Electroplating solution debugging device for tinned copper wire processing

Abstract

The utility model provides a device for debugging electroplating solution for tinned copper wire processing. The device for debugging electroplating solution for tinned copper wire processing comprises an adjusting chassis, a debugging box, a fixing frame, a circulating pipe, a first shunt frame, a second shunt frame, a monitoring component, a refrigeration equipment, a second return pipe, and a first conveying pipe. The device can input different hot fluids or cold fluids into the circulating pipe according to requirements, maintain the debugging electroplating solution at a corresponding temperature, and improve the stability and efficiency of the plating layer.

Description

Technical Field

[0001] This utility model relates to the field of electroplating solution adjustment technology, and in particular to an electroplating solution adjustment device for tin-plated copper wire processing. Background Technology

[0002] Tin-plated copper refers to copper with a thin layer of metallic tin plated on its surface, such as tin-plated copper wire. It has certain applications in cable manufacturing. Tin plating prevents copper from oxidizing and forming a film or verdigris when exposed to air. Verdigris has poor conductivity, increasing resistance. Verdigris formed on food containers can be harmful to human health. Therefore, the main purpose of tin plating is to prevent copper from oxidizing.

[0003] The tin-plated copper wire processing requires the use of electroplating solution to provide an electroplating environment that controls the deposition rate and quality. Therefore, when preparing and using the electroplating solution, an electroplating solution preparation device is needed to pre-treat the solution.

[0004] The existing electroplating solution adjustment device for tin-plated copper wire processing cannot accurately control the temperature of the electroplating solution during the pretreatment process. As a result, the quality of the plating layer is easily affected by the unstable temperature of the electroplating solution during the tin-plated copper wire processing.

[0005] Therefore, it is necessary to provide an electroplating solution preparation device for tin-plated copper wire processing to solve the above-mentioned technical problems. Summary of the Invention

[0006] This invention provides an electroplating solution adjustment device for tin-plated copper wire processing, which solves the problem that the lack of a structure for precise temperature control of the electroplating solution in tin-plated copper wire processing electroplating solution adjustment devices affects the stability of the plating layer.

[0007] To solve the above-mentioned technical problems, the electroplating solution adjustment device for tin-plated copper wire processing provided by this utility model includes: an adjustment base frame; A test box is mounted on top of an adjustable base frame via a support frame. A fixing frame is mounted on the back of the test box, and a flow pipe is mounted on the front of the fixing frame. A first flow divider and a second flow divider are respectively mounted on both ends of the flow pipe via connecting pipes. A monitoring component is mounted on the back of the fixing frame. A refrigeration device is mounted on top of the adjustable base frame. A second return pipe is mounted on the inlet of the refrigeration device, and a first delivery pipe is mounted on the outlet of the refrigeration device. A second solenoid valve is mounted on the other end of both the first delivery pipe and the second return pipe. A heating device is mounted on top of the adjustable base frame. A first return pipe is mounted on the inlet of the heating device, and a second delivery pipe is mounted on the outlet of the heating device. A first solenoid valve is mounted on the other end of both the second delivery pipe and the first return pipe. A drive assembly is installed at the bottom of the test box. The output end of the drive assembly is equipped with a stirring rack via a magnetic stirrer. Multiple filter assemblies are installed inside the test box. An inlet pipe is installed on the top of the test box. A discharge pipe with a first valve is installed on one side of the test box at the bottom. The refrigeration equipment includes a housing, auxiliary liquid cooling equipment, and a liquid pump. Two second solenoid valves are connected to the back of the first and second diversion frames respectively through pipes. Two first solenoid valves are connected to the first and second diversion frames respectively through two pipes. The heating equipment includes a housing, auxiliary liquid heating equipment, and a liquid pump. The stirring rack is located at the bottom of the inner wall of the test box. The magnetic stirrer allows the drive component to be not directly connected to the stirring rack, or it can drive the stirring rack to rotate. The magnetic stirring method avoids the corrosion problem caused by the direct contact between the traditional stirring shaft and the electroplating solution.

[0008] Preferably, a control box with a door is installed on the top of the adjustable base, and a control panel is installed on one side of the control box; The control panel can control the operation of the equipment. The control box contains power switches and controllers for the operation of auxiliary equipment.

