Electroplating tank

Abstract

The application provides an electroplating tank. The electroplating tank comprises a main tank, a sub-tank, a first channel, a second channel, a first partition plate and at least one second partition plate. The first channel is used for guiding the electroplating solution in the main tank to the sub-tank, and the second channel is used for guiding the solution in the sub-tank to the main tank. The first partition plate is arranged in the sub-tank and connected with the bottom wall of the sub-tank. The top surface of the first partition plate is higher than the liquid level of the electroplating solution, so as to divide the sub-tank into a first tank and a second tank. The first partition plate is formed with a first communication hole, the first communication hole communicates the first tank and the second tank, and the second channel communicates with the second tank. The at least one second partition plate is arranged in the first tank, the top surface of the second partition plate is higher than the liquid level of the electroplating solution, and the second partition plate is used for dividing the first tank into at least two sub-tanks. The at least two sub-tanks are arranged along the flow direction of the electroplating solution. The first channel communicates with the most upstream sub-tank. The second partition plate is formed with a second communication hole, and the second communication hole communicates two adjacent sub-tanks.

Description

Technical Field

[0001] This application relates to the field of electroplating technology, and more particularly to an electroplating tank. Background Technology

[0002] Electroplating tanks are the core equipment in the electroplating process. Some related technologies include main tanks and auxiliary tanks. During the electroplating process, the workpiece to be plated is placed in the main tank, and the electroplating reaction takes place in the main tank. The auxiliary tank is used to store the electroplating solution and to provide a place for the exchange of the electroplating solution and the addition of additives.

[0003] As the electroplating reaction proceeds, the metal ions in the electroplating solution in the main tank are continuously consumed. A portion of the liquid in the main tank overflows into the secondary tank, mixes with the liquid in the secondary tank, and is then circulated back into the main tank. Through continuous circulation, the concentration of metal ions in the electroplating solution in the main tank is ensured.

[0004] The electroplating solution flowing from the main tank to the auxiliary tank contains residual bubbles generated by the electroplating reaction. Furthermore, when the impact force between the liquid surface in the main tank and the liquid surface in the auxiliary tank is too great, bubbles will also be generated. When these bubbles are recycled back to the main tank, they will affect the coating quality and reduce the product yield. Utility Model Content

[0005] In view of this, embodiments of this application aim to provide an electroplating tank that helps reduce air bubbles in the electroplating solution circulating into the main tank.

[0006] This application provides an electroplating tank, including: The main tank is used to store the electroplating solution and to hold the workpieces to be plated. The auxiliary tank is used to store the electroplating solution; A first channel and a second channel, wherein the first channel is used to guide the electroplating solution in the main tank to the auxiliary tank, and the second channel is used to guide the solution in the auxiliary tank to the main tank; A first partition is disposed in the sub-tank and connected to the bottom wall of the sub-tank. The top surface of the first partition is higher than the liquid surface of the electroplating solution to divide the sub-tank into a first tank and a second tank. The first partition has a first connecting hole that connects the first tank and the second tank. The second channel is connected to the second tank. At least one second partition is disposed in the first tank, the top surface of the second partition being higher than the liquid surface of the electroplating solution, for dividing the first tank into at least two sub-tanks, the at least two sub-tanks being arranged along the flow direction of the electroplating solution, the first channel being connected to the upstream sub-tank, and the second partition having a second connecting hole connecting two adjacent sub-tanks.

[0007] In some implementations, a portion of the bottom surface of the first partition is spaced apart from the bottom wall of the secondary groove to form the first connecting hole.

[0008] In some implementations, a portion of the bottom surface of the second partition is spaced apart from the bottom wall of the sub-groove to form the second connecting hole.

[0009] In some implementations, a first gap is provided between the top surface of the first partition and the top wall of the secondary groove, the first gap being used for airflow.

[0010] In some embodiments, a second gap is provided between the top surface of the second partition and the top wall of the sub-slot, the second gap being used for airflow.

