A shower device and thin film deposition apparatus

Abstract

The application provides a spraying device and a thin film deposition equipment. The spraying device comprises a shell assembly and a heating wire. An inner part of the shell assembly is enclosed to form a mounting cavity. The heating wire is fixed in the mounting cavity. The heating wire comprises a first leading segment, a second leading segment and a bending segment. The first leading segment and the second leading segment are located on the same side. Two ends of the bending segment are connected with the first leading segment and the second leading segment respectively. The bending segment extends along the circumference of the mounting cavity in a reciprocating bending manner and is uniformly distributed in the mounting cavity. The heating wire is designed to comprise the first leading segment, the second leading segment and the bending segment. The bending segment extends along the circumference of the mounting cavity in a reciprocating bending manner and is uniformly distributed in the mounting cavity. Thus, the heating area of the heating wire is increased, the heat transfer efficiency and the heat conduction effect of the shell assembly are improved, the uniformity of the heating of the spraying device is improved, and the yield and the performance consistency of the semiconductor product are improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a spraying device and a thin film deposition equipment. Background Technology

[0002] In semiconductor manufacturing processes, chemical vapor deposition (CVD) and atomic layer deposition (ALD) equipment typically employ different reaction processes depending on the requirements. Some reaction processes often require heating the spray device to ensure that the process gas maintains the required temperature within the reaction chamber. This prevents problems such as uneven film formation and abnormal film stress caused by excessive heat dissipation, thereby ensuring product yield.

[0003] Currently, high-temperature spray systems commonly employ a solution with built-in metal heating wires. However, existing heating wires have physical bending structures due to layout requirements, creating localized low-temperature points. This design flaw results in an uneven thermal distribution within the heating wire itself. This non-uniformity, after being conducted through layers of the spray system material, is amplified into a significant temperature gap on its working surface. This gap not only causes continuous heat loss from the reaction chamber, disrupting the uniformity of the process thermal field, but also directly leads to quality defects such as film deviance at the wafer edge, severely restricting the production yield and performance consistency of high-end semiconductor devices. Utility Model Content

[0004] This utility model provides a spraying device and a thin film deposition equipment to solve the problem of uneven heating in the spraying device, which leads to low yield and performance consistency of semiconductor products.

[0005] This utility model provides a spraying device, which includes: The outer casing assembly has an internal enclosure that forms a mounting cavity. A heating wire is fixed in the mounting cavity. The heating wire includes a first lead-out section, a second lead-out section, and a bent section. The first lead-out section and the second lead-out section are located on the same side. The two ends of the bent section are respectively connected to the first lead-out section and the second lead-out section. The bent section extends and bends circumferentially along the mounting cavity and is evenly distributed in the mounting cavity.

[0006] In the spray device provided by this utility model, the outer shell assembly includes a first protective cover and a second protective cover that are connected to each other. The first protective cover and the second protective cover enclose the mounting cavity, and the first protective cover and the second protective cover are respectively fixedly connected to the upper and lower sides of the heating wire.

[0007] In the spraying device provided by this utility model, the heating wire is fixedly connected to the first protective cover by an insulating adhesive; and / or, the heating wire is fixedly connected to the second protective cover by an insulating adhesive.

[0008] In the spraying device provided by this utility model, the thermal conductivity of the second protective cover is greater than that of the first protective cover.

[0009] In the spraying device provided by this utility model, the first protective cover is made of stainless steel, and / or the second protective cover is made of aluminum alloy.

[0010] In the spraying device provided by this utility model, the spraying device further includes a heat insulation component, which is fixed to the top of the outer shell assembly.

[0011] In the spraying device provided by this utility model, the heat insulation component is Teflon heat insulation cotton.

[0012] In the spraying device provided by this utility model, the spraying device further includes a top plate, which is fixed to the bottom end of the outer shell assembly.

[0013] In the spraying device provided by this utility model, the spraying device further includes a spraying plate, which is fixed to the bottom end of the top plate.

[0014] This utility model also provides a thin film deposition apparatus, which includes: A spraying device, wherein the spraying device is any of the spraying devices described above.

