Cluster sputtering apparatus
Patent Information
- Application Number
- CN202522515905.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-26
- Publication Date
- 2026-10-16
- Estimated Expiration
- 2035-11-26
AI Technical Summary
[0003]然而现有团簇束流生成设备存在明显不足:一方面,设备组装与测试阶段需频繁拆装大量重量、体积较大的零部件,不仅易导致生产人员生理疲惫、生产效率降低,还可能造成零部件损坏;另一方面,设备运行中,溅射阴极调节时真空密封易失效、角度调节依赖刚性连接导致精度低且密封易破损、冷凝腔与阴极同轴度差造成原子蒸汽冷却不均、可调节喷嘴仅能单一调节孔径而无法同步控压与筛选轴线束流、离子漏斗电势梯度不均导致团簇聚焦与传输效率低,这些问题共同制约了团簇束流的稳定高效输出
[0015] The cluster sputtering device of this utility model has at least the following beneficial effects: The core components of the device (condensation chamber, adjustable nozzle, ion funnel, etc.) all adopt a modular and detachable structure, allowing for quick assembly and disassembly, reducing personnel fatigue and component damage, and improving production and testing efficiency; the ion source adjusts the position of the sputtering cathode through the sliding cooperation of the guide rod and slider, while the corrugated pipe sleeves the guide rod and seals the connection between the first flange and the cathode. Combined with the peripheral protection and sealing of the differential cavity, this ensures reliable vacuum sealing during cathode adjustment, preventing gas intrusion; the condensation chamber is connected to the cluster chamber through an angle adjustment mechanism composed of an elastic pipe and uniformly arranged adjusting components, allowing for precise deflection and maintenance. The high coaxiality with the cathode, combined with the low-temperature cavity formed by the inner and outer walls of the condensation chamber (connected to the refrigerant through the inlet and outlet water pipes), enables uniform cooling of atomic vapor and avoids cluster size dispersion. The adjustable nozzle adopts a "gear drive + adjustable aperture" linkage structure, which can precisely adjust the aperture while promoting the expansion and acceleration of the cluster gas flow and screening the high-concentration beam near the axis. The ion funnel uses concentric stacked planar ring electrodes, applying a constant gradient DC voltage to form a uniform potential gradient field, which can efficiently focus and transmit clusters in both rough vacuum and high vacuum environments, ultimately ensuring the accuracy of cluster size and atomic number, and achieving efficient and stable output of cluster beam.
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Figure CN224858430U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of cluster beam technology, and in particular to a cluster sputtering device. Background Technology
[0002] In the field of cluster beam technology, cluster beam generation equipment is the core for realizing cluster preparation and application. It typically integrates an atomic gas generation system, a gas phase condensation system, a beam extraction and focusing system, a mass selection system, and a beam deposition system to sequentially complete atomic vapor generation, condensation and agglomeration, beam collimation, mass screening, and non-destructive deposition, which are ultimately applied to material preparation or surface modification. Moreover, this type of equipment has extremely high requirements for dimensional accuracy and vacuum environment to ensure the accuracy of cluster size and atomic number.
[0003] However, existing cluster beam generation equipment has significant shortcomings: on the one hand, the equipment assembly and testing phases require frequent disassembly and reassembly of a large number of heavy and bulky parts, which not only easily leads to physiological fatigue of production personnel and reduced production efficiency, but may also cause damage to parts; on the other hand, during equipment operation, the vacuum seal is prone to failure when adjusting the sputtering cathode, the angle adjustment relies on rigid connections, resulting in low precision and easy seal damage, the poor coaxiality between the condensation chamber and the cathode causes uneven cooling of atomic vapor, the adjustable nozzle can only adjust the aperture and cannot simultaneously control the pressure and screen the axial beam, and the uneven potential gradient of the ion funnel leads to low cluster focusing and transmission efficiency. These problems together restrict the stable and efficient output of cluster beams. Utility Model Content
[0004] To address the shortcomings of the existing technology, the technical problem to be solved by this utility model is to provide a cluster sputtering device that improves the vacuum sealing, angle adjustment accuracy, condensation coaxiality, and beam focusing and transmission stability during equipment operation, thereby ensuring the accuracy of cluster size and number of atoms and achieving efficient and stable output of cluster beam.