[0011] In some embodiments, the electroplating tank further includes an overflow plate disposed within the first tank and located downstream of all the second baffles; The overflow plate is connected to the bottom wall of the sub-tank. The top surface of the overflow plate is lower than the liquid level of the electroplating solution and higher than the bottom surface of the second partition.

[0012] In some embodiments, the secondary groove includes a first sidewall, a second sidewall, a third sidewall, and a fourth sidewall connected in sequence. The first sidewall and the third sidewall are arranged opposite each other along a first direction, and the second sidewall and the fourth sidewall are arranged opposite each other along a second direction. The first direction and the second direction are substantially perpendicular. The first partition includes a first sub-plate, a second sub-plate, and a third sub-plate connected in sequence. The first sub-plate is connected to the fourth side wall, and the third sub-plate is connected to the second side wall. The first sub-plate and the second sub-plate are both approximately parallel to the first side wall, and the second sub-plate is approximately parallel to the second side wall. The third sub-plate is located on the side of the first sub-plate facing the third side wall. The first connection is formed in the third sub-plate, and the at least one second partition is disposed between the first sidewall and the first sub-plate.

[0013] In some embodiments, the electroplating tank further includes an overflow plate disposed within the first tank and located downstream of all the second baffles; The overflow plate is connected to the bottom wall of the sub-tank. The top surface of the overflow plate is lower than the liquid level of the electroplating solution and higher than the bottom surface of the second partition. The overflow plate is located between the second sub-plate and the second sidewall.

[0014] In some implementations, the main tank is provided with an outlet, the secondary tank is provided with an inlet, the outlet is positioned higher than the inlet, and the first channel connects the outlet and the inlet.

[0015] In some implementations, the secondary tank is located below the main tank, and the liquid outlet is located on the bottom wall of the main tank.

[0016] The electroplating tank provided in this application embodiment uses at least one second baffle to divide the first tank into multiple sub-tanks. As a result, due to the blocking effect of the second baffle, most of the bubbles in the electroplating solution in the sub-tank are retained above the liquid surface in the corresponding sub-tank and defoamed. The number of bubbles in the electroplating solution in the downstream sub-tank will inevitably be less than the number of bubbles in the electroplating solution in the upstream sub-tank. That is to say, along the flow direction of the electroplating solution, due to the blocking effect of the second baffle and the first baffle, the number of bubbles is continuously reduced, so as to isolate the bubbles in the first tank as much as possible. Attached Figure Description

[0017] Figure 1 A schematic diagram of the cross-sectional projection of the electroplating tank along the second direction provided in the embodiments of this application; Figure 2 for Figure 1 A schematic cross-sectional view of the structure shown along the AA direction; Figure 3 for Figure 1 A schematic cross-sectional view of the structure shown along the BB direction.

[0018] Explanation of reference numerals in the attached figures 10. Main tank; 20. Secondary tank; 20a. Liquid inlet; 21. First tank; 21a. Sub-tank; 22. Second tank; 23. First sidewall; 24. Second sidewall; 25. Third sidewall; 26. Fourth sidewall; 30. First channel; 40. First partition; 41. First connecting hole; 42. First sub-plate; 43. Second sub-plate; 44. Third sub-plate; 50. Second partition; 51. Second connecting hole; 60. Overflow plate; 70. First partition; 80. Second partition.

[0019] It should be noted that the terms "first" and "second" mentioned above are only used to distinguish between different options and do not represent the degree of superiority or inferiority of the options or their priority in the implementation process. Detailed Implementation

[0020] The embodiments of this application will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this application, but should not be used to limit the scope of this application.

[0021] In the description of the embodiments of this application, it should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0022] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application based on the specific circumstances.

