Circuit board nickel-gold plating device with solution guiding

Abstract

The utility model provides a line board nickel gold plating device with solution flow guide relates to nickel gold plating technical field, this line board nickel gold plating device with solution flow guide, including device body, the bottom wall inside device body is rotationally connected with the rotation bar, the rotation bar outside fixedly connected with the circumferential array distribution of pushing material fan blade, the pushing material fan blade bottom and the bottom wall contact of device body inside, this line board nickel gold plating device with solution flow guide sets up pushing material fan blade in the nickel gold plating device inside, and pushing material fan blade can push the precipitate and impurity on the nickel gold plating device bottom wall to the collection tank, and this design can effectively avoid the accumulation of precipitate and impurity on the bottom wall of device body, reduces the frequency and difficulty of manual cleaning, and improves the cleaning efficiency of precipitate, also ensures that the precipitate can be completely discharged, and the timely cleaning of precipitate can guarantee the uniformity of electroplating solution, thereby improves the electroplating efficiency and quality.

Description

Technical Field

[0001] This utility model relates to a nickel-gold plating device for circuit boards with solution guidance, specifically a nickel-gold plating device for circuit boards with solution guidance, belonging to the field of nickel-gold plating technology. Background Technology

[0002] Nickel plating is an important surface treatment process for circuit boards, primarily used to improve their conductivity, corrosion resistance, and solderability. A typical nickel plating bath includes a reaction tank, a preparation tank, a replenishment pipe, and a drain pipe. The preparation tank holds the required plating solution in advance, and the replenishment pipe supplies the reaction tank with a suitable plating solution in real time. In the prior art, patent CN220788855U discloses a nickel plating bath, including a nickel plating bath, a lifting plate and a lifting mechanism, as well as components such as a circulation pipe and a circulation pump. This nickel plating bath uses a circulation pump to circulate the plating solution within the bath, improving the uniformity of the plating solution and ensuring the plating effect. Simultaneously, the nickel plating bath also includes components such as a filter box, a pull-out box, and activated carbon. Currently, there are some problems with the use of nickel plating tanks. During electroplating, precipitates are generated, which accumulate at the bottom of the tank, affecting the circulation of the plating solution and the plating effect. Furthermore, cleaning the precipitates requires stopping the electroplating operation and opening the tank, which is cumbersome, increases the labor intensity of workers, and reduces production efficiency. In addition, if the precipitates are not cleaned in a timely manner, excessive accumulation can lead to blockage of the circulation pipes, affecting the normal operation of the entire electroplating system. Utility Model Content

[0003] (a) Technical problems to be solved The purpose of this invention is to provide a nickel-gold plating device for circuit boards with solution guidance in order to solve the above-mentioned problems, thereby solving the problem of cumbersome cleaning in the prior art nickel-gold plating devices with solution guidance.

[0004] (II) Technical Solution This utility model is achieved through the following technical solution: a circuit board nickel-gold plating device with solution guiding, comprising a device body, a rotating rod rotatably connected to the bottom wall inside the device body, a pushing fan blade with a circumferential array fixedly connected to the outside of the rotating rod, the bottom of the pushing fan blade contacting the bottom wall inside the device body, a discharge groove formed on the bottom wall inside the device body, an auger rod rotatably connected inside the discharge groove, and a collection groove formed on the bottom wall inside the discharge groove, a circulation pipe one and a circulation pipe two fixedly connected to one side of the device body, the circulation pipe two being through-connected to the bottom wall inside the collection groove.

[0005] Preferably, a first partition is fixedly connected to the inner wall of the device body. The first partition includes a conical plate, and a circular array of rods is fixedly connected between the outer wall of the conical plate and the interior of the device body.

[0006] Preferably, a second partition is fixedly connected to the inner wall of the device body. The second partition is an inverted conical structure, and a through-hole is opened at the center of the second partition. The second partition is located directly below the first partition.

[0007] Preferably, the top of the device body is provided with a filter box and a water pump. One side of the filter box is fixedly connected to both ends of the circulation pipe, and the other side of the filter box is fixedly connected to the water inlet of the water pump. The water outlet of the water pump is fixedly connected to one end of the circulation pipe.

[0008] Preferably, a through-hole is provided at the center of the first partition, and the first partition is rotatably sleeved on the outside of the rotating rod through the hole, and agitator blades distributed in a circular array are fixedly connected to the outside of the rotating rod.

