Transport device and laser processing apparatus

Abstract

The application relates to the technical field of mechanical equipment, in particular to a transfer device and a laser processing device. The transfer device comprises at least one material moving mechanism and a material stopping position. The material moving mechanism comprises a first mechanical arm, a second mechanical arm, a first mobile robot and a second mobile robot. The operation range of the first mechanical arm covers at least the first material stopping position and a processing position, so as to perform the taking and placing of a circuit board between the first material stopping position and the processing position. The operation range of the second mechanical arm covers at least the first material stopping position and a second material stopping position, so as to perform the taking and placing of an auxiliary part between the first material stopping position and the second material stopping position. The moving range of the first mobile robot covers at least the first material stopping position, and the moving range of the second mobile robot covers at least the second material stopping position. The application does not need fixed guide rails, eliminates the occupation of the workshop space by long guide rail paths, and significantly reduces the equipment floor area.

Description

Technical Field

[0001] This application relates to the field of mechanical equipment technology, and more specifically, to a transfer device and laser processing equipment. Background Technology

[0002] As a core component of electronic products, circuit boards (PCBs) are increasingly diverse in type and application scenarios, widely used in communication equipment, consumer electronics, automotive electronics, industrial control, medical instruments, and many other fields. Common PCB types in the industry currently include Printed Circuit Boards (PCBs), Flexible Printed Circuit Boards (FPCs), Rigid-Flex Boards (RPCs), High Density Interconnects (HDIs), Integrated Circuit Substrates (IC Substrate), Metal Core PCBs, Glass Substrates, and Ceramic Substrates. Currently, laser processing equipment used to process these PCBs typically uses a guide rail system for PCB transport. When using a guide rail system to transport PCBs, because the PCBs are mostly transported horizontally, a long guide rail path is often required. This not only occupies a significant amount of workshop space but also limits the flexibility of equipment layout.

[0003] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to those skilled in the art. Utility Model Content

[0004] The purpose of this application is to provide a transfer device and laser processing equipment, which aims to solve the technical problem in the related art that when the guide rail system transports circuit boards, the guide rail occupies a large amount of workshop space, which limits the flexibility of equipment layout.

[0005] To achieve the above objectives, the technical solution adopted in this application is as follows: This application provides a transfer device for loading and unloading circuit boards at a processing station, comprising: at least one transfer mechanism and at least one set of stop positions; The at least one material handling mechanism includes a first robotic arm, a second robotic arm, a first mobile robot, and a second mobile robot; The at least one set of stopping positions includes a first stopping position and a second stopping position arranged adjacent to each other along a first predetermined direction; The operating range of the first robotic arm covers at least the first stop position and the processing position to perform the picking and placing of the circuit board between the first stop position and the processing position; the operating range of the second robotic arm covers at least the first stop position and the second stop position to perform the picking and placing of auxiliary parts between the first stop position and the second stop position. The first mobile robot's movement range covers at least the first stopping position, and the second mobile robot's movement range covers at least the second stopping position.

[0006] In some implementations, the first stop position includes a first receiving space, and the second stop position includes a second receiving space; The first mobile robot is configured to temporarily stay in a first accommodating space to exchange the circuit board and the auxiliary component, wherein the circuit board is stacked at intervals along a second predetermined direction via the auxiliary component; The second mobile robot is configured to remain temporarily within the second accommodating space to facilitate the handover of the auxiliary components.

[0007] In some implementations, the material transfer mechanism further includes a carrier that can be detachably carried by the first mobile robot and the second mobile robot; The carrier corresponding to the first mobile robot is configured to carry the circuit board and the auxiliary components; The vehicle corresponding to the second mobile robot is configured to carry the auxiliary component.

[0008] In some implementations, the material handling mechanism further includes at least one transfer component; The transfer assembly includes a drive assembly and a support assembly, configured to transfer the carrier at a first stop position and / or a second stop position, so that the carrier is detached from or carried by a first mobile robot and / or a second mobile robot.

[0009] In some implementations, the drive assembly includes a first motor and a first lead screw and nut pair; The support assembly is connected to the first lead screw and nut pair and is configured as two spaced-apart support arms. The support arms are used to support the lower surface of the carrier so that the carrier can be detached from or carried by the first mobile robot.

[0010] In some implementations, the transfer device includes two material transfer mechanisms, which are arranged on both sides of the processing position along a first predetermined direction, namely a first material transfer mechanism and a second material transfer mechanism; the two sets of stopping positions corresponding to the two material transfer mechanisms are arranged on both sides of the processing position along the first predetermined direction, namely a first set of stopping positions and a second set of stopping positions.

[0011] In some implementations, a flipping mechanism is also included, and the operating range of the first robot arm also includes the flipping mechanism to transfer the processed circuit board that has passed through the processing station to the flipping mechanism; The flipping mechanism is configured to flip the processed circuit board at a preset angle and then transfer the flipped processed circuit board.

