A precise injection mold demolding device with a buffer structure

Abstract

The utility model discloses a kind of precision injection mould stripping devices with ejector pin buffer structure, it is related to injection mould technical field, including ejection end component, buffer component and ejector pin assembly, it is characterized by: the upper end of ejection end component is vertically connected and installed with buffer component, the ejector pin assembly is vertically connected and installed in the top of buffer component.The precision injection mould stripping device with ejector pin buffer structure, through the synergistic effect of ejection end component, buffer component and ejector pin assembly, efficient and stable stripping process is realized, ejection end component is designed ingenious, can accurately position and eject injection product, ensure the integrity and precision of finished product, buffer component plays key buffering effect, effectively reduce the impact force in ejection process, protect mould and finished product from being damaged, and ejector pin assembly provides stable and uniform ejecting force through its unique structure, further improves the efficiency and quality of stripping.

Description

Technical Field

[0001] This utility model relates to the field of injection mold technology, specifically to a precision injection mold demolding device with an ejector pin buffer structure. Background Technology

[0002] Injection molds are key industrial tools used for the mass production of plastic products. They are formed by injecting molten plastic into a mold cavity, which then cools and solidifies to create the desired plastic part. Their core function is to achieve efficient and precise manufacturing of plastic products, and they are widely used in home appliances, automotive parts, daily necessities, and other fields.

[0003] The ejection system (also known as the demolding device) of an injection mold is a mechanism used in the mold to push the cooled and solidified plastic part out of the cavity. Its core function is to ensure that the plastic part leaves the mold intact and efficiently, while avoiding deformation or damage.

[0004] Conventional injection mold ejection devices often lack effective buffering mechanisms during the ejection process, leading to excessive or unstable ejection forces, which in turn cause problems such as plastic part deformation and mold wear. This is especially true in the field of precision injection molding, where the requirements for the precision and surface quality of plastic parts are extremely high. Even the slightest damage can lead to product defects, increasing production costs and scrap rates. Utility Model Content

[0005] The purpose of this invention is to provide a demolding device for precision injection molds with an ejector pin buffer structure, so as to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a precision injection mold demolding device with an ejector pin buffer structure, comprising an ejector end component, a buffer component, and an ejector pin assembly, characterized in that: a buffer component is vertically connected and installed at the upper end of the ejector end component, and the ejector pin assembly is vertically connected and installed at the top of the buffer component; the buffer component includes a damping telescopic component, an upper connecting seat, a lower connecting seat, a buffer spring, a mating hole, a first assembly hole, and a shock-absorbing pin; the upper end of the damping telescopic component is provided with an upper connecting seat, and the lower end of the damping telescopic component is provided with a lower connecting seat; a buffer spring is provided between the lower connecting seat and the lower end of the damping telescopic component; a mating hole is vertically opened on the bottom surface of the lower connecting seat; a first assembly hole is also vertically opened on the bottom surface of the lower connecting seat; and a shock-absorbing pin is vertically arranged in the middle of the bottom of the lower connecting seat.

[0007] Furthermore, the ejector end component includes an ejector seat, a buffer seat, a docking post, and a second assembly hole. The ejector seat is provided with a buffer seat on its top, and a docking post is provided vertically on the top edge of the buffer seat. The second assembly hole is also provided vertically on the top surface of the buffer seat.

[0008] Furthermore, the ejector seat, buffer seat, and docking pile are integrated into a single structure, and the top center of the buffer seat has a vertically opened insertion hole structure that matches the outer surface structure of the shock-absorbing pile.

[0009] Furthermore, the second assembly hole and the first assembly hole are vertically opposite each other and structurally matched. The second assembly hole and the first assembly hole are arranged in a ring array structure with the buffer seat and the lower connecting seat as the center, and three sets are evenly distributed.

[0010] Furthermore, the outer surface structure of the docking pile and the inner surface structure of the docking hole are matched with each other, and the docking pile and the docking hole are arranged in a ring array structure with the buffer seat and the lower connecting seat as the center, and three sets are evenly distributed.

