Automatic silver plating equipment for electronic components

Abstract

The utility model relates to silver plating equipment technical field discloses an electronic component automatic silver plating equipment, including silver plating groove, the left surface fixed mounting of silver plating groove has circulating pipe, wherein, be provided with silver plating mechanism on silver plating groove, this equipment can guarantee silver plating quality and promote automation efficiency significantly, with silver plating groove as core work area, circulating pipe cooperation delivery pump drive plating solution circulation, polypropylene folding filter core can effectively filter plating solution impurity in the process, avoid the impurity influence component silver plating effect, the sediment tank adopts the design of separate drawer and supports the setting of inclination or ladder, can not only conveniently collect and clean silver plating sediment, but also can reduce the pollution of sediment to plating solution, maintain plating solution purity, simultaneously, the smooth sliding of moving guide rail guide moving block, drive mechanical arm automatic completion component between silver plating groove and subsequent process's snatch, removal, replace manual feeding and discharging, greatly improve production efficiency, reduce the influence of human operation error to silver plating quality.

Description

Technical Field

[0001] This utility model relates to the field of silver plating equipment technology, specifically to an automated silver plating equipment for electronic components. Background Technology

[0002] In the field of electronic component manufacturing, silver plating is a core process that ensures the conductivity, corrosion resistance, and signal transmission stability of components. Its technical level directly affects the performance and lifespan of the final product. However, the mainstream silver plating equipment for electronic components currently in the industry still faces multiple technical bottlenecks in actual production, resulting in unstable silver plating quality, low production efficiency, and insufficient environmental friendliness.

[0003] Although existing silver plating equipment is equipped with a basic plating solution circulation structure, it has obvious defects: the circulation system mostly uses simple filter screens with low filtration accuracy, which cannot effectively intercept the fine metal debris and organic impurities generated by chemical reactions in the plating solution. These impurities are easy to adhere to the surface of electronic components, resulting in defects such as pinholes, spots, and peeling in the silver plating layer, and a low finished product qualification rate. The metal sludge (such as silver slag and copper slag) generated during the silver plating process lacks an efficient collection mechanism. The sludge is easy to accumulate at the bottom of the silver plating tank and diffuses again with the circulation of the plating solution, further contaminating the plating solution. Frequent replacement of the plating solution is required, which increases the cost of raw materials and extends the downtime of the equipment. Utility Model Content

[0004] (a) Technical problems to be solved

[0005] To address the shortcomings of existing technologies, this utility model provides an automated silver plating equipment for electronic components, solving the problem of inconvenient silver plating in existing equipment.

[0006] (II) Technical Solution

[0007] To achieve the above objectives, this utility model provides the following technical solution: an automated silver plating equipment for electronic components, including a silver plating tank, wherein a circulation pipe is fixedly installed on the left surface of the silver plating tank;

[0008] The silver plating tank is equipped with a silver plating mechanism, which includes a conveying pump, a polypropylene pleated filter element, a sedimentation tank, a moving guide rail, a moving block, and a robotic arm.

[0009] The delivery pump is fixedly installed on the circulation pipe, while the polypropylene pleated filter element is movably installed on the circulation pipe.

[0010] The sludge trough is slidably fitted inside the silver plating tank, and the sludge trough is a separate drawer-type sludge trough.

[0011] Preferably, the movable guide rail is disposed on the rear surface of the silver plating tank, and the movable block is slidably sleeved on the outer surface of the movable guide rail;

[0012] The robotic arm is fixedly mounted on the upper surface of the moving block.

[0013] Preferably, the silver plating mechanism further includes a drying chamber fixedly installed on the right surface of the silver plating tank, and two fixing plates fixedly installed on the opposite sides of the two vertical plates of the drying chamber.

[0014] Preferably, the silver plating mechanism further includes extension plates and electric push rods. The two extension plates are slidably sleeved on the inner surfaces of the two fixed plates, and the piston rods of the two electric push rods are fixedly installed on the lower surfaces of the two extension plates. The two electric push rods are fixedly installed on the opposite sides of the two vertical plates of the drying chamber.

[0015] Preferably, the silver plating mechanism further includes fixing blocks, heating resistance wires, and a fan. Two fixing blocks are fixedly installed on the inner surfaces of the two vertical plates of the drying chamber, and two heating resistance wires are fixedly installed on the opposite sides of the fixing blocks.

[0016] The two fans are fixedly installed on opposite sides of the fixed block, and the two fans are installed in a corresponding manner with the two heating resistance wires.

[0017] Preferably, the silver plating mechanism further includes an axial flow duct and a granular activated carbon filter, with the axial flow duct fixedly installed on the right surface of the drying chamber;

[0018] The granular activated carbon filter is fixedly installed at the air outlet of the axial flow duct.

[0019] Preferably, the sedimentation tank is an inclined sedimentation tank.