[0012] In some implementations, the flip-plate mechanism includes a rotating component, a first moving component, a second moving component, and a first adsorption component; The rotating component is used to rotate the first adsorption component by a preset angle, the second moving component is used to move the first moving component along a second direction, and the first moving component is used to move the rotating component along a first direction, wherein the first direction is perpendicular to the second direction.

[0013] In some implementations, the carrier includes a base plate and a plurality of limiting posts; the limiting posts are fixed to the base plate, and the plurality of limiting posts are spaced apart along the edge of the base plate.

[0014] In some implementations, the first mobile robot is an automated guided vehicle (AGV), an autonomous mobile robot, or an intelligent guided vehicle; the second mobile robot is an AGV, an autonomous mobile robot, or an intelligent guided vehicle.

[0015] This application provides a laser processing device, including: a processing apparatus and a transfer device as described in any of the above implementations, wherein the processing apparatus includes at least a laser and the processing position, and the laser is used to process the circuit board to be processed on the processing position.

[0016] The main advantages of the transfer device and laser processing equipment provided in this application are: This application's transfer device can transfer both circuit boards awaiting processing and already processed circuit boards, thus improving its versatility. By employing a first mobile robot and a second mobile robot to transport circuit boards and auxiliary components respectively, replacing the guide rail system in related technologies, it eliminates reliance on fixed paths and optimizes transport routes in three-dimensional space. Furthermore, the mobile robots can move flexibly without fixed guide rails, eliminating the space occupied by long guide rail paths and significantly reducing the equipment's footprint. The first and second mobile robots cover the first and second stopping positions respectively, and can autonomously adjust transport paths according to real-time production needs, seamlessly coordinating with the first robotic arm (focused on picking up and placing circuit boards between the first and second stopping positions) and the second robotic arm (focused on picking up and placing auxiliary components between the first and second stopping positions). Through this clearly defined division of responsibilities, the device can handle the transfer tasks of circuit boards and auxiliary components in parallel, shortening the overall transport cycle and optimizing the logistics process.

[0017] Furthermore, compared with the horizontal laying of the guide rail system, this application improves the vertical space utilization rate and further optimizes space utilization efficiency. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of the laser processing apparatus provided in the embodiments of this application; Figure 2 yes Figure 1 A magnified schematic diagram of the partial structure at point A in the middle; Figure 3 yes Figure 1 A magnified schematic diagram of the local structure at point B; Figure 4 yes Figure 1 A magnified schematic diagram of the local structure at point C; Figure 5 This is a front view of the laser processing apparatus provided in the embodiments of this application; Figure 6 This is a top view of the laser processing apparatus provided in the embodiments of this application; Figure 7 This is a left view of the laser processing apparatus provided in the embodiments of this application; Figure 8 This is a schematic diagram of the structure of the first mobile robot and the carrier provided in the embodiments of this application; Figure 9 This is a top view of the first mobile robot and its carrier as provided in the embodiments of this application; Figure 10 This is a schematic diagram of the structure of the first mobile robot provided in an embodiment of this application; Figure 11 This is a schematic diagram of the structure of the transfer component provided in the embodiments of this application; Figure 12 This is a front view of the transfer component provided in the embodiments of this application; Figure 13 This is a left view of the transfer component provided in the embodiments of this application; Figure 14 This is a schematic diagram of the flap mechanism provided in the embodiments of this application; Figure 15 This is a front view of the flip-up mechanism provided in the embodiments of this application; Figure 16 This is a top view of the flip-up mechanism provided in the embodiments of this application; Figure 17 This is a right view of the flip-plate mechanism provided in the embodiments of this application.

[0020] Explanation of key figure labels: 201. Transfer mechanism; 201a. First transfer mechanism; 201b. Second transfer mechanism; 202. First robotic arm; 203. Second robotic arm; 204. First mobile robot; 205. Second mobile robot; 206. Carrier; 207. Base plate; 208. Limiting post; 209. Bearing surface; 210. Transfer assembly; 211. Support arm; 212. Buffer pad; 215. First motor; 216. First lead screw and nut pair; 217. First crossbeam; 218. Fixing frame; 219. First stopping position; 220. Second stopping position; 223. Flipping mechanism; 224. Rotating assembly; 225. First moving assembly; 226. Second moving assembly; 227. First suction assembly; 228. Main support; 229. First vacuum suction cup; 300. Processing device; 301. Processing station; 302. Loading and sorting station; 303. Unloading and sorting station; 304. NG station; 400. Circuit board. Detailed Implementation

[0021] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0022] In related technologies, laser processing equipment used for circuit board manufacturing typically relies on manual handling or a guide rail system to transport the circuit boards. Manual handling is cumbersome and inefficient; while using a guide rail system requires long guide rail paths because the circuit boards are often laid horizontally, which not only occupies a lot of workshop space but also limits the flexibility of equipment layout.

[0023] Therefore, this application provides a transfer device and a laser processing equipment to solve the problems in the related technology; the transfer device and laser processing equipment provided in this application are described in detail below with reference to the accompanying drawings.