[0011] Furthermore, the ejector pin assembly includes an ejector pin body, a guide sleeve component, a fixed seat component, a return spring, and a combined post. The guide sleeve component is sleeved in the middle of the ejector pin body, and the fixed seat component is fixedly installed at the upper end of the ejector pin body. A return spring is vertically arranged between the guide sleeve component and the fixed seat component, and a combined post is vertically arranged at the bottom end of the ejector pin body.

[0012] Furthermore, the combined pile and the upper connecting seat are connected by a threaded connection in the vertical direction, and the core body and the combined pile are integrally structured.

[0013] Furthermore, the guide sleeve component, the fixed seat component, and the return spring are fixedly connected, and bolts are vertically provided at the four opposite corners of the guide sleeve component and the fixed seat component.

[0014] This utility model provides a demolding device for precision injection molds with an ejector pin buffer structure, which has the following beneficial effects: 1. This utility model, through the structural design of the buffer component, utilizes the dual buffering effect of the damping telescopic component and the buffer spring to effectively absorb and disperse the impact force generated during ejection, preventing the plastic part from deforming or being damaged due to excessive ejection force. Simultaneously, it ensures the smoothness and precision of the ejection action, improving demolding quality. The damping telescopic component, through its internal damping material, provides continuous resistance during ejection, slowing down the ejection speed and preventing the plastic part from breaking due to sudden force. The buffer spring further absorbs the remaining impact force, ensuring the smoothness of the ejection process. Thus, by adding a spring buffer component between the ejector pin assembly and the ejection end component, rigid impact during ejection causes deformation of the plastic part, and the elastic structure improves demolding stability.

[0015] 2. In this utility model, the connection design between the top-out end component and the buffer component is achieved by matching the insertion of the docking stake and the docking hole, and by fixing the second assembly hole and the first assembly hole with bolts. This achieves a stable connection between the two, while facilitating disassembly and maintenance. This connection method not only enhances the stability of the overall structure, but also improves the flexibility and maintainability of the device and reduces the cost of use.

[0016] 3. In this utility model, the design of the ejector pin assembly also emphasizes practicality and durability. The ejector pin body is made of high-strength material, which can withstand large ejection forces without deformation. The guide sleeve component ensures that the ejector pin body maintains linear movement during ejection, avoiding damage to the plastic part caused by skewing. The combination of the fixed seat component and the return spring allows the ejector pin assembly to quickly return to its original position after completing the ejection action, preparing for the next demolding. The threaded connection between the combined pile and the upper connecting seat further enhances the connection strength between the ejector pin assembly and the buffer component, as well as the ease of assembly and disassembly.

[0017] 4. In this utility model, the three sets of docking stakes and docking holes arranged in a ring array structure, as well as the second assembly hole and the first assembly hole, realize uniform force between the top end component and the buffer component, and avoid structural damage or deformation caused by excessive local force. This design not only improves the overall stability of the device, but also extends its service life and reduces the replacement frequency and maintenance cost. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the main body of a precision injection mold demolding device with an ejector pin buffer structure according to the present invention; Figure 2 This is a schematic diagram of the ejector end component of a precision injection mold demolding device with an ejector pin buffer structure according to the present invention. Figure 3 This is a three-dimensional structural diagram of the ejector end component of a precision injection mold demolding device with ejector pin buffer structure according to the present invention. Figure 4 This is a three-dimensional structural diagram of the buffer component of a precision injection mold demolding device with an ejector pin buffer structure according to the present invention; Figure 5 This is a three-dimensional structural diagram of the buffer component of a precision injection mold demolding device with an ejector pin buffer structure according to the present invention; Figure 6 This is a three-dimensional structural diagram of the ejector pin assembly of a precision injection mold demolding device with an ejector pin buffer structure according to the present invention.

