Dispensing and mounting device for optical filters

Abstract

The application relates to the technical field of filter processing equipment, in particular to a filter dispensing and mounting device, which comprises a rack and further comprises a feeding module, a conveying module, a dispensing and mounting module, a wafer conveying module, a transfer and adjustment module and a discharging module; the conveying module comprises a material taking mechanism, a discharging mechanism and a mounting conveying mechanism, a containing space is formed between the material taking mechanism and the discharging mechanism, the mounting conveying mechanism is located in the containing space, the mounting conveying mechanism comprises a mounting table, and the mounting table is close to or far away from the containing space; the dispensing and mounting module, the wafer conveying module and the transfer and adjustment module are located on one side of the material taking mechanism and the discharging mechanism, and when the mounting table is far away from the containing space, the mounting table is close to the dispensing and mounting module, the wafer conveying module and the transfer and adjustment module. Through integration of various modules, the dispensing and filter mounting processes of a carrier plate are completed on the mounting table, error accumulation and poor mounting precision are reduced, and filter processing efficiency and processing quality are improved.

Description

Technical Field

[0001] This application relates to the field of filter processing equipment technology, and in particular to a filter dispensing and mounting device. Background Technology

[0002] With technological advancements, the processing and manufacturing of optical filters is continuously upgrading towards precision, efficiency, and automation to meet production demands. Existing filter processing equipment relies on multi-axis separation or single Z-axis time-sharing structures. Multi-axis separation structures distribute processes such as loading, dispensing, and mounting across multiple independent processing units, each equipped with its own motion mechanism. This design not only results in a large overall equipment size and excessive production space usage, but also leads to significant cumulative errors during filter transfer due to inconsistent positioning references between units, resulting in poor mounting accuracy. While single Z-axis time-sharing structures simplify spatial layout, the Z-axis head must sequentially perform dispensing, material handling, and mounting operations. This strictly sequential process prevents parallel multitasking, leading to lengthy processing cycles, limited capacity expansion, and impacting both filter processing efficiency and quality. Utility Model Content

[0003] The purpose of this application is to provide a filter dispensing and mounting device, which aims to improve the problems of error accumulation and poor mounting accuracy in filter processing equipment with independent processing structures, thereby improving the processing efficiency and quality of filters.

[0004] This application provides a filter dispensing and mounting apparatus, including a frame, and further including a loading module, a transport module, a dispensing and mounting module, a wafer feeding module, a transfer adjustment module, and a unloading module disposed on the frame; the transport module includes a picking mechanism, an unloading mechanism, and a mounting conveying mechanism disposed on the frame, the picking mechanism and the unloading mechanism are located on the same axis, and a receiving space is formed between the picking mechanism and the unloading mechanism, the mounting conveying mechanism is located in the receiving space, and the mounting conveying mechanism includes a mounting table, the mounting table being close to or away from the receiving space; the dispensing and mounting module, the wafer feeding module, and the transfer adjustment module are located on one side of the picking mechanism and the unloading mechanism, and when the mounting table is away from the receiving space, the mounting table is close to the dispensing and mounting module, the wafer feeding module, and the transfer adjustment module.

[0005] Furthermore, the placement conveying mechanism includes a placement conveying Y-axis module disposed on the frame, a placement conveying X-axis module disposed on the placement conveying Y-axis module, and a placement conveying Z-axis module disposed on the placement conveying X-axis module, with the placement table disposed on the placement conveying Z-axis module.

[0006] Furthermore, the transfer adjustment module includes a transfer Y-axis module disposed on the frame, a vacuum transfer stage assembly disposed on the transfer Y-axis module, a plurality of adjustment blocks disposed on the vacuum transfer stage assembly, and a transfer fine-tuning component for driving the adjustment blocks; the adjustment blocks are slidably connected to the vacuum transfer stage assembly, and the adjustment blocks have an adjustment cavity for accommodating the filter and an adjustment stop for adjusting the position of the filter.

[0007] Furthermore, the transfer adjustment module also includes a force control testing component, which is disposed on the vacuum transfer stage assembly and faces the dispensing and mounting module.

[0008] Furthermore, the dispensing and mounting module includes a dispensing and mounting base disposed on the frame, a dispensing and mounting X-axis module disposed on the dispensing and mounting base, a dispensing Z-axis assembly disposed on the dispensing and mounting X-axis, a mounting Z-axis assembly, and a material picking Z-axis assembly; the dispensing Z-axis assembly, the mounting Z-axis assembly, and the material picking Z-axis assembly move along the dispensing and mounting X-axis module between the transport module, the wafer feeding module, and the transfer and adjustment module.

[0009] Furthermore, the dispensing and mounting module also includes a wafer positioning component, a transfer platform positioning component, and a carrier board positioning component disposed on the dispensing and mounting base; the wafer positioning component faces the wafer feeding module, the transfer platform positioning component faces the transfer adjustment module, and the carrier board positioning component faces the mounting and conveying mechanism.

[0010] Furthermore, the wafer feeding module includes a wafer transport mechanism and a pin mechanism; the wafer transport mechanism includes a plurality of wafer stage assemblies, the pin mechanism is located below the wafer stage assembly, there are at least two pin mechanisms, and each of the plurality of pin mechanisms faces one of the wafer stage assemblies.