[0005] To solve the above-mentioned technical problems, the present invention provides a cluster sputtering device, including a cluster chamber, an ion source and a differential chamber disposed at one end of the cluster chamber, a condensation chamber disposed within the cluster chamber, and an adjustable nozzle. The ion source is connected to the cluster chamber through the differential chamber, one end of the condensation chamber is connected to the cluster chamber through an angle adjustment mechanism, and the adjustable nozzle is sealed at the other end of the condensation chamber. The atomic vapor generated by the ion source is cooled by the condensation chamber and then ejected through the adjustable nozzle.
[0006] Furthermore, the ion source includes a guide rod, a sputtering cathode, a connecting structure, and a first flange for connecting the guide rod to the differential cavity. One end of the guide rod near the differential cavity is connected to the sputtering cathode, and the other end coaxially passes through the first flange and is connected to the connecting structure. The guide rod can move relative to the first flange along its own axial direction.
[0007] Furthermore, the connection structure includes a mounting base, a bracket, and a slider. The bracket is disposed on the mounting base near the differential cavity. The first flange is disposed on the bracket. The slider is slidably disposed on the mounting base away from the first flange along the length direction of the guide rod. The side of the guide rod away from the sputtering cathode is connected to the slider. The guide rod can slide relative to the first flange. A bellows is disposed between the first flange and the sputtering cathode to cover the guide rod.
[0008] Furthermore, the differential cavity is sleeved on the outer periphery of the bellows, with one end of the differential cavity being sealed to the first flange and the other end being sealed to the cluster chamber.
[0009] Furthermore, the angle adjustment mechanism includes a second flange, a third flange, and an elastic pipe disposed between the second flange and the third flange. A plurality of evenly arranged adjusting members are provided between the second flange and the third flange. By adjusting the adjusting members, one side of the elastic pipe can be compressed, causing the angle adjustment structure to deflect and drive the condensation chamber to rotate. The second flange is connected to the cluster chamber, and the third flange is connected to the condensation chamber.
[0010] Furthermore, the adjusting component includes an adjusting bolt that passes through the second flange and the third flange, and the adjusting bolt is rotatably connected to the second flange and screwed to the third flange.
[0011] Furthermore, the condensation chamber is a cylindrical structure with openings at both ends and is arranged around the periphery of the sputtering cathode. The sputtering cathode and part of the corrugated pipe are located inside the condensation chamber. The condensation chamber includes an inner wall, an outer wall, an inlet pipe, and an outlet pipe. A cavity is formed between the inner wall and the outer wall. The inlet pipe and the outlet pipe are both connected to the cavity to receive and discharge refrigerant. One end of the condensation chamber is sealed to the cluster chamber through the angle adjustment mechanism.
[0012] Furthermore, the adjustable nozzle includes a fixed base, an adjustable aperture mounted on the fixed base, and a drive mechanism disposed between the fixed base and the adjustable aperture. The adjustable aperture has a lever for adjusting the aperture. The drive mechanism is used to drive the lever to rotate, thereby adjusting the aperture of the adjustable aperture. The drive mechanism includes a driven gear and a drive assembly for driving the driven gear. The lever is also used to connect to the driven gear so that the lever rotates relative to the adjustable aperture as the driven gear rotates.
[0013] Furthermore, the drive assembly includes a drive shaft and a main gear. The drive shaft is rotatably mounted on the fixed base and extends out at both ends. One end of the drive shaft is connected to an external power source, and the other end is fixedly connected to the main gear. The main gear is rotatably connected to the fixed base. The main gear meshes with the driven gear or the main gear meshes with the driven gear through a transmission gear.
