Graphene reinforced copper foil adhesive tape with electromagnetic interference resistance

Abstract

The utility model provides a kind of graphene reinforced copper foil adhesive tape of anti-electromagnetic interference, it is related to copper foil adhesive tape technical field, including protective layer, heat conducting layer, shielding layer, self-healing layer and substrate, substrate is flexible polymer material, with bottom surface and top surface, self-healing layer is located on the top surface of substrate, and it is closely combined with the top surface of substrate by hot-pressing bonding, self-healing layer is equipped with interlaced graphene fiber network, graphene fiber network is provided with conductive microcapsule, the design of the porous graphene structure and ferromagnetic particle embedded in shielding layer in the present scheme, compression pore is induced to move by magnetic field, realize dynamic adjustment shielding performance, effectively improve the protection ability to high frequency or variable frequency electromagnetic interference, improve shielding efficiency, avoid signal leakage and equipment failure, improve the stability and reliability of electronic equipment.

Description

Technical Field

[0001] This utility model relates to the field of copper foil tape technology, and in particular to a graphene-reinforced copper foil tape that resists electromagnetic interference. Background Technology

[0002] In existing technologies, anti-electromagnetic interference copper foil tape is a widely used shielding material in electronic devices, communication systems, and automotive electronics. It primarily uses copper foil as a core conductive layer to reflect or absorb electromagnetic waves, thus blocking electromagnetic interference (EMI). Common copper foil tapes typically consist of a base layer, a conductive copper foil layer, and an adhesive layer. The base layer is often made of polymer films such as polyester or polyimide, providing mechanical support and flexibility. The conductive copper foil layer is formed through rolling or electroplating processes, with a thickness generally between 20-100 micrometers, and is used to shield electromagnetic radiation. The adhesive layer is a pressure-sensitive adhesive used to fix the tape to the target surface. In production, this type of tape often employs simple lamination or coating processes to ensure basic functional integration. In some products, fillers such as carbon black or metal powder are added to enhance conductivity, adapting to EMI shielding requirements at different frequencies. For example, in the wrapping of mobile phones, computers, or cables, these tapes effectively reduce the interference of external electromagnetic signals on internal circuits, improving equipment stability.

[0003] However, existing copper foil tapes have several drawbacks. First, their shielding efficiency is limited, especially in high-frequency or variable-frequency electromagnetic environments. Traditional copper foil layers struggle to dynamically adjust shielding performance, resulting in insufficient protection against complex EMI and a high risk of signal leakage or equipment malfunction. Second, the tapes are susceptible to mechanical damage, such as scratches or bends. Once the conductive layer is damaged, it becomes permanently unrepairable, shortening its lifespan, particularly in applications under vibration or extreme conditions. Third, their thermal management is poor. Heat generated during EMI absorption cannot be effectively dissipated, leading to localized overheating that affects shielding effectiveness and material stability. Furthermore, their waterproof and corrosion-resistant properties are weak. Ordinary coatings are insufficient to prevent the intrusion of moisture or corrosive substances, causing internal oxidation or peeling, limiting their application in humid or outdoor environments. Finally, their overall thickness and lack of flexibility make them unsuitable for flexible electronics or compact devices. These shortcomings result in insufficient reliability of existing copper foil tapes in high-performance applications such as 5G equipment or electric vehicles, necessitating improvements to enhance overall performance. Therefore, a graphene-reinforced copper foil tape with electromagnetic interference resistance is needed to address these issues. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a graphene-reinforced copper foil tape that resists electromagnetic interference.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a graphene-reinforced copper foil tape for electromagnetic interference resistance, comprising a protective layer, a thermally conductive layer, a shielding layer, a self-healing layer, and a base layer. The base layer is a flexible polymer material with a bottom surface and a top surface. The self-healing layer is located on the top surface of the base layer and is tightly bonded to the top surface of the base layer by hot-pressing. The self-healing layer contains an interwoven graphene fiber network, and conductive microcapsules are disposed in the graphene fiber network. When the conductive microcapsules are damaged, they release conductive adhesive to repair the conductive paths of the graphene fiber network. The shielding layer is located on the top surface of the self-healing layer and is bonded to the top surface of the self-healing layer by vacuum lamination. The shielding layer contains a copper foil substrate, and a porous graphene structure is embedded in the copper foil substrate. The porous graphene structure contains ferromagnetic particles to adjust the pore density in response to an external electromagnetic field. The thermally conductive layer is located on the top surface of the shielding layer and is bonded by chemical vapor deposition. The thermally conductive layer includes a microchannel network arranged in a direction perpendicular to the surface of the shielding layer, and the microchannel network is filled with a thermally conductive medium. The protective layer is located on the top surface of the thermally conductive layer and is bonded by a coating process. The protective layer is a nano-hydrophobic coating used to provide waterproof and anti-corrosion functions. The base layer, self-healing layer, shielding layer, thermally conductive layer and protective layer are stacked in sequence and connected in the above manner to form an integral structure. The total thickness of the tape is between 50 micrometers and 200 micrometers.