[0009] Preferably, an inlet pipe is installed on the top of the test box, and a discharge pipe with a first valve is installed on one side of the test box at the bottom position; The inlet pipe facilitates the entry of electroplating solution.

[0010] Preferably, the adjusting base includes a base plate, an adjusting structure, and a mounting structure, wherein the mounting structure is used to mount the adjusting structure on the bottom of the base plate.

[0011] Preferably, the filter assembly includes a conical interceptor, a drain pipe, and a second valve, wherein the drain pipe is installed at the bottom end of the interceptor. The second valve is located outside the test box. After the second valve is opened, the drain pipe can discharge the filtered impurities.

[0012] Preferably, the drive assembly includes a drive component and a protective housing, the protective housing being used to mount the drive component that provides rotational driving force.

[0013] Compared with related technologies, the electroplating solution adjustment device for tin-plated copper wire processing provided by this utility model has the following beneficial effects: This invention provides an electroplating solution adjustment device for tin-plated copper wire processing. To accurately control the temperature during the electroplating solution adjustment process and improve the plating effect, a flow pipe is installed inside the adjustment box via a fixed frame. Then, the first and second flow dividers are connected to both ends of the flow pipe via two connecting pipes, allowing liquid of the corresponding temperature to flow through the flow pipe when needed. The outlet of the refrigeration equipment injects liquid into the flow pipe through the first delivery pipe and the second solenoid valve via a liquid pump, and finally returns to the refrigeration equipment through the second return pipe. During this process, the first solenoid valve is closed. When the heating equipment is operating, liquid of the corresponding temperature is injected into the flow pipe through the liquid pump and the second delivery pipe, and then returns to the heating equipment through the first return pipe. During this process, the first solenoid valve on the second delivery pipe and the first return pipe opens, and the second solenoid valve closes, thus raising the electroplating solution temperature to the corresponding level. This design allows different hot or cold fluids to be input into the flow pipe as needed, maintaining the adjusted electroplating solution at the corresponding temperature, which is beneficial for improving the stability and effect of the plating layer. Attached Figure Description

[0014] Figure 1 A schematic diagram of a preferred embodiment of the electroplating solution adjustment device for tin-plated copper wire processing provided by this utility model; Figure 2 This utility model provides a structural schematic diagram of a refrigeration device; Figure 3 Provided for this utility model Figure 2 An enlarged view of point A shown; Figure 4 A structural schematic diagram of the cone-shaped interceptor component is provided for this utility model; Figure 5 A schematic diagram of the drive component is provided for this utility model.

[0015] The diagram is labeled as follows: 1. Adjustable base frame; 101. Base plate; 102. Adjustable structure; 103. Mounting structure; 2. Support frame; 3. Discharge pipe; 4. First valve; 5. Debugging box; 6. Liquid inlet pipe; 7. Control box; 8. Box door; 9. Control panel; 10. Refrigeration equipment; 11. First delivery pipe; 12. Second delivery pipe; 13. Heating equipment; 14. First return pipe; 15. Filter assembly; 151. Conical interception component; 152. Sewage pipe; 153. Second valve; 16. Second return pipe; 17. Fixing frame; 18. First solenoid valve; 19. First diversion frame; 20. Flow pipe; 21. Drive assembly; 211. Drive component; 212. Protective shell; 22. Second solenoid valve; 23. Second diversion frame; 24. Connecting pipe; 25. Monitoring component; 26. Mixing frame; 27. Magnetic stirrer. Detailed Implementation

