the connecting part 22 of the sprinkler head 20, which can further improve the stability of the fixing support 31 and prevent the fixing support 31 from shifting under stress.

[0066] Figure 6 Another cross-sectional view of the spray device and spray head disassembly device provided in the embodiments of this application is shown. Please refer to [link / reference]. Figure 6 In some embodiments, the ejection mechanism 32 includes a gear 323 rotatably connected to the cover 10. The gear 323 can be rotatably connected to the cover 10 via bearings. The fixed support 31 includes a rack 311, which meshes with the gear 323. When rotating relative to the cover 10, the rack 311 can be moved away from the connecting portion 22, thereby moving the spray head 20 away from the cover 10. The rack 311 can be a straight rack, extending along the arrangement direction of the cover 10 and the connecting portion 22. Furthermore, the axial direction of the gear 323 and the extending direction of the rack 311 can be aligned along the axis of the spray head 20.

[0067] It should be noted that the ejection mechanism 32 may also include a connector 324, one end of which is connected to the connecting part 22, and the other end of which is connected to the gear 323. Specifically, the other end of the connector 324 may be connected to the gear 323 via a bearing, thereby allowing the gear 323 to be rotatably connected to the cover 10. The connector 324 may be a columnar structure, a cylindrical structure, etc., and this application does not limit its application to this.

[0068] In this embodiment, the rack 311 and gear 323 work together to ensure a stable transmission ratio between the ejector mechanism 32 and the fixed support 31. Therefore, when the gear 323 rotates a certain angle, the rack 311 will move a corresponding distance, thus ensuring the accuracy and repeatability of the spray head 20 disassembly.

[0069] Figure 7A top view of another spray device and spray head disassembly device provided in an embodiment of this application is shown. Please refer to [link / reference]. Figure 2 and Figure 7 In some embodiments of this application, multiple spray head disassembly devices 30 are provided, and the multiple spray head disassembly devices 30 are arranged at intervals along the circumference of the spray head 20. The multiple spray head disassembly devices 30 can be evenly arranged at intervals along the circumference of the spray head 20.

[0070] Optional, such as Figure 2 As shown, two spray head removal devices 30 can be provided, and the two spray head removal devices 30 can be arranged at 180° intervals along the circumference of the spray head 20. Optionally, such as Figure 7 As shown, the spray head disassembly device 30 can also be provided in four units, and the four spray head disassembly devices 30 can be evenly arranged at 90° intervals along the circumference of the spray head 20. Optionally, the spray head disassembly device 30 can also be provided in three, five, six, etc., which will not be described in detail in this application.

[0071] Since multiple spray head disassembly devices 30 are evenly distributed around the spray head 20, during the disassembly process, each spray head disassembly device 30 acts simultaneously and the force is evenly distributed, which enables the spray head 20 to be subjected to a balanced force, thereby moving smoothly away from the cover 10. This avoids the spray head 20 tilting, jamming, or even being damaged due to uneven force, and ensures that the disassembly process proceeds smoothly.

[0072] Please refer to some embodiments of this application. Figure 5 The spray device 100 may also include an isolation ring 40, which is disposed between the cover 10 and the spray head 20 and is fixedly connected to the cover 10.

[0073] The isolation ring 40, made of an insulating material (such as ceramic), separates the cover 10 from the spray head 20, ensuring the stable electrical performance of the spray device 100 and guaranteeing the accuracy of signal transmission during semiconductor manufacturing. Furthermore, the isolation ring 40 fills the gap between the spray head 20 and the cover 10, forming a sealed structure to prevent process gases from leaking out and corroding the equipment or affecting the process. In addition, since the spray device 100 may experience temperature changes during semiconductor equipment operation, the isolation ring 40 can provide thermal insulation, reducing heat transfer between the spray head 20 and the cover 10, minimizing thermal stress differences, and preventing deformation or damage to the cover 10 or spray head 20 due to thermal expansion differences, thus ensuring the stable operation of the spray device 100.