[0019] In the diagram: 1. Ejector end component; 101. Ejector seat; 102. Buffer seat; 103. Connecting pile; 104. Second assembly hole; 2. Buffer component; 201. Damping telescopic component; 202. Upper connecting seat; 203. Lower connecting seat; 204. Buffer spring; 205. Connecting hole; 206. First assembly hole; 207. Vibration damping pile; 3. Ejector pin assembly; 301. Ejector pin body; 302. Guide sleeve component; 303. Fixed seat component; 304. Return spring; 305. Combined pile. Detailed Implementation

[0020] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of this utility model.

[0021] like Figures 1 to 6 As shown, a precision injection mold demolding device with an ejector pin buffer structure includes an ejector end component 1, a buffer component 2, and an ejector pin assembly 3. The device is characterized in that: the upper end of the ejector end component 1 is vertically connected to and installed with the buffer component 2; the ejector pin assembly 3 is vertically connected to and installed at the top of the buffer component 2; the buffer component 2 includes a damping telescopic component 201, an upper connecting seat 202, a lower connecting seat 203, a buffer spring 204, a mating hole 205, a first assembly hole 206, and a shock-absorbing insert 207; the upper end of the damping telescopic component 201 is provided with the upper connecting seat 202, and the lower end of the damping telescopic component 201 is provided with the lower connecting seat 203; a buffer spring 204 is provided between the lower connecting seat 203 and the lower end of the damping telescopic component 201; the bottom surface of the lower connecting seat 203 is vertically provided with the mating hole 205; the bottom surface of the lower connecting seat 203 is also vertically provided with the first assembly hole 206; and a first assembly hole 206 is vertically provided in the middle of the bottom of the lower connecting seat 203. The shock-absorbing insert 207 has a vertically opposite and structurally matched second assembly hole 104 and first assembly hole 206. The second assembly hole 104 and the first assembly hole 206 are arranged in a ring array with the buffer seat 102 and the lower connecting seat 203 as the center, and three sets are evenly distributed. The matching design of the second assembly hole 104 and the first assembly hole 206 allows for a stable connection by passing bolts through them in sequence during assembly. This ring array of three sets of assembly holes not only ensures a uniform distribution of the connection strength between the ejector component 1 and the buffer component 2, but also effectively disperses the stress generated during ejection, avoiding structural deformation caused by local stress concentration. At the same time, the insertion and engagement of the insert 103 and the insert hole 205 further enhances the positioning accuracy and connection stability between the two, ensuring that the buffer component 2 can accurately transmit the ejection force during ejection, and avoiding ejection deviation or unstable operation caused by loose connection.

[0022] like Figures 1 to 6As shown, the ejector component 1 includes an ejector seat 101, a buffer seat 102, a docking stud 103, and a second assembly hole 104. The ejector seat 101 has a buffer seat 102 on its top, and a docking stud 103 is vertically disposed on the top edge of the buffer seat 102. The top surface of the buffer seat 102 has a vertically disposed second assembly hole 104. The ejector seat 101, buffer seat 102, and docking stud 103 are integrally formed. The top center of the buffer seat 102 has a vertically disposed insertion hole structure that matches the outer surface structure of the shock-absorbing stud 207. The outer surface structure of the docking stud 103 matches the inner surface structure of the docking insertion hole 205. The docking stud 103 and the docking insertion hole 205 are respectively connected by the buffer seat 102 and the lower connecting... The seat 203 is arranged in a circular array with three groups evenly distributed around it. The shock-absorbing insert 207 is designed to be matched with the insertion hole in the middle of the top of the buffer seat 102. When the buffer component 2 is assembled with the ejector component 1, the shock-absorbing insert 207 can be accurately inserted into the insertion hole. It not only plays a positioning role, but also effectively absorbs and disperses the vertical impact force during the ejection process, further enhancing the overall stability of the device, reducing structural shaking or displacement caused by impact force, and improving the accuracy of demolding action. The ejector pin assembly 3 is reliably fixed to the buffer component 2 through the threaded connection of the combination pin 305 to the upper connecting seat 202. This connection method facilitates quick disassembly and replacement of the ejector pin assembly 3, improving the maintenance efficiency of the device.

