A double-sided copper foil tearing apparatus for PCB

Abstract

The utility model relates to a kind of double-sided tear copper foil equipment for PCB, including machine table, the machine table is equipped with feeding area, tear copper foil area and discharging area, the feeding area and the discharging area all include carrier placement station, the side of the substrate carrier placement station is equipped with substrate positioning platform, the two sides of tear copper foil area are all connected with multi-axis mechanical arm by Y axis movement module, the end of the multi-axis mechanical arm is connected with substrate suction cup, an angle of the feeding area is equipped with ultrasonic film lifter, tear copper foil area includes two tear copper foil mechanisms, moving mechanism is equipped between two tear copper foil mechanisms, tear copper foil mechanism includes substrate adsorption platform and copper recovery tank, the side of the substrate adsorption platform and the copper recovery tank is connected with copper foil assembly by second Y axis movement module, the lower of the copper foil assembly is equipped with copper foil clamping assembly.The application is high in degree of automation, can automatically realize the layering of substrate and double-sided tear copper foil, greatly improve work efficiency.

Description

Technical Field

[0001] This utility model relates to the field of automation equipment technology, and in particular to a double-sided copper foil peeling device for PCBs. Background Technology

[0002] When a PCB substrate arrives, its surface is covered with a layer of copper foil to protect it from damage and contamination during transportation. The copper foil needs to be removed before use. Most common methods of removing copper foil rely on manual labor, which consumes a lot of manpower and is inefficient.

[0003] Patent No. CN2023233867587 discloses a copper foil tearing machine for removing copper foil from PCB carrier boards after lamination. The copper foil tearing machine includes a profile support, a support frame, an operating platform, a clamping mechanism, a vacuum adsorption platform, a retractable positioning mechanism, a linear guide rail, a copper foil tearing mechanism, a transmission mechanism, and a PLC controller. The support frame is located inside the profile support and has a groove at its top; the operating platform is located at the front end of the support frame; the clamping mechanism is located in the middle of the support frame; the vacuum adsorption platform is located at the top of the support frame; the retractable positioning mechanism is located outside the clamping mechanism; the linear guide rail is located below the groove; the copper foil tearing mechanism is connected to the linear guide rail; the transmission mechanism is connected to the copper foil tearing mechanism; and the PLC controller is connected to the operating platform, clamping mechanism, vacuum adsorption platform, retractable positioning mechanism, and transmission mechanism. The copper foil tearing machine requires the operator to first separate the copper foil on one side of the product and then place the product on the vacuum adsorption platform, which is inefficient and can only tear copper foil on one side. For products with copper foil on both sides, the product needs to be taken out and flipped over after one side is torn before the copper foil on the other side can be torn, which is cumbersome. Therefore, this utility model proposes a double-sided copper foil tearing device for PCB. Utility Model Content

[0004] The main objective of this invention is to provide a double-sided copper foil peeling device for PCBs to solve the problems mentioned in the background art.

[0005] This utility model achieves the above-mentioned objective through the following technical solution: A double-sided copper foil peeling device for PCBs includes a machine base, which is provided with a loading area, a copper foil peeling area, and a unloading area. Both the loading area and the unloading area include a carrier placement station. A substrate positioning platform is provided on one side of the substrate carrier placement station. Multi-axis robotic arms are connected to both sides of the copper foil peeling area via Y-axis moving modules. A substrate suction cup is connected to the end of each multi-axis robotic arm. An ultrasonic film lifting machine is provided in one corner of the loading area. The copper foil peeling area includes two copper foil peeling mechanisms. A transfer mechanism is provided between the two copper foil peeling mechanisms. Each copper foil peeling mechanism includes a substrate adsorption platform, a copper foil recycling box, and a copper foil lifting assembly connected to one side of the substrate adsorption platform via a second Y-axis moving module. A copper foil clamping assembly is provided below the copper foil lifting assembly and is connected to the second Y-axis moving module.

