High thermal conductive composite substrate hot press forming die

Abstract

The utility model provides a kind of high thermal conductivity composite substrate hot-press forming die, belong to composite substrate processing field, including hot-pressing bottom bin and model cavity, the model cavity is slidably connected in the inside of hot-pressing bottom bin, the surface of the model cavity is provided with clamping assembly, the inside of hot-pressing bottom bin is provided with support assembly.The utility model, when model cavity drops, will be through the inclined surface of wedge-shaped block to wedge-shaped block to exert thrust, so that wedge-shaped block exerts pressure on spring, until model cavity moves to specified position, wedge-shaped block and wedge-shaped groove are located at the same horizontal plane, at this moment, spring will push wedge-shaped block and be inserted into the inside of wedge-shaped groove, to complete the fixation of model cavity, when needing to disassemble model cavity, by pulling holding lever, so that holding lever drives wedge-shaped block and wedge-shaped groove to separate by bending rod and traction rod, model cavity can be replaced and handled, overall operation is simple and convenient, solve the existing hot-pressing die and have the problem of fixed complicated, change mould difficult.

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