A fixing device for sensor chip ribbonizer

Abstract

The utility model relates to chip fixing equipment technical field discloses a kind of fixing device for sensor chip strapping machine, including adsorption unit, the adsorption unit includes adsorption head, the adsorption head one end is equipped with first adsorption hole, the adsorption head is equipped with first elastic member in the end away from first adsorption hole, the first elastic member is equipped with fixing piece in the other end away from adsorption head, and the fixing piece is used to connect external driving device;In the utility model, the receiving plate of fixing unit is used as the initial bearing structure of chip, the preliminary positioning and fixing of chip are realized, the stable initial placement foundation for subsequent transfer is provided, and the displacement or falling of chip before transfer is avoided;The first adsorption hole of adsorption unit can adsorb the chip preliminarily fixed on receiving plate, and transfer it from initial position to the processing station required for strapping, replace manual or traditional mechanical clamping, and improve transfer efficiency.

Description

Technical Field

[0001] This utility model relates to the field of chip fixing equipment technology, and in particular to a fixing device for a sensor chip taping machine. Background Technology

[0002] With the rapid development of consumer electronics, industrial control, automotive electronics, and other fields, the demand for sensor chips has exploded. The tape and reel packaging process has become a crucial step connecting chip manufacturing and surface mount technology (SMT). Tape and reel packaging requires precisely fixing the sensor chip within the carrier tape grooves and then sealing it with a cover tape to ensure the chip's positional stability during transportation, storage, and subsequent SMT placement, preventing chip damage or displacement. This process places extremely high demands on the precision, stability, and compatibility of the "tape and reel machine fixing device."

[0003] The "chip fixing device for chip taping machine" disclosed in Chinese patent CN216413016U, although it achieves chip clamping and fixing through a fixing component composed of lead screw, motor, and slider, solves the chip breakage problem to a certain extent, still has significant technical limitations and cannot meet the high-precision and fragile taping requirements of sensor chips. This solution relies on mechanical clamping force to fix the chip, lacks an elastic buffer structure, and the clamping force is difficult to control precisely. For ultra-thin sensor chips with a thickness of less than 0.3mm, there is still a risk of pressure damage. It does not design a multi-dimensional adsorption path and only achieves fixing through clamping, which cannot cope with airflow disturbances or vibrations during chip transfer, and the probability of chip displacement is still relatively high. Utility Model Content

[0004] The purpose of this utility model is to solve the problems existing in the prior art by proposing a fixing device for a sensor chip taping machine.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A fixing device for a sensor chip taping machine includes an adsorption unit. The adsorption unit includes an adsorption head. One end of the adsorption head has a first adsorption hole. A first elastic element is provided at the end of the adsorption head away from the first adsorption hole. A fixing element is provided at the other end of the first elastic element away from the adsorption head. The fixing element is used to connect an external driving device. The ejection unit is a hollow structure, and an ejection pin is provided inside the ejection unit. One end of the ejection pin extends to the outside of the ejection unit. Third adsorption holes are provided on both sides of the ejection unit. Fixing units are installed on both sides of the ejection unit. The fixing unit includes an adsorption shell. One end of the adsorption shell forms a recess. A through hole is opened in the middle of the recess. Second adsorption holes are opened on both sides of the recess. A receiving plate is provided at one end of the adsorption shell. The receiving plate is used to fix the chip.

[0006] Preferably, a locking component is provided at one end of the ejector pin, and an elastic part is provided at the end of the locking component away from the ejector pin. The third suction hole is provided on both sides of the elastic part, and a driving device is installed on the side of the elastic part away from the locking component.

[0007] Preferably, the locking structure includes a base, a limiting plate is provided on the base, a locking hole is provided in the limiting plate through its upper and lower surfaces, and a locking ring is installed in the locking hole.

[0008] Preferably, the locking ring is a circular ring with a notch, and the surface of the limiting plate is provided with a threaded hole that communicates with the locking ring.