[0006] Preferably, the graphene fiber network in the self-healing layer has a three-dimensional interlocking mesh structure with a pore size between 10 nanometers and 100 nanometers. The conductive microcapsules are embedded at the nodes of the graphene fiber network through capillary action, and the diameter of the conductive microcapsules is between 1 micrometer and 5 micrometers.

[0007] Preferably, the porous graphene structure in the shielding layer has honeycomb-like pores with an average diameter of 50 nanometers to 500 nanometers, and the ferromagnetic particles are embedded in the pore walls through a co-precipitation process, with a particle size of 10 nanometers to 50 nanometers.

[0008] Preferably, the microchannel network in the thermally conductive layer is arranged in an alternating orthogonal direction, the cross-section of the microchannel is rectangular, and the width is 10 micrometers to 50 micrometers. The thermally conductive medium is filled into the microchannel by an injection process, and the thermally conductive medium is a graphene-based thermally conductive gel.

[0009] Preferably, the bottom surface of the substrate layer is coated with a pressure-sensitive adhesive by a coating process, the thickness of which is 10 micrometers to 30 micrometers, for adhering the tape to the target surface.

[0010] Preferably, a gradient interface transition layer is provided between the shielding layer and the self-healing layer. The gradient interface transition layer is formed by a progressive coating process and bonded to the top surface of the self-healing layer and the bottom surface of the shielding layer. The gradient interface transition layer includes a graphene particle density that gradually increases from the self-healing layer to the shielding layer. The thickness of the gradient interface transition layer is 5 micrometers to 20 micrometers.

[0011] Preferably, the nano-hydrophobic coating of the protective layer is formed by vapor deposition and bonded to the top surface of the thermally conductive layer, with a thickness of 1 micrometer to 5 micrometers, and the surface of the protective layer has a micrometer-level wrinkled structure to enhance flexibility and resistance to mechanical damage.

[0012] Preferably, the graphene fiber network in the self-healing layer is embedded in an elastic polymer matrix via solution spinning. The elastic polymer matrix has a wavy skeleton structure with a peak spacing of 50 to 100 micrometers, which is used to restore the conductive path through rebound after damage.

[0013] Preferably, the layers of the tape are formed into an integral structure through continuous extrusion and lamination processes, wherein the copper foil substrate in the shielding layer has a thickness of 20 micrometers to 50 micrometers, and the porous graphene structure 10 is embedded in the copper foil substrate by chemical vapor deposition, wherein the thickness of the porous graphene structure is 10 micrometers to 30 micrometers.

[0014] Preferably, when an external electromagnetic field is applied to the tape, the ferromagnetic particles in the shielding layer compress the pores of the porous graphene structure through magnetic field-induced movement, thereby improving the electromagnetic shielding efficiency of the shielding layer.

[0015] Beneficial effects This solution employs a design that embeds porous graphene structures and ferromagnetic particles within the shielding layer. By inducing movement through a magnetic field to compress the pores, the shielding performance can be dynamically adjusted, effectively enhancing the protection against high-frequency or variable-frequency electromagnetic interference, improving shielding efficiency, preventing signal leakage and equipment failure, and increasing the stability and reliability of electronic equipment.

