Punching apparatus for chip component packing tape and chip component packing tape

Abstract

The utility model discloses a kind of punching equipment of chip component packaging carrier tape and chip component packaging carrier tape, the punching equipment of chip component packaging carrier tape includes punch mechanism and pull belt mechanism.The upper die of punch mechanism is sequentially provided with first punch needle group and second punch needle group along the direction of carrier tape advancement, the distance between punch needle in two groups of needle groups is 2S, and the distance between head and tail punch needle of two groups of needle groups D satisfies D=(2k+1)S.Pull belt mechanism drives carrier tape step distance L after each synchronous punching, and L is the integer multiple of 2S.The utility model is through the cooperation of two groups of specific distance punch needle group and accurate stepping mechanism, the first punch needle group in front can punch between the hole column formed by the previous punching of second punch needle group in rear, using the mode of twice punching superposition, form the precision hole column with hole distance S on carrier tape staggered, solved the technical problem that small hole distance mould manufacturing is difficult, cost is high, realized cost reduction and efficiency increase.

Description

Technical Field

[0001] The present application relates to the technical field of manufacturing of carrier tapes for packaging chip components, in particular to a punching device for carrier tapes for packaging chip components and a carrier tape for packaging chip components. Background

[0002] In the packaging process of chip components (such as Multi-layer Ceramic Chip Capacitors (MLCC)), the components are usually loaded into receiving holes of a carrier tape and sealed with a cover film to facilitate transportation and mounting. With the trend of miniaturization of electronic components, the pitch of the receiving holes on the carrier tape is becoming smaller and smaller. In the prior art, for a small hole pitch requirement of, for example, 1mm, a die with a directly manufactured hole pitch of 1mm is usually used for punching. However, this solution has significant limitations: first, an excessively small punch pin pitch will lead to insufficient structural strength of the die, making manufacturing extremely difficult and resulting in a low yield; second, special design and material selection to meet strength requirements will significantly increase the manufacturing cost of the die. Therefore, the prior art has the problems of difficult die manufacturing and high manufacturing cost. Contents of the Utility Model

[0003] In view of the above, it is necessary to address the problems existing in the background art and provide a punching device for carrier tapes for packaging chip components.

[0004] The present utility model is implemented in the following manner: In a first aspect, the present utility model provides a punching device for carrier tapes for packaging chip components, comprising: a punching mechanism, wherein the punching mechanism comprises an upper die and a lower die arranged in sequence from top to bottom; the upper die is provided with a first punching pin set and a second punching pin set arranged in sequence along the advancing direction of the carrier tape; the pitch between the punching pins within each of the first punching pin set and the second punching pin set is 2S; the pitch between the last punching pin of the first punching pin set and the first punching pin of the second punching pin set is D, where D satisfies: D=(2k+1)S, and k is a positive integer; the first punching pin set and the second punching pin set are configured to perform punching synchronously; a tape pulling mechanism, wherein the tape pulling mechanism is configured to drive the carrier tape to advance by a step distance L after each synchronous punching; wherein the step distance L is an integer N multiple of 2S, and N≥2.

[0005] In one embodiment, the L is greater than D, and the L is less than D+W, where W is the length covered by the first punching pin set in the advancing direction of the carrier tape.

[0006] In one embodiment, k=1, and the pitch D=3S.

[0007] In one embodiment, both the first and second punching needle groups contain M punches, and the stepping distance L = M × 2S.

[0008] In one embodiment, M ≥ 6.

[0009] In one embodiment, the upper die is further provided with a positioning pin group; the positioning pin group is arranged in parallel with the first stamping pin group and the second stamping pin group in the direction perpendicular to the forward movement of the carrier belt, and in the forward movement direction, its first positioning pin is offset from the first punch of the first stamping pin group by a distance S; and the positioning pin group is stamped synchronously with the first stamping pin group and the second stamping pin group.

[0010] In one embodiment, the spacing between the positioning pins in the positioning pin group is 4S.

[0011] In one embodiment, the punch is a guide, the cross-sectional dimension of which is 0.03 mm to 0.10 mm larger on each side than the mounting surface dimension of the chip element to be mounted.

[0012] In one embodiment, the belt pulling mechanism includes a belt pulling wheel and a drive motor, and the belt pulling wheel is provided with a positioning post that cooperates with a positioning hole on the carrier belt.

[0013] In one embodiment, the positioning posts are circumferentially and evenly distributed on the pulley, and their spacing is adapted to the spacing of the positioning holes on the carrier belt.

[0014] Secondly, this utility model also provides a sheet component packaging carrier tape, wherein the loading holes on the carrier tape are made by the punching equipment described in the first aspect of this utility model, and the carrier tape includes a continuous effective hole row located in the middle and waste sections located at both ends, wherein the hole spacing of the effective hole row is S and the hole spacing of the waste sections is 2S.

