Electrostatic chucking device used in a substrate chucking process

Abstract

The utility model relates to the technical field of substrate processing equipment discloses a static adsorption device used in the process of substrate film pasting of steady adsorption, constitutes by support subassembly, pasting subassembly, flatten subassembly and static component, first motor drive transmission roll belt drive belt and convey substrate, second motor drive first threaded rod drive telescopic link and support block remove, cleaning roll contact substrate surface and remove with support block wipe and clean, rotate two -way threaded rod and adjust the sliding block spacing adaptation substrate size, take out film material from material box and place on the substrate, the console generates static electricity and transmits to the substrate vicinity through the power transmission pipe, makes substrate static adsorption film material, in the process of substrate movement, flatten pole is close to film material and substrate pasting place under the action of spring elasticity, flatten pasting surface along with substrate movement, and film pasting is completed.

Description

Technical Field

[0001] This utility model relates to the field of substrate processing equipment technology, specifically to an electrostatic adsorption device used in the process of substrate lamination with stable adsorption. Background Technology

[0002] In the processing and production of various substrates such as electronic substrates and metal substrates, film application is a key process to protect the substrate surface and prevent scratches or contamination. Especially for electronic substrates with high precision requirements, the quality of film application directly affects subsequent processing and product performance.

[0003] A search revealed existing technology (application number: CN202322095978.8), which describes "an electrostatic adsorption device." This utility model uses an electrostatically generated adsorption plate to adsorb dust and impurities in the air. An automatic cleaning device is installed on the outer frame, which causes a moving block to drive a scraper to scrape off the dust and impurities adsorbed on the adsorption plate, achieving the effect of cleaning the surface of the adsorption plate. This eliminates the need for manual cleaning of the adsorption plate, allowing it to remain clean even after long-term use. The automatic cleaning device includes a fixed plate, one side of which is fixedly connected to one side of the outer frame. A motor is fixedly connected to one side of the fixed plate. An electrostatic generator is installed inside the outer frame, and the positive and negative terminals of a power supply are fixedly connected to both sides of the outer frame.

[0004] However, while existing technologies use electrostatic adsorption plates to adsorb dust and impurities from the air, and feature an automatic cleaning device on the outer frame that moves a scraper to remove the adsorbed dust and impurities, thus cleaning the surface of the adsorption plate and eliminating the need for manual cleaning, ensuring the plate remains clean over long-term use, the automatic cleaning device, including a fixed plate with one side fixedly connected to one side of the outer frame and a motor fixedly connected to the other side, and an electrostatic generator inside the outer frame with the positive and negative terminals of a power supply fixedly connected to both sides of the outer frame, still have some shortcomings: most devices lack a dedicated substrate cleaning structure, allowing residual dust and impurities on the substrate surface to directly contact the membrane material, leading to localized protrusions or insufficient adhesion after membrane bonding, and making the membrane prone to detachment during later use; some devices, while having a cleaning function, use fixed brushes, which cannot adjust the cleaning range according to the substrate size, resulting in incomplete cleaning and still affecting the bonding effect. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing an electrostatic adsorption device for use in the process of applying a stable adsorption substrate film.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: an electrostatic adsorption device used in the process of applying film to a substrate, comprising: a support assembly disposed on the ground; an application assembly disposed on the support assembly; a flattening assembly disposed on the support assembly; and an electrostatic assembly disposed on the support assembly; wherein the application assembly comprises: a cleaning assembly disposed on the application assembly for cleaning the surface of the substrate before applying film.

[0007] As a further description of the above technical solution:

[0008] The mounting assembly further includes: a second motor, mounted on the support assembly; a first threaded rod, one end of which is fixedly connected to the output end of the second motor, and the other end of which is rotatably connected to the support assembly; a telescopic rod, one end of which is threaded to the first threaded rod and slidably connected to the support assembly; a support block, welded to the other end of the telescopic rod; a bidirectional threaded rod, rotatably connected to the support block; a guide rod, welded to the support block; and two sets of sliders, threaded to the bidirectional threaded rod and slidably connected to the guide rod.