[0016] In this solution, the conductive microcapsules and elastic polymer matrix in the self-healing layer release conductive adhesive to repair the conductive path when damage occurs. At the same time, the wave-shaped skeleton rebounds to restore structural integrity, achieving self-healing function within seconds. This significantly extends the service life of the tape under vibration or extreme environments, reducing maintenance costs and replacement frequency.

[0017] In this solution, the microchannel network of the thermal conductive layer is filled with graphene-based thermal conductive gel, which rapidly dissipates the heat generated by EMI absorption through a combination of convection and conduction, preventing local overheating, improving shielding effect and material stability, and making it suitable for high-power electronic devices, thereby improving overall thermal management efficiency.

[0018] In this solution, the protective layer adopts a nano-hydrophobic coating with a micron-level wrinkled structure to form a superhydrophobic surface, blocking the intrusion of moisture and corrosive substances, enhancing waterproof and anti-corrosion performance, suitable for humid or outdoor environments, preventing internal oxidation or peeling, and ensuring long-term stability and durability.

[0019] In this solution, the overall thickness of the multi-layer structure is controlled between 50 and 200 micrometers. Combined with a flexible polymer base layer and elastic design, it enhances the flexibility and thinness of the tape, adapts to the needs of flexible electronics or compact devices, and improves installation convenience and application range. Attached Figure Description

[0020] Figure 1 This is a schematic diagram showing the overall disassembly of this utility model; Figure 2 This is a schematic diagram of the self-healing layer structure of this utility model; Figure 3 This is a schematic diagram of the shielding layer structure of this utility model; Figure 4 This is a schematic diagram of the overall assembly of this utility model.

[0021] Legend: 1. Protective layer; 2. Thermally conductive layer; 3. Shielding layer; 4. Self-healing layer; 5. Base layer; 6. Pressure-sensitive adhesive; 7. Graphene fiber network; 8. Conductive microcapsules; 9. Copper foil substrate; 10. Porous graphene structure. Detailed Implementation

[0022] To make the technical means, creative features, and achieved objectives and effects of this utility model easier to understand, the present utility model is further described below with reference to specific embodiments and accompanying drawings. However, the following embodiments are merely preferred embodiments of this utility model and not all of them. Other embodiments obtained by those skilled in the art based on the embodiments described in the implementation plan without creative effort are all within the protection scope of this utility model.

[0023] The specific embodiments of this utility model are described below with reference to the accompanying drawings. Specific Implementation Example 1: Reference Figure 1-4 An anti-electromagnetic interference graphene-reinforced copper foil tape includes a protective layer 1, a thermally conductive layer 2, a shielding layer 3, a self-healing layer 4, and a base layer 5. The base layer 5 is a flexible polymer material with a bottom surface and a top surface. The self-healing layer 4 is located on the top surface of the base layer 5 and is tightly bonded to the top surface of the base layer 5 by hot pressing. The self-healing layer 4 contains an interwoven graphene fiber network 7, and conductive microcapsules 8 are disposed in the graphene fiber network 7. When the conductive microcapsules 8 are damaged, they release conductive adhesive to repair the conductive path of the graphene fiber network 7. The shielding layer 3 is located on the top surface of the self-healing layer 4 and is bonded to the top surface of the self-healing layer 4 by vacuum lamination. The shielding layer 3 contains a copper foil substrate 9, and a porous graphene structure 10 is embedded in the copper foil substrate 9. The porous graphene structure 10 contains ferromagnetic particles to adjust the pore density in response to the external electromagnetic field. The thermally conductive layer 2 is located on the top surface of the shielding layer 3 and is bonded by chemical vapor deposition. The thermally conductive layer 2 includes a microchannel network arranged in a direction perpendicular to the surface of the shielding layer 3, and the microchannel network is filled with a thermally conductive medium. The protective layer 1 is located on the top surface of the thermally conductive layer 2 and is bonded by a coating process. The protective layer 1 is a nano-hydrophobic coating used to provide waterproof and anti-corrosion functions. The base layer 5, self-healing layer 4, shielding layer 3, thermally conductive layer 2 and protective layer 1 are stacked in sequence and connected in the above manner to form an integral structure. The total thickness of the tape is between 50 micrometers and 200 micrometers.

