Multi-attitude chip placement device

Abstract

The utility model relates to chip tray arranging technical field, specifically disclose a multi -posture chip tray arranging equipment, include: tray supply module group, including tray supply bin, tray recycling bin and tray taking -placing manipulator, tray reciprocating conveying module group is used for sending out and back sending chip tray, carrier supply module group is used for supplying empty chip carrier, carrier rotary conveying module group is used for receiving the chip carrier that carrier supply module group sent out, and makes chip carrier rotate around vertical axis, tray manipulator is used for taking out chip from tray reciprocating conveying module group, and places into the chip carrier after rotating and adjusting position to carrier rotary conveying module group. The utility model provides a multi -posture chip tray arranging equipment, can effectively solve the problem that present chip tray arranging equipment can not realize chip multi -posture tray arranging.

Description

Technical Field

[0001] This utility model relates to the field of chip stacking technology, and in particular to a multi-pose chip stacking device. Background Technology

[0002] In the later stages of chip manufacturing, after testing, the chips are usually placed in a general transport tray and then sorted to be transferred to a dedicated chip carrier for subsequent packaging, testing, or transportation.

[0003] Currently, most chip placement equipment on the market uses robotic arms or suction nozzles combined with vision positioning to automate the transfer of chips from transport trays to chip carriers. However, these devices have significant limitations when dealing with production scenarios with special placement process requirements. For example, some processes require chips to be placed in an alternating rotation or staggered arrangement within the carrier. For instance, in the same chip carrier, the first row of chips might be placed in the normal orientation (upright), while the second row needs to be rotated 180° (reverse) to meet specific requirements in subsequent processes such as chip spacing, thermal management, or electrical performance testing. Existing chip placement equipment typically only supports chip picking and placement in a single direction, making it difficult to achieve multi-position staggered placement.

[0004] Therefore, existing chip placement equipment needs to be improved to solve the problem that it cannot achieve multi-position chip placement.

[0005] The information disclosed in this background section is included only to enhance the understanding of the context of this disclosure, and therefore may contain information that does not constitute prior art known to those skilled in the art. Utility Model Content

[0006] One objective of this invention is to provide a multi-position chip stacking device that can effectively solve the problem that existing chip stacking devices cannot achieve multi-position chip stacking.

[0007] To achieve the above objectives, this utility model provides a multi-pose chip stacking device, comprising:

[0008] The beneficial effects of this utility model are as follows: It provides a multi-pose chip stacking device, the working process of which is as follows:

[0009] S1A: The pallet pick-and-place robot of the pallet supply module first takes out a fully loaded chip pallet from the pallet supply bin, and then places the fully loaded chip pallet onto the pallet reciprocating conveyor module.

[0010] Subsequently, the pallet reciprocating conveyor module sends the fully loaded chip pallet out from the pallet pick-and-place robot and into the working area of ​​the tray-stacking robot;

[0011] S1B: Simultaneously with S1A, the carrier supply module begins supplying an empty chip carrier, which is then fed into the carrier rotary conveyor module.

[0012] After receiving the chip carrier, the carrier rotation and conveying module rotates the chip carrier around the vertical axis to adjust its orientation.

[0013] S2: The chip-loading robot then removes the chip from the fully loaded chip tray on the reciprocating conveyor module and places the chip into the chip carrier after it has been rotated and positioned by the carrier rotary conveyor module.

[0014] S3: After the tray is placed, the tray reciprocating conveyor module will send the empty chip tray back to the tray picking and placing robot, and the tray picking and placing robot will then put the empty chip tray back into the tray recycling bin.

[0015] Therefore, the multi-position chip stacking device provided by this utility model can effectively solve the problem that existing chip stacking devices cannot achieve multi-position chip stacking. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 A schematic diagram of the front structure of the multi-pose chip stacking device provided in the embodiment;

[0018] Figure 2 This is a schematic diagram of the pallet supply and receiving module provided in the embodiment;

[0019] Figure 3 This is a schematic diagram of the structure of the pallet reciprocating conveying module provided in the embodiment;

[0020] Figure 4 A schematic diagram of the vehicle supply module provided in the embodiment;

[0021] Figure 5 A schematic diagram of the transverse push assembly provided in the embodiment;

[0022] Figure 6 This is a schematic diagram of the structure of the vehicle rotation conveying module provided in the embodiment;

[0023] Figure 7 A schematic diagram of the chip alignment and rotation platform provided in this embodiment;

[0024] Figure 8 This is a schematic diagram of the back structure of the multi-pose chip stacking device provided in the embodiment.