[0074] In one possible structural design, the isolation ring 40 may include a first part 41 and a second part 42. The first part 41 is disposed between the spray section 21 and the cover 10, and the second part 42 is disposed between the connecting part 22 and the cover 10. Thus, the isolation ring 40 can isolate both the spray section 21 and the connecting part 22 of the spray head 20 from the cover 10, ensuring stable electrical performance of the spray device 100 and preventing deformation or damage to the cover 10 or the spray head 20 due to differences in thermal expansion, thereby ensuring stable operation of the spray device 100.

[0075] In addition, since the isolation ring 40 is fixedly connected to the cover 10, when the spray head 20 needs to be replaced or maintained, the spray head 20 can be moved away from the cover 10 under the action of the disassembly device 30, thus avoiding the spray head 20 from moving the isolation ring 40 together. Therefore, it is not necessary to reposition and install the isolation ring 40, reducing unnecessary disassembly and assembly steps and improving maintenance or repair efficiency.

[0076] Figure 8 The embodiments provided in this application are shown. Figure 7 Please refer to the structural diagram of the limiting component in the diagram. Figure 7 and Figure 8 In some embodiments, the spray head disassembly device 30 further includes a limiting member 36. Optionally, the limiting member 36 may include a first limiting part 361 fixed to the cover 10, the first limiting part 361 abutting against the side of the isolation ring 40 away from the cover 10.

[0077] The limiting member 36 may further include a second fastener 363, through which the first limiting part 361 can be fixedly connected to the cover 10. For example, the second fastener 363 may be a bolt, a snap-fit ​​structure, a rivet, solder, adhesive, etc., and this application does not limit it.

[0078] Since the first limiting part 361 abuts against the side of the isolation ring 40 away from the cover 10, the first limiting part 361 can firmly fix the isolation ring 40 on the cover 10, preventing the isolation ring 40 from moving with the spray head 20 during the operation of the spray head disassembly device 30, avoiding the isolation ring 40 being lifted up when disassembling the spray head 20, and facilitating the subsequent installation of the spray device 100.

[0079] Optionally, the limiting member 36 may further include a second limiting portion 362, which is connected to the first limiting portion 361. The first limiting portion 361 and the second limiting portion 362 are arranged perpendicularly, and the second limiting portion 362 is adapted to be located on the circumferential outer side of the isolation ring 40. The second limiting portion 362 and the first limiting portion 361 can be an integral structure, and the second limiting portion 362 can also be fixedly connected to the first limiting portion 361 by means of adhesive bonding, welding, threaded connection, etc. This application does not limit this.

[0080] Since the second limiting part 362 is located on the outer circumferential side of the isolation ring 40 and is connected to the first limiting part 361, the limiting member 36 can effectively prevent the isolation ring 40 from shifting or rotating in the horizontal direction (i.e., circumferential direction). Even if the spray device 100 is subjected to a large external force impact or vibration, the isolation ring 40 can maintain the predetermined position, which facilitates the subsequent installation of the spray device 100.

[0081] In some embodiments of this application, please refer to Figure 2 and Figure 7 Multiple limiting members 36 are provided, and the multiple limiting members 36 are arranged at intervals along the circumference of the spray head 20. Among them, one limiting member 36 is provided on each of the opposite sides of any disassembly device 30.

[0082] For example, such as Figure 2 As shown, there can be four limiting members 36 and two disassembly devices 30. Two of the four limiting members 36 are respectively located on opposite sides of one of the disassembly devices 30, and the other two of the four limiting members 36 are respectively located on opposite sides of another disassembly device 30.

[0083] For example, such as Figure 7 As shown, there can be eight limiting members 36 and four disassembly devices 30, with a limiting member 36 on each of the opposite sides of the four disassembly devices 30.