[0011] Furthermore, the wafer handling mechanism includes a wafer handling Y-axis module disposed on the rack and a wafer handling X-axis module disposed on the wafer handling Y-axis module, and a plurality of wafer worktable assemblies are disposed on the wafer handling X-axis module.

[0012] Furthermore, the ejector mechanism includes an ejector Y-axis module disposed on the frame, a slider structure disposed on the ejector Y-axis module, and an ejector Z-axis module disposed on the slider structure, wherein the ejector Z-axis module faces the wafer stage assembly.

[0013] Furthermore, it also includes a curing module, which includes a plurality of UV lamps disposed on the rack, the plurality of UV lamps facing the mounting table.

[0014] The beneficial effects of this application are: This application discloses a filter dispensing and mounting device. By integrating various modules, during filter dispensing and mounting, a feeding module feeds a carrier board. After feeding, the carrier board enters the picking mechanism of the transport module. The picking mechanism transports the carrier board closer to the receiving space and transfers it to the mounting conveyor mechanism. The mounting conveyor mechanism uses a mounting table to transport the carrier board away from the receiving space and closer to the dispensing and mounting module, the wafer feeding module, and the transfer and adjustment module. The wafer feeding module feeds the wafer and peels off the filter. The dispensing and mounting module then transports the extracted filter to the transfer and adjustment module. The process involves dispensing adhesive onto the carrier board and adjusting the position of the filter using the dispensing and mounting module. The dispensing and mounting module then transfers the adjusted filter to the carrier board for mounting. After mounting, the mounting table moves back to the receiving space to transport the carrier board with the filter to the unloading mechanism. The unloading mechanism then transports the carrier board to the unloading module. The entire process of dispensing adhesive and mounting the filter is completed on the mounting table, thus avoiding the problems of error accumulation and poor mounting accuracy caused by using independent processing structures, and improving the processing efficiency and quality of the filter. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of a filter dispensing and mounting device provided in an embodiment of this application; Figure 2 This is a top view of a filter dispensing and mounting apparatus provided in an embodiment of this application; Figure 3 This is a schematic diagram of the feeding module in an embodiment of this application; Figure 4 This is a schematic diagram of the transportation module in an embodiment of this application; Figure 5 This is a schematic diagram of the mounting and conveying mechanism in the embodiments of this application; Figure 6 This is a schematic diagram of the wafer handling mechanism in an embodiment of this application; Figure 7 This is a schematic diagram of the ejector mechanism in an embodiment of this application; Figure 8 This is a schematic diagram of the transfer and adjustment module in an embodiment of this application; Figure 9 This is a top view of the transfer adjustment module in the embodiment of this application; Figure 10 yes Figure 9 A magnified view of part A in the middle; Figure 11 This is a schematic diagram of the modified camera assembly in an embodiment of this application; Figure 12 This is a schematic diagram of the dispensing and mounting module in an embodiment of this application; Figure 13 This is a schematic diagram of the solidification module in an embodiment of this application.

[0016] Explanation of reference numerals in the attached figures: 01. Rack; 1. Feeding module; 11. Feeding base; 12. Feeding Z-axis module; 13. Feeding X-axis module; 2. Transportation module; 21. Material picking mechanism; 211. Material picking and transport seat; 212. Material picking X-axis module; 22. Unloading mechanism; 23. Placement conveyor mechanism; 231. Placement conveyor Y-axis module; 232. Placement conveyor X-axis module; 233. Placement table; 234. Adhesive scraper assembly; 3. Dispensing and mounting module; 31. Dispensing and mounting base; 32. Dispensing and mounting X-axis module; 33. Dispensing Z-axis assembly; 34. Mounting Z-axis assembly; 35. Picking Z-axis assembly; 36. Wafer positioning assembly; 37. Transfer station positioning assembly; 38. Carrier board positioning assembly; 4. Wafer feeding module; 41. Wafer handling mechanism; 411. Wafer handling Y-axis module; 412. Wafer handling X-axis module; 413. Wafer worktable assembly; 42. Ejector mechanism; 421. Ejector Y-axis module; 422. Slider structure; 423. Ejector Z-axis module; 5. Transfer adjustment module; 51. Transfer Y-axis module; 52. Vacuum transfer stage assembly; 53. Adjustment stop; 531. Adjustment cavity; 532. Adjustment stop; 54. Transfer fine-tuning assembly; 55. Force control test assembly; 56. Correction camera assembly; 6. Material feeding module; 7. Curing module; 71. UV lamp. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0018] It should be noted that although functional modules are divided in the device schematic diagram and a logical order is shown in the flowchart, in some cases, the steps shown or described may be performed in a different order than the module division in the device or the order in the flowchart. The terms "first," "second," etc., in the specification, claims, and the aforementioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing embodiments of this application only and is not intended to limit this application.