[0025] In the picture:

[0026] 100. Vehicle cargo box;

[0027] 1. Pallet feeding and receiving module; 101. Pallet feeding bin; 102. Pallet recycling bin; 103. Pallet picking and placing robot;

[0028] 2. Pallet reciprocating conveyor module; 201. Pallet carrying platform; 202. Pallet platform direct drive mechanism;

[0029] 3. Carrier supply module; 301. Double-layer support; 3011. Upper conveyor belt; 3012. Lower conveyor belt; 302. Material box transfer robot; 303. Horizontal push assembly; 3031. Horizontal push plate; 3031a. Rack and pinion section; 3032. Push plate rotary drive mechanism; 304. Material box supply and receiving lifting platform;

[0030] 4. Vehicle rotating conveyor module; 401. Vehicle rotating platform; 402. Vehicle platform direct drive mechanism;

[0031] 5. Plate-stacking robotic arm;

[0032] 6. Chip alignment and rotation platform;

[0033] 701. Vehicle docking platform; 702. Direct drive mechanism for docking platform. Detailed Implementation

[0034] In this utility model, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of this utility model. The term "embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment, nor does it specifically limit its independence or connection with other embodiments. In principle, in this utility model, as long as there are no technical contradictions or conflicts, the technical features mentioned in each embodiment can be combined in any way to form corresponding implementable technical solutions.

[0035] Unless otherwise defined, the technical terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains; the use of related terms herein is merely for the purpose of describing particular embodiments and is not intended to limit the invention.

[0036] In the description of this utility model, the term "and / or" is used to describe the logical relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A exists, B exists, and A and B exist simultaneously. Additionally, the character " / " generally indicates that the preceding and following objects have an "or" logical relationship.

[0037] In this invention, terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any actual quantity, hierarchy, or order between these entities or operations.

[0038] Without further limitations, the use of terms such as “comprising,” “including,” “having,” or other similar expressions in this invention is intended to cover non-exclusive inclusion, which does not exclude the presence of additional elements in a process, method, or product that includes the stated elements, such that a process, method, or product that includes a series of elements may include not only those defined elements but also other elements not expressly listed, or elements inherent to such a process, method, or product.

[0039] Similar to the understanding in the Examination Guidelines, in this utility model, expressions such as "greater than," "less than," and "exceeding" are understood to exclude the stated number; expressions such as "above," "below," and "within" are understood to include the stated number. Furthermore, in the description of the embodiments of this utility model, "multiple" means two or more (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups" and "multiple times," unless otherwise explicitly specified.

[0040] In the description of the embodiments of this utility model, the space-related expressions used, such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "vertical," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicate the orientation or positional relationship based on the orientation or positional relationship shown in the specific embodiments or drawings. They are only for the convenience of describing the specific embodiments of this utility model or for the reader's understanding, and do not indicate or imply that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this utility model.

[0041] Unless otherwise expressly specified or limited, the terms "installation," "connection," "linking," "fixing," and "setting," as used in the description of the embodiments of this utility model, should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two components or the interaction between two components. For those skilled in the art to which this utility model pertains, the specific meaning of the above terms in the embodiments of this utility model can be understood according to the specific circumstances.

[0042] The direct drive mechanism in this invention can be a linear motor, a cylinder, a hydraulic cylinder, or a motor lead screw and slider assembly, etc.; the rotary drive mechanism can be a servo motor, a stepper motor, or a rotary cylinder, etc.

[0043] See Figures 1-8 This embodiment provides a multi-pose chip stacking device, including:

[0044] The pallet supply and receiving module 1 includes a pallet feeding bin 101, a pallet recycling bin 102, and a pallet picking and placing robot 103 for taking out a fully loaded chip pallet from the pallet feeding bin 101 and putting an empty chip pallet back into the pallet recycling bin 102.

[0045] The pallet reciprocating conveyor module 2 is used to send a fully loaded chip pallet out from the pallet pick-and-place robot 103 and to send an empty chip pallet back to the pallet pick-and-place robot 103.

[0046] The carrier supply module 3 is used to supply unloaded chip carriers;

[0047] The carrier rotation conveying module 4 is used to receive the chip carrier sent out by the carrier supply module 3 and to rotate the chip carrier around a vertical axis.