[0009] Preferably, the elastic part includes a compression spring, one end of which is connected to the inner wall of the ejection unit, and the other end is connected to the locking assembly.

[0010] Preferably, the driving device includes a groove formed at one end of the ejection unit, and an electric push rod is provided on one side of the ejection unit, with the driving end of the electric push rod movably disposed in the groove.

[0011] Preferably, a fourth adsorption hole is formed between the inner wall of the chute and the drive shaft of the electric push rod, and a connecting pipe is provided through the ejection unit. One end of the connecting pipe is connected to the fourth adsorption hole, and the other end is connected to an external negative pressure source.

[0012] Preferably, the receiving plate has an adhesive layer on the side closest to the chip.

[0013] Preferably, the ejector unit has a stop on the side away from the drive device, and the stop has a limiting hole, the size of which matches the size of the ejector pin.

[0014] Preferably, the adsorption unit and the fixing unit are arranged opposite to each other.

[0015] Compared with the prior art, the beneficial effects of this utility model are: In this invention, the receiving plate of the fixing unit serves as the initial support structure for the chip, achieving initial positioning and fixing of the chip, providing a stable initial placement foundation for subsequent transfer, and preventing the chip from shifting or falling off before transfer; the first adsorption hole of the adsorption unit can adsorb the chip initially fixed on the receiving plate and transfer it from its initial position to the processing station required for tape and reeling, replacing manual or traditional mechanical clamping and improving transfer efficiency. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of a fixing device for a sensor chip taping machine proposed in this utility model; Figure 2 This is a three-dimensional schematic diagram of the ejection unit of a fixing device for a sensor chip taping machine proposed in this utility model; Figure 3 This is a side view of the ejector unit of a fixing device for a sensor chip taping machine proposed in this utility model; Figure 4 This is a schematic diagram of a locking assembly for a sensor chip taping machine according to the present invention; Figure 5 This is a schematic diagram showing the connection between the locking ring and the ejector pin of a fixing device for a sensor chip taping machine proposed in this utility model.

[0017] In the diagram: 1. Adsorption unit; 2. Adsorption head; 3. First adsorption hole; 4. Elastic element; 5. Fixing element; 6. Ejection unit; 7. Ejection pin; 8. Third adsorption hole; 9. Fourth adsorption hole; 10. Connecting tube; 11. Adsorption shell; 12. Recessed part; 13. Through hole; 14. Second adsorption hole; 15. Receiving plate; 16. Chip; 17. Elastic part; 18. Driving device; 20. Locking assembly; 21. Base; 22. Limiting plate; 23. Locking hole; 24. Locking ring; 25. Threaded hole; 27. Compression spring; 28. Slide groove; 29. ​​Electric push rod; 30. Stop; 31. Limiting hole. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0019] Reference Figures 1-5 A fixing device for a sensor chip taping machine includes an adsorption unit 1, the adsorption unit 1 includes an adsorption head 2, one end of the adsorption head 2 is provided with a first adsorption hole 3, the adsorption head 2 is provided with a first elastic element 4 at the end away from the first adsorption hole 3, and the first elastic element 4 is provided with a fixing element 5 at the other end away from the adsorption head 2. The fixing element 5 is used to connect an external driving device 18. The ejection unit 6 is a hollow structure, and an ejection pin 7 is provided inside the ejection unit 6. One end of the ejection pin 7 extends to the outside of the ejection unit 6. Third adsorption holes 8 are provided on both sides of the ejection unit 6. Fixing units are installed on both sides of the ejection unit 6. The fixing unit includes an adsorption shell 11. One end of the adsorption shell 11 forms a recess 12. A through hole 13 is opened in the middle of the recess 12. Second adsorption holes 14 are opened on both sides of the recess 12. A receiving plate 15 is provided at one end of the adsorption shell 11. The receiving plate 15 is used to fix the chip 16.