[0020] Reference Figure 1 as well as Figure 2 This application provides a filter dispensing and mounting device, including a frame 01, and further including a loading module 1, a transport module 2, a dispensing and mounting module 3, a wafer feeding module 4, a transfer adjustment module 5, and a unloading module 6 disposed on the frame 01; the transport module 2 includes a picking mechanism 21, an unloading mechanism 22, and a mounting conveying mechanism 23 disposed on the frame 01, the picking mechanism 21 and the unloading mechanism 22 are located on the same axis, and a receiving space is formed between the picking mechanism 21 and the unloading mechanism 22, the mounting conveying mechanism 23 is located in the receiving space, and the mounting conveying mechanism 23 includes a mounting table 233, which is close to or away from the receiving space; the dispensing and mounting module 3, the wafer feeding module 4, and the transfer adjustment module 5 are located on one side of the picking mechanism 21 and the unloading mechanism 22, and when the mounting table 233 is away from the receiving space, the mounting table 233 is close to the dispensing and mounting module 3, the wafer feeding module 4, and the transfer adjustment module 5.

[0021] Specifically, the frame 01 serves as the supporting foundation for the device. The frame 01 can be welded from high-strength steel or made of a single piece of cast aluminum to ensure the overall rigidity and stability of the device. Each module is supported and arranged on the frame 01. Each module can be fixed to its preset position on the frame 01 by bolts or pins. Alternatively, each module can be designed as an integrated component and installed together in a specific area of ​​the frame 01.

[0022] For ease of description, the length direction of frame 01 is set as the X-axis, which is also the material transport direction; the width direction of frame 01 is set as the Y-axis, which is perpendicular to the X-axis; and the height direction of frame 01 is set as the Z-axis, which is perpendicular to both the Y-axis and the X-axis.

[0023] Reference Figure 1 , Figure 2 as well as Figure 3 The loading module 1 and the unloading module 6 are respectively located on both sides of the length direction of the frame 01. The loading module 1 is used to load the carrier plate. The loading module 1 includes a loading seat 11, a loading Z-axis module 12 and a loading X-axis module 13 located on the loading seat 11. The loading module 1 loads the carrier plate in the form of a material box. After loading, the carrier plate is transferred to the transport module 2. The transport module 2, together with other modules, performs adhesive bonding on the carrier plate and then transports it to the unloading module 6. The unloading module 6 is used to unload, stack and store the carrier plates after adhesive bonding.

[0024] Reference Figure 1 , Figure 2 , Figure 4 as well as Figure 5 The transport module 2 includes a picking mechanism 21, a unloading mechanism 22, and a mounting conveyor 23, all of which are mounted on the frame 01. The picking mechanism 21 is located near the loading module 1. The picking mechanism 21 includes a picking transport seat 211, a picking X-axis module 212 mounted on the picking transport seat 211, and a picking hook block mounted on the picking X-axis module 212. During loading, the picking X-axis module 212 drives the picking hook block to approach and extend into the loading module 1 to hook the carrier plate. Then, the picking X-axis module 212 drives the picking hook block to retract, transferring the carrier plate to the picking mechanism 21. The picking mechanism 21 then transports the carrier plate to the mounting conveyor 23. Alternatively, the picking mechanism 21 can employ a vacuum suction cup combined with a cylinder-driven structure to pick up the carrier plate from the loading module 1.

[0025] The picking mechanism 21 and the unloading mechanism 22 are arranged on the same axis, that is, the axes of the picking mechanism 21 and the unloading mechanism 22 coincide. This layout ensures the continuity and alignment of the movement path of the carrier plate when entering and leaving the transport module 2. The center lines of the picking mechanism 21 and the unloading mechanism 22 can be precisely aligned by pre-setting a reference line on the frame 01, or the two can share a long guide rail, thereby ensuring the smooth transfer of the carrier plate between the two and reducing jamming or positioning errors that may occur due to misalignment.

[0026] Between the material handling mechanism 21 and the unloading mechanism 22, a receiving space is formed. This receiving space serves as an area for the initial transfer and waiting of the carrier plate within the transport module 2. This space can be an open rectangular area, designed to accommodate the mounting conveyor 23 and the carrier plate it carries, and allowing the mounting conveyor 23 to perform necessary movement and positioning operations within this area.

[0027] The placement conveyor mechanism 23 includes a placement table 233. The placement table 233 is the component that directly carries the carrier board, and it is used to support the carrier board and ensure the stability and positioning accuracy of the carrier board throughout the processing. Specifically, the placement table 233 can be a metal plate with a flat surface, which may be provided with holes and air passages for vacuum adsorption of the carrier board, or it may be provided with mechanical clamps to fix the carrier board to prevent displacement of the carrier board during movement and processing.

[0028] The placement table 233 can move closer to or further away from the receiving space, enabling it to transfer the carrier board from the receiving space area to other working areas and return after processing. When the placement conveyor 23 is in its initial state, the placement table 233 of the placement conveyor 23 remains in the receiving space, waiting to receive the carrier board from the picking mechanism 21; after the carrier board is processed, the placement table 233 transports the carrier board to the receiving space, thereby sending the processed carrier board to the unloading mechanism 22.

[0029] The dispensing and mounting module 3, the wafer feeding module 4, and the transfer and adjustment module 5 are positioned on one side of the picking mechanism 21 and the unloading mechanism 22. This arrangement allows the mounting stage 233 to be close to these modules when it is away from the receiving space, facilitating the processing of the carrier board by these modules. These modules can be arranged side-by-side on top of the transport module 2, or arranged in a specific layout around one side of the transport module 2, thus forming a centralized processing area. After moving away from the receiving space, the mounting stage 233 can simultaneously stop in the working areas of the dispensing and mounting module 3, the wafer feeding module 4, and the transfer and adjustment module 5, so that these modules can operate on the carrier board or filter, thereby achieving coordinated and synchronous operation of each process.