[0020] Preferably, the sedimentation tank is arranged in a stepped sedimentation tank configuration.

[0021] (III) Beneficial Effects

[0022] Compared with the prior art, this utility model provides an automated silver plating equipment for electronic components, which has the following beneficial effects:

[0023] 1. This equipment can significantly ensure the quality of silver plating and improve automation efficiency. With the silver plating tank as the core working area, the circulation pipe and the delivery pump drive the circulation of the plating solution. During the process, the polypropylene pleated filter can effectively filter impurities in the plating solution, preventing impurities from affecting the silver plating effect of the components. The sludge tank adopts a separate drawer design and supports tilting or stepped settings, which can not only conveniently collect and clean the silver plating sludge, but also reduce the pollution of the plating solution by the sludge and maintain the purity of the plating solution. At the same time, the moving guide rail guides the moving block to slide smoothly, driving the robotic arm to automatically complete the gripping and transfer of components between the silver plating tank and subsequent processes, replacing manual loading and unloading, greatly improving production efficiency and reducing the impact of human operation error on the silver plating quality.

[0024] 2. The equipment has good adaptability in the drying process and can achieve environmentally friendly emissions. The drying chamber provides a dedicated drying space for silver-plated components. The extension plate supported by the fixed plate can be extended and retracted under the drive of the electric push rod, which can adjust the effective space in the drying chamber according to the different sizes of components, ensuring that all types of components can be fully dried. The heating resistance wire fixed by the fixed block provides a stable heat source, and the corresponding installed fan can blow heat evenly to the components to accelerate drying. The axial flow duct ensures air circulation in the drying chamber, and the granular activated carbon filter at the air outlet can adsorb odors and harmful substances generated during the drying process, purify the exhaust gas, reduce environmental pollution, and balance drying effect with environmental protection requirements. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the structure of an automated silver plating equipment for electronic components according to this utility model;

[0026] Figure 2 This is a schematic diagram of the silver plating tank structure of this utility model;

[0027] Figure 3 This is a schematic diagram of the sedimentation tank structure of this utility model;

[0028] Figure 4 This is a schematic diagram of the internal structure of the silver plating tank of this utility model;

[0029] Figure 5 This is a schematic diagram of the internal structure of the drying chamber of this utility model.

[0030] In the diagram: 1. Silver plating tank; 2. Circulation pipe; 3. Transfer pump; 4. Polypropylene pleated filter element; 5. Sludge tank; 6. Moving guide rail; 7. Moving block; 8. Robotic arm; 9. Drying chamber; 10. Fixed plate; 11. Extension plate; 12. Electric push rod; 13. Fixed block; 14. Heating resistance wire; 15. Fan; 16. Axial flow duct; 17. Granular activated carbon filter screen. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0032] Please see Figure 1-5 This utility model provides a new technical solution: an automated silver plating equipment for electronic components, which solves the problem of inconvenient silver plating in traditional silver plating equipment.

[0033] Silver plating tank 1: As the core of the equipment, it is the main space for silver plating of electronic components. Other mechanisms are arranged around it. The left surface is connected to the circulation pipe 2, which provides a channel for the circulation of silver plating solution and ensures the stable progress of the silver plating process. Other mechanisms are arranged around it, which is the basic carrier of the entire silver plating process.

[0034] Circulation pipe 2: Fixed on the left surface of silver plating tank 1, it is the channel for circulating silver plating solution. Driven by delivery pump 3, it allows the silver plating solution to flow between the tank and the filter components, ensuring uniform composition of the silver plating solution and facilitating the filtration of impurities, thus maintaining a stable silver plating environment.

[0035] Transfer pump 3: Installed on circulation pipe 2, it provides power for the circulation of silver plating solution, drives the silver plating solution to flow in the pipe, and enables the liquid to be filtered and returned to silver plating tank 1, ensuring that the silver plating solution in the tank is continuously renewed and improving the uniformity of silver plating.

[0036] Polypropylene pleated filter element 4: It is movable and installed on the circulation pipe 2 to filter the circulating silver plating solution. Its multi-pleated structure increases the filtration area, effectively removes impurities, and prevents impurities from adhering to components and affecting the silver plating quality. The movable installation makes it easy to replace and clean.

[0037] Sludge Tank 5: Sliding sleeve inside the silver plating tank 1 to collect sludge generated during silver plating. The separate drawer design makes it easy to remove and clean. The inclined design helps to concentrate the sludge. The stepped sludge tank 5 facilitates layered sedimentation, reduces sludge contamination of the silver plating solution, and maintains the silver plating effect.

[0038] Moving guide rail 6: Located on the rear surface of the silver plating tank 1, it provides a sliding path for the moving block 7, guides the moving block 7 to move smoothly, and ensures that the robotic arm 8 accurately transfers the workpiece. It is a guiding structure for the transfer of workpieces between the silver plating and drying stages.

