A device for taking out a silicon wafer

Abstract

The utility model provides a kind of wafer taking device, it is related to wafer taking technical field.The wafer taking mechanism includes bearing plate and the multiple positioning blocks of being installed on bearing plate, each positioning block includes by upper to lower sequentially arranged guide surface, limit surface and supporting surface, guide surface is obliquely arranged, and it is first preset angle between with horizontal direction, for guiding to wafer, limit surface is vertically arranged, for limiting to wafer.Supporting surface is obliquely arranged, and it is second preset angle between with horizontal direction, for carrying wafer.Second preset angle is greater than first preset angle.In wafer taking process, wafer sequentially moves to supporting surface along guide surface and limit surface, and multiple positioning blocks limit wafer jointly.The above-mentioned technical scheme is through optimizing the motion trajectory of wafer, when wafer taking, wafer first enters along guide surface, then enters supporting surface along limit surface, and gradient is slow, reduce the direct impact of wafer and positioning block, form buffer, avoid damaging wafer.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer material handling technology, and in particular to a silicon wafer material handling device. Background Technology

[0002] In existing technologies, silicon wafers are typically transported using elastic belts. A mechanism brings the silicon wafer into direct contact with the belt, and the friction between the belt and the wafer propels the wafer forward. This method has several drawbacks. Firstly, dirt on the belt surface can transfer to the silicon wafer. Secondly, the relative movement between the wafer and the belt can cause scratches. Both of these issues can damage the wafer surface. Severe scratches can lead to lower photoelectric conversion efficiency, resulting in the waste of the final cells or requiring rework. This directly increases costs, affects the reliability and stability of the produced modules during use, increases the product failure rate, and raises after-sales costs. Utility Model Content

[0003] One objective of this invention is to provide a silicon wafer handling device that solves the technical problem that silicon wafers are easily scratched and soiled during the handling process in the prior art.

[0004] Another objective of this invention is to further prevent scratching of silicon wafers.

[0005] Specifically, this utility model provides a silicon wafer picking device, including at least one picking mechanism, each of the picking mechanisms comprising: Support plate; Multiple positioning blocks are mounted on the support plate. Each positioning block includes a guide surface, a limiting surface, and a supporting surface arranged sequentially from top to bottom. The guide surface is inclined and forms a first preset angle with the horizontal direction to guide the silicon wafer. The limiting surface is vertically arranged to limit the silicon wafer. The supporting surface is inclined and forms a second preset angle with the horizontal direction to support the silicon wafer. The first preset angle is greater than the second preset angle. During the wafer removal process, the silicon wafer moves sequentially along the guide surface and the limiting surface to the support surface; multiple positioning blocks jointly limit the silicon wafer.

[0006] Optionally, the plurality of positioning blocks are divided into two groups of positioning blocks, which are arranged at intervals along a first horizontal direction and are used to limit the opposite sides of the silicon wafer. Each group of positioning blocks includes a plurality of positioning blocks arranged at intervals along a second horizontal direction, which is perpendicular to the first horizontal direction.

[0007] Optionally, each group of positioning blocks includes two positioning blocks, and the distance between the two positioning blocks is less than the width of the silicon wafer.

[0008] Optionally, the carrier plate is provided with a buffer structure, which is used to buffer and support the silicon wafer during the sliding process.

[0009] Optionally, the buffer structure is a hollow structure.

[0010] Optionally, it also includes: An adhesive tape layer is adhered to the support plate and covers the buffer structure to form a flexible support area with the buffer structure.

[0011] Optionally, it also includes: First mounting plate; A horizontal moving mechanism is mounted on the first mounting plate and connected to the support plate, for controlling the movement of the support plate along a first horizontal direction.

[0012] Optionally, it also includes: A lifting mechanism is installed below the first mounting plate and is used to controllably drive the first mounting plate and the horizontal moving mechanism to rise and fall.

[0013] Optionally, it also includes a base located below the first mounting plate, and the lifting mechanism includes: A sliding component extends vertically and is connected to the first mounting plate and the base respectively, for realizing a vertical sliding connection between the first mounting plate and the base; A vertical motion electric cylinder is mounted on the base and includes an electric cylinder shaft connected to the first mounting plate for driving the first mounting plate to rise and fall.

[0014] Optionally, there are two film-taking mechanisms, which are arranged in parallel and both are connected to the horizontal moving mechanism.