[0009] As a further description of the above technical solution:

[0010] The cleaning assembly includes: a support column, one end of which is welded to a support block; a rotating rod, one end of which is rotatably connected to the other end of the support column; and a cleaning roller, rotatably connected to the other end of the rotating rod.

[0011] As a further description of the above technical solution:

[0012] The support assembly includes: a housing, disposed on the ground; a bracket, uniformly welded to the lower side of the housing; a conveying assembly, disposed on the housing; and a material box, disposed on the housing.

[0013] As a further description of the above technical solution:

[0014] The conveying assembly includes: a first motor mounted on the housing; two sets of conveying rollers, one set of which is fixedly connected to the output end of the first motor; and a belt slidably connected to the conveying rollers.

[0015] As a further description of the above technical solution:

[0016] The flattening assembly includes: a base, welded to the lower side of the material box; a flattening rod, one end of which is slidably connected to the base; and a spring, one end of which is welded to the base and the other end of which is welded to the flattening rod.

[0017] As a further description of the above technical solution:

[0018] The electrostatic component includes: a control console, mounted on a support assembly; and a power transmission pipe, with one end mounted on the control console and the other end mounted on the support assembly.

[0019] This utility model has the following beneficial effects:

[0020] The cleaning component of the mounting assembly moves with the support block via a cleaning roller, wiping the substrate surface. The support block's position can be adjusted via a second motor and a first threaded rod to accommodate cleaning ranges for substrates of different sizes. Compared to existing designs lacking a cleaning structure or with incomplete cleaning by fixed brushes, this design effectively removes dust and impurities from the substrate surface, preventing localized protrusions or insufficient film adhesion after bonding, reducing the risk of film detachment later, and improving the overall bonding quality. Attached Figure Description

[0021] Figure 1 This is a front view of an electrostatic adsorption device used in the process of applying a substrate film for stable adsorption, as proposed in this utility model.

[0022] Figure 2 This is a schematic diagram of the conveying component of an electrostatic adsorption device used in the process of applying a substrate film with stable adsorption, as proposed in this utility model.

[0023] Figure 3 This is a schematic diagram of the mounting assembly of an electrostatic adsorption device used in the substrate lamination process of the present invention.

[0024] Figure 4 This is a schematic diagram of the mounting assembly of an electrostatic adsorption device used in the substrate lamination process of the present invention.

[0025] Figure 5 An exploded view of the flattening component of the electrostatic adsorption device used in the substrate lamination process of this utility model.

[0026] Legend:

[0027] 1. Support assembly; 11. Housing; 12. Bracket; 13. Conveying assembly; 131. First motor; 132. Conveying roller; 133. Belt; 14. Material box; 2. Mounting assembly; 21. Second motor; 22. First threaded rod; 23. Telescopic rod; 24. Support block; 25. Bidirectional threaded rod; 26. Slider; 27. Guide rod; 28. Cleaning assembly; 281. Support column; 282. Rotating rod; 283. Cleaning roller; 3. Flattening assembly; 31. Base; 32. Flattening rod; 33. Spring; 4. Static control assembly; 41. Control console; 42. Power supply pipe. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The utility model will be further described in detail below with reference to the accompanying drawings.

[0030] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0031] Example 1:

[0032] like Figures 1 to 5 As shown in the figure, the electrostatic adsorption device used in the process of applying a substrate film in this embodiment includes: a support component 1, which is set on the ground; an application component 2, which is set on the support component 1; a flattening component 3, which is set on the support component 1; and an electrostatic component 4, which is set on the support component 1. The application component 2 includes: a cleaning component 28, which is set on the application component 2 and is used to clean the surface of the substrate before applying the film.

[0033] In this embodiment, the mounting component and the flattening component constitute an electrostatic adsorption device used in the process of applying a stable adsorption substrate film according to this application.

[0034] It should also be noted that the electrostatic adsorption device used in the substrate lamination process of this application can be a high-precision electrostatic adsorption lamination device for PCB electronic substrates, a damage-resistant electrostatic adsorption lamination device for flexible electronic substrates, or a wear-resistant film electrostatic adsorption lamination device for aluminum alloy metal substrates, etc. Figure 1 In this embodiment, the electrostatic adsorption device used in the process of applying a stable adsorption substrate film is described as a high-precision electrostatic adsorption film application device for PCB electronic substrates. Of course, other types of electrostatic adsorption devices used in the process of applying a stable adsorption substrate film can also adopt similar structures, which will not be described in detail below.