[0023] like Figures 1 to 6As shown, the ejector pin assembly 3 includes an ejector pin body 301, a guide sleeve component 302, a fixing seat component 303, a return spring 304, and a combination post 305. The guide sleeve component 302 is sleeved in the middle of the ejector pin body 301, and the fixing seat component 303 is fixedly installed at the upper end of the ejector pin body 301. A return spring 304 is vertically arranged between the guide sleeve component 302 and the fixing seat component 303, and a combination post 305 is vertically arranged at the bottom end of the ejector pin body 301. The combination post 305 and the upper connecting seat 202 are connected by a threaded connection in the vertical direction. The ejector pin body 301 and the combination post 305 are integrally formed. The guide sleeve component 302, the fixing seat component 303, and the return spring 304 are fixedly connected. Bolts are vertically provided at the four opposite corners of the guide sleeve component 302 and the fixing seat component 303. The guide sleeve component 302 guides the ejector body 301, allowing the ejector body 301 to move linearly along the axis of the guide sleeve component 302 during ejection. This effectively avoids problems such as scratches on the plastic part surface or uneven ejection caused by ejector pin misalignment, ensuring the quality and appearance integrity of the plastic part. At the same time, the fixed connection between the fixed seat component 303 and the guide sleeve component 302, as well as the setting of the return spring 304, enable the ejector assembly 3 to quickly return to the initial position under the elastic force of the return spring 304 after completing the ejection action, preparing for the next demolding operation and improving the working efficiency and continuous operation capability of the device. In addition, the threaded connection between the combined pile 305 and the upper connecting seat 202 not only has high connection strength but also facilitates disassembly and assembly, making it easy to maintain and replace the ejector assembly 3 and reducing the maintenance cost and difficulty of use of the device.

[0024] In summary, as Figures 1 to 6 As shown, the precision injection mold demolding device with ejector pin buffer structure, when in use, firstly, the buffer component 2 is matched and connected with the docking pin 103 and the second assembly hole 104 of the ejector end component 1 through the docking insertion hole 205 and the first assembly hole 206 on its lower connecting seat 203. Then, the bolts are passed through the second assembly hole 104 and the first assembly hole 206 in sequence to achieve a stable connection between the buffer component 2 and the ejector end component 1. At the same time, ensure that the shock-absorbing insert 207 on the lower connecting seat 203 of the buffer component 2 is accurately inserted into the insertion hole structure in the middle of the top of the buffer seat 102 of the top end component 1, so as to play the role of positioning and absorbing the vertical impact force. Then, the ejector assembly 3 is threadedly connected to the upper connecting seat 202 of the buffer component 2 through its combination post 305, so that the ejector assembly 3 is vertically installed on the top of the buffer component 2, and the assembly of the entire device is completed. During the demolding process of the injection mold, when the plastic part needs to be ejected, the external drive device is activated and the ejection end component 1 starts to work. Through the dual buffering effect of the damping telescopic component 201 and the buffer spring 204 in the buffer component 2, the impact force generated during the ejection process is effectively absorbed and dispersed. The damping material inside the damping telescopic component 201 provides continuous resistance during ejection, slows down the ejection speed, and prevents the plastic part from breaking due to sudden force. The buffer spring 204 further absorbs the remaining impact force to ensure the smoothness of the ejection process. Meanwhile, during the ejection process, the ejector pin assembly 3 moves linearly along the axis of the guide sleeve component 302. The guide sleeve component 302 plays a guiding role, preventing ejector pin misalignment that could cause scratches on the surface of the plastic part or uneven ejection, thus ensuring the quality and appearance integrity of the plastic part. After the ejection action is completed, the return spring 304 between the fixed seat component 303 and the guide sleeve component 302 takes effect, allowing the ejector pin assembly 3 to quickly return to its initial position under the elastic force of the return spring 304, preparing for the next demolding operation. Through this design, the entire device not only improves the demolding quality but also enhances the overall stability, flexibility, and maintainability of the device, reducing operating costs and maintenance frequency.