[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0017] Please refer to the following: Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 ,in Figure 1 A schematic diagram of a preferred embodiment of the electroplating solution adjustment device for tin-plated copper wire processing provided by this utility model; Figure 2 This utility model provides a structural schematic diagram of a refrigeration device; Figure 3 Provided for this utility model Figure 2 An enlarged view of point A shown; Figure 4 A structural schematic diagram of the cone-shaped interceptor component is provided for this utility model; Figure 5 This invention provides a structural schematic diagram of the driving component. The electroplating solution adjustment device for tin-plated copper wire processing includes: an adjusting base 1; A test box 5 is mounted on top of an adjustable base frame 1 via a support frame 2. A fixing frame 17 is mounted on the back of the test box 5. A flow pipe 20 is mounted on the front of the fixing frame 17. A first diversion frame 19 and a second diversion frame 23 are respectively mounted on both ends of the flow pipe 20 via connecting pipes 24. A monitoring component 25 is mounted on the back of the fixing frame 17. A refrigeration device 10 is mounted on top of the adjustable base frame 1. A second return pipe 16 is mounted on the inlet of the refrigeration device 10. A first delivery pipe 11 is mounted on the outlet of the refrigeration device 10. A second solenoid valve 22 is mounted on the other end of both the first delivery pipe 11 and the second return pipe 16. A heating device 13 is mounted on top of the adjustable base frame 1. A first return pipe 14 is mounted on the inlet of the heating device 13. A second delivery pipe 12 is mounted on the outlet of the heating device 13. A first solenoid valve 18 is mounted on the other end of both the second delivery pipe 12 and the first return pipe 14. The drive assembly 21 is installed at the bottom of the test box 5. The output end of the drive assembly 21 is equipped with a stirring rack 26 via a magnetic stirrer 27. Multiple filter assemblies 15 are installed inside the test box 5. An inlet pipe 6 is installed on the top of the test box 5. A discharge pipe 3 with a first valve 4 is installed on one side of the test box 5 at the bottom position. The refrigeration device 10 includes a housing, an auxiliary liquid cooling device, and a liquid pump. Two second solenoid valves 22 are connected to the back of the first diversion frame 19 and the second diversion frame 23 respectively through pipes. Two first solenoid valves 18 are connected to the first diversion frame 19 and the second diversion frame 23 respectively through two pipes. The heating device 13 includes a housing, an auxiliary liquid heating device, and a liquid pump. The stirring rack 26 is located at the bottom of the inner wall of the test chamber 5. The magnetic stirrer 27 can prevent the drive component 21 from being directly connected to the stirring rack 26, or it can drive the stirring rack 26 to rotate. The magnetic stirring method avoids the corrosion problem caused by the direct contact between the traditional stirring shaft and the electroplating solution. The monitoring component 25 can monitor the temperature of the electroplating solution inside the test chamber 5.

[0018] A control box 7 with a door 8 is installed on the top of the adjustable base frame 1, and a control panel 9 is installed on one side of the control box 7; The control panel 9 can control the operation of the equipment. The control box 7 contains the power switch and the controller for the operation of auxiliary equipment. The door 8 is equipped with a lock.

[0019] The top of the debugging box 5 is equipped with an inlet pipe 6, and a discharge pipe 3 with a first valve 4 is installed on one side of the debugging box 5 at the bottom position. The inlet pipe 6 facilitates the entry of electroplating solution, and a valve can be installed at the top of the inlet pipe 6.

[0020] The adjustable base frame 1 includes a base plate 101, an adjusting structure 102, and a mounting structure 103. The mounting structure 103 is used to mount the adjusting structure 102 on the bottom of the base plate 101. The threaded connection between the adjustment structure 102 and the mounting structure 103 can adjust the stability of the base plate 101.

[0021] The filter assembly 15 includes a conical interceptor 151, a drain pipe 152, and a second valve 153, wherein the drain pipe 152 is installed at the bottom end of the interceptor 151; The second valve 153 is located outside the test box 5. After the second valve 153 is opened, the drain pipe 152 can discharge the filtered impurities.

[0022] The drive assembly 21 includes a drive component 211 and a protective shell 212, wherein the protective shell 212 is used to mount the drive component 211 that provides rotational driving force. The drive unit 211 provides rotational power for the magnetic stirrer 27 and the stirring rack 26.