[0035] Understandable, Figure 1 This illustration only schematically shows some components of an electrostatic adsorption device used in the process of applying a stable adsorption substrate film. The actual shape, size, position, and structure of these components are not affected by the actual adsorption process. Figure 1 Due to limitations, an electrostatic adsorption device used in the process of applying a stable adsorption substrate film can also include, compared to... Figure 1 More or fewer parts.

[0036] It should also be understood that the first motor 131 and the second motor 21 were purchased from the market and are common knowledge in this field. They are only used and not modified, so the control method and circuit connection will not be described in detail.

[0037] In addition, in this embodiment, the mounting component 2 drives the cleaning component 28 to move, and the cleaning component 28 wipes and cleans the substrate surface.

[0038] Specifically, the mounting assembly 2 also includes: a second motor 21, mounted on the support assembly 1; a first threaded rod 22, one end of which is fixedly connected to the output end of the second motor 21, and the other end is rotatably connected to the support assembly 1; a telescopic rod 23, one end of which is threadedly connected to the first threaded rod 22 and slidably connected to the support assembly 1; a support block 24, welded to the other end of the telescopic rod 23; a bidirectional threaded rod 25, rotatably connected to the support block 24; a guide rod 27, welded to the support block 24; and two sets of sliders 26, threadedly connected to the bidirectional threaded rod 25 and slidably connected to the guide rod 27.

[0039] In this embodiment, the second motor 21 drives the first threaded rod 22 to rotate, thereby moving the telescopic rod 23 and the support block 24; rotating the bidirectional threaded rod 25 drives the two sets of sliders 26 to move in opposite directions along the guide rod 27.

[0040] Specifically, the cleaning component 28 includes: a support column 281, one end of which is welded to the support block 24; a rotating rod 282, one end of which is rotatably connected to the other end of the support column 281; and a cleaning roller 283, which is rotatably connected to the other end of the rotating rod 282.

[0041] In this embodiment, when the support block 24 moves, the cleaning roller 283 contacts the substrate surface and rotates synchronously with the support block 24 to wipe the substrate surface.

[0042] Specifically, the support component 1 includes: a housing 11, which is set on the ground; a bracket 12, which is uniformly welded to the lower side of the housing 11; a conveying component 13, which is set on the housing 11; and a material box 14, which is set on the housing 11.

[0043] In this embodiment, the conveying component 13 transports the substrate to the designated film application position, and the material box 14 stores the film material to be applied.

[0044] Specifically, the conveying assembly 13 includes: a first motor 131, mounted on the housing 11; two sets of conveying rollers 132, one set of which is fixedly connected to the output end of the first motor 131; and a belt 133, slidably connected to the conveying rollers 132.

[0045] With this configuration, the first motor 131 drives a set of conveyor rollers 132 to rotate, which in turn drives the belt 133 to move cyclically around the two sets of conveyor rollers 132. The belt 133 then drives the upper substrate to move.

[0046] Specifically, the flattening component 3 includes: a base 31, welded to the lower side of the material box 14; a flattening rod 32, one end of which is slidably connected to the base 31; and a spring 33, one end of which is welded to the base 31 and the other end of which is welded to the flattening rod 32.

[0047] During the film application process, the flattening rod 32 presses against the bonding area between the film and the substrate under the elastic force of the spring 33, and flattens the bonding surface as the substrate moves.

[0048] Specifically, the electrostatic component 4 includes: a control console 41, which is mounted on the support component 1; and a power transmission pipe 42, with one end mounted on the control console 41 and the other end mounted on the support component 1.

[0049] In this embodiment, the control console 41 generates static electricity and transmits it to the vicinity of the transmission component 13 through the power transmission pipe 42, so that the substrate surface is charged with static electricity and adsorbs the film material.