[0015] The punching equipment for the carrier tape of sheet component packaging in this application significantly reduces the processing difficulty of the mold and improves the structural strength by setting the spacing between the punch groups to 2S, which is twice the final hole spacing S. By limiting the spacing D between the two sets of punches to satisfy D=(2k+1)S, it is ensured that the second set of punches (the first punching needle group) can accurately punch holes between the holes formed by the first set of punches (the second punching needle group) in the previous punching. Combined with the tape pulling mechanism where the step distance L is an integer multiple of 2S each time, the hole arrays formed by the two punchings can be precisely staggered. The synergistic effect of these three factors ultimately forms a precision hole array with a hole spacing of S on the carrier tape, thereby achieving high-precision, small-hole-spacing carrier tape processing with low-cost and easy-to-manufacture molds. Attached Figure Description

[0016] Figure 1This is a schematic diagram of the punching equipment for the chip component packaging carrier tape described in the embodiments of this application; Figure 2 This is a schematic diagram of the punching mechanism of the punching equipment for the packaging carrier tape of the sheet components described in the embodiments of this application; Figure 3 This is a schematic diagram of the punching mechanism of the punching equipment for the packaging carrier tape of the sheet components described in the embodiments of this application; Figure 4 This is a schematic diagram of the punching mechanism of the punching equipment for the packaging carrier tape of the sheet component described in the embodiments of this application.

[0017] Icon labels: 100. Stamping mechanism; 110. Upper die; 111. First stamping needle group; 1111. Last punch of the first stamping needle group; 1112. First punch of the first stamping needle group; 112. Second stamping needle group; 1121. First punch of the second stamping needle group; 113. Positioning needle group; 1131. First positioning needle; 120. Lower die; 200. Belt pulling mechanism; 210. Belt pulling wheel; 211. Positioning post; 220. Drive motor; 300. Carrier belt; 310. Positioning hole; 320. Loading hole. Detailed Implementation

[0018] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0019] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0020] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0021] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0022] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0023] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0024] This application creatively proposes a "step-by-step staggered" punching concept to address the technical problems of difficult and costly mold manufacturing caused by directly processing small-pitch carrier tape in existing technologies. The core improvement lies in setting two sets of punching needles with specific spacing relationships and synchronizing their operation. Combined with a precisely defined carrier tape stepping distance, the second set of punching needles can perform secondary punching between the hole arrays formed by the first set of punching needles. Thus, using punches with an intra-group spacing of 2S, the superposition effect of the two punching operations ultimately yields a dense hole array with a hole spacing of S on the carrier tape. This concept decomposes the small-pitch holes, which originally required one-time high-precision forming, into two relatively loose-precision punching operations. This fundamentally avoids the mold manufacturing difficulties caused by excessively small punch spacing, significantly reduces the mold processing accuracy requirements and manufacturing costs, while ensuring the hole spacing accuracy of the final product, achieving the technical effect of cost reduction and efficiency improvement.

[0025] The punching apparatus for the packaging carrier tape of the sheet component according to embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0026] like Figures 1 to 4 As shown, this embodiment provides a punching device for a sheet component packaging carrier tape, including a punching mechanism 100 and a tape pulling mechanism 200.

[0027] The stamping mechanism 100 includes an upper die 110 and a lower die 120 arranged sequentially from top to bottom. The upper die 110 can be driven by a stamping motor (not shown in the figure) to perform up-and-down reciprocating motion. The lower die 120 is fixedly arranged relative to the upper die 110 and is used to support the carrier tape 300 to be processed during stamping. Specifically, the carrier tape is a paper carrier tape or a plastic carrier tape.

[0028] The upper die 110 is along the forward direction of the carrier belt 300 (i.e. Figure 1 and Figure 2 From left to right, a first punching needle group 111 and a second punching needle group 112 are sequentially fixed. These two groups of punching needles are mounted on the same upper die to achieve strict synchronous punching, that is, they simultaneously contact and leave the carrier belt 300 within the same punching cycle. The first punching needle group 111 and the second punching needle group 112 are each provided with multiple identical punches at equal intervals.

[0029] The spacing between the punches in both the first punching pin group 111 and the second punching pin group 112 is 2S. Here, "spacing" refers to the distance between the center lines of adjacent punches. A spacing of 2S within each group is a relatively lenient design that is easy to manufacture and ensures strength.

[0030] The spacing between the last punching needle 1111 of the first punching needle set 111 and the first punching needle 1121 of the second punching needle set 112 is D. This spacing D satisfies the mathematical relation: D = (2k+1)S, where k is a positive integer (such as 1, 2, 3...).