[0030] Through the above technical solution, the filter dispensing and mounting device of this application integrates multiple process modules such as feeding, transportation, dispensing and mounting, wafer feeding, transfer adjustment, and unloading onto a single frame 01. It utilizes the mounting table 233 as a carrier platform, enabling one-time positioning and continuous operation of the carrier throughout the entire processing flow. This effectively avoids the problems of large equipment space occupation, accumulation of multi-axis motion errors, and limited efficiency of serial operations caused by traditional multi-axis separation or single Z-axis time-sharing operation structures, thus effectively improving the processing efficiency and quality of filters.

[0031] In some embodiments, the placement conveying mechanism 23 includes a placement conveying Y-axis module 231 disposed on the frame 01, a placement conveying X-axis module 232 disposed on the placement conveying Y-axis module 231, and a placement conveying Z-axis module disposed on the placement conveying X-axis module 232, with the placement table 233 disposed on the placement conveying Z-axis module.

[0032] The Y-axis placement transport module 231 is an actuator that provides linear motion along the Y-axis direction. The Y-axis placement transport module 231 can be driven by a linear motor or a ball screw, thereby moving the X-axis placement transport module 232, the Z-axis placement transport module, and the placement table 233 in the Y-axis direction. Similarly, the X-axis placement transport module 232 and the Z-axis placement transport module can also be driven by linear motors or ball screws as needed, thereby moving the placement table 233 in all three axes to precisely deliver the carrier board to each module.

[0033] In this embodiment, the mounting conveying mechanism 23 further includes a scraper assembly 234, which is disposed on the mounting table 233. The scraper assembly 234 is used to cooperate with the dispensing and mounting module 3. During dispensing, the scraper assembly 234 scrapes off the original or newly applied glue on the dispensing and mounting module 3 by rotating, thereby controlling the amount of glue on the dispensing and mounting module 3 and preventing excessive glue from falling off.

[0034] Reference Figure 1 , Figure 2 , Figure 6 as well as Figure 7 In some embodiments, the wafer feeding module 4 includes a wafer transport mechanism 41 and a ejector pin mechanism 42; the wafer transport mechanism 41 includes a plurality of wafer stage assemblies 413, the ejector pin mechanism 42 is located below the wafer stage assembly 413, there are at least two ejector pin mechanisms 42, and each of the plurality of ejector pin mechanisms 42 faces a wafer stage assembly 413.

[0035] Specifically, the wafer feeding module 4 is mainly responsible for introducing the wafers to be processed into the device and peeling off the filters, providing the separated filters for the subsequent dispensing and mounting process. The main function of the wafer handling mechanism 41 is to move the peeled filters closer to the dispensing and mounting module 3, thereby facilitating the positioning and picking up of the filters by the dispensing and mounting module 3. The wafer handling mechanism 41 can be implemented in various ways, such as by a linear module, a robotic arm, or a conveyor belt, to ensure that the wafers can be stably and efficiently transported to the picking position. The ejector pin mechanism 42 is used to peel off or eject the filters from the wafer. Its working principle is that the upward-moving ejector pins separate the filters attached to the wafer from the wafer surface. This mechanism can be pneumatically, electrically, or hydraulically driven to achieve precise and controllable ejection actions.

[0036] In some embodiments, the wafer transport mechanism 41 includes a wafer transport Y-axis module 411 disposed on the rack 01 and a wafer transport X-axis module 412 disposed on the wafer transport Y-axis module 411, and a plurality of wafer stage assemblies 413 disposed on the wafer transport X-axis module 412.

[0037] Specifically, the wafer handling Y-axis module 411 and the wafer handling X-axis module 412 are linear motion units used to provide precise linear displacement in the Y-axis and X-axis directions, thereby driving the wafer stage assembly 413 to move quickly and accurately closer to or further away from the dispensing and mounting module 3.

[0038] In some embodiments, the ejector mechanism 42 includes an ejector Y-axis module 421 disposed on the frame 01, a slider structure 422 disposed on the ejector Y-axis module 421, and an ejector Z-axis module 423 disposed on the slider structure 422, the ejector Z-axis module 423 facing the wafer stage assembly 413.

[0039] Specifically, the ejector pin Y-axis module 421 is used to drive the slider structure 422 and the ejector pin Z-axis module 423 in the Y-axis direction, thereby causing the ejector pin mechanism 42 to approach different wafer stage assemblies 413 and perform filter stripping on the wafers on the different wafer stage assemblies 413. In this embodiment, there are two ejector pin mechanisms 42, each corresponding to two wafer stage assemblies 413, and the two wafer stage assemblies 413 are located above the ejector pin Y-axis module 421 of one ejector pin mechanism 42. By driving the ejector pin Y-axis module 421, the slider structure 422 and the ejector pin Z-axis module 423 can approach the corresponding wafer stage assembly 413, thereby realizing that one ejector pin mechanism 42 corresponds to two wafer stage assemblies 413 to eject the wafers.