[0009] Preferably, a mounting bracket is rotatably sleeved at the top of the rotating rod, and the mounting bracket is installed on the top of the device body. Servo motors are installed on one side of the device body and the top of the mounting bracket, and the output shafts of the two servo motors are fixedly connected to the top of the rotating rod and the end of the auger rod, respectively.

[0010] Preferably, a sedimentation tank is provided at the bottom of the second circulation pipe, and the sedimentation tank is located on one side of the device body.

[0011] Preferably, an inlet pipe is fixedly connected to one side of the device body, and a drain pipe is fixedly connected to one side of the circulation pipe II. Solenoid valves are provided on the inlet pipe, the drain pipe, and the circulation pipe II.

[0012] This invention provides a nickel-gold plating device for circuit boards with solution guidance, which has the following beneficial effects: This circuit board nickel-gold plating device with solution flow guidance uses pusher blades inside the device to push precipitates and impurities on the bottom wall of the device towards the collection tank. This design effectively avoids the accumulation of precipitates and impurities on the bottom wall of the device, reduces the frequency and difficulty of manual cleaning, improves the cleaning efficiency of precipitates, and ensures that precipitates can be completely discharged. Timely cleaning of precipitates ensures the uniformity of the electroplating solution, thereby improving electroplating efficiency and quality.

[0013] This circuit board nickel-gold plating device with solution flow guidance divides the interior of the device into upper and lower spaces by using a first and second partition. This allows impurities and sediments in the upper space to settle into the lower space for convenient centralized processing, while impurities and sediments in the lower space are less likely to return to the upper space. Since the circuit board nickel plating is located in the upper space, this improves the quality of circuit board nickel plating and enhances the ease of cleaning sediments in the solution-guided circuit board nickel plating device.

[0014] This circuit board nickel-gold plating device with solution flow guidance, by setting pusher fan blades and auger rods, can reduce the labor intensity of workers, reduce the time required for equipment maintenance, and improve the utilization rate of the equipment.

[0015] This circuit board nickel-gold plating device with solution flow guidance, by setting up a sedimentation tank and circulation pipe II, allows sediment to be collected in the sedimentation tank for convenient periodic cleaning without opening the plating tank, reducing the time and labor intensity of sediment cleaning; timely cleaning of sediment avoids obstruction of the electroplating solution circulation, ensuring the uniformity of the electroplating solution, thereby improving electroplating efficiency and quality. Attached Figure Description

[0016] Figure 1 This is a three-dimensional schematic diagram of the present invention; Figure 2 This is a three-dimensional cross-sectional view of the entire utility model; Figure 3 This is a three-dimensional schematic diagram of the cooperation between the rotating rod and the stirring fan blade of this utility model; Figure 4 This is a three-dimensional schematic diagram of the first partition of this utility model.

[0017] [Explanation of Key Component Symbols] 1. Device body; 2. Rotating rod; 3. Pusher blade; 4. Discharge chute; 5. Screw rod; 6. Collection chute; 7. Circulation pipe one; 8. First partition plate; 81. Conical plate; 82. Round rod; 9. Second partition plate; 10. Circulation pipe two; 11. Water pump; 12. Agitator blade; 13. Mounting frame; 14. Servo motor; 15. Sedimentation tank; 16. Filter box; 17. Liquid inlet pipe; 18. Liquid outlet pipe. Detailed Implementation

[0018] This utility model provides a nickel-gold plating device for circuit boards with solution guidance.

[0019] Example 1, please refer to Figure 1 , Figure 2 , Figure 3 and Figure 4The device includes a main body 1, a rotating rod 2 rotatably connected to the bottom wall inside the main body 1, a pushing fan blade 3 arranged in a circular array fixedly connected to the outside of the rotating rod 2, the bottom of the pushing fan blade 3 contacting the bottom wall inside the main body 1, a discharge groove 4 formed on the bottom wall inside the main body 1, an auger rod 5 rotatably connected inside the discharge groove 4, and a collection groove 6 formed on the bottom wall inside the discharge groove 4. A circulation pipe 1 7 and a circulation pipe 2 10 are fixedly connected to one side of the main body 1, and the circulation pipe 2 10 is connected to the bottom wall inside the collection groove 6. Specifically, the outer wall of the auger rod 5 contacts the inner wall of the discharge trough 4, and the bottom of the pusher blade 3 contacts the bottom wall inside the device body 1. The device body 1 is a nickel plating tank. This device is existing technology equipment, and its nickel plating operation method and related structural equipment are all existing technology equipment, which will not be described in detail in this application.