[0025] The graphene fiber network 7 in the self-healing layer 4 has a three-dimensional interlocking mesh structure with a mesh pore size between 10 nanometers and 100 nanometers. The conductive microcapsules 8 are embedded at the nodes of the graphene fiber network 7 through capillary action, and the diameter of the conductive microcapsules 8 is between 1 micrometer and 5 micrometers.

[0026] The porous graphene structure 10 in the shielding layer 3 has honeycomb-like pores with an average diameter of 50 nanometers to 500 nanometers. Ferromagnetic particles are embedded in the pore walls through a co-precipitation process, and the particle size of the ferromagnetic particles is 10 nanometers to 50 nanometers.

[0027] The microchannel network in the thermal conductive layer 2 is arranged in an alternating orthogonal direction. The cross-section of the microchannel is rectangular, with a width of 10 micrometers to 50 micrometers. The thermal conductive medium is filled into the microchannel by injection molding. The thermal conductive medium is graphene-based thermal conductive gel.

[0028] The bottom surface of the substrate 5 is coated with a pressure-sensitive adhesive 6 by a coating process. The thickness of the pressure-sensitive adhesive 6 is 10 micrometers to 30 micrometers, which is used to adhere the tape to the target surface.

[0029] A gradient interface transition layer is provided between the shielding layer 3 and the self-healing layer 4. The gradient interface transition layer is formed by a progressive coating process and bonded to the top surface of the self-healing layer 4 and the bottom surface of the shielding layer 3. The gradient interface transition layer includes a graphene particle density that gradually increases from the self-healing layer 4 to the shielding layer 3. The thickness of the gradient interface transition layer is 5 micrometers to 20 micrometers.

[0030] The nano-hydrophobic coating of the protective layer 1 is formed by vapor deposition and bonded to the top surface of the thermally conductive layer 2. The thickness is 1 micrometer to 5 micrometers, and the surface of the protective layer 1 has a micrometer-level wrinkled structure to enhance flexibility and resistance to mechanical damage.

[0031] The graphene fiber network 7 in the self-healing layer 4 is embedded in the elastic polymer matrix through a solution spinning process. The elastic polymer matrix has a wavy skeleton structure with a peak spacing of 50 to 100 micrometers, which is used to restore the conductive path through rebound after damage.

[0032] The layers of the tape are formed into an integral structure through continuous extrusion and lamination processes. The copper foil substrate 9 in the shielding layer 3 has a thickness of 20 micrometers to 50 micrometers, and the porous graphene structure 10 is embedded in the copper foil substrate 9 through chemical vapor deposition. The thickness of the porous graphene structure 10 is 10 micrometers to 30 micrometers.

[0033] When an external electromagnetic field is applied to the tape, the ferromagnetic particles in the shielding layer 3 compress the pores of the porous graphene structure 10 through magnetic field-induced movement, thereby improving the electromagnetic shielding efficiency of the shielding layer 3. Specific Implementation Example 2: Reference Figure 1-4 The graphene-reinforced copper foil tape for electromagnetic interference protection used in this application is a multi-layer composite material. It is mainly composed of a base layer 5, a self-healing layer 4, a shielding layer 3, a thermally conductive layer 2, and a protective layer 1, which are stacked sequentially from bottom to top. The total thickness is controlled between 50 micrometers and 200 micrometers to ensure the tape's flexibility and thinness, while achieving efficient electromagnetic interference shielding, self-healing repair, thermal management, and waterproof and anti-corrosion functions. The layers of the tape are formed into an integral structure through continuous extrusion and lamination processes. This process first pre-treats each layer of material and then extrudes it under high temperature and high pressure. Then, it is stacked and cured layer by layer through a laminator to ensure that the interlayer interfaces are tightly bonded, free of bubbles, and uniformly distributed, thereby improving the overall mechanical strength and functional stability.

