A novel integrated circuit cutting device

Abstract

The utility model relates to novel integrated circuit cutting device technical field discloses a novel integrated circuit cutting device, including the upper die, the lower die is provided below the upper die, the upper die includes the stripping unit, the stripping unit both ends are provided with the bending unit, the inside of lower die is provided with the rectangular spring, the upper side of rectangular spring is provided with the support unit, the upper side of lower die is provided with the transmission track, one end of transmission track is provided with the fixed pin, the utility model improves the problem that the tin plating layer scratch area is big, makes the tin area to reduce one time, the scratch is slightly no leakage base material, satisfies the follow -up package and use demand, improves production efficiency.

Description

Technical Field

[0001] This utility model relates to the technical field of novel integrated circuit cutting devices, specifically a novel integrated circuit cutting device. Background Technology

[0002] In the field of integrated circuit manufacturing, the dicing process is a crucial factor determining product quality and production efficiency. With the rapid development of technology, electronic products are moving towards miniaturization and high performance, placing higher demands on the integration and precision of integrated circuits, thus making the performance of dicing equipment paramount. Currently, the production processes for different customer products vary significantly. Existing production technologies employ a process of dicing individual chips before electroplating. While this process ensures that the dicing process does not affect the tin layer of the product, its drawbacks are also significant. The small size of the individual chips after dicing makes it difficult to distribute the plating evenly, resulting in inconsistent plating thickness, especially at product edges or areas with complex structures. Moreover, dicing individual chips before electroplating increases operation time, increases equipment load, and severely reduces overall production efficiency. Simultaneously, metal shavings and residues generated during dicing easily adhere to the surface of individual chips; if cleaning is inadequate before electroplating, it can lead to poor plating adhesion or even defects. However, the method of electroplating followed by individual cutting can affect the product's plating layer. This demonstrates that existing integrated circuit cutting and related production processes exhibit numerous problems in various scenarios, failing to meet the ever-increasing demands for high precision, high efficiency, and high quality production. Against this backdrop, the development of a new integrated circuit cutting device is urgently needed. This device aims to overcome the shortcomings of existing production processes by setting up upper and lower molds, transport tracks, and employing a rational component layout and collaborative working methods. This will improve cutting accuracy, optimize the demolding process, increase production efficiency, reduce production costs, and minimize adverse effects on the product's plating layer, providing a new solution for the integrated circuit manufacturing industry and driving further technological development within the sector. Utility Model Content

[0003] The purpose of this invention is to address the shortcomings of existing technologies by proposing a novel integrated circuit cutting device.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: a novel integrated circuit cutting device, comprising an upper mold, a lower mold disposed below the upper mold, the upper mold comprising a demolding unit, bending units disposed at both ends of the demolding unit, a rectangular spring disposed inside the lower mold, a support unit disposed above the rectangular spring, a transmission track disposed above the lower mold, and a fixing pin disposed at one end of the transmission track.

[0005] As a further description of the above technical solution:

[0006] The upper mold and the lower mold together form a product forming unit.

[0007] As a further description of the above technical solution:

[0008] The side of the bending unit closest to the demolding unit is a cutting surface, and the lower end of the cutting surface has an R-angle, which is an arc angle.

[0009] As a further description of the above technical solution:

[0010] A groove is provided in the lower center of the demolding unit, and a fixing pin is slidably connected to the groove to assist demolding.

[0011] As a further description of the above technical solution:

[0012] The rectangular springs are arranged in several groups, and each rectangular spring is provided with a support unit above it for supporting the product.

[0013] As a further description of the above technical solution:

[0014] The fixing pins are provided in several sets, and each set of fixing pins is matched with the demolding unit.

[0015] This utility model has the following beneficial effects:

[0016] 1. The lower end of the cutting surface of the bending unit near the demolding unit is provided with an R-angle, which can reduce stress concentration during the cutting process, make the cutting edge smoother, improve the cutting quality, and reduce the probability of product defects caused by cutting. The lower center of the demolding unit is provided with a groove that slides with the fixing pin to assist demolding, reduce the risk of damage to the product during demolding, improve demolding efficiency, and help improve the overall production efficiency.

[0017] 2. Multiple sets of rectangular springs are installed inside the lower mold, and a support unit is arranged above each set of rectangular springs. This provides stable support for the product, ensures the positional accuracy of the product during processing, avoids product deformation or processing errors caused by unstable support, and improves the processing accuracy and consistency of the product. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the upper mold of a novel integrated circuit cutting device proposed in this utility model;

[0019] Figure 2 This is a schematic diagram of the lower mold of a novel integrated circuit cutting device proposed in this utility model;

[0020] Figure 3 This is a partial schematic diagram of the upper mold of a novel integrated circuit cutting device proposed in this utility model;

[0021] Figure 4 This is a schematic diagram of the groove in the demolding unit of a novel integrated circuit cutting device proposed in this utility model.

[0022] Figure 5 This is a schematic diagram of the support unit of a novel integrated circuit cutting device proposed in this utility model;

[0023] Figure 6 This is a schematic diagram of a rectangular spring in a novel integrated circuit cutting device proposed in this utility model;

[0024] Figure 7 This is a schematic diagram of the transmission track of a novel integrated circuit cutting device proposed in this utility model.

[0025] Figure 8 This is a schematic diagram of a novel integrated circuit cutting device proposed in this utility model.

[0026] Legend:

[0027] 1. Upper mold; 11. Demolding unit; 12. Bending unit; 13. Groove; 14. R-angle; 2. Lower mold; 21. Support unit; 22. Rectangular spring; 3. Transfer track; 31. Fixing pin; 4. Rib cutting unit; 5. Product forming unit; 6. Frame removal and single-piece cutting unit. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The utility model will be further described in detail below with reference to the accompanying drawings.