[0024] Combination Figures 1 to 4As shown, this application embodiment provides a transfer device, including: at least one material transfer mechanism 201 and a stopping position; the at least one material transfer mechanism 201 includes a first robotic arm 202, a second robotic arm 203, a first mobile robot 204, and a second mobile robot 205; at least one set of stopping positions includes a first stopping position 219 and a second stopping position 220 arranged adjacent to each other along a first predetermined direction. The operating range of the first robotic arm at least covers the first stopping position and the processing position to perform circuit board pick-and-place between the first stopping position and the processing position. The operating range of the second robotic arm at least covers the first stopping position and the second stopping position to perform auxiliary component pick-and-place between the first stopping position and the second stopping position; the moving range of the first mobile robot at least covers the first stopping position, and the moving range of the second mobile robot at least covers the second stopping position. For example, adjacent arrangement can mean that two stopping positions (first stopping position 219 and second stopping position 220) are closest to each other in the first predetermined direction, and they can be in direct contact, or there can be a gap necessary to achieve the purpose of this application.

[0025] The transfer device provided in this application embodiment can transfer circuit boards to be processed as well as processed circuit boards, which is beneficial to improving its versatility. By using a first mobile robot 204 and a second mobile robot 205 to transport circuit boards and auxiliary components respectively, replacing the guide rail system in related technologies, it is possible to optimize the transportation route in three-dimensional space without relying on a fixed path, and greatly save labor. In addition, the mobile robots can move flexibly without fixed guide rails, eliminating the occupation of workshop space by long guide rail paths and significantly reducing the equipment footprint. The movement range of the first mobile robot 204 and the second mobile robot 205 covers the first stopping position 219 and the second stopping position 220 respectively, and can autonomously adjust the transportation path according to real-time production needs, and achieve seamless cooperation with the first robotic arm 202 (focusing on picking up and placing circuit boards 400 between the first stopping position 219 and the processing position 301) and the second robotic arm 203 (focusing on picking up and placing auxiliary components between the first stopping position 219 and the second stopping position 220). With this clearly defined division of responsibilities, the device can handle the transfer of circuit board 400 and auxiliary components in parallel, shortening the overall transportation cycle and optimizing the logistics process.

[0026] In some embodiments, the first set direction may be along a horizontal direction, such as along the length of the laser processing equipment. It is understood that the first set direction can also be designed as needed, and this application does not limit it. The circuit board 400 may be a printed circuit board (PCB), a flexible printed circuit (FPC), a rigid-flex board, a high-density interconnect (HDI), an integrated circuit substrate, a metal core PCB, a glass substrate, or a ceramic substrate. Furthermore, the circuit board 400 may be a single-layer board or a multi-layer board. The transfer mechanism 201 can transfer the circuit board to be processed onto the processing device 300 of the laser processing equipment, and / or remove the processed circuit board from the processing device 300 of the laser processing equipment. It should be noted that the transfer device is not limited to the circuit board 400, but is also suitable for transferring other plate-shaped structures or other types of circuit boards.

[0027] It is understood that the first robotic arm 202 and the second robotic arm 203 can adopt the same structure, or different structures can be adopted as needed. The first robotic arm 202 and the second robotic arm 203 can be robotic arms including vacuum suction cups, which can achieve the adsorption or release of circuit boards or auxiliary components, and then drive the circuit boards or auxiliary components to perform lifting and / or horizontal movements. Furthermore, robotic arms are something that those skilled in the art should understand, and are well-known and easily implemented by those skilled in the art; therefore, the specific structure of the robotic arms will not be described in detail in this application embodiment. Moreover, the first mobile robot 204 and the second mobile robot 205 can adopt the same structure, or different structures can be adopted as needed.

[0028] The auxiliary component is a sheet-like structure, which can be a rigid structure or a flexible structure. When multiple circuit boards 400 are stacked, the auxiliary component is sandwiched between two adjacent circuit boards 400, which can play the role of isolation, support and protection.

[0029] In some embodiments, the first stopping position 219 includes a first accommodating space, and the second stopping position 220 includes a second accommodating space; the first mobile robot 204 is configured to temporarily stay in the first accommodating space to transfer circuit boards 400 and auxiliary components, wherein the circuit boards 400 are stacked at intervals along a second predetermined direction via auxiliary components; the second mobile robot 205 is configured to temporarily stay in the second accommodating space to transfer auxiliary components. Exemplarily, the second predetermined direction can be a vertical direction or a horizontal direction; it is understood that the stacking direction can also be other directions. The first mobile robot 204 is used to transport multiple stacked circuit boards and auxiliary components sandwiched between two adjacent circuit boards, wherein the circuit boards are circuit boards to be processed or processed circuit boards. The operating range of the first robotic arm at least covers the first stopping position and the processing position, and the moving range of the first mobile robot at least covers the first stopping position, thus enabling the transfer of circuit boards between the first robotic arm 202 and the first mobile robot 204. The second mobile robot 205 is used to transport auxiliary components. The operating range of the second robotic arm covers at least the first and second stopping positions, and the moving range of the second mobile robot covers at least the second stopping position. This enables the transfer of auxiliary parts between the second robotic arm 203 and the second mobile robot 205.