[0006] Preferably, the copper foil assembly includes a horizontally arranged support plate, on which a mounting plate is vertically mounted. A tape unwinding roller and a tape rewinding roller are located on the top of the front side of the mounting plate. The tape unwinding roller is wound with tape. A swing arm is rotatably connected to the mounting plate below the tape unwinding roller via a pin. The swing arm is V-shaped and includes a first section, a second section, and a third section. The connection between the first and second sections is rotatably connected to the mounting plate via a pin. The first section is connected to a drive assembly for rotating it. A movable rod is slidably connected to the third section via a guide sleeve perpendicular to its axis. One end is connected to a U-shaped clamp, and a pressure roller is connected to the inner side of the U-shaped clamp. A spring is sleeved on the movable rod, and the two ends of the spring are respectively connected to the U-shaped clamp and the guide sleeve. A first guide roller is provided on the left side of the tape unwinding roller, and a second guide roller is provided at a position slightly to the right below the first guide roller. A third guide roller and a fourth guide roller are respectively provided on both sides of the guide sleeve on the third section. A fifth guide roller is provided on the mounting plate to the right of the rotation point of the swing arm. The tape passes sequentially through the left side of the first guide roller, the right side of the second guide roller, the bottom of the third guide roller, the left side of the pressure roller, the top of the fourth guide roller, and the right side of the fifth guide roller before being wound onto the tape take-up roller.

[0007] Preferably, the drive assembly includes a slider slidably connected to the back of the mounting plate via a transverse slide rail. The back of the mounting plate is provided with an axially horizontally arranged servo motor. The output end of the servo motor is connected to a lead screw. The slider is provided with a screw hole that matches the lead screw. The lead screw passes through the slider and is threadedly engaged with the slider. A roller is connected to the front of the slider. The mounting plate is provided with an opening. The roller extends to the front from the opening. The first section is provided with a slot along its length. The roller is rotatably connected in the slot.

[0008] Preferably, the bottom left side of the support plate is provided with an L-shaped side plate, and the copper foil clamping assembly includes a gripper cylinder connected to the lower end face of the side plate. The gripper cylinder is located below the pressure roller, and the output end of the gripper cylinder is connected to two gripper fingers.

[0009] Preferably, the substrate positioning platform includes a positioning plate, and the lower end face of the positioning plate is provided with a first cylinder axially perpendicular to its periphery. The top rod of the first cylinder is connected to a horizontally arranged connecting rod. The upper end face of the connecting rod is provided with positioning wheels axially vertically arranged at both ends. The periphery of the positioning plate is provided with positioning wheel clearance openings.

[0010] The beneficial effects of this utility model are as follows: the ultrasonic film-lifting machine can achieve layering of copper foil at the corner of the substrate, avoiding the drawbacks of manual layering. The copper foil lifting assembly can peel off one corner of the layered copper foil. After the copper foil clamping assembly clamps the copper foil, the Y-axis moving module drives the copper foil clamping assembly away from the substrate, thereby tearing off the copper foil. There are two copper foil tearing mechanisms. The transfer mechanism and the multi-axis robotic arm can cooperate to automatically flip the substrate, thereby realizing double-sided copper foil tearing of the substrate, which greatly improves work efficiency. Attached Figure Description

[0011] Figure 1 This is a top view of a double-sided copper foil peeling device for PCBs, as shown in the example.

[0012] Figure 2 This is a schematic diagram of the copper foil tearing mechanism.

[0013] Figure 3 This is a schematic diagram of the copper foil tearing assembly.

[0014] Figure 4 This is a schematic diagram of the substrate positioning platform structure.

[0015] The numbers in the diagram represent: 1. Machine base; 2. Loading area; 3. Copper foil tearing area; 4. Unloading area; 5. Carrier placement station; 6. Substrate positioning platform; 7. Y-axis moving module; 8. Multi-axis robotic arm; 9. Substrate suction cup; 10. Ultrasonic film lifting machine; 11. Copper foil tearing mechanism; 12. Transfer mechanism; 13. XYZ axis moving module; 14. Substrate adsorption platform; 15. Copper foil recycling box; 16. Second Y-axis moving module; 17. Copper foil lifting assembly; 18. Copper foil clamping assembly; 19. Support plate; 20. Mounting plate; 21. Tape unwinding roller; 22. Tape winding roller; 23. Swing arm; 24. First section; 25. Second section; 26. Third section; 27. Drive assembly; 28. Guide sleeve; 29. ​​Movable rod; 30. U-shaped clamp; 31. Pressure roller; 32. Spring; 33. First guide roller; 34. Second guide roller; 35. Third guide roller; 36. Fourth guide roller; 37. Fifth guide roller; 38. Slider; 39. Lead screw; 40. Roller; 41. Slot; 42. L-shaped side plate; 43. Gripper cylinder; 44. Gripper finger; 45. Copper foil gripping assembly; 46. Rotary cylinder; 47. Second gripper cylinder; 48. Second gripper finger; 49. Positioning plate; 50. First cylinder; 51. Connecting rod; 52. Positioning wheel; 53. Positioning wheel clearance groove; 54. Rotary lifting cylinder; 55. Pressure rod. Detailed Implementation

[0016] The present invention will be further described in detail below with reference to specific embodiments.