[0014] Furthermore, it also includes an ion funnel disposed on the side of the adjustable nozzle from which the cluster particles are ejected. The ion funnel includes a DC power supply and N annular electrodes. The N annular electrodes are stacked concentrically from the inside out to form a planar structure. Each annular electrode has the same wall thickness. The radius of the N annular electrodes gradually increases from the inside out to form a concentric circle structure. Each annular electrode is spaced at the same distance. The DC power supply applies a DC voltage with a constant gradient to each annular electrode from the inside out.
[0015] The cluster sputtering device of this utility model has at least the following beneficial effects: The core components of the device (condensation chamber, adjustable nozzle, ion funnel, etc.) all adopt a modular and detachable structure, allowing for quick assembly and disassembly, reducing personnel fatigue and component damage, and improving production and testing efficiency; the ion source adjusts the position of the sputtering cathode through the sliding cooperation of the guide rod and slider, while the corrugated pipe sleeves the guide rod and seals the connection between the first flange and the cathode. Combined with the peripheral protection and sealing of the differential cavity, this ensures reliable vacuum sealing during cathode adjustment, preventing gas intrusion; the condensation chamber is connected to the cluster chamber through an angle adjustment mechanism composed of an elastic pipe and uniformly arranged adjusting components, allowing for precise deflection and maintenance. The high coaxiality with the cathode, combined with the low-temperature cavity formed by the inner and outer walls of the condensation chamber (connected to the refrigerant through the inlet and outlet water pipes), enables uniform cooling of atomic vapor and avoids cluster size dispersion. The adjustable nozzle adopts a "gear drive + adjustable aperture" linkage structure, which can precisely adjust the aperture while promoting the expansion and acceleration of the cluster gas flow and screening the high-concentration beam near the axis. The ion funnel uses concentric stacked planar ring electrodes, applying a constant gradient DC voltage to form a uniform potential gradient field, which can efficiently focus and transmit clusters in both rough vacuum and high vacuum environments, ultimately ensuring the accuracy of cluster size and atomic number, and achieving efficient and stable output of cluster beam. Attached Figure Description
[0016] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings: Figure 1 This is a schematic diagram of the structure of an embodiment of the cluster sputtering device of this utility model; Figure 2 This is a schematic cross-sectional view of an embodiment of the cluster sputtering device of this utility model. Figure 1 ; Figure 3 This is a schematic cross-sectional view of an embodiment of the cluster sputtering device of this utility model. Figure 2 ; Figure 4 This is a schematic diagram of the differential cavity structure in one embodiment of the cluster sputtering device of this utility model; Figure 5 This is a schematic diagram of the angle adjustment mechanism in one embodiment of the cluster sputtering device of this utility model; Figure 6 This is a schematic diagram of the condensation chamber in one embodiment of the cluster sputtering device of this utility model; Figure 7 This is a schematic diagram of the adjustable nozzle in one embodiment of the cluster sputtering device of this utility model; Figure 8 An explosion of the adjustable nozzle structure in one embodiment of the cluster sputtering device of this utility model. Figure 1 ; Figure 9 An explosion of the adjustable nozzle structure in one embodiment of the cluster sputtering device of this utility model. Figure 2 ; Figure 10 This is a cross-sectional schematic diagram of the adjustable nozzle in one embodiment of the cluster sputtering device of this utility model.