[0023] The working principle of the electroplating solution adjustment device for tin-plated copper wire processing provided by this utility model is as follows: Inside the test chamber 5, a flow pipe 20 is installed via a mounting bracket 17. Then, the first diversion frame 19 and the second diversion frame 23 are connected to both ends of the flow pipe 20 via two connecting pipes 24, respectively, so that the liquid of the corresponding temperature can flow inside the flow pipe 20 when needed. The outlet of the refrigeration equipment 10 injects liquid into the flow pipe 20 through the first delivery pipe 11 and the second solenoid valve 22 via a liquid pump. Finally, the liquid returns to the refrigeration equipment 10 through the second return pipe 16. During this process, the first solenoid valve 18 is closed. When the heating equipment 13 is working, the liquid of the corresponding temperature is injected into the flow pipe 20 through the liquid pump and the second delivery pipe 12, and then returns to the heating equipment 13 through the first return pipe 14. During this process, the first solenoid valve 18 on the second delivery pipe 12 and the first return pipe 14 is open, and the second solenoid valve 22 is closed, so that the temperature of the electroplating solution can be raised to the corresponding temperature.

[0024] Compared with related technologies, the electroplating solution adjustment device for tin-plated copper wire processing provided by this utility model has the following beneficial effects: To precisely control the temperature during the electroplating solution adjustment process and improve the plating effect, a flow pipe 20 is installed inside the test chamber 5 via a mounting bracket 17. Then, the first distribution frame 19 and the second distribution frame 23 are connected to both ends of the flow pipe 20 via two connecting pipes 24, allowing liquids of the corresponding temperatures to flow through the flow pipe 20 when needed. The outlet of the cooling device 10 uses a liquid pump to inject liquid into the flow pipe 20 via the first delivery pipe 11 and the second solenoid valve 22. Finally, the liquid returns to the cooling device 10 via the second return pipe 16. During the process, the first solenoid valve 18 is closed. When the heating device 13 is working, the liquid of the corresponding temperature is injected into the flow pipe 20 through the liquid pump and the second delivery pipe 12, and then returned to the heating device 13 through the first return pipe 14. During this process, the first solenoid valve 18 on the second delivery pipe 12 and the first return pipe 14 is opened and the second solenoid valve 22 is closed, which can raise the temperature of the electroplating solution to the corresponding temperature. Through this design, different hot or cold fluids can be input into the flow pipe 20 according to the needs, and the adjusted electroplating solution can be maintained at the corresponding temperature, which is beneficial to improving the stability and effect of the coating.

[0025] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. An electroplating solution preparation device for tin-plated copper wire processing, characterized in that, include: Adjust the base frame; A test box is mounted on top of an adjustable base frame via a support frame. A fixing frame is mounted on the back of the test box, and a flow pipe is mounted on the front of the fixing frame. A first diverter frame and a second diverter frame are respectively mounted on both ends of the flow pipe via connecting pipes. A monitoring component is mounted on the back of the fixing frame. A refrigeration device is mounted on top of the adjustable base frame. A second return pipe is installed at the inlet of the refrigeration device, and a first delivery pipe is installed at the outlet of the refrigeration device. A second solenoid valve is installed at the other end of both the first delivery pipe and the second return pipe. A heating device is mounted on top of the adjustable base frame. A first return pipe is installed at the inlet of the heating device, and a second delivery pipe is installed at the outlet of the heating device. A first solenoid valve is installed at the other end of both the second delivery pipe and the first return pipe. A drive assembly is installed at the bottom of the test box. The output end of the drive assembly is equipped with a stirring rack via a magnetic stirrer. Multiple filter assemblies are installed inside the test box.

2. The electroplating solution adjustment device for tin-plated copper wire processing according to claim 1, characterized in that, A control box with a door is installed on the top of the adjustable base frame, and a control panel is installed on one side of the control box.

3. The electroplating solution adjustment device for tin-plated copper wire processing according to claim 1, characterized in that, The top of the test box is equipped with an inlet pipe, and a discharge pipe with a first valve is installed on one side of the test box at the bottom.

4. The electroplating solution adjustment device for tin-plated copper wire processing according to claim 1, characterized in that, The adjustable base includes a base plate, an adjusting structure, and a mounting structure, wherein the mounting structure is used to install the adjusting structure on the bottom of the base plate.

5. The electroplating solution adjustment device for tin-plated copper wire processing according to claim 1, characterized in that, The filter assembly includes a conical interceptor, a drain pipe, and a second valve, with the drain pipe installed at the bottom of the interceptor.

6. The electroplating solution adjustment device for tin-plated copper wire processing according to claim 1, characterized in that, The drive assembly includes a drive component and a protective housing, the protective housing being used to mount the drive component that provides rotational driving force.

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