[0048] The tray-mounting robot 5 is used to remove chips from the tray reciprocating conveying module 2 and place them into the chip carrier after being rotated and positioned by the carrier rotary conveying module 4.

[0049] The multi-pose chip stacking device provided in this embodiment operates as follows (S1A-S3):

[0050] S1A: The pallet picking and placing robot 103 of the pallet feeding module 1 first takes out a fully loaded chip pallet from the pallet feeding bin 101, and then places the fully loaded chip pallet on the pallet reciprocating conveying module 2.

[0051] Subsequently, the pallet reciprocating conveyor module 2 sends the fully loaded chip pallet out from the pallet pick-and-place robot 103 and into the working area of ​​the tray-stacking robot 5.

[0052] In this embodiment, the pallet reciprocating conveying module 2 includes a pallet carrying platform 201 and a pallet platform direct drive mechanism 202 that drives the pallet carrying platform 201 to reciprocate between the pallet slab manipulator 5 and the pallet pick-and-place manipulator 103.

[0053] S1B: Simultaneously with S1A, the carrier supply module 3 begins to supply an empty chip carrier, which is then fed into the carrier rotation conveyor module 4.

[0054] After receiving the chip carrier, the carrier rotation conveyor module 4 rotates the chip carrier around the vertical axis to adjust its orientation.

[0055] In this embodiment, the vehicle supply module 3 includes:

[0056] A double-layer support 301 is used to load the carrier box 100 of the chip carrier. The double-layer support 301 includes an upper conveyor belt 3011 for conveying the fully loaded carrier box 100, and a lower conveyor belt 3012 located below the upper conveyor belt 3011 for conveying the empty carrier box 100; wherein the conveying directions of the two conveyor belts are opposite.

[0057] Material box transfer robot 302 is located at the discharge end of the upper conveyor belt 3011 and is used to receive the fully loaded carrier material box 100 sent out by the upper conveyor belt 3011 and send the empty carrier material box 100 back to the lower conveyor belt 3012.

[0058] A horizontal push assembly 303 is located on the side of the material box transfer robot 302 away from the tray robot 5. It is used to push the chip carrier in the carrier material box 100 held by the material box transfer robot 302 laterally out of the carrier material box 100 so that the carrier material box 100 enters the carrier rotary conveying module 4.

[0059] The material box supply and receiving lifting platform 304 is located at the feeding end of the upper conveyor belt 3011. It is used to rise to be flush with the upper conveyor belt 3011 and transport the fully loaded vehicle material box 100 to the upper conveyor belt 3011, and to descend to be flush with the lower conveyor belt 3012 and retrieve the empty vehicle material box 100 sent out by the lower conveyor belt 3012.

[0060] Furthermore, the lateral push assembly 303 includes:

[0061] A transverse push plate 3031, wherein a rack portion 3031a is provided on the side of the transverse push plate 3031;

[0062] The push plate rotary drive mechanism 3032 has its drive end connected to the rack part 3031a via a gear assembly, and is used to drive the transverse push plate 3031 to reciprocate.

[0063] Specifically, the vehicle supply module 3 operates as follows:

[0064] ① First, the material box feeding and receiving lifting platform 304 is located at the feeding end of the upper conveyor belt 3011. After rising to be flush with the upper conveyor belt 3011, it transports the fully loaded carrier material box 100 onto the upper conveyor belt 3011.

[0065] ② The upper conveyor belt 3011 transports the fully loaded carrier box 100 to the discharge end in a specific direction. The box transfer robot 302 is located at the discharge end of the upper conveyor belt 3011, receives the fully loaded carrier box 100 sent out by the upper conveyor belt 3011, and clamps the carrier box 100.

[0066] ③ The horizontal push assembly 303 starts to operate: The push plate rotary drive mechanism 3032 drives the horizontal push plate 3031 through the gear assembly meshing with the rack part 3031a on the side of the horizontal push plate 3031, driving the horizontal push plate 3031 to extend forward, thereby pushing the chip carrier in the carrier box 100 held by the box transfer robot 302 out of the carrier box 100 laterally, so that the chip carrier enters the carrier rotary conveying module 4; Optionally, the carrier box 100 has a multi-layer structure, with one chip carrier placed in each layer. After the first chip carrier is pushed out, the box transfer robot 302 drives the carrier box 100 to move down one position, and the horizontal push assembly 303 continues to push out the next chip carrier;

[0067] ④ After all the chip carriers have been pushed out, the carrier box 100 becomes empty. The box transfer robot 302 sends the empty carrier box 100 back to the lower conveyor belt 3012.