[0084] Since multiple limiting elements 36 are arranged at intervals along the circumference of the spray head 20, the isolation ring 40 can be provided with relatively balanced limiting, which helps to ensure that the isolation ring 40 remains stable during operation and avoids tilting or displacement due to uneven force.

[0085] In addition, since each disassembly device 30 has a limiting member 36 on both sides, when disassembling the spray head 20, the two limiting members 36 on both sides of the disassembly device 30 can help disperse the force applied by the disassembly device 30, which can prevent the isolation ring 40 from being damaged due to excessive local force, and make the force evenly distributed on the entire circumference, thus extending the service life of the isolation ring 40.

[0086] like Figure 6 As shown, in some embodiments of this application, the spray device 100 further includes a sealing ring 50, which is disposed between the spray head 20 and the isolation ring 40, and / or, the sealing ring 50 is disposed between the isolation ring 40 and the cover 10.

[0087] It is understandable that during the spraying process, process gases are ejected through the spray head 20 under a certain pressure. If gaps exist between the spray head 20 and the isolation ring 40, or between the isolation ring 40 and the cover 10, process gases may leak out from these gaps. This embodiment of the application, by providing a sealing ring 50, can fill these gaps, thereby creating a sealed environment in the vacuum chamber and preventing process gas leakage from affecting the equipment and the process. Furthermore, the sealing ring 50 can prevent dust, particles, and other impurities from entering the vacuum chamber through the gaps between the spray devices 100, ensuring the cleanliness of the semiconductor equipment's interior.

[0088] The above-described preferred embodiments have further detailed the purpose, technical solution, and advantages of this utility model. It should be understood that the above are merely preferred embodiments of this utility model and are not intended to limit this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A sprinkler head disassembly device for disassembling sprinkler heads mounted on a cover, characterized in that, include: A fixed support and an ejector mechanism are provided. The fixed support is adapted to be fixedly connected to the spray head. The ejector mechanism is adapted to abut against the cover along the axial direction of the spray head. The ejector mechanism is rotatably connected to the fixed support and, when the ejector mechanism rotates relative to the fixed support, it can push the fixed support and the spray head to move away from the cover.

2. The spray head disassembly device according to claim 1, characterized in that, The fixed support is provided with an internal threaded hole; The ejection mechanism includes a rod body, the outer periphery of which is provided with an external thread, and the external thread of the rod body is threadedly connected to the internal threaded hole.

3. The spray head disassembly device according to claim 2, characterized in that, The ejection mechanism further includes a head, which is connected to the rod and is adapted to be disposed on the side of the fixed support opposite to the spray head.

4. The spray head disassembly device according to any one of claims 1-3, characterized in that, The spray head disassembly device also includes: An ejector base is adapted to be disposed on the cover, and the ejector base abuts against the ejector mechanism along the axial direction of the spray head.

5. The spray head disassembly device according to claim 4, characterized in that, The material hardness of the ejector base is greater than that of the cover.

6. The spray head disassembly device according to any one of claims 1-5, characterized in that, The ejection mechanism includes a gear for rotatably connecting the cover; the fixed support includes a rack that meshes with the gear.

7. The spray head disassembly device according to any one of claims 1-6, characterized in that, The spray head disassembly device further includes a guide member, one end of which passes through the fixed support along the axial direction of the spray head, and the other end of which is adapted to be detachably connected to the cover.

8. The spray head disassembly device according to any one of claims 1-7, characterized in that, Also includes: The limiting member includes a first limiting part, which is used to fix the cover and is adapted to abut against the side of the isolation ring disposed between the cover and the spray head away from the cover.

9. The spray head disassembly device according to claim 8, characterized in that, The limiting member further includes a second limiting part, which is connected to the first limiting part and is adapted to be disposed on the circumferential outer side of the isolation ring.

10. The spray head disassembly device according to claim 8 or 9, characterized in that, Multiple limiting members are provided, and the multiple limiting members are adapted to be arranged at intervals along the circumference of the spray head.

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