[0030] The transfer of circuit boards between the first robotic arm 202 and the first mobile robot 204 can refer to the first robotic arm 202 moving the circuit board to be processed from the first mobile robot 204 to another location, such as to the processing device 300 of the laser processing equipment, when the first mobile robot 204 is loaded with the circuit board to be processed; or it can refer to the first robotic arm 202 transferring the processed circuit board from the processing device 300 of the laser processing equipment to the first mobile robot 204 after the processing device 300 processes the circuit board to be processed, so that the first mobile robot 204 can then transfer the processed circuit board to other processing steps.

[0031] The transfer of auxiliary components between the second robotic arm 203 and the second mobile robot 205 can refer to the following: when the first mobile robot 204 is loaded with a circuit board to be processed, after the first robotic arm 202 moves a circuit board to be processed from the first mobile robot 204 to another position, the second robotic arm 203 transfers an auxiliary component exposed on the first mobile robot 204 to the second mobile robot 205; or it can refer to the following: after the first robotic arm 202 transfers a processed circuit board from the processing device 300 of the laser processing equipment to the first mobile robot 204, the second robotic arm 203 transfers one of the multiple auxiliary components loaded on the second mobile robot 205 to the first mobile robot 204.

[0032] It is understandable that the number of first robotic arms 202 in the material transfer mechanism 201 can be one or more. When there are multiple first robotic arms 202, the number can be two or three, which can be determined according to actual needs. For example, it can be determined according to the number of processing positions 301 in the processing device 300 of the laser processing equipment. When there are two processing positions 301, the number of first robotic arms 202 can be two. In addition, when there are space and cost constraints, the material transfer mechanism 201 can include only one robotic arm, which can be used to pick up and place auxiliary parts and circuit boards 400 in sequence. The material transfer mechanism 201 can also include only one mobile robot. After the spaced-overlapping circuit boards 400 and auxiliary parts are transferred to the first stop position 219 for handover, the mobile robot can move to the second stop position 220 to receive the separated auxiliary parts.

[0033] In some embodiments, the first mobile robot 204 is an Automated Guided Vehicle (AGV), an Autonomous Mobile Robot (AMR), or an Intelligent Guided Vehicle (IGV); the second mobile robot 205 is an Automated Guided Vehicle (AGV), an Autonomous Mobile Robot (AMR), or an Intelligent Guided Vehicle (IGV).

[0034] Combination Figures 8 to 10 As shown, in some embodiments, the material handling mechanism 201 further includes a carrier 206, which is detachably supported by a first mobile robot 204 and a second mobile robot 205. The carrier 206 on the first mobile robot 204 is used to support circuit boards and auxiliary components; the carrier 206 on the second mobile robot 205 is used to support auxiliary components. The carrier 206, as a platform for supporting circuit boards and auxiliary components, provides a stable support structure, reducing shaking or displacement during transportation. When circuit boards or auxiliary components are directly stacked on the mobile robot, they may occupy the robot's space, making it usable only by the transfer device. However, with the carrier 206, pre-stacking of circuit boards and auxiliary components can be supported, allowing for batch preparation of circuit boards before transportation by the mobile robot. Furthermore, as an independent support module, the carrier 206 simplifies the transportation function design of the mobile robot, facilitates maintenance and replacement, and reduces maintenance costs and downtime. For example, a damaged carrier 206 can be directly replaced without adjusting the mobile robot body.

[0035] Combination Figures 8 to 10As shown, exemplarily, the first mobile robot 204 and the second mobile robot 205 adopt the same structure; the carrier 206 includes a base plate 207 and a plurality of limiting posts 208; the limiting posts 208 are fixed to the base plate 207, and the plurality of limiting posts 208 are distributed at intervals along the edge of the base plate 207. The base plate 207 can be circular, elliptical, or polygonal. When the base plate 207 is polygonal, the polygon can be triangular, rectangular, or pentagonal. The material of the base plate 207 can be engineering plastic or metal. Engineering plastic can be PA, PC, POM, PPS, or PEEK; metal can be aluminum alloy or stainless steel. The limiting posts 208 can be threaded or welded to the base plate 207. When the base plate 207 is rectangular, the plurality of limiting posts 208 can be distributed on two adjacent sides of the base plate 207, which facilitates the alignment of the stacked circuit boards 400. The carrier 206 is in contact with the mobile robot, that is, the carrier 206 is placed on the bearing surface 209 of the mobile robot, which facilitates the placement and removal of the carrier 206. It is understandable that the vehicle 206 is not limited to the above-mentioned structural form; the vehicle 206 can also be a box-shaped structure with an opening.