[0017] Example: like Figure 1 and Figure 2As shown, this utility model discloses a double-sided copper foil peeling device for PCBs, comprising a machine base 1. The machine base 1 is provided with a loading area 2, a copper foil peeling area 3, and a unloading area 4. Both the loading area 2 and the unloading area 4 include a carrier placement station 5, where a trolley is parked. A material frame for placing substrates is installed on the trolley. A substrate positioning platform 6 is provided on one side of the substrate carrier placement station 5. Multi-axis robotic arms 8 are connected to both sides of the copper foil peeling area 3 via Y-axis moving modules 7. The ends of the multi-axis robotic arms 8 are connected to substrate suction cups 9. An ultrasonic film lifting machine 10 is provided at one corner of the loading area 2. The copper foil peeling area 3 includes two copper foil peeling mechanisms 11. A transfer mechanism 12 is provided between the copper foil tearing mechanisms 11. The transfer mechanism 12 includes an XYZ axis moving module 13 located between the two copper foil tearing mechanisms 11. A substrate suction cup 9 is connected to the XYZ axis moving module 13. The copper foil tearing mechanism 11 includes a substrate adsorption platform 14 and a copper foil recycling box 15. The substrate adsorption platform 14 has an inner cavity and a vacuum suction hole on the table surface. The inner cavity is connected to a vacuum pump through a pipe. A copper foil lifting assembly 17 is connected to one side of the substrate adsorption platform 14 and the copper foil recycling box 15 through a second Y-axis moving module 16. A copper foil clamping assembly 18 is provided below the copper foil lifting assembly 17 to transport the trolley containing the substrate to the carrier placement station 5. The Y-axis moving module 7 drives the multi-axis robotic arm 8 to move along the Y-axis. The multi-axis robotic arm 8 uses the substrate suction cup 9 to pick up and transport the substrate from the trolley to the substrate positioning platform 6 for positioning. After positioning, the multi-axis robotic arm 8 picks up the substrate and sends one corner of the substrate to the ultrasonic film-forming machine 10. The ultrasonic film-forming machine 10 separates the copper foil at the corner of the substrate from the substrate. The multi-axis robotic arm 8 then transports the substrate to the substrate adsorption platform 14, which holds the substrate. The second Y-axis moving module 16 drives the copper foil lifting assembly 17 to move above the substrate, and the copper foil lifting assembly 17 lifts the copper foil... One corner is lifted, the copper foil clamping assembly 18 clamps the copper foil, the copper foil clamping assembly 18 is driven away from the substrate, thereby peeling off the copper foil on one side of the substrate. The transfer mechanism 12 picks up the copper foil and sends it to the copper foil tearing mechanism 11 on the other side. Another multi-axis robotic arm 8 picks up the lower end face of the substrate. The transfer mechanism 12 releases the substrate. The multi-axis robotic arm 8 rotates the substrate 180° and then places it on another substrate adsorption platform 14, thereby flipping the substrate. This allows the copper foil tearing mechanism 11 on the other side to tear the copper foil on the other side of the substrate, thus achieving double-sided copper foil tearing of the substrate. After the copper foil is torn, the multi-axis robotic arm 8 sends the substrate to the material frame of the trolley in the unloading area 4.