[0015] This application designs the heating wire to include a first lead-out section, a second lead-out section, and a bent section. The bent section extends and bends circumferentially along the mounting cavity and is evenly distributed within the mounting cavity, thereby increasing the heating area of ​​the heating wire, increasing the heat transfer efficiency and thermal conductivity of the housing assembly, thereby improving the heating uniformity of the spray device, and further improving the yield and performance consistency of semiconductor products. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figures 1a-1b These are structural diagrams of the spray device at various angles in the embodiments of this utility model; Figure 2 This is a cross-sectional view of the spraying device in an embodiment of the present invention; Figure 3 This is an exploded view of the spraying device in an embodiment of this utility model; Figure 4 This is a structural diagram of the heating wire in an embodiment of the present invention.

[0018] The labels for the attached figures are as follows: 1. Outer shell assembly; 11. Mounting cavity; 12. First protective cover; 13. Second protective cover; 2. Heating wire; 21. First lead-out section; 22. Second lead-out section; 23. Bending section; 3. Insulation component; 4. Top plate; 5. Spray plate; 6. Thermocouple. Detailed Implementation

[0019] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The preferred embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0020] Reference Figures 1a to 4 The diagram illustrates an embodiment of the spraying device and thin film deposition equipment of this invention. The spraying device includes a housing assembly 1 and a heating wire 2. The housing assembly 1 encloses a mounting cavity 11. The heating wire 2 is fixed within the mounting cavity 11 and includes a first lead-out section 21, a second lead-out section 22, and a bent section 23. The first lead-out section 21 and the second lead-out section 22 are located on the same side. The two ends of the bent section 23 are respectively connected to the first lead-out section 21 and the second lead-out section 22. The bent section 23 extends and bends circumferentially along the mounting cavity 11 and is evenly distributed within the mounting cavity 11.

[0021] Specifically, the spraying device is used in thin film deposition equipment in the semiconductor field. The spraying device can spray process gas towards the wafer, thereby improving the mixing degree and uniformity of the process gas, ensuring that the process gas is mixed evenly after passing through the spraying device so as to react and generate a thin film on the wafer surface, and at the same time ensuring that the process gas can be evenly sprayed to various positions on the wafer to improve the uniformity of the thin film on the wafer surface.

[0022] The spraying device includes a housing assembly 1 and a heating wire 2. The housing assembly 1 protects the heating wire 2, preventing it from contacting external objects, thus improving the service life of the heating wire 2 and the safety of the spraying device. Simultaneously, the housing assembly 1 also transfers the heat generated by the heating wire 2 to heat the spray plate 5 of the spraying device, thereby ensuring the reaction environment of the process gas. The interior of the housing assembly 1 forms a mounting cavity 11 for mounting the heating wire 2.

[0023] Furthermore, referring to Figure 3 As shown, the outer shell assembly 1 has a double-ring structure, with the middle part used for the passage of process gas so that the process gas flows to the spray plate 5; the mounting cavity 11 is located between the inner ring and the outer ring of the outer shell assembly 1 and is a sealed space, and the mounting cavity 11 extends along the circumference of the outer shell assembly 1.

[0024] Reference Figure 4 As shown, the heating wire 2 has the function of generating heat to heat the spray device, thereby ensuring the temperature of the process gas in the reaction chamber. The heating wire 2 is fixed in the mounting cavity 11 to improve the structural stability of the spray device. The heating wire 2 includes a first lead-out section 21, a second lead-out section 22, and a bent section 23. The first lead-out section 21 and the second lead-out section 22 are used to connect to an AC power source so that current can be input into the heating wire 2, thereby causing the heating wire 2 to generate heat. That is, the first lead-out section 21 and the second lead-out section 22 are the starting point and the ending point of the heating wire 2, respectively. An external power source is connected to the first lead-out section 21 and the second lead-out section 22 to provide AC power to the heating wire 2, causing the heating wire 2 to heat up.

[0025] The two ends of the bent section 23 are respectively connected to the first lead-out section 21 and the second lead-out section 22, so that the heating wire 2 forms a circuit, and the current can flow in from the first lead-out section 21 and along the first lead-out section 21 and the bent section 23 to the second lead-out section 22, and finally flow out through the second lead-out section 22.