[0017] The meanings of the labels in the attached diagram are as follows: Cluster chamber 1; Ion source 2, guide rod 21, sputtering cathode 22, first flange 23, first mounting base 24, bracket 25, slider 26, bellows 27; Differential cavity 3, first connecting part 31, second connecting part 32, third connecting part 33; Angle adjustment mechanism 4, second flange 41, third flange 42, elastic pipe 43, adjusting bolt 44, cylinder 45; Condensation chamber 5, inner wall of the chamber 51, outer wall of the chamber 52, water inlet pipe 53, water outlet pipe 54, cavity 55; Adjustable nozzle 6, fixed base 61, mounting hole 611, adjustable aperture 62, lever 621, drive mechanism 63, driven gear 631, through hole 632, drive shaft 633, main gear 634, transmission gear 635, connecting mechanism 64, fourth flange 641, second mounting base 642, aperture fixing plate 643, exposed part 6431, groove 644, sealing groove 645, sealing ring 646, first through hole 647, second through hole 648; Ion funnel 7, ring electrode 71. Detailed Implementation
[0018] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0019] The following disclosure provides various embodiments or examples of different features for implementing this utility model. Specific examples of components and arrangements will be described below to simplify the utility model. Of course, these are merely examples and are not intended to limit the utility model. For example, in the following description, forming a first component above or on a second component may include embodiments where the first and second components are in direct contact, or embodiments where other components may be formed between the first and second components such that the first and second components are not in direct contact. Additionally, reference numerals and / or characters may be repeated in various instances of the utility model. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or configurations.
[0020] Furthermore, spatial relation terms such as "below," "under," "below," "above," and "above" may be used herein to readily describe the relationship between one element or component and another element (or component) or component (or component) as shown in the figure. In addition to the orientations shown in the figure, spatial relation terms will encompass various different orientations of the device in use or operation. The device may be positioned in other ways (rotated 90 degrees or in other orientations) and will be interpreted accordingly through the spatial relation descriptors used herein.
[0021] Furthermore, the technical parts described in this utility model and the appended claims are mainly the improved technical parts of this utility model, and do not limit the object protected by this utility model to only having these technical parts. Other known necessary components (structures and / or methods) and / or non-essential components of the protected object, other than the technical parts described in this utility model and the appended claims, are not included in this utility model and the appended claims because they do not fall within the scope of improvement of this utility model. However, this does not mean that the object protected by this utility model does not possess these known components.
[0022] The present invention will be further described below with reference to the accompanying drawings.
[0023] Please refer to Figures 1 to 10 The present invention provides a cluster sputtering device comprising a cluster chamber 1, an ion source 2 and a differential chamber 3 disposed at one end of the cluster chamber 1, a condensation chamber 5 disposed within the cluster chamber 1, an adjustable nozzle 6, and an ion funnel 7. The ion source 2 is connected to the cluster chamber 1 through the differential chamber 3. One end of the condensation chamber 5 is connected to the cluster chamber 1 through an angle adjustment mechanism 4. The adjustable nozzle 6 is sealed at the other end of the condensation chamber 5. The atomic vapor generated by the ion source 2 is cooled by the condensation chamber 5 and then ejected from the ion funnel 7 through the adjustable nozzle 6.
[0024] The ion source 2 includes a guide rod 21, a sputtering cathode 22, a connecting structure, and a first flange 23 for connecting the guide rod 21 to the differential cavity 3. The connecting structure includes a first mounting base 24, a bracket 25, and a slider 26. The bracket 25 is vertically disposed at one end of the first mounting base 24, and the first flange 23 is disposed at the upper end of the bracket 25. The slider 26 is slidably disposed on the first mounting base 24 along the length direction of the guide rod 21. The guide rod 21 is horizontally mounted in the middle of the first flange 23 and can slide relative to the first flange 23 along its own length direction. One end of the guide rod 21 extends to be fixedly connected to the slider 26, thereby sliding with the slider 26; the other end of the guide rod 21 is connected to the sputtering cathode 22. A bellows 27, which covers the guide rod 21, is provided between the first flange 23 and the sputtering cathode 22. When the guide rod 21 slides relative to the first flange 23, the bellows 27 is stretched or contracted accordingly, thereby ensuring the isolation of the sputtering cathode 22 from the space outside the cluster chamber 1. The guide rod 21 is hollow to allow the passage of wires connected to the sputtering cathode 22.