[0018] The copper foil assembly 17 includes a horizontally arranged support plate 19, on which a mounting plate 20 is vertically mounted. A tape unwinding roller 21 and a tape take-up roller 22 are located on the top of the front side of the mounting plate 20. The tape unwinding roller 21 is wound with tape. A swing arm 23 is rotatably connected to the mounting plate 20 below the tape unwinding roller 21 via a pin. The swing arm 23 is V-shaped and includes a first segment 24, a second segment 25, and a third segment 26. The connection between the first segment 24 and the second segment 25 is rotatably connected to the mounting plate 20 via a pin. The first segment 24 is connected to a drive mechanism. The rotating drive assembly 27 has a movable rod 29 slidably connected to the third segment 26 via a guide sleeve 28 perpendicular to its axis. One end of the movable rod 29 is connected to a U-shaped clamp 30, and a pressure roller 31 is connected to the inner side of the U-shaped clamp 30. A spring 32 is sleeved on the movable rod 29, and the two ends of the spring 32 are respectively connected to the U-shaped clamp 30 and the guide sleeve 28. A first guide roller 33 is provided on the left side of the tape unwinding roller 21, and a second guide roller 34 is provided at a position slightly to the right below the first guide roller 33. A third guide roller 35 and a fourth guide roller are respectively provided on both sides of the guide sleeve 28 on the third segment 26. 36. A fifth guide roller 37 is provided on the mounting plate 20 to the right of the rotation point of the swing arm 23. The tape passes sequentially through the left side of the first guide roller 33, the right side of the second guide roller 34, below the third guide roller 35, the left side of the pressure roller 31, above the fourth guide roller 36, and the right side of the fifth guide roller 37 before being wound onto the tape take-up roller 22, with the adhesive side of the tape facing outwards. The driving assembly 27 drives the swing arm 23 to rotate counterclockwise, thereby driving the pressure roller 31 to press the tape down onto the copper foil. The Y-axis moving module 7 drives the copper foil lifting assembly 17 to move back and forth, thereby pulling up the copper foil through the adhesiveness of the tape. After the foil is separated from the substrate, the driving component 27 drives the swing arm 23 to reset, and then the tape at the pressure roller 31 peels off one corner of the copper foil. After the corner of the copper foil is peeled off, the copper foil clamping component 18 clamps the corner of the copper foil. The Y-axis moving module 7 drives the copper foil clamping component 18 away from the substrate, thereby tearing off the copper foil. At one corner of the substrate adsorption platform 14 on the machine, a pressure rod 55 is connected to the rotating lifting cylinder 54. After the copper foil clamping component 18 clamps the corner of the copper foil, the rotating lifting cylinder 54 drives the pressure rod 55 to press down on one corner of the substrate to prevent the substrate from being pulled down when tearing the copper foil.

[0019] The drive assembly 27 includes a slider 38 slidably connected to the back of the mounting plate 20 via a transverse slide rail. A servo motor is axially horizontally positioned on the back of the mounting plate 20. A lead screw 39 is connected to the output end of the servo motor. The slider 38 has a threaded hole matching the lead screw 39. The lead screw 39 passes through the slider 38 and is threadedly engaged with it. A roller 40 is connected to the front of the slider 38. The mounting plate 20 has an opening, and the roller 40 extends from the opening to the front. A slot 41 along the length of the first segment 24 is provided. The roller 40 is rotatably connected within the slot 41. The servo motor drives the lead screw 39 to rotate, thereby driving the slider 38 to slide circumferentially. The slider 38 pushes the inner wall of the slot 41 through the roller 40, thereby driving the swing arm 23 to rotate. The swing arm 23 rotates counterclockwise, thereby causing the pressure roller 31 to press down onto the copper foil on the substrate.

[0020] The support plate 19 has an L-shaped side plate 42 at its bottom left side. The copper foil clamping assembly 18 includes a clamping cylinder 43 connected to the lower end face of the side plate. The clamping cylinder 43 is located below the pressure roller 31. The output end of the clamping cylinder 43 is connected to two clamping fingers 44. In the initial state, the two clamping fingers 44 are separated, and the pressure roller 31 is pressed down onto the copper foil between the two clamping fingers. After the copper foil is lifted, the clamping cylinder 43 drives the clamping fingers 44 to clamp the copper foil, thereby facilitating the subsequent tearing of the copper foil.

[0021] A copper foil gripping assembly 45 is provided on one side of the copper foil recycling bin 15 on the machine base 1. The copper foil gripping assembly 45 includes a horizontally axially arranged rotary cylinder 46. The rotating end of the rotary cylinder 46 is connected to a second gripper cylinder 47, and the output end of the second gripper cylinder 47 is connected to a second gripper finger 48. When the Y-axis moving module 7 drives the copper foil tearing mechanism 11 to tear off the copper foil before it is completely removed (a corner of the copper foil is still attached), the rotary cylinder 46 drives the second gripper cylinder 47 to rotate upwards. The second gripper cylinder 47 drives the second gripper finger 48 to clamp the unremoved corner of the copper foil. The gripper cylinder 43 drives the gripper finger 44 to release the torn corner of the copper foil. The Y-axis moving module 7 drives the copper foil tearing mechanism 11 to continue moving away from the substrate, so that the torn corner of the copper foil is completely removed. The rotary pneumatic drive drives the second gripper to rotate, thereby completely tearing off the copper foil. The second gripper cylinder 47 drives the second gripper finger 48 to release the copper foil, and the torn copper foil falls into the copper foil recycling box 15.