[0036] It should be noted that in some other possible embodiments, the surface of the carrier 206 that contacts the mobile robot (first mobile robot 204 or second mobile robot 205) may have a through hole, while the bearing surface 209 of the mobile robot may have an anti-slip pad made of rubber or plastic. This anti-slip pad can protrude from the bearing surface 209 and extend into the through hole, achieving stable contact between the two. It is understood that the anti-slip pad can also be flush with the bearing surface 209. Alternatively, an anti-slip pad can also be fixed to the side of the carrier 206 that contacts the mobile robot (i.e., the lower surface), while the bearing surface 209 of the mobile robot is also fixed with an anti-slip pad, thereby increasing the friction between the two.

[0037] Combination Figures 11 to 13As shown, in some embodiments, the material handling mechanism 201 further includes at least one transfer component 210; the transfer component 210 can move the carrier 206 along a preset direction, for example, by lifting the carrier; it is understood that it can also move horizontally and / or vertically along the carrier. Thus, the transfer component 210 can lift the carrier 206 carried by the mobile robot (first mobile robot 204 or second mobile robot 205) to a set position, allowing the mobile robot (first mobile robot 204 or second mobile robot 205) to separate from the carrier 206. After separation, the mobile robot (first mobile robot 204 or second mobile robot 205) can move to the charging position or to other positions to transport circuit boards. The first stopping position 219 and / or the second stopping position 220 are provided with the transfer component 210. The transfer component 210 can continuously rise as the number of circuit boards or auxiliary components on the carrier 206 decreases, moving the outermost exposed circuit boards or auxiliary components to a preset fixed position (spatial position and orientation).

[0038] It should be noted that in some other possible embodiments, the material transfer mechanism 201 may not be provided with the transfer component 210. In this case, during the processing, the first mobile robot 204 stays at the first stop position 219 to continuously support the carrier 206; the second mobile robot 205 stays at the second stop position 220 to continuously support the carrier 206.

[0039] Combination Figures 11 to 13 As shown, in some embodiments, the transfer assembly 210 includes a drive assembly and a support assembly; the transfer assembly 210 is configured to transfer the carrier 206 at a first stop position 219 and / or a second stop position 220, causing the carrier 206 to detach from or be carried by a first mobile robot 204 and / or a second mobile robot 205. It is understood that the support assembly can provide support from the bottom of the carrier or suspend it from above the carrier (e.g., a hanging basket).

[0040] Combination Figures 11 to 13 As shown, in some embodiments, the drive assembly includes a first motor 215 and a first lead screw and nut assembly 216; the first lead screw and nut assembly 216 is connected to the support assembly. Thus, the first lead screw and nut assembly 216 enables the stability of the support assembly and allows the support assembly to stop at any preset height position. For example, the first motor 215 can be a servo motor, a stepper motor, or a linear motor. The first lead screw and nut assembly 216 can be a sliding lead screw and nut assembly, a ball screw and nut assembly, or a hydrostatic lead screw and nut assembly.

[0041] The support assembly includes two spaced-apart support arms 211, which support the lower surface of the carrier 206 so that the carrier 206 can be detached from or carried by the first mobile robot 204; the carrier 206 can be moved smoothly by using the two support arms 211.

[0042] For example, the area of ​​the carrier 206 is larger than the area of ​​the mobile robot's bearing surface 209, which facilitates the two support arms 211 in lifting the carrier 206 off the mobile robot's bearing surface 209. The two support arms 211 are arranged parallel to each other along their length directions; multiple buffer pads 212 can be fixed to the upper surface of the support arms 211, which can ensure the translational movement of the carrier 206 during its ascent. The number of buffer pads 212 can be two, three, or four; the multiple buffer pads 212 are spaced apart along the length direction of the support arms 211; the two support arms 211 can be fixedly connected by a first crossbeam 217.

[0043] See Figure 1 , Figure 5 and Figure 6 As shown, in some embodiments, the transfer device includes two material transfer mechanisms 201, which are symmetrically arranged on both sides of the processing position along a first predetermined direction. The two sets of stop positions corresponding to the two material transfer mechanisms 201 are symmetrically arranged on both sides of the processing position along the first predetermined direction. The two material transfer mechanisms 201 are respectively the first material transfer mechanism 201a and the second material transfer mechanism 201b. The two sets of stop positions corresponding to the two material transfer mechanisms 201 are symmetrically arranged on both sides of the processing position along the first predetermined direction. They are respectively the first set of stop positions and the second set of stop positions.

[0044] In the first material transfer mechanism 201a, the first robot arm 202 is configured to pick up the circuit board to be processed from the first stop position 219 of the first group of stop positions and transfer the circuit board to be processed to the processing position 301. The second robot arm 203 is configured to pick up the exposed auxiliary parts located in the first stop position 219 of the first group of stop positions and transfer the exposed auxiliary parts to the second stop position 220 of the first group of stop positions. In the second material transfer mechanism 201b, the first robot arm 202 is configured to pick up the processed circuit board from the processing position 301 and transfer the processed circuit board to the first stop position 219 of the second group of stop positions. The second robot arm 203 is configured to pick up the auxiliary parts of the second stop position 220 of the second group of stop positions and move the auxiliary parts to the first stop position 219 of the second group of stop positions. In this way, the two material transfer mechanisms 201 enable the transfer device to have the functions of loading and unloading, so as to provide the circuit board to be processed to the processing device 300 or to transfer the processed circuit board from the processing device 300.