[0023] In the embodiments of this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature and the second feature are in direct contact, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0024] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the embodiments of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0025] In related technologies, the electroplating solution in the main tank enters the auxiliary tank primarily through overflow and active circulation. Overflow refers to the electroplating solution naturally flowing into the auxiliary tank through an overflow pipe when the liquid level in the main tank is higher than that in the auxiliary tank. During overflow, a large difference in liquid level between the main tank and the auxiliary tank can cause the electroplating solution to impact the surface of the auxiliary tank at high speed, resulting in an increase in bubbles. Active circulation refers to using a pump to draw the solution from the main tank to the auxiliary tank. If air is drawn into the pump during the pumping process, bubbles will be generated. Alternatively, excessive pumping pressure can cause the solution to impact the surface of the auxiliary tank at high speed, also generating bubbles.

[0026] If air bubbles return to the main tank along with the electroplating solution, it will affect the quality of the plating layer and thus the product yield.

[0027] In view of this, in order to reduce the air bubbles in the electroplating solution circulating from the secondary tank 20 to the main tank 10, this application embodiment provides an electroplating tank.

[0028] In this embodiment, the first direction is the direction indicated by v1 in the figure, the second direction is the direction indicated by v2 in the figure, and the height direction is the direction indicated by v3 in the figure. The first direction, the second direction, and the height direction are approximately perpendicular to each other.

[0029] In this application embodiment, "approximately perpendicular" is used to describe the angular relationship between two directions, planes, or components. Its meaning includes, but is not limited to, an absolute, ideal 90-degree perpendicularity. It covers angles close to 90 degrees within engineering design and manufacturing tolerances.

[0030] Specifically, please refer to Figure 1 The electroplating tank includes a main tank 10, a secondary tank 20, a first channel 30, and a second channel (not shown in the figure).

[0031] The main tank 10 is used to store the electroplating solution and to place the workpieces to be plated. The electroplating reaction takes place in the main tank 10.

[0032] Sub-tank 20 is used to store electroplating solution.

[0033] The first channel 30 is used to guide the electroplating solution in the main tank 10 to the auxiliary tank 20, and the second channel is used to guide the solution in the auxiliary tank 20 to the main tank 10.

[0034] Specifically, the main tank 10 is provided with a liquid outlet, the auxiliary tank 20 is provided with a liquid inlet 20a, the position of the liquid outlet is higher than that of the liquid inlet 20a, and the first channel 30 connects the liquid outlet and the liquid inlet 20a.

[0035] For example, the outlet is positioned higher than the inlet 20a. This helps the solution flowing out of the outlet to flow through the first channel 30 to the inlet 20a under the influence of gravity, and then to the secondary tank 20.

[0036] Understandably, the height difference between the outlet and the inlet 20a can be set according to the actual design, as long as it is ensured that the solution flowing out of the outlet flows to the inlet 20a through the first channel 30 under the action of gravity.

[0037] It is understood that the arrangement of the main slot 10 and the secondary slot 20 is not limited. For example, in some embodiments, such as... Figure 1 and Figure 3 As shown, the secondary tank 20 is located entirely below the main tank 10, which facilitates the flow of the electroplating solution in the main tank 10 to the secondary tank 20 through the first channel 30 under the influence of gravity. In this embodiment, the electroplating solution in the secondary tank 20 can be pumped into the main tank 10 through the second channel.

[0038] It is understandable that the secondary slot 20 is located below the main slot 10, either directly below or diagonally below. There is no limitation here, as long as the highest point of the secondary slot 20 is lower than the lowest point of the main slot 10.

[0039] For example, the liquid outlet is located on the bottom wall of the main tank 10. In this way, on the one hand, outside air will not enter the first channel 30 through the liquid outlet, and on the other hand, the solution in the main tank 10 can flow through the liquid outlet to the first channel 30 and then into the secondary tank 20, and then be circulated back into the main tank 10.