[0015] The wafer-retrieving mechanism of this invention includes a support plate and multiple positioning blocks mounted on the support plate. Each positioning block includes a guide surface, a limiting surface, and a supporting surface arranged sequentially from top to bottom. The guide surface is inclined and forms a first preset angle with the horizontal direction to guide the silicon wafer. The limiting surface is vertically arranged to limit the silicon wafer. The supporting surface is inclined and forms a second preset angle with the horizontal direction to support the silicon wafer. The second preset angle is greater than the first preset angle. During wafer retrieval, the silicon wafer moves sequentially along the guide surface and the limiting surface to the supporting surface, and the multiple positioning blocks jointly limit the silicon wafer. This technical solution optimizes the movement trajectory of the silicon wafer. During wafer retrieval, the silicon wafer first enters along the guide surface and then along the limiting surface to the supporting surface, resulting in a gentler slope. This reduces the direct impact between the silicon wafer and the positioning blocks, creating a buffer and preventing damage to the silicon wafer. This retrieval process does not involve any contact with the silicon wafer surface, achieving traceless retrieval and avoiding dirt or scratches on the silicon wafer.

[0016] Furthermore, the support plate of this invention is provided with a buffer structure, which is used to buffer and effectively support the silicon wafer during the sliding process, so as to avoid the silicon wafer from directly contacting the support plate and causing scratches.

[0017] The above and other objects, advantages and features of this utility model will become more apparent to those skilled in the art from the following detailed description of specific embodiments of this utility model in conjunction with the accompanying drawings. Attached Figure Description

[0018] The following sections will describe some specific embodiments of the present invention in a detailed manner by way of example and not limitation, with reference to the accompanying drawings. The same reference numerals in the drawings denote the same or similar parts or components. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings: Figure 1 This is a schematic structural diagram of a silicon wafer feeding device according to an embodiment of the present invention; Figure 2 This is a schematic structural diagram of a silicon wafer placed on a wafer-retrieving mechanism according to an embodiment of the present invention; Figure 3 This is a schematic structural diagram of a slice-taking mechanism according to an embodiment of the present utility model; Figure 4 This is a schematic side view of a slice-taking mechanism according to an embodiment of the present invention; Figure 5 This is a schematic enlarged view of a positioning block according to an embodiment of the present utility model.

[0019] Figure label: 100-Material handling device, 200-Silicon wafer, 10-Wafer handling mechanism, 20-Horizontal moving mechanism, 30-Lifting mechanism, 41-First mounting plate, 42-Bracket, 11-Bearing plate, 12-Equal height block, 13-Connecting plate, 111-Positioning block, 112-Buffer structure, 113-Guide surface, 114-Limiting surface, 115-Supporting surface, 116-Top surface, 21-Motor, 22-Sliding plate, 23-Slide rail, 50-Sliding assembly, 30-Lifting mechanism, 31-Vertical motion electric cylinder, 311-Electric cylinder shaft, 60-Base, 61-Second mounting plate, 62-Column profile, 63-Base plate. Detailed Implementation

[0020] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0021] In the description of this utility model, it should be understood that the terms "upper" and "lower" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0022] Unless otherwise expressly specified and limited, the terms "connection," "installation," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art should be able to understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0023] Unless otherwise specified, all terms (including technical and scientific terms) used in the description of this embodiment have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0024] Figure 1 This is a schematic structural diagram of a silicon wafer feeding device 100 according to an embodiment of the present invention. Figure 2 This is a schematic structural diagram of a silicon wafer 200 placed on a wafer-receiving mechanism 10 according to an embodiment of the present invention. Figure 3 This is a schematic structural diagram of a plurality of wafer-picking mechanisms 10 according to an embodiment of the present invention. Figure 4This is a schematic side view of the slice-taking mechanism 10 according to an embodiment of the present invention. Figure 5 This is a schematic enlarged view of the positioning block 111 according to an embodiment of the present invention. Figures 1 to 5 As shown, in a specific embodiment, the silicon wafer picking device 100 includes at least one picking mechanism 10. Each picking mechanism 10 includes a support plate 11 and a plurality of positioning blocks 111. The plurality of positioning blocks 111 are mounted on the support plate 11. Each positioning block 111 includes a guide surface 113, a limiting surface 114, and a supporting surface 115 arranged sequentially from top to bottom. The guide surface 113 is inclined and forms a first preset angle with the horizontal direction to guide the silicon wafer 200. The limiting surface 114 is vertically arranged to limit the silicon wafer 200. The supporting surface 115 is inclined and forms a second preset angle with the horizontal direction to support the silicon wafer 200. The first preset angle is greater than the second preset angle. During the picking process, the silicon wafer 200 moves sequentially along the guide surface 113 and the limiting surface 114 to the supporting surface 115, and the plurality of positioning blocks 111 jointly limit the silicon wafer 200. Here, the silicon wafer 200 is supported and moved by the wafer picking mechanism 10, and the supporting range of the multiple positioning blocks 111 of the wafer picking mechanism 10 is exactly below the silicon wafer 200.