[0040] The slider structure 422 is a sliding unit mounted on the guide rail of the ejector pin Y-axis module 421. Specifically, the slider structure 422 can be driven by a motor or cylinder. In this embodiment, the slider structure 422 is tilted. Driven by the slider structure 422, the ejector pin Z-axis module 423 will move upward or downward along the tilt direction, thereby approaching or moving away from the wafer. The ejector pin Z-axis module 423 has ejector pins. The ejector pin Z-axis module 423 can be driven by a micro-cylinder or electric push rod, enabling rapid and controllable vertical lifting and lowering of the ejector pins. The ejector pin Z-axis module 423 faces the wafer stage assembly 413. When performing the lifting operation, the ejector pins can act on the wafer at a preset angle and direction, thereby peeling off the filter and reducing damage to the wafer or filter. After the ejector pin mechanism 42 peels off the filter from the wafer, the dispensing and mounting module 3 moves the peeled filter to the transfer and adjustment module 5.

[0041] Reference Figure 2 , Figure 8 , Figure 9 as well as Figure 10 In some embodiments, the transfer adjustment module 5 includes a transfer Y-axis module 51 disposed on the frame 01, a vacuum transfer stage assembly 52 disposed on the transfer Y-axis module 51, a plurality of adjustment blocks 53 disposed on the vacuum transfer stage assembly 52, and a transfer fine-tuning assembly 54 for driving the adjustment blocks 53; the adjustment blocks 53 are slidably connected to the vacuum transfer stage assembly 52, and the adjustment blocks 53 have an adjustment cavity 531 for accommodating the filter and an adjustment stop 532 for adjusting the position of the filter.

[0042] Specifically, the Y-axis transfer module 51 provides Y-axis movement for the vacuum transfer table assembly 52, enabling it to be positioned on the frame 01 to adapt to different workstations or for coarse positioning. This module can be implemented using a linear motor-driven slide table, with position feedback via an encoder, thereby achieving precise Y-axis positioning.

[0043] The vacuum transfer stage assembly 52 is a platform that uses vacuum adsorption to fix the filter. It is used to stably support the filter and prevent it from shifting during adjustment, providing a stable foundation for subsequent precise adjustment. This assembly can be designed as a flat plate with multiple vacuum suction holes. A vacuum pump generates negative pressure to adsorb and fix the filter on its surface. The distribution and size of the suction holes can be selected according to the size of the filter.

[0044] The adjustment stop 53 is a component used to physically contact and limit the position of the filter. Its function is to contact the edge of the filter and make preliminary or fine position adjustments to the filter through physical limiting. The inner surface of the stop is smooth to avoid scratching the filter. The intermediate fine-tuning component 54 is a mechanism used to drive the adjustment stop 53 to make small and precise movements, thereby providing high-precision driving force so that the adjustment stop 53 can perform fine position calibration of the filter. This component can use a precision lead screw mechanism driven by a stepper motor or servo motor, in conjunction with an encoder to achieve adjustment. By setting multiple adjustment stops 53, multiple adjustment stops 53 can be driven, thereby adjusting multiple filters simultaneously.

[0045] The adjusting block 53 is slidably connected to the vacuum turntable assembly 52, meaning the adjusting block 53 can move relative to the surface of the vacuum turntable assembly 52 to adjust the filter in multiple directions. The adjusting cavity 531 is located in the middle of the adjusting block 53, providing a pre-positioning area for the filter, and works in conjunction with the adjusting edge 532 to adjust the filter. The adjusting edge 532, through its physical structure and movement, precisely adjusts the final position of the filter on the vacuum turntable assembly 52. ​​When adjusting the filter, the adjusting block 53 is driven to move by the turntable fine-tuning assembly 54, allowing the adjusting edge 532 to contact and drive the filter, thereby adjusting its position so that it is aligned or moved to a preset position. After the adjusting block 53 drives the filter, the filter is picked up by the dispensing and mounting module 3, ready for mounting onto the carrier plate.

[0046] Reference Figure 1 , Figure 8 , Figure 9 as well as Figure 11 In some embodiments, the transfer adjustment module 5 further includes a force control test component 55, which is disposed on the vacuum transfer stage component 52 and faces the dispensing and mounting module 3.

[0047] The force control testing component 55 is a device for real-time measurement and feedback of force, which can convert mechanical force signals into electrical signals that can be recognized and processed by the system. Specifically, the force control testing component 55 can employ a piezoelectric sensor or a resistance strain gauge sensor. In this embodiment, the force control testing component 55 is used to calibrate and standardize the force before the Z-axis mounting component 34 is attached. When the Z-axis mounting component 34 of the dispensing and mounting module 3 is about to pick up and mount the filter, the Z-axis mounting component 34 can first contact the force control testing component 55 to obtain the downward pressure or downward stroke of the Z-axis mounting component 34. Based on the data, the downward pressure or downward stroke is adjusted to reduce the possibility of filter damage due to excessive downward pressure or downward stroke, improving the stability and reliability of the picking process, and thus improving the processing quality and yield of the filter. In this embodiment, the transfer adjustment module 5 also includes a correction camera component 56, which is used to inspect the picked-up filter.