[0040] In some other embodiments, the main tank 10 and the auxiliary tank 20 may be arranged along a first direction or a second direction, with the outlet of the main tank 10 positioned higher than the inlet 20a of the auxiliary tank 20. Due to the level difference between the main tank 10 and the auxiliary tank 20, a portion of the solution in the main tank 10 overflows into the auxiliary tank 20 through the first channel 30. The solution in the auxiliary tank 20 can be pumped into the main tank 10. It is understandable that in some embodiments, the solution in the main tank 10 can also be pumped into the secondary tank 20.

[0041] In some embodiments, such as Figure 2 As shown, the electroplating tank includes a first partition 40, which is disposed within the secondary tank 20 and connected to the bottom wall of the secondary tank 20. The first partition 40 divides the secondary tank 20 into a first tank 21 and a second tank 22. The first partition 40 has a first connecting hole 41, which connects the first tank 21 and the second tank 22. A first channel 30 connects to the first tank 21, and a second channel connects to the second tank 22. In this embodiment, the electroplating solution in the main tank 10 flows to the first tank 21 through the first channel 30, and then flows to the second tank 22 through the first connecting hole 41. When the electroplating solution flows through the first tank 21, the bubbles in the electroplating solution float to the surface due to buoyancy. Due to the blocking effect of the first partition 40, most of the bubbles will remain above the surface of the liquid in the first tank 21 and then defoam, thus reducing the number of bubbles in the electroplating solution flowing to the second tank 22.

[0042] In some embodiments, the electroplating tank includes at least one second partition 50 disposed in the first tank 21. The top surface of the second partition 50 is higher than the liquid surface of the electroplating solution, and is used to divide the first tank 21 into at least two sub-tanks 21a. The at least two sub-tanks 21a are arranged along the flow direction of the electroplating solution. The first channel 30 communicates with the upstream sub-tank 21a. The second partition 50 is formed with a second connecting hole 51, which connects the two adjacent sub-tanks 21a.

[0043] In this embodiment, at least one second partition 50 is used to divide the first tank 21 into multiple sub-tanks 21a. As a result of the blocking effect of the second partition 50, most of the bubbles in the electroplating solution in the sub-tank 21a are retained above the liquid surface in the corresponding sub-tank 21a and defoamed. The number of bubbles in the electroplating solution in the downstream sub-tank 21a will inevitably be less than the number of bubbles in the electroplating solution in the upstream sub-tank 21a. That is to say, along the flow direction of the electroplating solution, the number of bubbles is continuously reduced due to the blocking effect of the second partition 50 and the first partition 40, so as to isolate the bubbles in the first tank 21 as much as possible.

[0044] For example, such as Figure 1 As shown, a portion of the bottom surface of the first partition 40 is spaced apart from the bottom wall of the secondary tank 20 to form a first connecting hole 41. This positions the first connecting hole 41 as low as possible, allowing the lower layer of electroplating solution in the first tank 21 to flow to the second tank 22 through the first connecting hole 41. Since bubbles rise due to buoyancy, the number of bubbles in the lower layer of electroplating solution is less than that in the upper layer, thus further reducing the number of bubbles in the electroplating solution flowing to the second tank 22.

[0045] For example, such as Figure 3 As shown, a portion of the bottom surface of the second partition 50 is spaced apart from the bottom wall of the sub-tank 20 to form a second connecting hole 51. This allows the lower layer of the electroplating solution in the upstream sub-tank 21a to flow through the second connecting hole 51 to the downstream sub-tank 21a, thereby further reducing air bubbles in the electroplating solution flowing to the downstream sub-tank 21a.