[0050] In actual use, the operator first turns on the second motor 21 to drive the first threaded rod 22 to rotate, causing the telescopic rod 23 to slide along the groove on the support assembly 1, sliding to above the material box 14. The control console 41 is turned on so that static electricity is conducted to the mounting assembly 2 through the power transmission pipe 42, adsorbing the material from inside the material box 14. The bidirectional threaded rod 25 is rotated to drive the slider 26 to slide along the guide rod 27, thereby controlling the adsorption of materials of different sizes to be mounted on substrates of different sizes. The base 31 is turned on to drive the flattening rod 32 to rotate, causing the spring 33 to slide. The substrate to be mounted is placed on the spring 33. The mounting assembly 2 is pressed down to drive the rotating rod 282 to rotate, causing the cleaning roller 283 to clean the dust on the substrate. After cleaning, the film is mounted. When the substrate passes through the flattening rod 32, the spring 33 contracts and the flattening rod 32 scrapes off the air bubbles.

[0051] Both the first motor 131 and the second motor 21 are electrically connected to the PLC controller, which is electrically connected to an external power supply. The PLC controller facilitates the power supply control of the electrical equipment, ensuring that the equipment can be powered on when needed, thus avoiding the situation where power cannot be supplied when power is required.

[0052] It should be noted that the controller can be a conventional known device that is controlled by a computer or other means. The detailed description of known functions and known components is omitted in the specific embodiments of this disclosure. In order to ensure the compatibility of the device, the operating methods used are consistent with the parameters of commercially available instruments.

[0053] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An electrostatic adsorption device used in the process of applying a substrate film for stable adsorption, characterized in that: include: Support component (1) is set on the ground; Mounting component (2) is mounted on support component (1); The flattening component (3) is mounted on the support component (1); An electrostatic component (4) is mounted on a support component (1); The mounting assembly (2) includes: A cleaning component (28) is disposed on the mounting component (2) for cleaning the surface of the substrate before it is coated.

2. The electrostatic adsorption device used in the substrate lamination process according to claim 1, characterized in that: The mounting assembly (2) also includes: The second motor (21) is mounted on the support assembly (1); The first threaded rod (22) is fixedly connected at one end to the output end of the second motor (21), and rotatably connected at the other end to the support assembly (1); The telescopic rod (23) is threaded at one end to the first threaded rod (22) and slidably connected to the support assembly (1); Support block (24) is welded to the other end of telescopic rod (23); A two-way threaded rod (25) is rotatably connected to a support block (24); The guide rod (27) is welded to the support block (24); The slider (26) is in two sets, threadedly connected to the bidirectional threaded rod (25) and slidably connected to the guide rod (27).

3. The electrostatic adsorption device used in the substrate lamination process according to claim 2, characterized in that: The cleaning component (28) includes: The support column (281) is welded at one end to the support block (24); The rotating rod (282) is rotatably connected at one end to the other end of the support column (281); The cleaning roller (283) is rotatably connected to the other end of the rotating rod (282).

4. The electrostatic adsorption device used in the substrate lamination process according to claim 3, characterized in that: The support component (1) includes: The outer casing (11) is set on the ground; The bracket (12) is evenly welded to the lower side of the outer shell (11); A transmission component (13) is disposed on the housing (11); Material box (14) is set on outer shell (11).

5. The electrostatic adsorption device used in the substrate lamination process according to claim 4, characterized in that: The transmission component (13) includes: The first motor (131) is mounted on the outer casing (11); The conveyor rollers (132) are in two sets, one of which is fixedly connected to the output end of the first motor (131); The belt (133) is slidably connected to the conveyor roller (132).

6. The electrostatic adsorption device used in the substrate lamination process according to claim 5, characterized in that: The flattening component (3) includes: The base (31) is welded to the lower side of the material box (14); A flattening rod (32) is slidably connected at one end to a base (31); The spring (33) is welded at one end to the base (31) and at the other end to the flattening rod (32).

7. The electrostatic adsorption device used in the substrate lamination process according to claim 6, characterized in that: The electrostatic component (4) includes: The console (41) is set on the support component (1); The power transmission pipe (42) is mounted on the control console (41) at one end and on the support assembly (1) at the other end.

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