[0030] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0031] Example 1:

[0032] like Figures 1 to 7 As shown, the system includes an upper mold 1, with a lower mold 2 positioned below it. The upper mold 1 and lower mold 2 are positioned opposite each other. The upper mold 1 includes a demolding unit 11 located in the middle. This demolding unit 11 has a groove structure, designed to accommodate the protruding fixing pins on the transfer track. The groove size is larger than the fixing pin size. Bending units 12 are provided at both ends of the demolding unit 11. The lower mold 2 has a rectangular design and contains a rectangular spring 22. The rectangular spring is model SWF6-35, which has a large rectangular width and thread density, resulting in better stability. A support unit 21 is provided above the rectangular spring 22. A transfer track 3 is provided above the lower mold 2. The transfer track 3 is used to transport products and has multiple protruding fixing pins 31, the number of which matches the demolding unit 11 of the upper mold.

[0033] Example 2:

[0034] The upper mold 1 and the lower mold 2 together form the product molding unit 5. After the product is encapsulated, it is baked and cured. The molding operation is further completed by closing the upper mold 1 and the lower mold 2 to ensure that the product can achieve the expected shape and specifications.

[0035] The side of the bending unit 12 closest to the demolding unit 11 is a cutting surface, with a radius angle 14 at the lower end. The radius angle 14 can be 1.0°, the bending unit thickness can be 3.5mm, and the bending unit length can be 22.96mm. Furthermore, 0.035mm of the cutting surface can be ground away to form a -3° angle. This ensures a certain gap between the product pins and the bending unit during the product forming unit 5 operation, preventing scratches caused by the tin-plated surface of the pins being tightly fitted to the sidewall of the support unit, thus improving product quality.

[0036] A groove 13 is provided in the lower center of the demolding unit 11, and the groove 13 is slidably connected to the fixing pin 31 to assist demolding. During the upper die pressing operation, the fixing pin 31 can pre-fix the product placed in the lower die, so that the product is subjected to uniform force and avoids the product from being jammed due to uneven force during the high-pressure stamping process, which may cause the pins to break. After the operation is completed, the upper die is lifted first and then the fixing pin is lifted. This action can relieve the upward impact force brought by the spring of the support unit after the upper die is lifted quickly when the product is demolded, so as to avoid damage to the product. The sliding connection between the groove 13 and the fixing pin 31 of the demolding unit 11 further ensures the smoothness of the demolding process.

[0037] Several sets of rectangular springs 22 are provided, and each rectangular spring 22 is equipped with a support unit 21 above it for supporting the product. The rectangular springs 22 inside the lower mold can reduce the buffering resistance when the product is pressed down, assist the product in separating from the mold, and improve material jamming. After the rectangular springs 22 are compressed downward under the downward pressure, they leave a gap for the support unit 21. This gap can be customized according to the size or characteristics of the product to better support the product and ensure the quality of the product pin bending forming.

[0038] Several sets of fixing pins 31 are provided, and each set of fixing pins 31 matches the demolding unit 11. This ensures that during the pressing and lifting of the upper mold, the fixing pins 31 can work in conjunction with the demolding unit 11 to pre-fix the product, assist in uniform force distribution on the product, and relieve impact force during demolding, thus ensuring the stable operation of the entire cutting device and the stability of product quality. At the same time, the process flow is optimized. Through process reversal and innovative single-die mold structure, the problem of material jamming during cutting is solved while ensuring the coating quality, thereby reducing production costs and improving production efficiency.

[0039] Example 3

[0040] like Figure 8 As shown, a novel integrated circuit cutting device includes a rib removal unit 4, a product forming unit 5, and a frame removal and single-piece cutting unit 6. The rib removal unit is used to remove the ribs between products, the product forming unit 5 is used to bend and shape the product leads, and the frame removal and single-piece cutting unit 6 is used to remove the product frame and cut the product into single pieces, ensuring that the cut is flat and burr-free, avoiding damage to the product body structure, meeting the requirements of subsequent packaging and use, significantly improving product processing efficiency, and reducing labor costs and quality risks.

[0041] Finally, it should be noted that the above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A novel integrated circuit cutting device, comprising an upper mold (1) and a lower mold (2) disposed below the upper mold (1), characterized in that: The upper mold (1) includes a demolding unit (11), and bending units (12) are provided at both ends of the demolding unit (11). A rectangular spring (22) is provided inside the lower mold (2), and a support unit (21) is provided above the rectangular spring (22). A transmission track (3) is provided above the lower mold (2), and a fixing pin (31) is provided at one end of the transmission track (3).

2. The novel integrated circuit cutting device according to claim 1, characterized in that: The upper mold (1) and the lower mold (2) are closed to form the product.

3. The novel integrated circuit cutting apparatus according to claim 1, characterized in that: The side of the bending unit (12) closest to the demolding unit (11) is a cutting surface, and the lower end of the cutting surface has an R angle (14), which is an arc angle.

4. The novel integrated circuit cutting apparatus according to claim 3, characterized in that: A groove (13) is provided in the lower center of the demolding unit (11), and the groove (13) is slidably connected to a fixing pin (31) to assist in demolding.

5. The novel integrated circuit cutting apparatus according to claim 1, characterized in that: The rectangular springs (22) are arranged in several groups, and a support unit (21) is arranged above the rectangular springs (22) to support the product.

6. The novel integrated circuit cutting apparatus according to claim 1, characterized in that: The fixing pins (31) are provided in several groups, and each group of fixing pins (31) is matched with the demolding unit (11).

7. The novel integrated circuit cutting apparatus according to claim 1, characterized in that: The cutting device also includes a tendon-connecting cutting unit and a frame-removing single-unit cutting unit.

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