[0025] The differential cavity 3 has a first connecting portion 31 for connecting to the cluster chamber 1, a second connecting portion 32 disposed on the first connecting portion 31, and a third connecting portion 33. The second connecting portion 32 is a hollow cylindrical shape, and the cavity in its middle extends through the first connecting portion 31. The second connecting portion 32 is used for connecting a first flange 23. When the differential cavity 3 is connected to the cluster chamber 1, the guide rod 21 and the bellows 27 extend into the cluster chamber 1 through the cavity in the middle of the second connecting portion 32. The third connecting portion 33 is used to connect a delivery pipe for supplying cooling medium to the condensation chamber 5.
[0026] The angle adjustment mechanism 4 includes a second flange 41, a third flange 42, and an elastic pipe 43 disposed between the second flange 41 and the third flange 42. The second flange 41 is connected to the inner wall of the cluster chamber 1 near the differential chamber 3, and the third flange 42 is connected to the condensation chamber 5. The condensation chamber 5 and the elastic pipe 43 are both sleeved on the outside of the guide rod 21 and the bellows 27. A plurality of evenly arranged adjusting members are provided between the second flange 41 and the third flange 42. By adjusting the adjusting members, one side of the elastic pipe 43 can be compressed, causing the angle adjustment mechanism to deflect and drive the condensation chamber 5 to rotate.
[0027] The adjusting components include an adjusting bolt 44 and a cylinder 45 threadedly matched with the adjusting bolt 44. The adjusting bolt 44 is rotatably mounted on the second flange 41, and the central axis of the adjusting bolt 44 is parallel to the central axis of the second flange 41. The end of the adjusting bolt 44 extends toward the third flange 42, and an adjusting hole for the adjusting bolt 44 to pass through is provided at a corresponding position on the third flange 42. The inner diameter of the adjusting hole is larger than the outer diameter of the adjusting bolt 44 to allow for movement of the adjusting bolt 44. The cylinder 45 is screwed onto the outer circumference of the adjusting bolt 44 and is rotatably connected to the side of the third flange 42 facing the second flange 41. Several sets of the adjusting components are arranged evenly spaced in a circular pattern with the central axis of the second flange 41 as the center. By adjusting different adjusting components, the effect of compressing one side of the elastic pipe 43 can be achieved.
[0028] The condensing chamber 5 is a cylindrical structure open at both ends and arranged around the sputtering cathode 22. One end of the condensing chamber 5 is connected to the third flange 42. The sputtering cathode 22 and part of the bellows 27 are located inside the condensing chamber 5. The condensing chamber 5 includes an inner wall 51, an outer wall 52, an inlet pipe 53, and an outlet pipe 54. A cavity 55 is formed between the inner wall 51 and the outer wall 52. The inlet pipe 53 and the outlet pipe 54 are both connected to the cavity 55 to receive and discharge refrigerant. There are two third connecting parts 33. The other ends of the inlet pipe 53 and the outlet pipe 54 are respectively connected to the two third connecting parts 33. The third connecting parts 33 are externally connected to equipment for conveying the cooling medium (not shown in the figure).
[0029] The adjustable nozzle 6 is located on the side of the condensation chamber 5 away from the angle adjustment mechanism 4 and closes the condensation chamber 5. The adjustable nozzle 6 includes a fixed base 61, an adjustable aperture 62 mounted on the fixed base 61, and a drive mechanism 63 disposed between the fixed base 61 and the adjustable aperture 62. The adjustable aperture 62 has a lever 621 for adjusting the aperture, and the drive mechanism 63 is used to drive the lever 621 to rotate, thereby adjusting the aperture of the adjustable aperture 62. The adjustable aperture 62 is detachably connected to the fixed base 61 through a set of connecting mechanisms 64.