[0020] The receiving plate 15 of the fixed unit serves as the initial bearing structure for the chip 16, achieving the initial positioning and fixing of the chip 16, providing a stable initial placement foundation for subsequent transfer, and preventing the chip 16 from shifting or falling off before transfer. The first adsorption hole 3 of the adsorption unit 1 can adsorb the chip 16 initially fixed on the receiving plate 15 and transfer it from the initial position to the processing station required for tape and reeling, replacing manual or traditional mechanical gripping and improving transfer efficiency. The first elastic element 4 of the adsorption unit 1 can buffer the contact force of the adsorption head 2 during the adsorption and transfer of the chip 16, so as to avoid damage to the sensor chip 16 by rigid contact (especially suitable for fragile sensor elements). The ejector pin 7 and hollow structure of the ejector unit 6 can assist the chip 16 when it is transferred from the receiving plate 15 to the processing station.

[0021] In an example of this application, a locking component 20 is provided at one end of the ejector pin 7, and an elastic part 17 is provided at the end of the locking component 20 away from the ejector pin 7. The third suction hole 8 is provided on both sides of the elastic part 17, and a driving device 18 is installed on the side of the elastic part 17 away from the locking component 20. The locking component 20 can fix the connection between the ejector pin 7 and the elastic part 17 to prevent the ejector pin 7 from shifting during movement; the elastic part 17 can buffer the impact of the ejector pin 7's movement to avoid hard contact damage to the chip 16 or the ejector pin 7 itself.

[0022] The third adsorption hole 8 is located on both sides of the elastic part 17. It can work with the fourth adsorption hole 9 to adsorb the periphery of the support plate before the ejector pin 7 is operated, further preventing the support plate from shifting.

[0023] The drive device 18 provides stable power to the ejector pin 7, and pushes the ejector pin 7 to eject the chip 16 in front of the adsorption unit 1.

[0024] In an example of this application, the locking structure includes a base 21, on which a limiting plate 22 is provided. The limiting plate 22 has a locking hole 23 extending through its upper and lower surfaces. A locking ring 24 is installed in the locking hole 23. The locking ring 24 is a circular ring with a notch. The surface of the limiting plate 22 has a threaded hole 25 that communicates with the locking ring 24. After the ejector pin 7 is inserted into the inner circumference of the locking ring 24, the ejector pin 7 can be fixed by inserting a bolt into the locking ring 24.

[0025] In an example of this application, the elastic part 17 includes a compression spring 27. One end of the compression spring 27 is connected to the inner wall of the ejection unit 6, and the other end is connected to the locking assembly 20. The elastic properties of the compression spring 27 can absorb the impact when the ejection pin 7 extends, avoiding hard contact damage to the chip 16. After the ejection action is completed, the compression spring 27 can drive the ejection pin 7 to reset through its own elastic force, ensuring the repeatability and stability of the ejection action.

[0026] In an example of this application, the drive device 18 includes a groove 28 formed at one end of the ejection unit 6. An electric push rod 29 is provided on one side of the ejection unit 6, and the drive end of the electric push rod 29 is movably disposed in the groove 28. The electric push rod 29 can provide a stable and adjustable driving force, and can control the ejection speed and stroke according to the working rhythm of the tape machine, adapt to the high-speed tape production requirements, reduce manual intervention, and improve work efficiency.

[0027] In an example of this application, a fourth adsorption hole 9 is formed between the inner wall of the slide 28 and the drive shaft of the electric push rod 29, and a connecting pipe 10 is provided through the ejection unit 6. One end of the connecting pipe 10 is connected to the fourth adsorption hole 9, and the other end is connected to an external negative pressure source. The fourth adsorption hole 9 is connected to the negative pressure source through the connecting pipe 10, which can adsorb the gap between the inner wall of the slide 28 and the drive shaft of the electric push rod 29, and is connected to the second adsorption hole 14 through the third adsorption hole 8 to adsorb the support plate.

[0028] In an example of this application, the receiving plate 15 has an adhesive layer on the side near the chip 16. The adhesive layer is made of silicone and can initially fix the chip 16 onto the receiving plate 15.