[0026] The bending section 23 extends and bends reciprocally along the circumference of the mounting cavity 11, and the bending section 23 is evenly distributed in the mounting cavity 11, thereby increasing the distribution area of ​​the heating wire 2 and the uniformity of heating of the heating wire 2, so as to improve the contact area and heating uniformity between the heating wire 2 and the outer shell assembly 1, thereby increasing the heat conduction effect of the outer shell assembly 1, thereby improving the heating effect and heating uniformity of the spraying device, avoiding the occurrence of low temperature points, which could cause edge deviation during film formation.

[0027] More specifically, the bending section 23 is generally annular, and the first lead-out section 21 and the second lead-out section 22 are located on one side of the bending section 23, so that the heating range of the bending section 23 is more in line with the shape of the outer shell assembly 1, thereby further increasing the heat transfer area of ​​the outer shell assembly 1 and improving the heating effect and heating uniformity of the spray device.

[0028] Furthermore, referring to Figure 4 As shown, the bent section 23 is a meandering serpentine channel structure. The bent section 23 is processed into a serpentine channel by laser processing to improve the heating area and heating uniformity of the heating wire 2.

[0029] Therefore, this application designs the heating wire 2 to include a first lead-out section 21, a second lead-out section 22, and a bent section 23. The bent section 23 extends and bends along the circumference of the mounting cavity 11 and is evenly distributed within the mounting cavity 11, thereby increasing the heating area of ​​the heating wire 2, increasing the heat transfer efficiency and heat conduction effect of the outer shell assembly 1, thereby improving the heating uniformity of the spray device, and further improving the yield and performance consistency of semiconductor products.

[0030] In one embodiment, reference is made to Figures 2 to 3 As shown, the outer casing assembly 1 includes a first protective cover 12 and a second protective cover 13 connected to each other. The first protective cover 12 and the second protective cover 13 enclose the mounting cavity 11, and the first protective cover 12 and the second protective cover 13 are respectively fixedly connected to the upper and lower sides of the heating wire 2. Specifically, the outer casing assembly 1 includes a first protective cover 12 and a second protective cover 13, which are connected to each other and enclose the mounting cavity 11, where the heating wire 2 is installed.

[0031] Meanwhile, the first protective cover 12 is fixedly connected to the upper side of the heating wire 2, and the second protective cover 13 is fixedly connected to the lower side of the heating wire 2. That is, the first protective cover 12 and the second protective cover 13 are located on the upper and lower sides of the heating wire 2, respectively, and the heating wire 2 is covered inside the first protective cover 12 and the second protective cover 13. Therefore, the first protective cover 12 and the second protective cover 13 jointly protect the heating wire 2 and transfer the heat of the heating wire 2 to the spray plate 5 of the spray device to heat the process gas.

[0032] Furthermore, a connecting portion is provided on one side of the first protective cover 12 and the second protective cover 13. The connecting portion protrudes outward from one side of the mounting cavity 11 and connects the mounting cavity 11 to the outside. The first lead-out section 21 and the second lead-out section 22 are fixed to the connecting portion, thereby connecting the first lead-out section 21 and the second lead-out section 22 to an external power source.

[0033] In a specific embodiment, the heating wire 2 is fixedly connected to the first protective cover 12 via an insulating adhesive; and / or, the heating wire 2 is fixedly connected to the second protective cover 13 via an insulating adhesive (not shown in the figure). Specifically, the heating wire 2 is fixedly connected to the first protective cover 12 and the second protective cover 13, with the upper end of the heating wire 2 fixedly connected to the first protective cover 12 and the lower end of the heating wire 2 fixedly connected to the second protective cover 13. In conventional fixing methods, the heating wire 2 is mainly fixed to the first protective cover 12 and the second protective cover 13 by welding. However, this method will create gaps between the heating wire 2 and the first protective cover 12 and the second protective cover 13, thereby reducing the contact area between the heating wire 2 and the first protective cover 12 and the second protective cover 13, and thus affecting the thermal conductivity and thermal effect of the outer shell assembly 1.