[0045] For example, in the first transfer mechanism 201a, the first robot arm 202 can transfer the circuit board to be processed on the first mobile robot 204 to the processing device 300 of the laser processing equipment, and the second robot arm 203 can transfer the auxiliary parts on the first mobile robot 204 to the second mobile robot 205; in the second transfer mechanism 201b, the first robot arm 202 can transfer the processed circuit board formed by the processing device 300 to the first mobile robot 204, and the second robot arm 203 is used to transfer the auxiliary parts on the second mobile robot 205 to the first mobile robot 204, so that the auxiliary parts are sandwiched between two adjacent circuit boards.

[0046] It is understandable that all the material transfer mechanisms 201 in the transfer device may be used only for loading, or only for unloading, or a portion of the material transfer mechanisms 201 may be used for loading and a portion of the material transfer mechanisms 201 may be used for unloading. The specific method can be determined according to actual needs. The number of material transfer mechanisms 201 in the transfer device may also be three, four, or five, etc.

[0047] This application embodiment uses two material transfer mechanisms 201 in the transfer device as an example for specific illustration. The first material transfer mechanism 201a can have two first robotic arms 202, and the second material transfer mechanism 201b can also have two first robotic arms 202. The transfer device includes a fixed frame 218, and a transfer component 210 is mounted on the fixed frame 218. The fixed frame 218 has a first stopping position 219 and a second stopping position 220, and each of the first stopping position 219 and the second stopping position 220 is provided with a transfer component 210. The fixed frame 218 also has a first stopping position 219 and a second stopping position 220, and each of the first stopping position 219 and the second stopping position 220 is provided with a transfer component 210.

[0048] Combination Figures 14 to 17 As shown, in some embodiments, the transfer device further includes a flipping mechanism 223, and the operating range of the first robotic arm 202 also includes the flipping mechanism 223, to transfer the processed circuit board that has passed the processing position to the flipping mechanism; the flipping mechanism 223 is used to flip the processed circuit board at a preset angle and transfer the flipped processed circuit board. Flipping the processed circuit board by the flipping mechanism 223 can also meet the set requirements. For example, the flipping mechanism 223 can transfer the flipped processed circuit board to the carrier 206.

[0049] It should be noted that in some other possible implementations, the flipping mechanism 223 can also be used to flip the circuit board to be processed.

[0050] Combination Figures 14 to 17As shown, in some embodiments, the flip-plate mechanism 223 includes a rotating component 224, a first moving component 225, a second moving component 226, and a first adsorption component 227; the rotating component 224 is used to rotate the first adsorption component 227 by a preset angle, and the second moving component 226 is used to move the first moving component 225 along a second direction; the first moving component 225 is used to move the rotating component 224 along a first direction, and the first direction is perpendicular to the second direction.

[0051] For example, the preset angle can be 180 degrees, so that when the circuit board is circuit board 400, the circuit board 400 can be flipped. After the flipping mechanism 223 flips the processed circuit board, the processed circuit board is located below the first adsorption component 227. The rotating component 224 can be a rotary cylinder; or the rotating component 224 can include a second motor, a first gear, and an external gear ring. The output shaft of the second motor is fixedly connected to the first gear, the first gear meshes with the external gear ring, and the external gear ring is connected to the first adsorption component 227, so that the rotation of the external gear ring can drive the first adsorption component 227 to rotate together. The first adsorption component 227 can include a main support 228 and a plurality of first vacuum suction cups 229 mounted on the main support 228. The first vacuum suction cups 229 are connected to a negative pressure device or a vacuum pump to achieve adsorption or release of the circuit board or auxiliary components. The first direction can be vertical, and the second direction can be horizontal. This allows the rotating component 224 and the first adsorption component 227 to move up and down together, and also allows them to move horizontally. The first moving component 225 and the second moving component 226 can be electric linear guides, thereby using the movement of the slider on the guide rail to achieve both vertical and horizontal movement of the rotating component 224 and the first adsorption component 227.

[0052] Combination Figures 1 to 6As shown, this application provides a laser processing apparatus, including a processing device 300 and a transfer device provided in any of the above embodiments. The processing device 300 includes a laser for processing the circuit board to be processed. The laser processing apparatus has the same technical effects as the transfer device provided in the foregoing embodiments, and will not be described in detail here. Furthermore, the processing device 300 is something that those skilled in the art should understand, is well-known and easily implemented by those skilled in the art, and is unrelated to the purpose of this application; therefore, this application will not describe it in detail in its embodiments. The processing device 300 may have two processing positions 301, a loading and sorting position 302, a unloading and sorting position 303, and an NG position 304. When the circuit board to be processed is in processing position 301, the processing device 300 can process the circuit board. Before processing, the circuit board to be processed is placed in loading and sorting position 302, and its position is adjusted by the positioning device in the processing device 300. In addition, before processing the circuit board, the processing device 300 can also identify the type of the circuit board. If the type of the circuit board cannot be identified, the second robot 203 or other robot will place the circuit board to be processed in NG position 304. After processing, the processed circuit board is first placed in unloading and sorting position 303, and another positioning device adjusts the position of the processed circuit board. After the processing device 300 processes the circuit board to be processed, the circuit board becomes a processed circuit board.