[0031] In this embodiment, the tape pulling mechanism 200 is configured to drive the carrier tape 300 to move forward by a fixed stepping distance after each synchronous punching is completed. The stepping distance L is configured to be an integer N multiple of 2S, and N≥2. In this embodiment, L is preferably required to be greater than D. In this case, the punching position of the front first punching needle set 111 will be precisely aligned between the hole rows formed by the rear second punching needle set 112 in the previous punching, so as to punch new holes and form dense hole rows with a hole spacing of S.

[0032] To ensure the continuity and effectiveness of punching, the stepping distance L needs to satisfy: L<D+W, where W is the length covered by the first punching needle set 111 in the advancing direction of the carrier tape 300. The function of this limitation is to ensure that after each stepping of the carrier tape 300, the punching start position of the first punching needle set 111 is still within the effective hole row region formed by the second punching needle set 112 in the previous punching, so as to ensure that the staggered punching process can be carried out stably and continuously, and avoid the out-of-control of the punching position caused by an excessively large stepping distance.

[0033] During the working process, the punching equipment for the chip component packaging carrier tape operates cyclically at the rhythm of "punching - stepping - punching". Through the first punching, the two punching needle sets punch holes with a spacing of 2S on the carrier tape; after stepping for a distance L, the second punching is performed. At this time, the first punching needle set exactly punches new holes between the holes punched by the second punching needle set in the previous time, so that the holes punched in these two times are staggered with each other, and finally a dense hole row with a hole spacing of S is formed in this region. Such cycles can efficiently and low-costly manufacture high-precision packaging carrier tapes.

[0034] In the punching equipment for the chip component packaging carrier tape according to the embodiments of the present application, by setting the internal spacing of the punching needle set to 2S which is twice the final hole spacing S, the machining difficulty of the die is significantly reduced and the structural strength is improved. By limiting the spacing D between the two sets of punching needles to satisfy D=(2k+1)S, it is ensured that the second set of punching needles (the first punching needle set) can accurately punch holes between the holes formed by the first set of punching needles (the second punching needle set) in the previous time. Combined with the tape pulling mechanism whose each stepping distance L is an integer multiple of 2S, the hole rows formed by the two times of punching can be precisely staggered. The synergistic effect of the three finally forms a precise hole row with a hole spacing of S on the carrier tape, so as to realize the machining of the carrier tape with high precision and small hole spacing by using a die that is low-cost and easy to manufacture.

[0035] In a preferred embodiment, k is set to 1. That is, the distance D between the last punch 1111 of the first punching needle group 111 and the first punch 1121 of the second punching needle group 112 is specifically 3S. This solution is the simplest and most effective way to achieve half the hole spacing, and the mold structure is the most compact.

[0036] Furthermore, both the first punching pin group 111 and the second punching pin group 112 can contain M punches. Correspondingly, the single-step distance L of the belt-pulling mechanism 200 is set to M×2S, ensuring that each step precisely moves an entire group of punched areas out of the working area while simultaneously bringing in a new area to be processed. The logic is clear and the control is simple. To ensure production efficiency and material utilization, the value of M is typically not less than 6. For example, in this embodiment, M can be 12, meaning each group contains 12 punches, and the single-step distance L=24S.

[0037] To achieve precise stepping of the carrier tape, in one embodiment, the upper die 110 is further provided with a positioning pin group 113. This positioning pin group 113 is arranged side-by-side with the stamping pin group in the direction perpendicular to the forward movement of the carrier tape 300 (i.e., the width direction of the carrier tape 300). Crucially, in the forward movement direction, its first positioning pin 1131 is offset by a distance S from the first punch pin 1112 of the first stamping pin group 111. This specific offset ensures a fixed positional relationship between the punched positioning hole 310 and the loading hole 320, which ultimately matches the loading hole spacing, ensuring the accuracy of subsequent stepping and mounting processes. The positioning pin group 113 operates synchronously with the stamping pin group, completing the punching of all holes in one operation.

[0038] More preferably, such as Figure 1 As shown, the spacing between the positioning pins in the positioning pin group is set to 4S. This spacing is an integer multiple of the basic spacing of 2S and matches the standard specification of the carrier tape 300. Its purpose is to optimize the layout of the pins on the mold while ensuring positioning accuracy, avoid affecting the mold strength due to excessively dense positioning pins, and meet the reliability requirements of the carrier tape index.

[0039] In one embodiment, the punch is preferably a guide pin, the cross-sectional shape of which is adapted to the mounting surface of the chip component (such as an MLCC). To ensure that the component can be easily inserted and stably held, the cross-sectional dimension of the guide pin needs to be slightly larger than the mounting surface dimension of the component. In this embodiment, this dimension is optimized to be 0.03 mm to 0.10 mm larger on each side. This specific tolerance range is one of the inventive contributions of this application in practice; it balances the contradictory requirements of "easy insertion" and "stable clamping," and is key to achieving high-yield packaging.

