A circuit board copper plating device

Abstract

The utility model discloses a circuit board copper deposition device, including copper deposition pool and circulating device, the utility model discloses a circulating device is set up in the inside bottom of copper deposition pool, and the circulating pump is started through the control panel, and the liquid suction port inhales the pool liquid inside copper deposition pool in this process, then is pumped into the circulating pump through second liquid pipe and circulating pipe, and the circulating pump is pumped to the pool liquid to the liquid outlet port again through first liquid pipe, makes the pool liquid inside copper deposition pool inhale from the one side of liquid suction port, and then discharges from the one side of liquid outlet port, forms the convection area between liquid suction port and liquid outlet port, and the copper layer deposition rate can be improved significantly when circuit board is immersed in the convection area, and the processing time is effectively shortened, and the reciprocating mechanism is set up in the left and right side wall in the copper deposition pool, and the uniform speed reciprocating action is carried out through the starting of cylinder actuator, and the cylinder actuator carries out the uniform speed reciprocating action through the crossbeam control telescopic support, and the liquid outlet port and liquid suction port of both sides reciprocating lift, to expand the convection range, improve the copper layer deposition rate.

Description

Technical Field

[0001] This utility model relates to the field of copper plating technology for circuit boards, specifically a copper plating device for circuit boards. Background Technology

[0002] Plating copper on PCBs is a crucial step in achieving hole metallization. Its core purpose is to deposit a thin layer of copper on the insulating hole walls and board surface, providing a conductive foundation for subsequent copper electroplating. The plating process primarily takes place within a copper plating bath. Existing patent application number: CN111299867B An integrated drilling and copper plating equipment for processing through holes in circuit boards includes a loading and unloading mechanism, a drilling mechanism, a transfer mechanism, and a copper plating mechanism. The output end of the loading and unloading mechanism is connected to the input end of the drilling mechanism, the output end of the drilling mechanism is connected to the input end of the transfer mechanism, and the output end of the transfer mechanism is connected to the input end of the copper plating mechanism.

[0003] The aforementioned patent describes the functional structure of existing circuit board copper plating pools. In the copper plating process, due to the different opening positions of the circuit boards, the pool liquid is difficult to penetrate into the hole walls of the circuit boards, resulting in a low copper deposition rate and difficulty in further shortening the processing time. Therefore, we propose a circuit board copper plating device to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to provide a circuit board copper plating device to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a circuit board copper plating device, comprising a copper plating tank and a circulation device. The circulation device is provided at the bottom inner side of the copper plating tank. The circulation device includes a circulation pipe, a circulation pump, a first liquid pipe, an outlet port, a second liquid pipe, a suction port, a control panel, and a reciprocating mechanism. The circulation pipe is horizontally embedded at the bottom inner side of the copper plating tank. The circulation pump is installed on the right inner wall of the copper plating tank. The inlet of the circulation pump is connected to the right end of the circulation pipe. The outlet of the circulation pump is connected to the bottom end of the first liquid pipe. The top end of the first liquid pipe is connected to the outlet port. The left end of the circulation pipe is connected to the second liquid pipe. The top end of the second liquid pipe is connected to the suction port. The control panel is embedded in the right side of the copper plating tank. The control panel is electrically connected to the circulation pump through a wire. The reciprocating mechanism is provided on the left and right inner walls of the copper plating tank.

[0006] Preferably, both the first liquid tube and the second liquid tube are spiral-shaped flexible tubes.

[0007] Preferably, the reciprocating mechanism includes a telescopic bracket, a crossbeam, a support, and a cylinder actuator. The telescopic brackets are symmetrically installed on the left and right sides of the bottom surface inside the copper immersion tank. The liquid outlet and liquid suction ports are both installed and supported by the telescopic brackets at their corresponding positions. A crossbeam is horizontally installed at the top of the telescopic bracket. A support is integrally provided along the top edge of the left and right side walls inside the copper immersion tank. A cylinder actuator is vertically installed at the top of the support. The piston rod at the bottom of the cylinder actuator passes through the support and is bolted to the crossbeam.

[0008] Preferably, the extension / retraction stroke of the cylinder actuator is 10-20cm.