[0025] This embodiment optimizes the movement trajectory of the silicon wafer 200. During wafer retrieval, the silicon wafer 200 first enters along the guide surface 113, and then enters the support surface 115 along the limiting surface 114. The gentler slope reduces the direct impact between the silicon wafer 200 and the positioning block 111, creating a buffer and preventing damage to the silicon wafer 200. In other words, the guide surface 113 effectively guides the silicon wafer 200 before it enters the support area, ensuring its smooth entry. To prevent the wafer retrieval mechanism 10 from moving too fast during horizontal movement and causing the silicon wafer 200 to veer out of the positioning area through the guide surface 113, this embodiment adds the limiting surface 114, which effectively prevents the silicon wafer 200 from veering out of the positioning area. This retrieval process involves no contact with the surface of the silicon wafer 200, achieving traceless retrieval and preventing dirt or scratches on the silicon wafer 200.

[0026] In some embodiments, each positioning block 111 further includes a top surface 116, which is horizontally arranged. This embodiment utilizes multiple positioning blocks 111 to surround the silicon wafer 200, forming a support structure. During wafer removal, the edge of the silicon wafer 200 contacts the support surface 115, thus lifting the silicon wafer 200 while reducing the risk of scratches on the silicon wafer 200.

[0027] In some embodiments, the range of the first preset angle can be 50° to 80°, for example, 50°, 60°, 70°, or 80°. The range of the second preset angle can be 15° to 45°, for example, 15°, 30°, 40°, or 45°. In other embodiments, the ranges of the first and second preset angles can be determined according to specific design requirements.

[0028] In some embodiments, the plurality of positioning blocks 111 are divided into two groups of positioning blocks, which are arranged at intervals along a first horizontal direction and are used to limit the opposite sides of the silicon wafer 200. Each group of positioning blocks includes a plurality of positioning blocks 111 arranged at intervals along a second horizontal direction, which is perpendicular to the first horizontal direction. It can be understood that the silicon wafer 200 is rectangular, and the two groups of positioning blocks are located on opposite sides of the length of the silicon wafer 200. The plurality of positioning blocks 111 in each group contact the side edge of the silicon wafer 200 in the same width direction.

[0029] In some embodiments, each group of positioning blocks includes two positioning blocks 111, the distance between the two positioning blocks 111 being less than the width of the silicon wafer 200, ensuring that the wafer-picking mechanism 10 enters the basket without interference and can accurately lift the silicon wafer 200. Furthermore, this embodiment can control the distance between the two groups of positioning blocks, allowing the silicon wafer 200 to accurately fall into the corresponding support area. The gentle slope design of the support surface 115 relatively reduces the requirements for incoming material accuracy, allowing for a certain amount of error. In other embodiments, the number of positioning blocks 111 in each group of positioning blocks can be determined according to specific design requirements, for example, it can be three, four, or five.

[0030] Since the silicon wafer 200 is relatively long along its length, in order to prevent it from bending in the middle when supported at both ends, this embodiment is designed with a support plate 11 to support the middle position of the silicon wafer 200, thereby reducing the degree of bending of the silicon wafer 200 and preventing damage to the silicon wafer 200.

[0031] In some embodiments, the carrier plate 11 is provided with a buffer structure 112, which is used to buffer and effectively support the silicon wafer 200 during the sliding process, so as to prevent the silicon wafer 200 from directly contacting the carrier plate 11 and causing scratches.

[0032] In some embodiments, the buffer structure 112 is a hollow structure. This can be understood as follows: to prevent the silicon wafer 200 from making hard contact with the support plate 11 when it falls onto the support surface 115, thus avoiding damage or scratches, this embodiment designs a hollow structure on the support plate 11. This can be understood as having at least one through slot on the support plate 11. In this embodiment, the support plate 11 has two through slots.