[0030] The connecting mechanism 64 includes a fourth flange 641, a second mounting base 642, and an aperture fixing plate 643. The mounting base 61 has a mounting hole 611 for assembling the connecting mechanism 64, and the mounting hole 611 extends through the mounting base 61 along its thickness direction. The mounting hole 611 has a first hole and a second hole arranged coaxially. The inner diameter of the first hole is smaller than the inner diameter of the second hole to form a stepped surface between the first and second holes. This stepped surface is used to axially limit the movement of the second mounting base 642.
[0031] The outer diameter of the second mounting base 642 matches the mounting hole 611 so that it can be engaged within the mounting hole 611. Both axial sides of the second mounting base 642 are exposed outside the mounting hole 611. The aperture fixing plate 643 is coaxially and detachably disposed on the side of the second mounting base 642 exposed outside the first hole. In this embodiment, the aperture fixing plate 643 and the second mounting base 642 share a first fixing hole. A first fixing bolt (not shown in the figure) is disposed in the first fixing hole to connect the second mounting base 642 and the aperture mounting plate. The first fixing hole has several holes evenly spaced around the axis of the second mounting base 642 and the aperture fixing plate 643. The first fixing bolt also has several matching holes. The side of the aperture fixing plate 643 away from the second mounting base 642 has an exposed portion 6431 exposed outside the first hole. The exposed portion 6431 is arc-shaped. The adjustable aperture 62 is engaged within the inner circumference of the exposed portion 6431, and the lever 621 extends radially from the arc-shaped notch of the exposed portion 6431.
[0032] The fourth flange 641 is detachably disposed on the side of the second mounting base 642 away from the aperture mounting plate. A groove 644 is formed on the side of the fourth flange 641 facing the second mounting base 642, the inner diameter of which matches the outer diameter of the second mounting base 642 for the second mounting base 642 to be accommodated. A sealing groove 645 is formed on the side of the second mounting base 642 facing the fourth flange 641, and a sealing ring 646 is disposed within the sealing groove 645. The second mounting base 642 and the fourth flange 641 can press the sealing ring 646 together from both sides to increase the sealing performance between them. A second fixing hole is formed between the second mounting base 642 and the fourth flange 641, and a second fixing bolt (not shown in the figure) is disposed within the second fixing hole to connect the second mounting base 642 and the fourth flange 641. Several second fixing holes are evenly spaced circumferentially around the axis of the second mounting base 642 and the aperture fixing plate 643, and several second fixing bolts are also provided, each matching the previous one. A third fixing hole is provided between the fourth flange 641 and the fixing base 61. A third fixing bolt (not shown in the figure) is provided in the third fixing hole to connect the fourth flange 641 and the fixing base 61. When the fourth flange 641 is connected to the fixing base 61, the second mounting base 642 and the aperture fixing plate 643 can be fixed to the fixing base 61. The fourth flange 641 is also used to connect and seal the end of the condensation chamber 5 away from the angle adjustment mechanism 4.
[0033] A first through hole 647 is formed at the center of the fourth flange 641, penetrating the fourth flange 641. The inner diameter of the first through hole 647 gradually decreases from the distance from the second mounting base 642 to the distance from the second mounting base 642, forming a frustum-shaped hole. A second through hole 648 is formed at the center of the second mounting base 642, penetrating the second mounting base 642. The inner diameter of the second through hole 648 gradually decreases from the distance from the fourth flange 641 to the distance from the fourth flange 641, forming a frustum-shaped hole. The maximum inner diameter of the second through hole 648 matches the minimum inner diameter of the first through hole 647 for mutual connection and matching. The first through hole 647 and the second through hole 648 allow the cluster beam to pass through, and after passing through, the cluster beam exits through the hole in the middle of the adjustable aperture 62 to achieve the jetting of the cluster beam. Such a frustum-shaped aperture can guide the cluster beam. When the cluster beam passes through, the scattered beams will collide with the conical structure, while the highly concentrated beams will pass through the circular aperture of the aperture, thus filtering out the highly concentrated beams and improving the sputtering quality.