[0035] The base layer 5, serving as the basic support layer of the tape, is made of a flexible polymer material (such as polyimide or polyester) and has a bottom surface and a top surface. The bottom surface is uniformly coated with pressure-sensitive adhesive 6 through a coating process. The thickness of the pressure-sensitive adhesive 6 is 10 to 30 micrometers. This adhesive is a pressure-sensitive adhesive material that can quickly adhere to the target surface, such as the housing of electronic devices or cables, under light pressure, thereby making the tape easy to install and fix. The top surface of the base layer 5 is tightly bonded to the self-healing layer 4 through hot-press bonding. This hot-press bonding process involves pressing the two layers together at a temperature of 150-200°C and appropriate pressure, allowing the polymer molecular chains to interpenetrate and form a strong bonded interface, preventing interlayer separation.

[0036] The self-healing layer 4 is one of the core functional layers of the tape, located on the top surface of the base layer 5. It contains an interwoven graphene fiber network 7 and conductive microcapsules 8. The graphene fiber network 7 has a three-dimensional interlocking mesh structure with pore sizes between 10 and 100 nanometers. This mesh is embedded in an elastic polymer matrix using a solution spinning process. The elastic polymer matrix (such as a polyurethane elastomer) has a wavy skeleton structure with a peak spacing of 50 to 100 micrometers. This wavy design provides elastic cushioning; when the tape suffers mechanical damage such as scratching or cutting, the wavy skeleton... The frame recovers its original shape through rebound, while the conductive microcapsules 8 are embedded in the grid nodes through capillary action. The microcapsules have a diameter of 1 to 5 micrometers. When damage breaks the outer shell of the microcapsules, the conductive adhesive inside (such as epoxy resin dispersed with silver nanoparticles) is released, quickly filling and curing the cracks, repairing the conductive path of the graphene fiber network 7, thereby restoring the overall conductivity and shielding performance of the tape. This self-healing mechanism is based on the rupture response of the microcapsules and the rapid polymerization principle of the adhesive, which can achieve damage repair within seconds and improve the durability of the tape in vibration or extreme environments.

[0037] The shielding layer 3 is located on the top surface of the self-healing layer 4 and is bonded to the top surface of the self-healing layer 4 through vacuum lamination. This vacuum lamination process is performed in a vacuum environment to avoid air inclusions, ensuring a smooth interface and continuous conductivity. The shielding layer 3 contains a copper foil substrate 9 and a porous graphene structure 10 embedded therein. The copper foil substrate 9 has a thickness of 20 to 50 micrometers and provides basic electromagnetic reflection shielding. The porous graphene structure 10 has a thickness of 10 to 30 micrometers and is embedded in the copper foil substrate 9 through chemical vapor deposition. This deposition process deposits graphene precursor gas onto the copper foil surface at high temperature to form a uniform... The composite porous graphene structure 10 has honeycomb-like pores with an average pore diameter of 50 to 500 nanometers. It contains embedded ferromagnetic particles (such as iron oxide nanoparticles) with a particle size of 10 to 50 nanometers. These particles are embedded in the pore walls through a co-precipitation process. When an external electromagnetic field is applied, the ferromagnetic particles compress the pores through magnetic field-induced movement, increasing the pore density and thereby enhancing the electron transport blocking and electromagnetic wave absorption capabilities of graphene. This adaptive shielding principle is based on magnetically controlled pore adjustment, which can improve electromagnetic shielding efficiency, especially in high-frequency EMI environments, reducing electromagnetic leakage and protecting internal electronic components.

[0038] A gradient interface transition layer with a thickness of 5 to 20 micrometers is provided between the shielding layer 3 and the self-healing layer 4. This transition layer is formed and bonded to the top surface of the self-healing layer 4 and the bottom surface of the shielding layer 3 through a progressive coating process. This progressive coating involves spraying a suspension of graphene particles with a gradually increasing concentration layer by layer, gradually increasing the graphene particle density from the self-healing layer 4 to the shielding layer 3. This gradient design optimizes the interlayer stress distribution and conductivity matching, prevents peeling caused by uneven thermal expansion, and enhances the continuity of electron transport, thereby improving the overall shielding stability and mechanical compatibility. The thermally conductive layer 2 is located on the top surface of the shielding layer 3 and is bonded to the top surface of the shielding layer 3 through chemical vapor deposition. This CVD bonding process deposits thermally conductive materials in a vacuum furnace to form atomic-level bonds, ensuring efficient heat conduction.