[0029] In an example of this application, the ejector unit 6 is provided with a stop 30 on the side away from the drive device 18. The stop 30 has a limiting hole 31. The size of the limiting hole 31 matches the size of the ejector pin 7. The limiting hole 31 of the stop 30 and the size of the ejector pin 7 can guide the protruding end of the ejector pin 7, prevent the ejector pin 7 from bending or deviating during long stroke movement, and ensure that the ejector pin 7 is always aligned with the preset position of the chip 16.

[0030] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A fixing device for a sensor chip taping machine, characterized in that: The device includes an adsorption unit (1), which includes an adsorption head (2). One end of the adsorption head (2) is provided with a first adsorption hole (3). A first elastic element (4) is provided at the end of the adsorption head (2) away from the first adsorption hole (3). A fixing element (5) is provided at the other end of the first elastic element (4) away from the adsorption head (2). The fixing element (5) is used to connect an external driving device (18). The ejection unit (6) is a hollow structure, and an ejection pin (7) is provided inside the ejection unit (6). One end of the ejection pin (7) extends to the outside of the ejection unit (6). A third adsorption hole (8) is provided on both sides of the ejection unit (6). A fixing unit is installed on both sides of the ejection unit (6). The fixing unit includes an adsorption shell (11). A recess (12) is formed at one end of the adsorption shell (11). A through hole (13) is opened in the middle of the recess (12). A second adsorption hole (14) is opened on both sides of the recess (12). A receiving plate (15) is provided at one end of the adsorption shell (11). The receiving plate (15) is used to fix the chip (16).

2. The fixing device for a sensor chip taping machine according to claim 1, characterized in that, The ejector pin (7) is provided with a locking component (20) at one end. The locking component (20) is provided with an elastic part (17) at the end away from the ejector pin (7). The third suction hole (8) is provided on both sides of the elastic part (17), and the elastic part (17) is provided with a driving device (18) on the side away from the locking component (20).

3. The fixing device for a sensor chip taping machine according to claim 2, characterized in that, The locking assembly (20) includes a base (21), a limiting plate (22) is provided on the base (21), and a locking hole (23) is provided in the limiting plate (22) through its upper and lower surfaces. A locking ring (24) is installed in the locking hole (23).

4. The fixing device for a sensor chip taping machine according to claim 3, characterized in that, The locking ring (24) is a circular ring with a notch, and the surface of the limiting plate (22) is provided with a threaded hole (25) that communicates with the locking ring (24).

5. The fixing device for a sensor chip taping machine according to claim 4, characterized in that, The elastic part (17) includes a compression spring (27), one end of which is connected to the inner wall of the ejection unit (6), and the other end is connected to the locking assembly (20).

6. The fixing device for a sensor chip taping machine according to claim 5, characterized in that, The drive device (18) includes a groove (28) opened at one end of the ejection unit (6), and an electric push rod (29) is provided on one side of the ejection unit (6), and the drive end of the electric push rod (29) is movably disposed in the groove (28).

7. A fixing device for a sensor chip taping machine according to claim 6, characterized in that, A fourth adsorption hole (9) is formed between the inner wall of the chute (28) and the drive shaft of the electric push rod (29), and a connecting pipe (10) is provided through the ejection unit (6). One end of the connecting pipe (10) is connected to the fourth adsorption hole (9), and the other end is connected to an external negative pressure source.

8. The fixing device for a sensor chip taping machine according to claim 7, characterized in that, The receiving plate (15) has an adhesive layer on the side near the chip (16).

9. A fixing device for a sensor chip taping machine according to claim 8, characterized in that, The ejector unit (6) has a stop (30) on the side away from the drive device (18), and a limiting hole (31) is provided on the stop (30), the size of which matches the size of the ejector pin (7).

10. A fixing device for a sensor chip taping machine according to claim 9, characterized in that, The adsorption unit (1) is arranged opposite to the fixing unit.

Images