[0009] Preferably, both the outlet port and the suction port are fitted with filter covers.

[0010] Compared with the prior art, the beneficial effects of this utility model are: This invention features a circulation device installed at the bottom of the inner side of the copper plating tank. By starting the circulation pump via the control panel, a negative pressure suction is generated at the pump inlet. During this process, the liquid inside the copper plating tank is drawn in through the suction port and then pumped into the circulation pump via the second liquid pipe and the circulation pipe. The circulation pump then pumps the liquid out of the tank through the first liquid pipe to the discharge port, so that the liquid inside the copper plating tank is drawn in from the suction port side and discharged from the discharge port side. A convection zone is formed between the suction port and the discharge port. When the circuit board is immersed in the convection zone, the copper deposition rate can be significantly improved, effectively shortening the processing time.

[0011] This invention incorporates a reciprocating mechanism on the left and right side walls inside the copper deposition tank. By activating a cylinder actuator, the cylinder actuator controls the telescopic support to reciprocate at a constant speed via a crossbeam, causing the liquid outlet and suction ports on both sides to rise and fall repeatedly, thereby expanding the convection range and increasing the copper deposition rate. Attached Figure Description

[0012] Figure 1 This is a front view cross-sectional structural diagram of the copper settling tank in this utility model; Figure 2 In this utility model Figure 1 A schematic diagram of the partial structure on the left side; Figure 3 In this utility model Figure 1 A partial structural diagram on the right side.

[0013] In the diagram: Copper plating tank-1, Circulation device-2, Circulation pipe-21, Circulation pump-22, First liquid pipe-23, Liquid outlet port-24, Second liquid pipe-25, Liquid suction port-26, Control panel-27, Reciprocating mechanism-28, Telescopic bracket-281, Crossbeam-282, Support-283, Cylinder actuator-284. Detailed Implementation

[0014] To further explain the technical solution of this utility model, a detailed description is provided below through specific embodiments.

[0015] Please see Figure 1 This utility model provides a circuit board copper plating device, including a copper plating tank 1 and a circulation device 2, wherein the circulation device 2 is provided at the bottom of the inner side of the copper plating tank 1.

[0016] Please see Figure 3 This utility model provides a circuit board copper plating device. The circulation device 2 includes a circulation pipe 21, a circulation pump 22, a first liquid pipe 23, an outlet port 24, a second liquid pipe 25, a suction port 26, a control panel 27, and a reciprocating mechanism 28. The circulation pipe 21 is horizontally embedded at the bottom of the inner side of the copper plating tank 1. The circulation pump 22 is installed on the right inner side of the copper plating tank 1. The inlet of the circulation pump 22 is connected to the right end of the circulation pipe 21. The outlet of the circulation pump 22 is connected to the bottom end of the first liquid pipe 23. The top end of the first liquid pipe 23 is connected to the outlet port 24. The left end of the circulation pipe 21 is connected to the second liquid pipe 25. The top end of the second liquid pipe 25 is connected to the suction port 26. The control panel 27 is embedded in the right side of the copper plating tank 1. The control panel 27 is electrically connected to the circulation pump 22 through wires. The reciprocating mechanism 28 is provided on the left and right side walls inside the copper plating tank 1.

[0017] The first liquid tube 23 and the second liquid tube 25 are both spiral flexible tubes, which enable the first liquid tube 23 and the second liquid tube 25 to extend and retract synchronously with the lifting and lowering movements of the liquid outlet port 24 and the liquid suction port 26.

[0018] To further explain, both the outlet port 24 and the suction port 26 are equipped with filter covers to prevent impurities from entering the circulation device 2.