[0039] The thermally conductive layer 2 includes a network of microchannels arranged perpendicular to the surface of the shielding layer 3. The network is arranged in an alternating orthogonal direction. The cross-section of the microchannels is rectangular, with a width of 10 to 50 micrometers. The microchannels are formed by laser etching or photolithography. The microchannels are filled with a thermally conductive medium, which is a graphene-based thermally conductive gel (such as graphene-dispersed silica gel), by injection. This filling ensures uniform distribution of the medium. When the tape is in operation, heat generated from the shielding layer 3 (such as Joule heat generated by EMI absorption) is rapidly diffused and conducted to the outside through the microchannels. This thermal conductivity principle is based on a combination of convection and conduction, which can effectively dissipate heat, prevent performance degradation caused by heat accumulation, and improve the reliability of the tape in high-power electronic devices.

[0040] Protective layer 1 is located on the top surface of thermally conductive layer 2 and is bonded to the top surface of thermally conductive layer 2 by a coating process. This coating involves roller coating or spraying of nanomaterials followed by curing to form a uniform film. Protective layer 1 is a nano-hydrophobic coating formed by vapor deposition, with a thickness of 1 to 5 micrometers. Its surface has a micrometer-level wrinkled structure, which is formed by stencil imprinting or self-assembly process, providing a superhydrophobic surface with a lotus leaf effect. This structure enhances flexibility and resistance to mechanical damage, while also providing waterproof and anti-corrosion functions. The principle is that the wrinkles increase the surface roughness, reduce the water droplet contact angle, and allow water to roll off quickly, preventing water from penetrating the inner layer. At the same time, it blocks corrosive gases or chemicals, ensuring the long-term stability of the tape in humid or corrosive environments.

[0041] The overall working principle of the tape is multifunctional synergy: the base layer 5 and pressure-sensitive adhesive 6 provide the mounting foundation; the self-healing layer 4 achieves damage self-repair through microcapsules 8 and an elastic skeleton, maintaining structural integrity; the shielding layer 3 dynamically responds to EMI through a porous graphene structure 10 regulated by ferromagnetic particles, achieving efficient shielding; the microchannel network and thermal conductive medium of the thermally conductive layer 2 quickly dissipate heat; and the hydrophobic pleated structure of the protective layer 1 protects against external erosion. This integrated design enables the tape not only to shield electromagnetic interference, repair damage, dissipate heat and waterproof, but also to adapt to frequency conversion EMI and extreme conditions, improving the reliability and lifespan of electronic devices. For example, when used in 5G devices or electric vehicles, it can reduce signal interference, extend service life, and reduce maintenance costs.

[0042] It should be noted that the various layers of the tape in this solution have complementary functions, achieving synergistic effects rather than simple superposition. This significantly improves the durability, shielding efficiency, and environmental adaptability of the tape in scenarios such as 5G equipment and electric vehicles, demonstrating creativity.

[0043] In summary: 1. The base layer 5 serves as the basic support layer of the tape. It is made of a flexible polymer material (such as polyimide or polyester) and has a bottom surface and a top surface. The bottom surface is uniformly coated with pressure-sensitive adhesive 6 through a coating process. The thickness of the pressure-sensitive adhesive 6 is 10 micrometers to 30 micrometers. This adhesive is a pressure-sensitive adhesive material that can quickly adhere to the target surface, such as the housing of electronic devices or cables, under light pressure, thereby making the tape easy to install and fix. The top surface of the base layer 5 is tightly bonded to the self-healing layer 4 through hot-press bonding. This hot-press bonding process involves pressing the two layers together at a temperature of 150-200°C and appropriate pressure, so that the polymer molecular chains interpenetrate to form a strong bonded interface and avoid interlayer separation.

[0044] 2. A gradient interface transition layer is provided between the shielding layer 3 and the self-healing layer 4. The thickness of this transition layer is 5 micrometers to 20 micrometers. It is formed and bonded to the top surface of the self-healing layer 4 and the bottom surface of the shielding layer 3 through a progressive coating process. This progressive coating involves spraying a suspension with a gradually increasing concentration of graphene particles layer by layer. The density of graphene particles gradually increases from the self-healing layer 4 to the shielding layer 3. This gradient design optimizes the interlayer stress distribution and conductivity matching, prevents peeling caused by uneven thermal expansion, and enhances the continuity of electron transport, thereby improving the overall shielding stability and mechanical compatibility. The thermally conductive layer 2 is located on the top surface of the shielding layer 3 and is bonded to the top surface of the shielding layer 3 through chemical vapor deposition. This CVD bonding process deposits thermally conductive materials in a vacuum furnace to form atomic-level bonds, ensuring efficient heat conduction.