[0022] The substrate positioning platform 6 includes a positioning plate 49. The lower end face of the positioning plate 49 is provided with a first cylinder 50 axially perpendicular to its periphery. The top rod of the first cylinder 50 is connected to a horizontally arranged connecting rod 51. The upper end face of the connecting rod 51 is provided with two axially vertically arranged positioning wheels 52. The periphery of the positioning plate 49 is provided with positioning wheel clearance openings 53.

[0023] The above descriptions are merely some embodiments of this utility model. For those skilled in the art, various modifications and improvements can be made without departing from the inventive concept of this utility model, and all such modifications and improvements fall within the protection scope of this utility model.

Claims

1. A double-sided copper foil peeling device for PCBs, the PCB comprising a substrate, characterized in that: The double-sided copper foil tearing equipment includes a machine base, which is provided with a feeding area, a copper foil tearing area, and a unloading area. Both the feeding area and the unloading area include a carrier placement station. A substrate positioning platform is provided on one side of the substrate carrier placement station. Multi-axis robotic arms are connected to both sides of the copper foil tearing area via Y-axis moving modules. The ends of the multi-axis robotic arms are connected to substrate suction cups. An ultrasonic film lifting machine is provided in one corner of the feeding area. The copper foil tearing area includes two copper foil tearing mechanisms. A transfer mechanism is provided between the two copper foil tearing mechanisms. Each copper foil tearing mechanism includes a substrate adsorption platform, a copper foil recycling box, and a copper foil lifting assembly connected to one side of the substrate adsorption platform via a second Y-axis moving module. A copper foil clamping assembly is provided below the copper foil lifting assembly and is connected to the second Y-axis moving module.

2. The double-sided copper foil peeling device for PCBs according to claim 1, characterized in that: The copper foil assembly includes a horizontally arranged support plate, on which a mounting plate is vertically mounted. A tape unwinding roller and a tape take-up roller are located on the top front of the mounting plate. The tape unwinding roller is wound with tape. A swing arm is rotatably connected to the mounting plate below the tape unwinding roller via a pin. The swing arm is V-shaped and includes a first section, a second section, and a third section. The connection between the first and second sections is rotatably connected to the mounting plate via a pin. The first section is connected to a drive assembly for rotating it. A movable rod is slidably connected to the third section via a guide sleeve perpendicular to its axis. One end of the movable rod... A U-shaped clamp is attached, and a pressure roller is connected to the inner side of the U-shaped clamp. A spring is sleeved on the movable rod, and the two ends of the spring are respectively connected to the U-shaped clamp and the guide sleeve. A first guide roller is provided on the left side of the tape unwinding roller, and a second guide roller is provided at a position slightly to the right below the first guide roller. A third guide roller and a fourth guide roller are respectively provided on both sides of the guide sleeve on the third section. A fifth guide roller is provided on the mounting plate to the right of the rotation point of the swing arm. The tape passes sequentially through the left side of the first guide roller, the right side of the second guide roller, the bottom of the third guide roller, the left side of the pressure roller, the top of the fourth guide roller, and the right side of the fifth guide roller before being wound onto the tape take-up roller.

3. The double-sided copper foil peeling device for PCBs according to claim 2, characterized in that: The drive assembly includes a slider slidably connected to the back of the mounting plate via a transverse slide rail. The back of the mounting plate is provided with an axially horizontally arranged servo motor. The output end of the servo motor is connected to a lead screw. The slider is provided with a screw hole that matches the lead screw. The lead screw passes through the slider and is threadedly engaged with the slider. A roller is connected to the front of the slider. The mounting plate is provided with an opening. The roller extends to the front from the opening. The first section is provided with a slot along its length. The roller is rotatably connected in the slot.

4. The double-sided copper foil peeling device for PCBs according to claim 3, characterized in that: The support plate has an L-shaped side plate at the bottom left side. The copper foil clamping assembly includes a gripper cylinder connected to the lower end face of the side plate. The gripper cylinder is located below the pressure roller, and the output end of the gripper cylinder is connected to two gripper fingers.

5. A double-sided copper foil peeling device for PCBs according to claim 1, characterized in that: The substrate positioning platform includes a positioning plate. The lower end face of the positioning plate is provided with a first cylinder axially perpendicular to its periphery. The top rod of the first cylinder is connected to a horizontally arranged connecting rod. The upper end face of the connecting rod is provided with positioning wheels axially vertically arranged at both ends. The periphery of the positioning plate is provided with positioning wheel clearance openings.

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