[0048] Reference Figure 1 , Figure 2 as well as Figure 12 In some embodiments, the dispensing and mounting module 3 includes a dispensing and mounting base 31 disposed on the frame 01, a dispensing and mounting X-axis module 32 disposed on the dispensing and mounting base 31, a dispensing Z-axis assembly 33 disposed on the dispensing and mounting X-axis, a mounting Z-axis assembly 34, and a material picking Z-axis assembly 35; the dispensing Z-axis assembly 33, the mounting Z-axis assembly 34, and the material picking Z-axis assembly 35 move along the dispensing and mounting X-axis module 32 between the transport module 2, the wafer feeding module 4, and the transfer adjustment module 5.

[0049] Specifically, the dispensing and mounting base 31 serves as the base for the dispensing and mounting module 3, providing a stable mounting platform and structural support for the various components within the module. The dispensing and mounting X-axis module 32 is used to realize the reciprocating motion of the dispensing Z-axis assembly 33, the mounting Z-axis assembly 34, and the material picking Z-axis assembly 35 in the X-axis direction.

[0050] The dispensing Z-axis assembly 33 is specifically designed for dispensing operations, responsible for precisely applying adhesive to the carrier board. It may include a precision dispensing valve and a Z-axis motion mechanism, which can employ a miniature ball screw or voice coil motor-driven Z-axis slide to achieve rapid valve lifting and precise adhesive volume control. The placement Z-axis assembly 34 is used to pick up filters from the transfer and adjustment module 5 and precisely place them onto the dispensed carrier board. It may include a vacuum nozzle or miniature gripper, and a ZR-axis motion mechanism. The ZR-axis motion mechanism includes a Z-axis motion mechanism and an R-axis motion mechanism disposed within the Z-axis motion mechanism. Specifically, the R-axis motion mechanism may be a rotary motor structure with a built-in attachment head. The vacuum nozzle or miniature gripper is disposed within the R-axis motion mechanism, allowing the ZR-axis motion mechanism to work with a vision recognition system to achieve precise alignment, adjustment, and placement of the filters. The pick-up Z-axis assembly 35 is used to pick up filters from the wafer feeding module 4. It may include a vacuum nozzle and a Z-axis motion mechanism.

[0051] The dispensing Z-axis assembly 33, the placement Z-axis assembly 34, and the material picking Z-axis assembly 35 move along the dispensing and placement X-axis module 32 between the transport module 2, the wafer feeding module 4, and the transfer adjustment module 5. The three can move as a whole or independently in the X-axis direction, thereby independently and flexibly approaching or entering different working areas such as the transport module 2, the wafer feeding module 4, and the transfer adjustment module 5.

[0052] Through the above technical solution, the dispensing Z-axis assembly 33, the placement Z-axis assembly 34, and the pick-up Z-axis assembly 35 inside the dispensing and placement module 3 can move flexibly between different working areas along the shared dispensing and placement X-axis module 32, enabling the three processes of dispensing, placement, and pick-up to operate in parallel or quasi-parallel. For example, when the dispensing Z-axis assembly 33 is dispensing on the carrier board, the pick-up Z-axis assembly 35 can simultaneously pick up the filter from the wafer feeding module 4, while the placement Z-axis assembly 34 can prepare to place the adjusted filter onto the carrier board. Compared with the traditional serial operation of a single actuator, this parallel operation can significantly reduce the waiting time between processes and greatly improve the overall efficiency and capacity of filter dispensing and placement.

[0053] In some embodiments, the dispensing and mounting module 3 further includes a wafer positioning component 36, a transfer station positioning component 37, and a carrier board positioning component 38 disposed on the dispensing and mounting base 31; the wafer positioning component 36 faces the wafer feeding module 4, the transfer station positioning component 37 faces the transfer adjustment module 5, and the carrier board positioning component 38 faces the mounting and conveying mechanism 23.

[0054] Specifically, the wafer positioning component 36 is a device used to accurately determine the position of the wafer in the wafer feeding module 4, providing a reference for the pick-up operation of the dispensing and mounting module 3. Specifically, the wafer positioning component 36 can be a vision recognition system that captures wafer images through an integrated camera and accurately calculates the wafer's coordinates and orientation information using image processing algorithms. Multiple wafer positioning components 36 are available, each corresponding to a different wafer worktable component 413. Similarly, the transfer station positioning component 37 is used to accurately determine the position of the transfer station in the transfer adjustment module 5, so that the dispensing and mounting module 3 can accurately place the filter on the transfer station and adjust the filter. The transfer station positioning component 37 can also be a vision recognition system. The carrier plate positioning component 38 is used to accurately determine the position of the carrier plate on the mounting conveyor mechanism 23, providing precise positioning for the dispensing and mounting operations of the dispensing and mounting module 3. It can also be a vision recognition system that calculates the precise position and orientation of the carrier plate by identifying feature points or edges on the carrier plate.

[0055] When the dispensing Z-axis assembly 33, the mounting Z-axis assembly 34, and the picking Z-axis assembly 35 move along the dispensing and mounting X-axis module 32 between different modules, the wafer positioning assembly 36 can ensure precise alignment when picking up the filter from the wafer feeding module 4, ensuring the accuracy of the picking action; the transfer station positioning assembly 37 can accurately lock the position of the transfer station in the transfer adjustment module 5, thereby ensuring the transfer accuracy of the filter after adjustment; the carrier plate positioning assembly 38 can accurately identify the real-time position of the carrier plate on the mounting conveyor mechanism 23, ensuring that the filter can be accurately attached to the predetermined area of ​​the carrier plate, so that dispensing, mounting, and picking actions can all be completed under high-precision reference, thereby improving the processing accuracy and processing quality of the device.