[0034] Therefore, in this embodiment, the upper end of the heating wire 2 is fixedly connected to the first protective cover 12 through an insulating adhesive, and the insulating adhesive is located between the first protective cover 12 and the heating wire 2. The insulating adhesive has the functions of insulation and adhesion, thereby insulating the heating wire 2 and avoiding safety hazards and operational risks. In addition, the insulating adhesive can also fix the heating wire 2 on the first protective cover 12. The fixing method is simple, and it can also make the heating wire 2 completely fit the first protective cover 12, thereby increasing the contact area between the heating wire 2 and the first protective cover 12 and improving the thermal conductivity and thermal conductivity effect of the first protective cover 12.

[0035] And / or, the lower end of the heating wire 2 is fixedly connected to the second protective cover 13 through an insulating adhesive, and the insulating adhesive is located between the second protective cover 13 and the heating wire 2. The insulating adhesive has the functions of insulation and adhesion, thereby insulating the heating wire 2 and avoiding safety hazards and operational risks. In addition, the insulating adhesive can also fix the heating wire 2 on the second protective cover 13. The fixing method is simple and can also make the heating wire 2 completely fit the second protective cover 13, thereby increasing the contact area between the heating wire 2 and the second protective cover 13 and improving the thermal conductivity and thermal conductivity effect of the first protective cover 12.

[0036] In one embodiment, the thermal conductivity of the second protective cover 13 is greater than that of the first protective cover 12. Specifically, the first protective cover 12 is located above the heating wire 2, the second protective cover 13 is located below the heating wire 2, and the spray plate 5 of the spray device is located below the heating wire 2, that is, the spray plate 5 is located below the second protective cover 13, and the heating wire 2 mainly heats the spray plate 5. Therefore, heat needs to be transferred from the heating wire 2 to the second protective cover 13 and then to the spray plate 5 to ensure the temperature of the process gas on the spray plate 5.

[0037] Therefore, in this embodiment, the thermal conductivity of the second protective cover 13 is set to be greater than that of the first protective cover 12. A higher thermal conductivity indicates better thermal conductivity, and the second protective cover 13 has a higher thermal conductivity than the first protective cover 12. When the heating wire 2 is working, the heat generated by the heating wire 2 is transferred to both the first protective cover 12 and the second protective cover 13. Since the thermal conductivity of the second protective cover 13 is greater than that of the first protective cover 12, the second protective cover 13 transfers the heat from the heating wire 2 more efficiently. This allows most of the heat generated by the heating wire 2 to flow to the spray plate 5 via the second protective cover 13, reducing the amount of heat from the heating wire 2 flowing to the outside via the first protective cover 12. This avoids excessive heat loss during heat transfer and improves the heating effect and efficiency of the spray device.

[0038] In a specific embodiment, the first protective cover 12 is made of stainless steel, and / or the second protective cover 13 is made of aluminum alloy. Specifically, the first protective cover 12 is fixed above the heating wire 2, and the area above the first protective cover 12 is the atmosphere. Therefore, the first protective cover 12 mainly serves to protect the heating wire 2. The first protective cover 12 is made of stainless steel, which has excellent corrosion resistance, can resist the erosion of air, water vapor, acids and alkalis, and is not easy to rust; it has high mechanical strength, and also has toughness and hardness, can withstand certain pressure and impact, and has a long service life. Therefore, the first protective cover 12 has the advantages of corrosion resistance and high strength, thereby better protecting the heating wire 2. In addition, the thermal conductivity of stainless steel is low, so as to avoid most of the heat of the heating wire 2 flowing to the outside through the first protective cover 12, reducing heat loss.

[0039] And / or, the second protective cover 13 is made of aluminum alloy. The second protective cover 13 is fixed below the heating wire 2, and the spray plate 5 is located below the second protective cover 13. Therefore, the heat of the heating wire 2 needs to be transferred to the spray plate 5 through the second protective cover 13. The second protective cover 13 mainly has the functions of protecting the heating wire 2 and transferring heat. The second protective cover 13 is made of aluminum alloy. Aluminum alloy has the advantages of low density and light weight, excellent strength, natural corrosion resistance, good processing performance, and good thermal and electrical conductivity. Therefore, the second protective cover 13 has the advantages of high strength and good thermal conductivity, so that the second protective cover 13 can better protect the heating wire 2. Moreover, the second protective cover 13 has high thermal conductivity, so that most of the heat generated by the heating wire 2 is transferred to the spray plate 5 through the second protective cover 13, thereby improving the heating effect and heating efficiency of the spray device.