[0068] ⑤ The lower conveyor belt 3012 delivers the empty vehicle material box 100 to the material box supply and collection lifting platform 304 in the opposite conveying direction to the upper conveyor belt 3011. After the material box supply and collection lifting platform 304 descends to be level with the lower conveyor belt 3012, it retrieves the empty vehicle material box 100.

[0069] S2: The tray-mounting robot 5 then takes out the chip from the fully loaded chip tray on the tray reciprocating conveyor module 2 and places the chip into the chip carrier after it has been rotated and positioned by the carrier rotary conveyor module 4.

[0070] The carrier rotation conveying module 4 includes a carrier rotation platform 401 that drives the chip carrier to rotate around a vertical axis, and a carrier platform direct drive mechanism 402 that drives the carrier rotation platform 401 to reciprocate between the swivel robot arm 5 and the carrier supply module 3.

[0071] After the carrier supply module 3 sends the chip carrier into the carrier rotation platform 401, the carrier rotation platform 401 causes the chip carrier to rotate around the vertical axis to adjust the angle (for example, rotate the chip carrier by 90° or 180°, etc.); then the carrier platform direct drive mechanism 402 drives the carrier rotation platform 401 to move to the plate-mounting robot 5 for the plate-mounting robot 5 to place the chip.

[0072] S3: After the tray is placed, the tray reciprocating conveyor module 2 will send the empty chip tray back to the tray picking and placing robot 103, and the tray picking and placing robot 103 will then put the empty chip tray back into the tray recycling bin 102.

[0073] Therefore, the multi-position chip stacking device provided by this utility model can effectively solve the problem that existing chip stacking devices cannot achieve multi-position chip stacking.

[0074] Optionally, the multi-posture chip placement device also includes a chip alignment rotation platform 6, which is located between the tray reciprocating conveying module 2 and the carrier rotation conveying module 4, and is used to rotate the chip around the vertical axis to fine-tune the placement angle of the chip.

[0075] The tray-mounting robot 5 is used to first remove the chip from the tray reciprocating conveying module 2 and place it on the chip alignment rotating platform 6, and then transfer the angle-corrected chip to the chip carrier delivered by the carrier rotating conveying module 4.

[0076] In this embodiment, the chip alignment rotation platform 6 is mainly used for fine-tuning the chip placement angle. To ensure adjustment accuracy, the rotational adjustment stroke of the chip alignment rotation platform 6 is generally small, and it cannot achieve large angle adjustments such as 180°. Therefore, the chip cannot be directly adjusted by 180° using the chip alignment rotation platform 6 before being placed directly onto the carrier rotation conveyor module 4. That is, to ensure the rotational accuracy of the chip alignment rotation platform 6, this embodiment places the large-angle adjustment function at the carrier rotation conveyor module 4, thereby meeting the requirements of multi-posture placement.

[0077] During operation, the tray-mounting robot 5 first removes the chip from the tray reciprocating conveying module 2 and places it on the chip alignment rotating platform 6. The chip alignment rotating platform 6 rotates the chip around the vertical axis to fine-tune the chip's placement angle. After the fine-tuning is completed, the tray-mounting robot 5 transfers the angle-corrected chip to the chip carrier delivered by the carrier rotating conveying module 4.

[0078] Optionally, the multi-position chip stacking device also includes:

[0079] The carrier docking platform 701 is used to receive the chip carrier delivered by the carrier rotary conveying module 4.

[0080] The direct drive mechanism 702 of the docking platform is connected to the vehicle docking platform 701 at its drive end, and is used to drive the vehicle docking platform 701 to move laterally to align with the vehicle rotary conveying module 4.

[0081] The drive end of the direct drive mechanism 702 of the docking platform is connected to the carrier docking platform 701, driving the carrier docking platform 701 to move laterally to align with the carrier rotary conveyor module 4 so as to receive the chip carrier smoothly. Furthermore, after receiving the fully loaded chip carrier, the direct drive mechanism 702 of the docking platform drives the docking platform to move laterally to align with the downstream conveyor line, so that the fully loaded chip carrier can be sent downstream.

[0082] Finally, it should be noted that although the above embodiments have been described in the text and drawings of this application, this should not limit the scope of patent protection of this application. Any technical solutions that are based on the essential concept of this application and utilize the content described in the text and drawings of this application, resulting in equivalent structural or procedural substitutions or modifications, as well as the direct or indirect application of the technical solutions of the above embodiments to other related technical fields, are all included within the scope of patent protection of this application.