[0034] The drive mechanism 63 includes a driven gear 631 and a drive assembly for driving the driven gear 631. The drive shaft 633 is rotatably sleeved on the outer periphery of the exposed portion. The driven gear 631 has a radially extending through hole 632, into which the lever 621 is inserted. The drive assembly includes a drive shaft 633 and a main gear 634. The drive shaft 633 is rotatably mounted on the fixed base 61, with both ends extending outwards. One end of the drive shaft 633 is connected to an external power source, and the other end is fixedly connected to the main gear 634. The main gear 634 is rotatably connected to the fixed base 61, and the main gear 634 meshes with the driven gear 631, or the main gear 634 meshes with the driven gear 631 via a transmission gear 635. In this embodiment, a transmission gear 635 is provided on the fixed base 61 at a position corresponding to the position between the main gear 634 and the driven gear 631, and there are several transmission gears 635.
[0035] The particle funnel is positioned on the side of the adjustable nozzle 6 away from the condensation chamber 5 to receive particles ejected from the adjustable nozzle 6. The ion funnel 7 includes a DC power supply and N annular electrodes 71. The N annular electrodes 71 are stacked concentrically from the inside out, forming a planar structure. Each annular electrode 71 has the same wall thickness, and the radii of the N annular electrodes 71 gradually increase from the inside out, forming concentric circles. Each annular electrode 71 is spaced at the same distance. The DC power supply applies a constant gradient DC voltage to each annular electrode 71 from the inside out. Based on the focusing principle, the gradient voltage of the different concentric annular electrodes 71 creates a potential gradient field stacked on the same plane, from the outside in and from high to low. Therefore, a large range of particles will be rapidly and strongly focused within the same plane.
[0036] Compared with existing technologies, the cluster sputtering device of this invention adopts a modular and detachable structure for its core components (condensation chamber, adjustable nozzle, ion funnel, etc.), allowing for quick assembly and disassembly, reducing personnel fatigue and component damage, and improving production and testing efficiency. The ion source adjusts the position of the sputtering cathode through the sliding cooperation of a guide rod and a slider. Simultaneously, a corrugated pipe sleeves the guide rod and seals the connection between the first flange and the cathode. Combined with the peripheral protection and sealing of the differential cavity, this ensures reliable vacuum sealing during cathode adjustment, preventing gas intrusion. The condensation chamber is connected to the cluster chamber via an angle adjustment mechanism composed of an elastic pipe and uniformly arranged adjusting components, allowing for precise deflection and maintaining alignment with the surrounding structure. The high coaxiality of the cathode, combined with the low-temperature cavity formed by the inner and outer walls of the condensation chamber (connected to the refrigerant through the inlet and outlet water pipes), achieves uniform cooling of atomic vapor and avoids cluster size dispersion. The adjustable nozzle adopts a "gear drive + adjustable aperture" linkage structure, which can precisely adjust the aperture while promoting the expansion and acceleration of the cluster gas flow and screening the high-concentration beam near the axis. The ion funnel uses concentric stacked planar ring electrodes, applying a constant gradient DC voltage to form a uniform potential gradient field, which can efficiently focus and transmit clusters in both rough vacuum and high vacuum environments, ultimately ensuring the accuracy of cluster size and atomic number, and achieving efficient and stable output of cluster beam.
[0037] The above embodiments only illustrate preferred implementations of this utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.
Claims
1. A cluster sputtering apparatus, comprising a cluster chamber, characterized in that: It also includes an ion source and a differential chamber disposed at one end of the cluster chamber, a condensation chamber disposed within the cluster chamber, and an adjustable nozzle. The ion source is connected to the cluster chamber through the differential chamber. One end of the condensation chamber is connected to the cluster chamber through an angle adjustment mechanism. The adjustable nozzle is sealed and installed at the other end of the condensation chamber. The atomic vapor generated by the ion source is cooled by the condensation chamber and then ejected through the adjustable nozzle.