[0033] In some embodiments, the material handling device 100 further includes an adhesive tape layer, which adheres to the carrier plate 11 and covers the buffer structure 112 to form a flexible support area with the buffer structure 112. This embodiment uses the adhesive tape layer for fixed buffering, and combined with the hollow structure at the bottom of the adhesive tape layer to form a flexible support area, which can buffer and support the silicon wafer 200, reducing the damage rate of the silicon wafer 200.

[0034] In some embodiments, the material handling device 100 further includes a first mounting plate 41 and a horizontal moving mechanism 20. The horizontal moving mechanism 20 is mounted on the first mounting plate 41 and connected to the support plate 11, and is used to controllably drive the support plate 11 to move along a first horizontal direction. It can be understood that during the wafer handling process, the horizontal moving mechanism 20 can drive the wafer handling mechanism 10 to move along the first horizontal direction.

[0035] In some embodiments, the number of film-grabbing mechanisms 10 is two, arranged in parallel, and both are connected to the horizontal moving mechanism 20. In other embodiments, the number of film-grabbing mechanisms 10 can be determined according to specific design requirements, such as three or four.

[0036] In some embodiments, the material handling device 100 further includes at least one leveling block 12, each leveling block 12 corresponding to and connected to a piece handling mechanism 10. When there are multiple piece handling mechanisms 10, there are also multiple leveling blocks 12. Multiple leveling blocks 12 can ensure that the support plates 11 of multiple piece handling mechanisms 10 are on the same horizontal plane, ensuring the horizontality of the final piece handling, i.e., height consistency. In addition, there is a gap between two adjacent leveling blocks 12 and the corresponding two adjacent piece handling mechanisms 10, which can avoid the belt between two piece handling mechanisms 10 and prevent unnecessary interference problems.

[0037] In some embodiments, the material handling device 100 further includes at least one connecting plate 13, with a level block 12 and a support plate 11 connected to each end of each connecting plate 13, which can effectively avoid interference and machining waste caused by the integrated design of the connecting plate 13.

[0038] In some embodiments, the horizontal moving mechanism 20 includes a motor 21, a slide rail 23 and a sliding plate 22. The leveling block 12 is connected to the sliding plate 22. Driven by the motor 21, the sliding plate 22 moves along the slide rail 23, thereby driving the plate taking mechanism 10 to move.

[0039] In some embodiments, the material handling device 100 further includes a lifting mechanism 30, which is installed below the first mounting plate 41 and is used to controllably drive the first mounting plate 41 and the horizontal moving mechanism 20 to rise and fall.

[0040] In some embodiments, the material handling device 100 further includes a base 60 located below the first mounting plate 41. The lifting mechanism 30 includes a sliding component 50 and a vertical motion cylinder 31. The sliding component 50 extends vertically and is connected to the first mounting plate 41 and the base 60 respectively, for realizing a vertical sliding connection between the first mounting plate 41 and the base 60. The vertical motion cylinder 31 is mounted on the base 60 and includes a cylinder shaft 311, which is connected to the first mounting plate 41 for driving the first mounting plate 41 to lift. When picking up the wafer, the lifting mechanism 30 moves upward, causing the silicon wafer 200 to disengage from the basket teeth. This process does not require additional force to be applied to the silicon wafer 200, thus avoiding scratches on the silicon wafer 200.

[0041] In some embodiments, the base 60 includes a base plate 63, a second mounting plate 61, and a plurality of column profiles 62. The plurality of column profiles 62 are arranged vertically on the base plate 63, and the second mounting plate 61 is arranged horizontally and fixedly mounted above the column profiles 62. A vertical motion cylinder 31 is mounted on the second mounting plate 61, and the cylinder shaft 311 extends upward out of the second mounting plate 61 and is connected to the first mounting plate 41. The column profiles 62 serve as auxiliary fixation, allowing space for the installation of the vertical motion cylinder 31. In this embodiment, the vertical motion cylinder 31 drives the first mounting plate 41 to move while simultaneously causing the film-picking mechanism 10 to move up and down. The horizontal moving mechanism 20 drives the film-picking mechanism 10 to move along a first horizontal direction, thereby realizing the film-picking action.