[0053] Combination Figures 1 to 6 As shown, the working principle of the rotating device in this embodiment is as follows: 1. The feeding process of the first material transfer mechanism 201a In the first material transfer mechanism 201a, the first mobile robot 204 moves to the first stop position 219 of the first set of stop positions, and the second mobile robot 205 moves to the second stop position 220 of the first set of stop positions. At this time, the carrier 206 on the first mobile robot 204 carries the circuit board to be processed and auxiliary parts, that is, the carrier 206 is in a fully loaded state; while the carrier 206 of the second mobile robot is in an unloaded state; the transfer component 210 located at the first stop position 219 of the first set of stop positions lifts the carrier 206 on the first mobile robot 204 to a set height; the transfer component 210 located at the second stop position 220 of the first set of stop positions lifts the carrier 206 on the second mobile robot 205 to a set height. The second robotic arm 203 transfers the topmost auxiliary component of the carrier 206 corresponding to the first mobile robot 204 to the carrier 206 corresponding to the second mobile robot 205. Then, the first robotic arm 202 transfers the exposed circuit board to be processed on the carrier 206 corresponding to the first mobile robot to the loading and sorting position 302 of the processing device 300. After adjusting the position of the circuit board to be processed, the first robotic arm 202 transfers the circuit board to be processed to the processing position 301. At the same time, the second robotic arm 203 transfers the auxiliary component from the carrier 206 corresponding to the first mobile robot 204 located at the first stop position 219 of the first group of stop positions to the second mobile robot 205. The first robotic arm 202 then transfers the circuit board to be processed from the carrier 206 corresponding to the first mobile robot 204 located at the first stop position 219 of the first group of stop positions. This operation continues until there is no circuit board to be processed on the carrier 206 corresponding to the first mobile robot 204 located at the first stop position 219 of the first group of stop positions. Finally, the transfer component 210 descends, and the different carriers 206 land on the first mobile robot 204 and the second mobile robot 205 respectively. The first mobile robot 204 and the second mobile robot 205 move out from the first stop position 219 and the second stop position 220 of the first group of stop positions respectively.

[0054] 2. The process of the second moving mechanism unloading materials. In the second material transfer mechanism 201b, the first mobile robot 204 moves to the first stop position 219 of the second set of stop positions, and the second mobile robot 205 moves to the second stop position 220 of the second set of stop positions. At this time, the carrier 206 on the first mobile robot 204 is in an unloaded state; while the carrier 206 of the second mobile robot 205 carries multiple stacked auxiliary components; the transfer component 210 located at the first stop position 219 of the second set of stop positions lifts the carrier 206 on the first mobile robot 204 to a set height; the transfer component 210 located at the second stop position 220 of the second set of stop positions lifts the carrier 206 on the second mobile robot 205 to a set height. The first robotic arm 202 transfers the processed circuit board, formed by the processing device 300, to the carrier 206 corresponding to the first mobile robot 204. The second robotic arm 203 transfers auxiliary components from the carrier 206 corresponding to the second mobile robot 205 to the carrier 206 corresponding to the first mobile robot 204, so that auxiliary components are sandwiched between adjacent circuit boards. When the carrier 206 corresponding to the first mobile robot 204 is fully loaded, the transfer component 210 lowers the carrier 206 onto the first mobile robot 204, allowing the first mobile robot 204 to transfer the processed circuit board to other processes.

[0055] It should be noted that, in the scenario where the processing device 300 performs single-sided processing on the circuit board 400, during the unloading process of the second moving mechanism, the first robotic arm 202 can directly transfer the processed circuit board from the processing device 300 of the laser processing equipment to the carrier 206 carried by the transfer component 210, and then the transfer component 210 places the carrier 206 onto the first mobile robot 204. In the scenario where the processing device 300 performs double-sided processing on the circuit board 400, during the unloading process of the second moving mechanism, the first robotic arm 202 first transfers the processed circuit board formed by the processing device 300 to the flipping mechanism 223. The flipping mechanism 223 flips the processed circuit board at a preset angle and then transfers the flipped processed circuit board to the carrier 206 carried by the transfer component 210.

[0056] It should be understood that, in the embodiments of this application, unless otherwise expressly specified and limited, the terms "connection," "fixed connection," "contact," etc., should be interpreted broadly. Those skilled in the art can understand the specific meanings of the various terms in the embodiments of this application according to the specific circumstances.

[0057] For example, the "connection" can be a fixed connection, a rotating connection, a flexible connection, a sliding connection, a one-piece molding, an electrical connection, a contact connection, or other connection methods; it can be a direct connection, or an indirect connection through an intermediate medium, or a connection within two components or an interaction between two components.