[0056] Reference Figure 1 , Figure 2 as well as Figure 13 In some embodiments, a curing module 7 is also included, which includes a plurality of UV lamps 71 disposed on the rack 01 and facing the mounting table 233.

[0057] Specifically, the curing module 7 refers to a device used to transform adhesive or other bonding agents from a liquid or semi-liquid state to a solid state through a physical or chemical reaction. Several UV lamps 71 in the curing module 7 are capable of emitting ultraviolet light of specific wavelengths to initiate the curing reaction of the photosensitive adhesive. Their specific number can be flexibly configured according to the size of the curing area, the type of adhesive, and the required curing efficiency.

[0058] By adding a curing module 7 to the filter dispensing and mounting device, and aligning several UV lamps 71 in this module towards the mounting table 233, the filter can be cured in situ after the dispensing and mounting processes are completed on the mounting table 233, without needing to transfer the carrier board from the mounting table 233 to other independent equipment. This effectively avoids the problem of filter displacement or detachment during subsequent transportation or unloading due to uncured adhesive, thereby improving the reliability and quality stability of the mounting process. Simultaneously, since the curing process is completed directly on the mounting table 233, additional handling steps and waiting time are reduced, further improving the continuity and efficiency of the entire processing flow.

[0059] The working principle of the filter dispensing and mounting device disclosed in this application is as follows: the carrier board is fed into the material box via the feeding module 1. The picking mechanism 21 picks up the carrier board through the picking X-axis module 212 and the picking hook block. Then, the picking mechanism 21 transports the carrier board to the mounting table 233 of the mounting conveyor mechanism 23. The mounting table 233 is initially located in the receiving space. The mounting table 233 temporarily fixes the carrier board by vacuum and transports the carrier board to the dispensing and mounting station near the dispensing and mounting module 3 via the three-axis module, ready to cooperate with the dispensing and mounting module 3 for dispensing and mounting.

[0060] Simultaneously, the wafer is fed into the wafer feeding module 4. The wafer feeding module 4, through the wafer transport Y-axis module 411 and wafer transport X-axis module 412 of the wafer transport mechanism 41, transports the wafer to the pick-up station near the dispensing and mounting module 3, ready to cooperate with the dispensing and mounting module 3 to pick up the filter. Subsequently, the wafer positioning assembly 36 positions the wafer, and the ejector pin mechanism 42, through the ejector pin Y-axis module 421 and slider structure 422, drives the ejector pin Z-axis module 423 to move to the corresponding wafer worktable assembly 413, and lifts the filter of the wafer at that location, causing the filter to be peeled off the wafer.

[0061] The Z-axis assembly 35 of the dispensing and mounting module 3 moves closer to and picks up the peeled-off filter, placing it on the adjustment block 53 of the transfer and adjustment module 5. When attaching multiple filters at once, taking four filters as an example, the Z-axis assembly 35 places the four filters sequentially onto the vacuum transfer stage assembly 52 along the X-axis. The vacuum transfer stage assembly 52 uses vacuum to limit the position of the filters, ensuring that the filters are arranged in sequence on the vacuum transfer stage assembly 52. ​​Subsequently, the transfer stage positioning assembly 37 observes and positions the filters in preparation for adjustment. Then, the adjusting block 53 moves under the drive of the transfer fine-tuning component 54. At this time, the vacuum transfer stage component 52 remains stationary. The adsorption force of the vacuum transfer stage component 52 on the filter can be adjusted as needed. The transfer stage fine-tuning component first drives the adjusting block 53 to move back and forth along the Y-axis, thereby driving the adjusting edge 532 to push the filter flat. Then, it drives the adjusting block 53 to move left and right along the X-axis, thereby driving the adjusting edge 532 to adjust the gap between the four filters. The fine-tuning is repeated in the order of first the Y-axis and then the X-axis until the filter position is adjusted to the preset position.

[0062] After the filter is adjusted to the preset position, the mounting Z-axis assembly 34 descends and presses against the upper surface of the force control test assembly 55. The reading of the force control test assembly 55 is observed, and the descent height of the mounting Z-axis assembly 34 is adjusted to adjust the bonding force. This calibrates the bonding force before mounting to prevent excessive bonding force from damaging the filter. The dispensing Z-axis moves to the scraper assembly 234 for cleaning, removing excess adhesive. Then, the mounting stage 233 moves to the dispensing position. The carrier plate positioning assembly 38 positions the carrier plate on the mounting stage 233, and the dispensing Z-axis assembly 33 descends along the Z-axis to apply adhesive to the carrier plate. After application, the dispensing Z-axis assembly 33 returns to its original position. The mounting Z-axis assembly 34, with the bonding force adjusted, moves the filter from the intermediate position to above the correction camera assembly 56 for observation and position correction. After position correction, the filter is moved to the mounting position, and the mounting Z-axis assembly 34 descends along the Z-axis to complete the filter mounting.