[0040] like Figure 1 and Figure 2As shown, one specific implementation of the belt pulling mechanism 200 includes a belt pulling wheel 210 and a drive motor 220. The belt pulling wheel 210 has multiple positioning pins 211, which are evenly spaced circumferentially. Their function is to engage with the positioning holes 310 punched out on the carrier belt 300 to achieve a "pin-hole engagement" type of traction. The drive motor 220 drives the belt pulling wheel 210 to rotate by a fixed angle, thereby pulling the carrier belt 300 a fixed step distance L. To ensure step accuracy, the spacing of the positioning pins 211 on the belt pulling wheel 210 must match the spacing of the positioning holes 310 on the carrier belt 300 (as in the previous 4S).

[0041] This application also protects a chip component packaging carrier tape manufactured by any of the aforementioned punching equipment, wherein the middle section consists of a continuous effective row of holes with a hole spacing of S for holding chip components; while both ends have waste sections with a hole spacing of 2S. These waste sections are an inevitable byproduct of implementing the "step-by-step staggered" punching process of this application and are removed during final slitting and packaging. This carrier tape product itself is distinguished from carrier tapes manufactured by conventional equipment due to its unique hole spacing distribution structure.

[0042] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0043] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A punching device for a carrier tape for packaging sheet components, characterized in that, comprising: a punching mechanism (100), wherein the punching mechanism (100) comprises an upper die (110) and a lower die (120) arranged in sequence from top to bottom; the upper die (110) is provided with a first punching needle set (111) and a second punching needle set (112) arranged in sequence along the advancing direction of the carrier tape (300); the spacing between punching needles within each of the first punching needle set (111) and the second punching needle set (112) is 2S; the spacing between the last punching needle (1111) of the first punching needle set and the first punching needle (1121) of the second punching needle set is D, where D satisfies: D=(2k+1)S, and k is a positive integer; the first punching needle set (111) and the second punching needle set (112) are configured to perform punching synchronously; a tape pulling mechanism (200), wherein the tape pulling mechanism (200) is configured to drive the carrier tape (300) to advance by a step distance L after each synchronous punching; wherein the step distance L is an integer N multiple of 2S, and N≥2.

2. The punching equipment for the carrier tape of sheet component packaging according to claim 1, characterized in that, The L is greater than D, and the L is less than D+W, where W is the length covered by the first punching needle set (111) in the advancing direction of the carrier tape (300).

3. The punching apparatus for a chip component packaging carrier tape according to claim 2, characterized in that, k=1, and the spacing D=3S.

4. The punching apparatus for a chip component packaging carrier tape according to claim 3, characterized in that, Each of the first punching needle set (111) and the second punching needle set (112) comprises M punching needles, and the step distance L= M×2S.

5. The punching equipment for the carrier tape of sheet component packaging according to claim 1, characterized in that, The upper die (110) is further provided with a positioning needle set (113); the positioning needle set (113) is arranged side by side with the first punching needle set (111) and the second punching needle set (112) in the direction perpendicular to the advancing direction of the carrier tape (300), and in the advancing direction, the first positioning needle (1131) thereof is arranged to be offset by a distance S from the first punching needle (1112) of the first punching needle set (111); and the positioning needle set (113) performs punching synchronously with the first punching needle set (111) and the second punching needle set (112).

6. The punching equipment for the carrier tape of sheet component packaging according to claim 5, characterized in that, The spacing between positioning needles in the positioning needle set (113) is 4S.

7. The punching equipment for the carrier tape of sheet component packaging according to claim 1, characterized in that, The punching needle is a square needle, and the cross-sectional dimension thereof is 0.03mm to 0.10mm larger on each side than the dimension of the mounting surface of the chip component to be loaded.

8. The punching equipment for the carrier tape of sheet component packaging according to claim 1, characterized in that, The tape pulling mechanism (200) comprises a tape pulling wheel (210) and a driving motor (220), and the tape pulling wheel (210) is provided with positioning posts (211) that match the positioning holes (310) on the carrier tape (300).

9. The punching equipment for the carrier tape of chip component packaging according to claim 8, characterized in that, The positioning posts (211) are distributed on the tape pulling wheel (210) at equal intervals in the circumferential direction, and the spacing therebetween is adapted to the spacing of the positioning holes (310) on the carrier tape (300).

10. A carrier tape for packaging sheet components, characterized in that, The loading holes on the carrier tape are manufactured by the punching apparatus according to any one of claims 1 to 9, the carrier tape comprises a continuous effective hole row in the middle and waste material sections at both ends, the hole spacing of the effective hole row is S, and the hole spacing of the waste material sections is 2S.

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