[0046] In some embodiments, such as Figure 1 As shown, the dimension d1 of the first connecting hole 41 along the height direction is 180mm~220mm. That is, 180mm≤d1≤220mm. For example, d1 can be 180mm, 185mm, 190mm, 205mm, 210mm, 220mm, etc. By controlling d1 within this range, it helps to ensure the flow efficiency of the electroplating solution, and also facilitates the blocking effect of the first partition 40 on air bubbles. In some embodiments, such as Figure 3As shown, the dimension d4 of the second connecting hole 51 along the height direction is 180mm~220mm. That is, 180mm≤d4≤220mm. For example, d4 can be 180mm, 185mm, 190mm, 205mm, 210mm, 220mm, etc. By controlling d4 within this range, it helps to ensure the flow efficiency of the electroplating solution, and also facilitates the blocking effect of the second baffle 50 on air bubbles.

[0047] For example, such as Figure 1 As shown, there is a first gap 70 between the top surface of the first partition 40 and the top wall of the secondary groove 20. The first gap 70 is used to allow airflow so that the air pressure in the first groove 21 and the second groove 22 is equal.

[0048] For example, please continue reading Figure 1 A second gap 80 is provided between the top surface of the second partition 50 and the top wall of the sub-slot 20. The second gap 80 is used to allow airflow so that the airflow of two adjacent sub-slots 21a is interconnected, ensuring that the air pressure of the two adjacent sub-slots 21a is comparable. In some embodiments, please refer to the accompanying documentation. Figure 1 , Figure 2 and Figure 3 The electroplating tank also includes an overflow plate 60, which is located within the first tank 21 and downstream of all the second baffles 50. The overflow plate 60 is connected to the bottom wall of the sub-tank 20, and its top surface is lower than the surface of the electroplating solution but higher than the bottom surface of the second baffles 50. Thus, the overflow plate 60 acts as an overflow buffer, helping to slow the flow rate of the electroplating solution into the second tank 22, preventing the formation of new bubbles. Furthermore, since the overflow plate 60 is located downstream of all the second baffles 50, most of the bubbles in the electroplating solution have already floated to the surface and remain in the sub-tank 21a upstream of the overflow plate 60. The slower flow rate of the electroplating solution also allows the remaining small number of bubbles to float to the surface under buoyancy and remain in the first tank 21.

[0049] In some embodiments, please refer to Figure 2 The secondary channel 20 includes a first sidewall 23, a second sidewall 24, a third sidewall 25, and a fourth sidewall 26 connected in sequence. The first sidewall 23 and the third sidewall 25 are arranged opposite each other along a first direction, and the second sidewall 24 and the fourth sidewall 26 are arranged opposite each other along a second direction. The first direction and the second direction are approximately perpendicular. That is, the cross-sectional projection of the secondary channel 20 along the height direction is rectangular, and the secondary channel 20 has a cuboid structure.

[0050] For example, the first partition 40 includes a first sub-plate 42, a second sub-plate 43, and a third sub-plate 44 connected in sequence. The first sub-plate 42 is connected to the fourth sidewall 26, and the third sub-plate 44 is connected to the second sidewall 24. The first sub-plate 42 and the third sub-plate 44 are both substantially parallel to the first sidewall 26, and the second sub-plate 43 is substantially parallel to the second sidewall 24. The third sub-plate 44 is located on the side of the first sub-plate 42 facing the third sidewall 25. A first connecting opening is formed in the third sub-plate 44, and at least one second partition 50 is disposed between the first sidewall 23 and the first sub-plate 42. Thus, the first partition 40 has a bent structure, and after entering the upstream sub-tank 21a from the first channel 30, it flows in the second direction and then in the first direction to the first connecting hole 41, which helps to increase the flow path of the electroplating solution, so that the bubbles in the electroplating solution in the first tank 21 float to the surface as much as possible.

[0051] It should be noted that "approximately parallel" is used to describe the angular relationship between two directions, planes, or components. Approximately parallel includes, but is not limited to, absolute, ideal 180-degree parallelism. It covers angles close to 180 degrees within engineering design and manufacturing tolerances.

[0052] In some embodiments, the overflow plate 60 is disposed between the second sub-plate 43 and the second sidewall 24. This positions the overflow plate 60 on the side of the first connecting hole 41 facing the first sidewall 23 in a first direction, and downstream of all the second partitions 50.