[0040] In a specific embodiment, refer to Figures 1a to 3 As shown, the spraying device further includes a heat insulation component 3, which is fixed to the top of the outer shell assembly 1. Specifically, the spraying device further includes a heat insulation component 3, which has a heat insulation function and is fixed to the top of the outer shell assembly 1, that is, the heat insulation component 3 is fixed to the top of the first protective cover 12. This allows the heat insulation component 3 to insulate the first protective cover 12, preventing the heat of the heating wire 2 from escaping from the first protective cover 12 to the outside, avoiding excessive heat loss in the spraying device, and thus improving the heating effect of the spraying device.

[0041] Therefore, the spray device achieves gradient resistance compensation through structural optimization of the heating wire 2 and the heat preservation effect of the insulation cotton, thereby improving the heating effect and heating uniformity of the spray device.

[0042] In a specific embodiment, the insulation component 3 is Teflon insulation cotton. Specifically, the insulation component 3 is a key heat insulation component in the spray device used to wrap around the first protective cover 12 to reduce heat loss, maintain the operating temperature of the spray device, and ensure operational safety. In this embodiment, the insulation component 3 is Teflon insulation cotton. Teflon insulation cotton specifically refers to a fibrous or cotton-like flexible insulation material made of polytetrafluoroethylene (PTFE) as the base material through a special processing technology. This material inherits the inherent properties of PTFE and possesses excellent heat insulation performance due to its porous and fluffy physical structure. Specifically, its interior is filled with a large amount of still air, effectively blocking the path of heat conduction.

[0043] The use of Teflon insulation cotton as the insulation component 3 aims to comprehensively utilize its unique and superior properties: First, excellent high-temperature resistance, capable of long-term stable operation within a wide temperature range of -200℃ to +260℃, suitable for the high-temperature conditions commonly encountered in semiconductor equipment; Second, outstanding chemical corrosion resistance, able to resist the erosion of almost all strong acids, strong alkalis, and organic solvents, preventing aging and failure due to contact with chemicals during process environments or equipment cleaning; Third, extremely low thermal conductivity, its loose fiber structure contains a large amount of still air, which can effectively impede heat transfer and ensure excellent insulation performance; Fourth, its inherent non-stickiness and low coefficient of friction make it difficult for dust or deposits to adhere, facilitating cleaning and maintenance, while its flexibility makes it easy to fill or wrap around components with complex shapes.

[0044] Therefore, the use of Teflon insulation cotton in the spray device can achieve efficient, reliable and long-lasting heat preservation. This allows the spray device to achieve gradient resistance compensation through the structural optimization of the heating wire 2 and the heat preservation effect of the insulation cotton, thereby improving the heating effect and heating uniformity of the spray device.

[0045] In one embodiment, reference is made to Figures 1a to 3 As shown, the spraying device also includes a top plate 4, which is fixed to the bottom end of the outer casing assembly 1. Specifically, the spraying device also includes a top plate 4, which is used to connect the outer casing assembly 1 and the spray plate 5. The top plate 4 is fixed to the bottom end of the outer casing assembly 1, that is, the heating wire 2 heats above the top plate 4, and the heat flows through the second protective cover 13 to the top plate 4, and finally to the spray plate 5.

[0046] The design of fixing the top plate 4 to the bottom of the outer shell assembly 1 allows the top plate 4 to serve as a sealing base plate for the cavity, forming a sealed gas distribution cavity together with the side wall and top of the outer shell assembly 1 for carrying and distributing process gas. At the same time, the top plate 4 serves as the mounting base for the spray plate 5, which is usually fixed to the inside of the top plate 4 by fasteners or secondary welding.

[0047] Therefore, by setting the top plate 4 at the bottom of the outer casing assembly 1, this embodiment ensures that the airflow path from the gas distribution chamber to the reaction chamber is strictly limited to the channels of the spray plate 5 that must be passed through. At the same time, it provides crucial lower structural integrity and sealing for the entire spray device and ensures the heating path of the heating wire 2.