Claims

1. A multi-pose chip stacking device, characterized in that, include: The pallet feeding and receiving module (1) includes a pallet feeding bin (101), a pallet recycling bin (102), and a pallet picking and placing robot (103) for taking out a fully loaded chip pallet from the pallet feeding bin (101) and putting an empty chip pallet back into the pallet recycling bin (102). The pallet reciprocating conveyor module (2) is used to send a fully loaded chip pallet out from the pallet pick-and-place robot (103) and send an empty chip pallet back to the pallet pick-and-place robot (103); A carrier supply module (3) is used to supply an empty chip carrier; The carrier rotation conveying module (4) is used to receive the chip carrier sent out by the carrier supply module (3) and to rotate the chip carrier around the vertical axis. The tray-mounting robot (5) is used to take the chip out from the tray reciprocating conveying module (2) and place it into the chip carrier after it has been rotated and positioned by the carrier rotation conveying module (4).

2. The multi-pose chip stacking device according to claim 1, characterized in that, The pallet reciprocating conveying module (2) includes a pallet carrying platform (201) and a pallet platform direct drive mechanism (202) that drives the pallet carrying platform (201) to reciprocate between the pallet slab manipulator (5) and the pallet pick-and-place manipulator (103).

3. The multi-pose chip stacking device according to claim 1, characterized in that, The vehicle supply module (3) includes: A double-layer support (301) is used to load carrier boxes (100) of chip carriers. The double-layer support (301) includes an upper conveyor belt (3011) for conveying fully loaded carrier boxes (100) and a lower conveyor belt (3012) located below the upper conveyor belt (3011) for conveying empty carrier boxes (100); wherein the conveying directions of the two conveyor belts are opposite. Material box transfer robot (302) is located at the discharge end of the upper conveyor belt (3011) and is used to receive the fully loaded carrier material box (100) sent out by the upper conveyor belt (3011) and send the empty carrier material box (100) back to the lower conveyor belt (3012). A horizontal push assembly (303) is located on the side of the material box transfer robot (302) away from the tray robot (5) and is used to push the chip carrier in the carrier material box (100) held by the material box transfer robot (302) laterally out of the carrier material box (100) so that the carrier material box (100) enters the carrier rotary conveying module (4).

4. The multi-pose chip stacking device according to claim 3, characterized in that, The lateral push assembly (303) includes: A transverse push plate (3031) is provided with a rack portion (3031a) on its side. The push plate rotary drive mechanism (3032) is driven by a gear assembly that meshes with the rack part (3031a) to drive the transverse push plate (3031) to reciprocate.

5. The multi-pose chip stacking device according to claim 3, characterized in that, The vehicle supply module (3) also includes: Material box feeding and receiving lifting platform (304) is located at the feeding end of the upper conveyor belt (3011). It is used to rise to be level with the upper conveyor belt (3011) and transport a fully loaded vehicle material box (100) to the upper conveyor belt (3011), and to descend to be level with the lower conveyor belt (3012) and retrieve an empty vehicle material box (100) sent out by the lower conveyor belt (3012).

6. The multi-pose chip stacking device according to claim 1, characterized in that, The carrier rotation conveying module (4) includes a carrier rotation platform (401) that drives the chip carrier to rotate around a vertical axis, and a carrier platform direct drive mechanism (402) that drives the carrier rotation platform (401) to reciprocate between the swivel manipulator (5) and the carrier supply module (3).

7. The multi-pose chip stacking device according to claim 1, characterized in that, Also includes: Chip alignment rotation platform (6), the chip alignment rotation platform (6) is located between the tray reciprocating conveying module (2) and the carrier rotation conveying module (4), and is used to rotate the chip around the vertical axis to finely adjust the placement angle of the chip; The tray manipulator (5) is used to first take the chip out from the tray reciprocating conveying module (2) and place it on the chip alignment rotating platform (6), and then transfer the angle-corrected chip to the chip carrier sent out by the carrier rotating conveying module (4).

8. The multi-pose chip stacking device according to claim 1, characterized in that, Also includes: The vehicle docking platform (701) is used to receive the chip carrier sent out by the vehicle rotation conveying module (4); The direct drive mechanism (702) of the docking platform is connected to the vehicle docking platform (701) at its drive end, and is used to drive the vehicle docking platform (701) to move laterally to align with the vehicle rotating conveyor module (4).

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