[0045] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0046] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A graphene-reinforced copper foil tape for electromagnetic interference resistance, comprising a protective layer (1), a thermally conductive layer (2), a shielding layer (3), a self-healing layer (4), and a base layer (5), wherein the base layer (5) has a bottom surface and a top surface, the self-healing layer (4) is located on the top surface of the base layer (5) and is tightly bonded to the top surface of the base layer (5) by thermo-pressing, wherein the self-healing layer (4) contains an interwoven graphene fiber network (7), and conductive microcapsules (8) are disposed in the graphene fiber network (7), and the shielding layer (3) contains a conductive microcapsules (8). Located on the top surface of the self-healing layer (4), and bonded to the top surface of the self-healing layer (4) by vacuum lamination, the shielding layer (3) contains a copper foil substrate (9), the copper foil substrate (9) contains a porous graphene structure (10), the porous graphene structure (10) contains ferromagnetic particles, the thermally conductive layer (2) is located on the top surface of the shielding layer (3) and is bonded by chemical vapor deposition; the protective layer (1) is located on the top surface of the thermally conductive layer (2) and is bonded by coating process, the protective layer (1) is a nano-hydrophobic coating.

2. The graphene-reinforced copper foil tape for electromagnetic interference suppression according to claim 1, characterized in that: The graphene fiber network (7) in the self-healing layer (4) has a three-dimensional interlocking mesh structure, and the conductive microcapsules (8) are embedded in the nodes of the graphene fiber network (7) through capillary action.

3. The graphene-reinforced copper foil tape for electromagnetic interference suppression according to claim 1, characterized in that: The porous graphene structure (10) in the shielding layer (3) has honeycomb-like pores, and the ferromagnetic particles are embedded in the pore walls by a co-precipitation process.

4. The graphene-reinforced copper foil tape for electromagnetic interference suppression according to claim 1, characterized in that: The bottom surface of the substrate layer (5) is coated with a pressure-sensitive adhesive (6) by a coating process, and the thickness of the pressure-sensitive adhesive (6) is 10 micrometers to 30 micrometers.

5. The graphene-reinforced copper foil tape for electromagnetic interference suppression according to claim 1, characterized in that: A gradient interface transition layer is provided between the shielding layer (3) and the self-healing layer (4). The gradient interface transition layer is formed by a progressive coating process and bonded to the top surface of the self-healing layer (4) and the bottom surface of the shielding layer (3). The gradient interface transition layer includes a graphene particle density that gradually increases from the self-healing layer (4) to the shielding layer (3).

6. The graphene-reinforced copper foil tape for electromagnetic interference suppression according to claim 1, characterized in that: The nano-hydrophobic coating of the protective layer (1) is formed by vapor deposition and bonded to the top surface of the thermally conductive layer (2), and the surface of the protective layer (1) has a micron-scale wrinkled structure.

7. The graphene-reinforced copper foil tape for electromagnetic interference suppression according to claim 1, characterized in that: The graphene fiber network (7) in the self-healing layer (4) is embedded in the elastic polymer matrix by solution spinning process, and the elastic polymer matrix has a wavy skeleton structure.

8. The graphene-reinforced copper foil tape for electromagnetic interference suppression according to claim 1, characterized in that: The layers of the tape are formed into an integral structure through continuous extrusion and lamination processes, and the porous graphene structure (10) is embedded in the copper foil substrate (9) by chemical vapor deposition.

9. The graphene-reinforced copper foil tape for electromagnetic interference suppression according to claim 1, characterized in that: When an external electromagnetic field is applied to the tape, the ferromagnetic particles in the shielding layer (3) compress the pores of the porous graphene structure (10) through magnetic field-induced movement.

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