[0048] In a specific embodiment, refer to Figures 1a to 3As shown, the spraying device also includes a spray plate 5, which is fixed to the bottom end of the top plate 4. Specifically, the spray plate 5 is a precision plate-shaped component, typically made of aluminum alloy or stainless steel, with a large number of micropores arranged in a specific array, and whose aperture and spacing are precisely calculated. The top plate 4 constitutes the upper structure of the spraying device and integrates a gas interface and a temperature control channel. Through a continuous automated welding process, or by using a set of evenly distributed high-strength bolts and a high-temperature resistant fluororubber O-ring seal, the spray plate 5 is firmly and sealed to the bottom end of the top plate 4. This bottom mounting method creates a highly sealed gas distribution chamber between the spray plate 5 and the top plate 4.

[0049] When the heating wire 2 is heated, the heat is transferred to the top plate 4 through the second protective cover 13, so that the heat can be directly and evenly conducted to the entire spray plate 5 through the closely contacting interface, avoiding the formation of local low temperature areas and improving the heating effect and heating uniformity of the spray plate 5.

[0050] More specifically, the spray device also includes a thermocouple 6, one end of which is connected to the spray plate 5 to detect the temperature of the spray plate 5. This allows the user to adjust the heat of the heating wire 2 via PID control for a faster temperature response.

[0051] Furthermore, three thermocouples 6 are provided, and the three thermocouples 6 are arranged at intervals along the circumference of the spray plate 5 at the edge of the spray plate 5. This improves the accuracy of detecting the temperature of the spray plate 5.

[0052] This embodiment also provides a thin film deposition apparatus (not shown in the figure), which includes a spray device. The spray device can be any type of spray device provided by this utility model. Since the specific structure and working principle of the spray device have been described in detail in the previous specification, they will not be repeated here for the sake of brevity.

[0053] The thin film deposition equipment in this embodiment employs the spray device provided by this utility model. The spray device provides uniform heating, ensuring that the process gas in the thin film deposition equipment is heated evenly. This avoids problems such as edge deviation during film formation, thereby improving the yield and performance consistency of semiconductor products.

[0054] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this utility model, and these modifications or substitutions should all be covered within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A spraying device, characterized in that, include: The outer casing assembly has an internal enclosure that forms a mounting cavity. A heating wire is fixed in the mounting cavity. The heating wire includes a first lead-out section, a second lead-out section, and a bent section. The first lead-out section and the second lead-out section are located on the same side. The two ends of the bent section are respectively connected to the first lead-out section and the second lead-out section. The bent section extends and bends circumferentially along the mounting cavity and is evenly distributed in the mounting cavity.

2. The spraying device according to claim 1, characterized in that, The housing assembly includes a first protective cover and a second protective cover that are connected to each other. The first protective cover and the second protective cover enclose the mounting cavity and are respectively fixedly connected to the upper and lower sides of the heating wire.

3. The spraying device according to claim 2, characterized in that, The heating wire is fixedly connected to the first protective cover via an insulating adhesive; and / or, the heating wire is fixedly connected to the second protective cover via an insulating adhesive.

4. The spraying device according to claim 2, characterized in that, The thermal conductivity of the second protective cover is greater than that of the first protective cover.

5. The spraying device according to claim 4, characterized in that, The first protective cover is made of stainless steel, and / or the second protective cover is made of aluminum alloy.

6. The spraying device according to claim 1, characterized in that, The spraying device also includes a heat insulation component, which is fixed to the top of the outer shell assembly.

7. The spraying device according to claim 6, characterized in that, The insulation component is Teflon insulation cotton.

8. The spraying device according to claim 1, characterized in that, The spraying device also includes a top plate, which is fixed to the bottom of the housing assembly.

9. The spraying device according to claim 8, characterized in that, The spraying device also includes a spray plate, which is fixed to the bottom end of the top plate.

10. A thin film deposition apparatus, characterized in that, include: A spraying device, wherein the spraying device is the spraying device according to any one of claims 1-9.

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