[0053] The various embodiments / implementations provided in this application can be combined with each other without creating contradictions.

[0054] The above description is merely a preferred embodiment of this application and is not intended to limit the application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. An electroplating tank, characterized in that, include: The main tank is used to store the electroplating solution and to hold the workpieces to be plated. The auxiliary tank is used to store the electroplating solution; A first channel and a second channel, wherein the first channel is used to guide the electroplating solution in the main tank to the auxiliary tank, and the second channel is used to guide the solution in the auxiliary tank to the main tank; A first partition is disposed in the sub-tank and connected to the bottom wall of the sub-tank. The top surface of the first partition is higher than the liquid surface of the electroplating solution to divide the sub-tank into a first tank and a second tank. The first partition has a first connecting hole that connects the first tank and the second tank. The second channel is connected to the second tank. At least one second partition is disposed in the first tank, the top surface of the second partition being higher than the liquid surface of the electroplating solution, for dividing the first tank into at least two sub-tanks, the at least two sub-tanks being arranged along the flow direction of the electroplating solution, the first channel being connected to the upstream sub-tank, and the second partition having a second connecting hole connecting two adjacent sub-tanks.

2. The electroplating tank according to claim 1, characterized in that, A portion of the bottom surface of the first partition is spaced apart from the bottom wall of the secondary groove to form the first connecting hole.

3. The electroplating tank according to claim 1, characterized in that, A portion of the bottom surface of the second partition is spaced apart from the bottom wall of the sub-groove to form the second connecting hole.

4. The electroplating tank according to claim 1, characterized in that, There is a first gap between the top surface of the first partition and the top wall of the secondary groove, the first gap being used for airflow.

5. The electroplating tank according to claim 1, characterized in that, There is a second gap between the top surface of the second partition and the top wall of the sub-slot, the second gap being used for airflow.

6. The electroplating tank according to claim 1, characterized in that, The electroplating tank also includes an overflow plate, which is disposed in the first tank and located downstream of all the second partitions; The overflow plate is connected to the bottom wall of the sub-tank. The top surface of the overflow plate is lower than the liquid level of the electroplating solution and higher than the bottom surface of the second partition.

7. The electroplating tank according to claim 1, characterized in that, The secondary groove includes a first sidewall, a second sidewall, a third sidewall, and a fourth sidewall connected in sequence. The first sidewall and the third sidewall are arranged opposite each other along a first direction, and the second sidewall and the fourth sidewall are arranged opposite each other along a second direction. The first direction and the second direction are approximately perpendicular. The first partition includes a first sub-plate, a second sub-plate, and a third sub-plate connected in sequence. The first sub-plate is connected to the fourth side wall, and the third sub-plate is connected to the second side wall. The first sub-plate and the second sub-plate are both approximately parallel to the first side wall, and the second sub-plate is approximately parallel to the second side wall. The third sub-plate is located on the side of the first sub-plate facing the third side wall. The first connection is formed in the third sub-plate, and the at least one second partition is disposed between the first sidewall and the first sub-plate.

8. The electroplating tank according to claim 7, characterized in that, The electroplating tank also includes an overflow plate, which is disposed in the first tank and located downstream of all the second partitions; The overflow plate is connected to the bottom wall of the sub-tank. The top surface of the overflow plate is lower than the liquid level of the electroplating solution and higher than the bottom surface of the second partition. The overflow plate is located between the second sub-plate and the second sidewall.

9. The electroplating tank according to claim 1, characterized in that, The main tank is provided with a liquid outlet, the secondary tank is provided with a liquid inlet, the first channel connects the liquid outlet and the liquid inlet, and the position of the liquid outlet is higher than that of the liquid inlet.

10. The electroplating tank according to claim 9, characterized in that, The secondary tank is located below the main tank, and the liquid outlet is located on the bottom wall of the main tank.

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