[0058] For example, a "fixed connection" can be a component that can be directly or indirectly fixedly connected to another component; a fixed connection can include mechanical connection, welding, bonding or integral molding, etc., wherein mechanical connection can include riveting, bolting, threaded connection, keying, snap-fit ​​connection, locking connection, plugging, etc., and bonding can include adhesive bonding and solvent bonding, etc.

[0059] It should also be understood that the “parallel” or “perpendicular” described in the embodiments of this application can be understood as “approximately parallel” or “approximately perpendicular”.

[0060] It should also be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Features specified as "first" or "second" may explicitly or implicitly include one or more of that feature.

[0061] In the embodiments of this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature and the second feature are in direct contact, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0062] It should also be understood that the terms “length,” “width,” “up,” “down,” “front,” “back,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship (if any) based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0063] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims. In conclusion, the above are merely preferred embodiments of the technical solution of this application and are not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A transfer device for loading and unloading circuit boards at a processing station, characterized in that, include: At least one material transfer mechanism and at least one set of stop positions; The at least one material handling mechanism includes a first robotic arm, a second robotic arm, a first mobile robot, and a second mobile robot; The at least one set of stopping positions includes a first stopping position and a second stopping position arranged adjacent to each other along a first predetermined direction; The operating range of the first robotic arm covers at least the first stop position and the processing position to perform the picking and placing of the circuit board between the first stop position and the processing position; the operating range of the second robotic arm covers at least the first stop position and the second stop position to perform the picking and placing of auxiliary parts between the first stop position and the second stop position. The first mobile robot's movement range covers at least the first stopping position, and the second mobile robot's movement range covers at least the second stopping position.

2. The transfer device as described in claim 1, characterized in that, The first stopping position includes a first accommodating space, and the second stopping position includes a second accommodating space; The first mobile robot is configured to temporarily stay in a first accommodating space to exchange the circuit board and the auxiliary component, wherein the circuit board is stacked at intervals along a second predetermined direction via the auxiliary component; The second mobile robot is configured to remain temporarily within the second accommodating space to facilitate the handover of the auxiliary components.

3. The transfer device as described in claim 1, characterized in that, The material handling mechanism also includes a carrier, which can be detachably carried on the first mobile robot and the second mobile robot; The carrier corresponding to the first mobile robot is configured to carry the circuit board and the auxiliary components; The vehicle corresponding to the second mobile robot is configured to carry the auxiliary component.

4. The transfer device as described in claim 3, characterized in that, The material handling mechanism further includes at least one transfer component; The transfer assembly includes a drive assembly and a support assembly, configured to transfer the carrier at a first stop position and / or a second stop position, so that the carrier is detached from or carried by a first mobile robot and / or a second mobile robot.

5. The transfer device as described in claim 4, characterized in that, The drive assembly includes a first motor and a first lead screw and nut pair; The support assembly is connected to the first lead screw and nut pair and is configured as two spaced-apart support arms. The support arms are used to support the lower surface of the carrier so that the carrier can be detached from or carried by the first mobile robot.

6. The transfer device as described in any one of claims 1-5, characterized in that, The transfer device includes two material transfer mechanisms, which are arranged on both sides of the processing position along a first predetermined direction, namely the first material transfer mechanism and the second material transfer mechanism; the two sets of stopping positions corresponding to the two material transfer mechanisms are arranged on both sides of the processing position along the first predetermined direction, namely the first set of stopping positions and the second set of stopping positions.

7. The transfer device as described in claim 5, characterized in that, It also includes a flipping mechanism, and the operating range of the first robot arm also includes the flipping mechanism to transfer the processed circuit board that has passed through the processing station to the flipping mechanism; The flipping mechanism is configured to flip the processed circuit board at a preset angle and then transfer the flipped processed circuit board.

8. The transfer device as described in claim 7, characterized in that, The flip-plate mechanism includes a rotating component, a first moving component, a second moving component, and a first adsorption component; The rotating component is used to rotate the first adsorption component by a preset angle, the second moving component is used to move the first moving component along a second direction, and the first moving component is used to move the rotating component along a first direction, wherein the first direction is perpendicular to the second direction.

9. The transfer device as described in any one of claims 3-5, characterized in that, The carrier includes a base plate and a plurality of limiting posts; the limiting posts are fixed on the base plate, and the plurality of limiting posts are distributed at intervals along the edge of the base plate.

10. The transfer device according to any one of claims 1-5, characterized in that, The first mobile robot is an automated guided vehicle, an autonomous mobile robot, or an intelligent guided vehicle; the second mobile robot is an automated guided vehicle, an autonomous mobile robot, or an intelligent guided vehicle.

11. A laser processing device, characterized in that, include: The processing apparatus and the transfer device as described in any one of claims 1-10, wherein the processing apparatus includes at least a laser and the processing station, the laser being used to process the circuit board to be processed at the processing station.

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