[0019] Specifically, a circulation device 2 is installed at the bottom of the inner side of the copper plating tank 1. When in use, the circulation pump 22 is started by operating the control panel 27, which generates a negative pressure suction at the inlet of the circulation pump 22. During this process, the liquid in the copper plating tank 1 is drawn in by the suction port 26 and then pumped into the circulation pump 22 through the second liquid pipe 25 and the circulation pipe 21. The circulation pump 22 then pumps the liquid out of the outlet port 24 through the first liquid pipe 23, so that the liquid in the copper plating tank 1 is drawn in from the suction port 26 side and discharged from the outlet port 24 side. A convection area is formed between the suction port 26 and the outlet port 24. When the circuit board is immersed in the convection area, the copper deposition rate can be significantly improved, and the processing time can be effectively shortened. Please see Figure 2This utility model provides a circuit board copper plating device. The reciprocating mechanism 28 includes a telescopic bracket 281, a crossbeam 282, a support 283, and a cylinder actuator 284. The telescopic brackets 281 are symmetrically installed on the left and right sides of the bottom surface inside the copper plating tank 1. The liquid outlet port 24 and the liquid suction port 26 are installed and supported by the telescopic brackets 281 at the corresponding positions. The crossbeam 282 is horizontally installed at the top of the telescopic bracket 281. The support 283 is integrally provided on the top edge of the left and right side walls inside the copper plating tank 1. The cylinder actuator 284 is vertically installed on the top of the support 283. The piston rod at the bottom of the cylinder actuator 284 passes through the support 283 and is bolted to the crossbeam 282.

[0020] The cylinder actuator 284 has a telescopic stroke of 10-20cm, providing sufficient lifting range for the liquid outlet port 24 and the liquid suction port 26 to expand the convection range.

[0021] Specifically, a reciprocating mechanism 28 is installed on the left and right side walls inside the copper deposition tank 1. After the circulation device 2 is started, the cylinder actuator 284 is further activated. The cylinder actuator 284 controls the telescopic bracket 281 to perform a uniform reciprocating motion through the crossbeam 282, so that the liquid outlet port 24 and the liquid suction port 26 on both sides reciprocate to expand the convection range and increase the copper deposition rate.

[0022] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A circuit board copper plating apparatus, characterized in that: The system includes a copper settling tank (1) and a circulation device (2). The circulation device (2) is installed at the bottom inner side of the copper settling tank (1). The circulation device (2) includes a circulation pipe (21), a circulation pump (22), a first liquid pipe (23), an outlet port (24), a second liquid pipe (25), a suction port (26), a control panel (27), and a reciprocating mechanism (28). The circulation pipe (21) is horizontally buried at the bottom inner side of the copper settling tank (1). The circulation pump (22) is installed on the right inner wall of the copper settling tank (1). The inlet of the circulation pump (22) is connected to the circulation pipe (21). The right end of the circulating pump (22) is connected to the bottom end of the first liquid pipe (23), the top end of the first liquid pipe (23) is connected to the outlet port (24), the left end of the circulating pipe (21) is connected to the second liquid pipe (25), the top end of the second liquid pipe (25) is connected to the suction port (26), the right side of the copper sink (1) is fitted with a control panel (27), the control panel (27) is electrically connected to the circulating pump (22) through wires, and the left and right side walls inside the copper sink (1) are provided with a reciprocating mechanism (28).

2. The circuit board copper plating apparatus according to claim 1, characterized in that: Both the first liquid tube (23) and the second liquid tube (25) are spiral flexible tube structures.

3. The circuit board copper plating apparatus according to claim 1, characterized in that: The reciprocating mechanism (28) includes a telescopic bracket (281), a crossbeam (282), a support (283), and a cylinder actuator (284). The telescopic brackets (281) are symmetrically installed on the left and right sides of the bottom surface inside the copper immersion tank (1). The liquid outlet port (24) and the liquid suction port (26) are both installed and supported by the telescopic brackets (281) at the corresponding positions. The crossbeam (282) is horizontally installed at the top of the telescopic bracket (281). The support (283) is integrally provided on the top edge of the left and right side walls inside the copper immersion tank (1). The cylinder actuator (284) is vertically installed at the top of the support (283). The piston rod at the bottom of the cylinder actuator (284) passes through the support (283) and is bolted to the crossbeam (282).

4. The circuit board copper plating apparatus according to claim 3, characterized in that: The extension stroke of the cylinder actuator (284) is 10-20cm.

5. The circuit board copper plating apparatus according to claim 1, characterized in that: Both the outlet port (24) and the suction port (26) are fitted with filter covers.

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