[0063] After mounting, the curing module 7 uses UV lamp 71 to cure the mounted filter. After curing, the mounting table 233 returns to the receiving space under the drive of the three-axis module and transports the mounted carrier board to the unloading mechanism 22. The unloading mechanism 22 transports the carrier board to the unloading module for unloading.

[0064] Exemplary embodiments of this disclosure have been specifically shown and described above. It should be understood that this disclosure is not limited to the detailed structures, arrangements, or implementations described herein; rather, this disclosure is intended to cover various modifications and equivalent arrangements contained within the spirit and scope of the appended claims.

Claims

1. A filter dispensing and mounting device, comprising a frame (01), characterized in that, It also includes a loading module (1), a transport module (2), a dispensing and mounting module (3), a wafer feeding module (4), a transfer and adjustment module (5), and a unloading module (6) disposed on the rack (01); the transport module (2) includes a picking mechanism (21), a unloading mechanism (22), and a mounting conveyor (23) disposed on the rack (01), the picking mechanism (21) and the unloading mechanism (22) are located on the same axis, and a receiving space is formed between the picking mechanism (21) and the unloading mechanism (22), the mounting... The conveying mechanism (23) is located in the accommodating space. The mounting conveying mechanism (23) includes a mounting table (233), which is close to or away from the accommodating space. The dispensing mounting module (3), the wafer feeding module (4), and the transfer adjustment module (5) are located on one side of the picking mechanism (21) and the unloading mechanism (22). When the mounting table (233) is away from the accommodating space, the mounting table (233) is close to the dispensing mounting module (3), the wafer feeding module (4), and the transfer adjustment module (5).

2. The filter dispensing and mounting device according to claim 1, characterized in that, The mounting conveying mechanism (23) includes a mounting conveying Y-axis module (231) disposed on the frame (01), a mounting conveying X-axis module (232) disposed on the mounting conveying Y-axis module (231), and a mounting conveying Z-axis module disposed on the mounting conveying X-axis module (232). The mounting table (233) is disposed on the mounting conveying Z-axis module.

3. The filter dispensing and mounting device according to claim 1, characterized in that, The transfer adjustment module (5) includes a transfer Y-axis module (51) disposed on the frame (01), a vacuum transfer stage assembly (52) disposed on the transfer Y-axis module (51), a plurality of adjustment blocks (53) disposed on the vacuum transfer stage assembly (52), and a transfer fine adjustment assembly (54) for driving the adjustment blocks (53); the adjustment blocks (53) are slidably connected to the vacuum transfer stage assembly (52), and the adjustment blocks (53) have an adjustment cavity (531) for accommodating the filter and an adjustment stop (532) for adjusting the position of the filter.

4. The filter dispensing and mounting device according to claim 3, characterized in that, The transfer adjustment module (5) further includes a force control test component (55), which is disposed on the vacuum transfer stage assembly (52) and faces the dispensing and mounting module (3).

5. The filter dispensing and mounting device according to claim 1, characterized in that, The dispensing and mounting module (3) includes a dispensing and mounting base (31) disposed on the frame (01), a dispensing and mounting X-axis module (32) disposed on the dispensing and mounting base (31), a dispensing Z-axis assembly (33) disposed on the dispensing and mounting X-axis, a mounting Z-axis assembly (34), and a material picking Z-axis assembly (35); the dispensing Z-axis assembly (33), the mounting Z-axis assembly (34), and the material picking Z-axis assembly (35) move along the dispensing and mounting X-axis module (32) between the transport module (2), the wafer feeding module (4), and the transfer adjustment module (5).

6. The filter dispensing and mounting device according to claim 5, characterized in that, The dispensing and mounting module (3) further includes a wafer positioning component (36), a transfer station positioning component (37), and a carrier board positioning component (38) disposed on the dispensing and mounting base (31); the wafer positioning component (36) faces the wafer feeding module (4), the transfer station positioning component (37) faces the transfer adjustment module (5), and the carrier board positioning component (38) faces the mounting and conveying mechanism (23).

7. A filter dispensing and mounting apparatus according to any one of claims 1-6, characterized in that, The wafer feeding module (4) includes a wafer transport mechanism (41) and a ejector mechanism (42); the wafer transport mechanism (41) includes a plurality of wafer stage assemblies (413), the ejector mechanism (42) is located below the wafer stage assembly (413), there are at least two ejector mechanisms (42), and each of the plurality of ejector mechanisms (42) faces one of the wafer stage assemblies (413).

8. The filter dispensing and mounting device according to claim 7, characterized in that, The wafer handling mechanism (41) includes a wafer handling Y-axis module (411) disposed on the rack (01) and a wafer handling X-axis module (412) disposed on the wafer handling Y-axis module (411), and a plurality of wafer worktable assemblies (413) are disposed on the wafer handling X-axis module (412).

9. A filter dispensing and mounting device according to claim 7, characterized in that, The ejector mechanism (42) includes an ejector Y-axis module (421) disposed on the frame (01), a slider structure (422) disposed on the ejector Y-axis module (421), and an ejector Z-axis module (423) disposed on the slider structure (422), the ejector Z-axis module (423) facing the wafer stage assembly (413).

10. A filter dispensing and mounting device according to claim 1, characterized in that, It also includes a curing module (7), which includes a plurality of UV lamps (71) disposed on the rack (01) and the plurality of UV lamps (71) facing the mounting table (233).

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