2. The cluster sputtering apparatus as described in claim 1, characterized in that: The ion source includes a guide rod, a sputtering cathode, a connecting structure, and a first flange for connecting the guide rod to the differential cavity. One end of the guide rod near the differential cavity is connected to the sputtering cathode, and the other end is coaxially inserted through the first flange and connected to the connecting structure. The guide rod can move relative to the first flange along its own axial direction.
3. The cluster sputtering apparatus as described in claim 2, characterized in that: The connection structure includes a mounting base, a bracket, and a slider. The bracket is disposed on the mounting base near the differential cavity. The first flange is disposed on the bracket. The slider is slidably disposed on the mounting base away from the first flange along the length direction of the guide rod. The side of the guide rod away from the sputtering cathode is connected to the slider. The guide rod can slide relative to the first flange. A bellows is disposed between the first flange and the sputtering cathode to cover the guide rod.
4. The cluster sputtering apparatus as described in claim 3, characterized in that: The differential cavity is fitted around the outer periphery of the bellows, with one end of the differential cavity being sealed to the first flange and the other end being sealed to the cluster chamber.
5. The cluster sputtering apparatus as described in claim 1, characterized in that: The angle adjustment mechanism includes a second flange, a third flange, and an elastic pipe disposed between the second flange and the third flange. A plurality of evenly arranged adjusting members are provided between the second flange and the third flange. By adjusting the adjusting members, one side of the elastic pipe can be compressed, causing the angle adjustment structure to deflect and drive the condensation chamber to rotate. The second flange is connected to the cluster chamber, and the third flange is connected to the condensation chamber.
6. The cluster sputtering apparatus as described in claim 5, characterized in that: The adjusting component includes an adjusting bolt that passes through the second flange and the third flange, and is rotatably connected to the second flange and screwed to the third flange.
7. The cluster sputtering apparatus as described in claim 3, characterized in that: The condensation chamber is a cylindrical structure with openings at both ends and is arranged around the periphery of the sputtering cathode. The sputtering cathode and part of the corrugated pipe are located inside the condensation chamber. The condensation chamber includes an inner wall, an outer wall, an inlet pipe, and an outlet pipe. A cavity is formed between the inner wall and the outer wall. The inlet pipe and the outlet pipe are both connected to the cavity to receive and discharge refrigerant. One end of the condensation chamber is sealed to the cluster chamber through the angle adjustment mechanism.
8. The cluster sputtering apparatus as described in claim 1, characterized in that: The adjustable nozzle includes a fixed base, an adjustable aperture mounted on the fixed base, and a drive mechanism disposed between the fixed base and the adjustable aperture. The adjustable aperture has a lever for adjusting the aperture. The drive mechanism is used to drive the lever to rotate, thereby adjusting the aperture of the adjustable aperture. The drive mechanism includes a driven gear and a drive assembly for driving the driven gear. The lever is also used to connect to the driven gear so that the lever rotates relative to the adjustable aperture as the driven gear rotates.
9. The cluster sputtering apparatus as described in claim 8, characterized in that: The drive assembly includes a drive shaft and a main gear. The drive shaft is rotatably mounted on the fixed base and extends out at both ends. One end of the drive shaft is connected to an external power source, and the other end is fixedly connected to the main gear. The main gear is rotatably connected to the fixed base. The main gear meshes with the driven gear or meshes with the driven gear through a transmission gear.
10. The cluster sputtering apparatus as described in claim 1, characterized in that: It also includes an ion funnel disposed on the side of the adjustable nozzle from which the cluster particles are ejected. The ion funnel includes a DC power supply and N annular electrodes. The N annular electrodes are stacked concentrically from the inside out to form a planar structure. The wall thickness of each annular electrode is the same. The radius of the N annular electrodes gradually increases from the inside out to form a concentric circle structure. The same spacing is provided between each annular electrode. The DC power supply applies a DC voltage with a constant gradient to each annular electrode from the inside out.