[0025] The embodiments of this utility model are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the utility model to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better illustrate the principles and practical applications of this utility model, and to enable those skilled in the art to understand this utility model and design various embodiments with various modifications suitable for a particular purpose.

Claims

1. A precision injection mold demolding device with an ejector pin buffer structure, comprising an ejector end component (1), a buffer component (2), and an ejector pin assembly (3), characterized in that: A buffer member (2) is vertically connected to the upper end of the ejector component (1), and the ejector pin assembly (3) is vertically connected to the top of the buffer member (2). The buffer member (2) includes a damping telescopic member (201), an upper connecting seat (202), a lower connecting seat (203), a buffer spring (204), a mating hole (205), a first assembly hole (206), and a shock-absorbing insert (207). The upper end of the damping telescopic member (201) is provided with an upper connecting seat (202). The lower end of the damping expansion member (201) is provided with a lower connecting seat (203), and a buffer spring (204) is provided between the lower connecting seat (203) and the lower end of the damping expansion member (201). The bottom surface of the lower connecting seat (203) is vertically provided with a mating hole (205), and the bottom surface of the lower connecting seat (203) is also vertically provided with a first assembly hole (206). The bottom center of the lower connecting seat (203) is vertically provided with a shock-absorbing insert (207).

2. The demolding device for a precision injection mold with an ejector pin buffer structure according to claim 1, characterized in that, The ejector end component (1) includes an ejector seat (101), a buffer seat (102), a docking pin (103), and a second assembly hole (104). The top of the ejector seat (101) is provided with a buffer seat (102), and the top edge of the buffer seat (102) is vertically provided with a docking pin (103). The top surface of the buffer seat (102) is vertically provided with a second assembly hole (104).

3. The demolding device for a precision injection mold with an ejector pin buffer structure according to claim 2, characterized in that, The top-out seat (101), buffer seat (102), and docking pile (103) are integrated into one structure, and the top center of the buffer seat (102) has a vertically opened insertion hole structure that matches the outer surface structure of the shock-absorbing pile (207).

4. The demolding device for a precision injection mold with an ejector pin buffer structure according to claim 2, characterized in that, The second assembly hole (104) and the first assembly hole (206) are vertically opposite each other and structurally matched. The second assembly hole (104) and the first assembly hole (206) are arranged in a ring array structure with the buffer seat (102) and the lower connecting seat (203) as the center, and three sets are evenly distributed.

5. A precision injection mold demolding device with an ejector pin buffer structure according to claim 2, characterized in that, The outer surface structure of the docking stake (103) and the inner surface structure of the docking hole (205) are matched with each other. The docking stake (103) and the docking hole (205) are arranged in a ring array structure with the buffer seat (102) and the lower connecting seat (203) as the center, and three sets are evenly distributed.

6. The demolding device for a precision injection mold with an ejector pin buffer structure according to claim 1, characterized in that, The ejector assembly (3) includes an ejector body (301), a guide sleeve component (302), a fixing seat component (303), a return spring (304), and a combination post (305). The guide sleeve component (302) is sleeved in the middle of the ejector body (301), and the fixing seat component (303) is fixedly installed at the upper end of the ejector body (301). The return spring (304) is vertically arranged between the guide sleeve component (302) and the fixing seat component (303), and the combination post (305) is vertically arranged at the bottom end of the ejector body (301).

7. A precision injection mold demolding device with an ejector pin buffer structure according to claim 6, characterized in that, The combined pile (305) and the upper connecting seat (202) are connected by a threaded combination in the vertical direction, and the core body (301) and the combined pile (305) are set as an integral structure.

8. A precision injection mold demolding device with an ejector pin buffer structure according to claim 6, characterized in that, The guide sleeve component (302), the fixed seat component (303), and the return spring (304) are fixedly connected, and bolts are vertically provided at the four opposite corners of the guide sleeve component (302) and the fixed seat component (303).

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