[0020] Please see Figure 1 , Figure 2 and Figure 4 A first partition 8 is fixedly connected to the inner wall of the device body 1. The first partition 8 includes a conical plate 81. A circular array of rods 82 is fixedly connected between the outer wall of the conical plate 81 and the interior of the device body 1.

[0021] Please see Figure 2 and Figure 4 A second partition 9 is fixedly connected to the inner wall of the device body 1. The second partition 9 is an inverted conical structure, and a through-hole is opened at the center of the second partition 9. The second partition 9 is located directly below the first partition 8. Specifically, the first partition 8 and the second partition 9 are designed to allow impurities and precipitates in the solution to settle below the second partition 9, making cleaning easier.

[0022] Please see Figure 1 and Figure 2 The device body 1 is equipped with a filter box 16 and a water pump 11 on the top. One side of the filter box 16 is fixedly connected to the end of the second circulation pipe 10, and the other side of the filter box 16 is fixedly connected to the water inlet of the water pump 11. The water outlet of the water pump 11 is fixedly connected to the end of the first circulation pipe 7. Specifically, the filter box 16 is a prior art device, with internal filtration structures such as a pull-out box for filtering the solution, a mesh screen, and activated carbon. Its specific form, usage, and installation method are all existing technologies, and this application will not elaborate on them.

[0023] Please see Figure 2 and Figure 4 A through-hole is provided at the center of the first partition plate 8, and the first partition plate 8 is rotatably sleeved on the outside of the rotating rod 2 through the rotating hole. A stirring fan blade 12 arranged in a circular array is fixedly connected to the outside of the rotating rod 2.

[0024] Please see Figure 1 , Figure 2 and Figure 4 The top of the rotating rod 2 is rotatably fitted with a mounting bracket 13, which is installed on the top of the device body 1. A servo motor 14 is installed on one side of the device body 1 and the top of the mounting bracket 13. The output shafts of the two servo motors 14 are fixedly connected to the top of the rotating rod 2 and the end of the auger rod 5, respectively. Specifically, both the servo motor 14 and the water pump 11 are electrically connected to the power supply. The models of the servo motor 14 and the water pump 11 are not limited, but are subject to the compatible equipment.

[0025] Please see Figure 1 and Figure 2 A sedimentation tank 15 is provided at the bottom of the circulation pipe 2 10, and the sedimentation tank 15 is located on one side of the device body 1. Specifically, the sedimentation tank 15 is installed in a detachable manner at the bend of the circulation pipe 2 10. The detachable manner utilizes existing technologies, such as: the inlet of the sedimentation tank 15 is provided with an internal thread, the bottom end of the circulation pipe 2 10 is fixedly connected to an external threaded pipe, the sedimentation tank 15 is threaded onto the outside of the external threaded pipe using the internal thread, and a sealing ring is provided between the sedimentation tank 15 and the external threaded pipe to increase the sealing performance, thus facilitating the cleaning of impurities and sediments in the sedimentation tank 15.

[0026] Please see Figure 1 and Figure 2 One side of the device body 1 is fixedly connected to the liquid inlet pipe 17, and one side of the circulation pipe 2 10 is fixedly connected to the liquid outlet pipe 18. Solenoid valves are installed on the liquid inlet pipe 17, the liquid outlet pipe 18 and the circulation pipe 2 10. Specifically, the solenoid valve is used to switch the inlet pipe 17, the outlet pipe 18, or the circulation pipe 10. Its specific form, usage, and installation are all existing technologies, and this application will not elaborate on them. Specifically, during the nickel-gold plating process, the solenoid valve on the inlet pipe 17 is open, allowing the plating solution to flow into the device body 1; the solenoid valves on the drain pipe 18 and the second circulation pipe 10 are closed. During the precipitate transport process, the solenoid valve on the inlet pipe 17 is closed, and the solenoid valve on the second circulation pipe 10 is open, allowing the precipitate to enter the precipitation tank 15 through the second circulation pipe 10; the solenoid valve on the drain pipe 18 is closed. During the solution circulation process, the solenoid valves on the inlet pipe 17 and the drain pipe 18 are closed, and the solenoid valve on the second circulation pipe 10 is open, allowing the solution to enter the filter box 16 through the second circulation pipe 10.