[0042] In some embodiments, the material handling device 100 further includes two supports 42, which are vertically mounted below the first mounting plate 41. Two sliding components 50 are also included, each mounted on one of the two supports 42. The second mounting plate 61 is connected to the two sliding components 50. Here, the sliding component 50 has a structure that combines a slide rail and a slider.

[0043] This embodiment, through the design of the horizontal moving mechanism 20 and the lifting mechanism 30, can fully meet the vertical and horizontal movement requirements of the wafer picking mechanism 10. The support and positioning functions of the silicon wafer 200 are achieved by multiple positioning blocks 111, which are installed on the carrier plate 11 to form an overall support area that surrounds the silicon wafer 200. During wafer picking, the horizontal moving mechanism 20 first moves the wafer picking mechanism 10 to below the corresponding silicon wafer 200, that is, the wafer picking mechanism 10 extends into the basket mechanism, so that the support area formed by the multiple positioning blocks 111 is located below the silicon wafer 200. Then the lifting mechanism 30 then performs an overall upward movement, lifting the silicon wafer 200 away from the original contact surface. Finally, the wafer picking mechanism 10 moves out of the original mechanism along with the horizontal moving mechanism 20, thereby realizing the removal of the silicon wafer 200. Then, the lifting mechanism 30 is used to lift and lower the silicon wafer 200 to place it in the target position. This process does not involve direct contact with the surface of the silicon wafer 200, achieving traceless material picking. Unlike the original mechanism, it does not need to consider the impact of contact with dirt, nor does it need to consider the additional suction or pressure on the surface of the silicon wafer 200 as with the suction cup method, thus avoiding unnecessary scratches on the silicon wafer 200.

[0044] Therefore, those skilled in the art should recognize that although many exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications conforming to the principles of the present invention can be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and recognized as covering all such other variations or modifications.

Claims

1. A silicon wafer feeding device, characterized in that, Includes at least one film-retrieving mechanism, each of the film-retrieving mechanisms comprising: Support plate; Multiple positioning blocks are mounted on the support plate. Each positioning block includes a guide surface, a limiting surface, and a supporting surface arranged sequentially from top to bottom. The guide surface is inclined and forms a first preset angle with the horizontal direction to guide the silicon wafer. The limiting surface is vertically arranged to limit the silicon wafer. The supporting surface is inclined and forms a second preset angle with the horizontal direction to support the silicon wafer. The first preset angle is greater than the second preset angle. During the wafer removal process, the silicon wafer moves sequentially along the guide surface and the limiting surface to the support surface; multiple positioning blocks jointly limit the silicon wafer.

2. The material handling device according to claim 1, characterized in that, The plurality of positioning blocks are divided into two groups of positioning blocks, which are arranged at intervals along a first horizontal direction and are used to limit the relative sides of the silicon wafer. Each group of positioning blocks includes a plurality of positioning blocks arranged at intervals along a second horizontal direction, which is perpendicular to the first horizontal direction.

3. The material handling device according to claim 2, characterized in that, Each group of positioning blocks includes two positioning blocks, and the distance between the two positioning blocks is less than the width of the silicon wafer.

4. The material handling device according to claim 3, characterized in that, The support plate is provided with a buffer structure, which is used to buffer and support the silicon wafer during the sliding process.

5. The material handling device according to claim 4, characterized in that, The buffer structure is a hollow structure.

6. The material handling device according to claim 5, characterized in that, Also includes: An adhesive tape layer is adhered to the support plate and covers the buffer structure to form a flexible support area with the buffer structure.

7. The material handling device according to any one of claims 1-6, characterized in that, Also includes: First mounting plate; A horizontal moving mechanism is mounted on the first mounting plate and connected to the support plate, for controlling the movement of the support plate along a first horizontal direction.

8. The material handling device according to claim 7, characterized in that, Also includes: A lifting mechanism is installed below the first mounting plate and is used to controllably drive the first mounting plate and the horizontal moving mechanism to rise and fall.

9. The material handling device according to claim 8, characterized in that, It also includes a base located below the first mounting plate, and the lifting mechanism includes: A sliding component extends vertically and is connected to the first mounting plate and the base respectively, for realizing a vertical sliding connection between the first mounting plate and the base; A vertical motion electric cylinder is mounted on the base and includes an electric cylinder shaft connected to the first mounting plate for driving the first mounting plate to rise and fall.

10. The material handling device according to claim 7, characterized in that, There are two film-taking mechanisms, which are arranged in parallel and both are connected to the horizontal moving mechanism.

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