[0027] Working principle: The electroplating solution enters the device body 1 through the inlet pipe 17. The circuit board is fed into the device body 1 for processing using existing technology equipment such as clamping machine arms. After processing, it can be taken out. During the electroplating process, the corresponding servo motor 14 is started to drive the rotating rod 2 to rotate. The rotating rod 2 drives the stirring fan blade 12 to slowly stir the pool water. The pushing fan blade 3 pushes the impurities and sediments at the bottom of the pool into the discharge trough 4. At the same time, the corresponding servo motor 14 is started to drive the auger rod 5 to rotate. The auger rod 5 transports the impurities and sediments into the collection trough 6 and finally discharges them through the circulation pipe 10. Start the water pump 11 and use the water pump 11 to transport the solution discharged from the second circulation pipe 10 to the filter box 16 for filtration. The filtered solution is then transported back to the device body 1 through the first circulation pipe 7, thus completing the water circulation. The solution discharged from circulation pipe 2 10 will pass through sedimentation tank 15, where solid impurities in the solution will be precipitated.

[0028] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A circuit board nickel-gold plating apparatus with solution guiding, comprising an apparatus body (1), characterized in that: A rotating rod (2) is rotatably connected to the bottom wall inside the device body (1). A pushing fan blade (3) with a circular array is fixedly connected to the outside of the rotating rod (2). The bottom of the pushing fan blade (3) contacts the bottom wall inside the device body (1). A discharge groove (4) is formed on the bottom wall inside the device body (1). An auger rod (5) is rotatably connected inside the discharge groove (4). A collection groove (6) is formed on the bottom wall inside the discharge groove (4). A circulation pipe one (7) and a circulation pipe two (10) are fixedly connected to one side of the device body (1). The circulation pipe two (10) is connected to the bottom wall inside the collection groove (6).

2. The circuit board nickel-gold plating device with solution guiding according to claim 1, characterized in that: A first partition (8) is fixedly connected to the inner wall of the device body (1). The first partition (8) includes a conical plate (81). A circular rod (82) arranged in a circular array is fixedly connected between the outer wall of the conical plate (81) and the inside of the device body (1).

3. The circuit board nickel-gold plating device with solution guiding according to claim 2, characterized in that: The device body (1) has a second partition (9) fixedly connected to its inner wall. The second partition (9) is an inverted conical structure, and a through-hole is provided at the center of the second partition (9). The second partition (9) is located directly below the first partition (8).

4. The circuit board nickel-gold plating device with solution guiding according to claim 3, characterized in that: The device body (1) is provided with a filter box (16) and a water pump (11) on the top. One side of the filter box (16) is fixedly connected to the end of the second circulation pipe (10). The other side of the filter box (16) is fixedly connected to the water inlet of the water pump (11). The water outlet of the water pump (11) is fixedly connected to the end of the first circulation pipe (7).

5. The circuit board nickel-gold plating device with solution guiding according to claim 4, characterized in that: The first partition (8) has a through-hole at its center, and the first partition (8) is rotatably sleeved on the outside of the rotating rod (2) through the hole. The rotating rod (2) is fixedly connected to the outside of the rotating rod (2) with a circumferentially distributed stirring fan blades (12).

6. The circuit board nickel-gold plating device with solution guiding according to claim 1, characterized in that: The top of the rotating rod (2) is fitted with a mounting bracket (13), which is installed on the top of the device body (1). A servo motor (14) is installed on one side of the device body (1) and the top of the mounting bracket (13). The output shafts of the two servo motors (14) are fixedly connected to the top of the rotating rod (2) and the end of the auger rod (5), respectively.

7. The circuit board nickel-gold plating apparatus with solution guiding according to claim 1, characterized in that: The bottom of the second circulation pipe (10) is provided with a sedimentation tank (15), which is located on one side of the device body (1).

8. The circuit board nickel-gold plating apparatus with solution guiding according to claim 1, characterized in that: The device body (1) is fixedly connected to an inlet pipe (17) on one side, and the circulation pipe (2) (10) is fixedly connected to a drain pipe (18) on one side. Solenoid valves are provided on the inlet pipe (17), the drain pipe (18) and the circulation pipe (2) (10).

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