[0039] Moving block 7: Sliding sleeve outside the moving guide rail 6, it can slide along the guide rail, carry the robotic arm 8 and drive it to move, realize the position adjustment of the robotic arm between the silver plating tank 1 and the drying chamber 9, and ensure the precise and efficient transfer of workpieces.

[0040] Robotic arm 8: Fixed on the moving block 7, it is responsible for grabbing electronic components. Driven by the moving block 7, it puts the parts to be plated into the silver plating tank 1. After completion, it is transferred to the drying chamber 9, realizing automated loading and unloading and improving production efficiency.

[0041] Drying Chamber 9: Located to the right of Silver Plating Tank 1, it is used to dry silver-plated components. It provides a closed space and, together with heating and air supply devices, quickly removes moisture from the surface of the components, ensuring that the silver plating layer is dry and firm, thus improving product quality.

[0042] Fixed plate 10: Fixed to the opposite surfaces of the two vertical plates of the drying chamber 9, providing sliding support for the extension plate 11, restricting the movement direction of the extension plate 11, ensuring its stable extension and contraction, and is a basic component for adjusting the internal space of the drying chamber.

[0043] Extension plate 11: It slides inside the fixed plate 10 and can extend and retract under the drive of the electric push rod 12. By changing its extension length, it can adjust the effective space in the drying chamber 9 to adapt to the drying needs of components of different sizes.

[0044] Electric push rod 12: One end is connected to the extension plate 11, and the other end is fixed to the vertical plate of the drying chamber 9. It provides power to the extension plate 11 and drives the extension plate 11 to slide within the fixed plate 10 through telescopic movement, so as to realize the automatic adjustment of the drying space.

[0045] Fixing block 13: Installed on the inner surface of the two vertical plates of the drying chamber 9, it is used to fix the heating resistance wire 14 and the fan 15, providing stable support for these two components and ensuring that they are in a stable position and function properly during operation.

[0046] Heating resistance wire 14: Fixed on the opposite sides of two fixed blocks 13, it generates heat after being energized, providing a heat source for the drying chamber 9, raising the indoor temperature, accelerating the evaporation of moisture on the surface of components, and achieving rapid drying.

[0047] Fan 15: Installed on the opposite side of the fixed block 13, corresponding to the heating resistance wire 14. When working, it blows the heat generated by the resistance wire toward the components, promotes indoor air circulation, makes the heat distribution uniform, and improves drying efficiency.

[0048] Axial air duct 16: Fixed on the right surface of drying chamber 9, responsible for indoor air circulation, exhausting the moisture generated during drying to the outside, while introducing fresh air to maintain a suitable humidity environment in drying chamber 9 and ensure drying effect.

[0049] Granular activated carbon filter 17: Installed at the air outlet of axial flow duct 16, it filters the exhaust air, adsorbs odors and residual harmful substances in the air, purifies the exhaust gas, and reduces environmental pollution.

[0050] This automated silver plating equipment for electronic components achieves automated silver plating and subsequent processing of electronic components through the coordinated operation of various components. The silver plating tank 1 is the core working area used for silver plating of electronic components. The circulation pipe 2, together with the transfer pump 3, enables the plating solution in the silver plating tank 1 to circulate. The polypropylene pleated filter element 4 can filter the circulating plating solution to ensure its purity. The sludge tank 5 is used to collect the sludge generated during the silver plating process. The separate drawer design facilitates cleaning. The robotic arm 8 is used to grab and transfer electronic components. The drying chamber 9 dries the silver-plated electronic components. The heating resistance wire 14 provides heat, the fan 15 accelerates the flow of hot air, the axial flow duct 16 is responsible for air circulation, and the granular activated carbon filter screen 17 purifies the exhaust air.

[0051] Example 1: Application of Inclined Slag Tank in High-Precision Connector Silver Plating Production

[0052] like Figure 3 On the silver plating production line for mobile phone signal connectors, the surface precision requirement of the connectors is 0.01mm. Even a trace amount of sludge adhering to the plating solution can lead to poor signal transmission. In this case, an inclined sludge tank (15° inclination) is used. The silver sludge generated during the silver plating process naturally slides down the inclined tank wall to the sludge collection area at the end of the tank due to gravity. After the equipment has been running for 8 hours, the workers only need to pull out the drawer-type sludge tank to clean more than 95% of the silver sludge at once. This avoids the cleaning dead corners caused by the scattered accumulation of sludge in the traditional flat-bottom tank. At the same time, the inclined structure reduces the contact area between the sludge and the plating solution by 60%, reducing the risk of secondary dissolution of sludge and contamination of the plating solution. The plating solution replacement cycle is extended from the original 3 days to 7 days, and the pass rate of a single batch of connectors is increased to 99.2%.

[0053] Example 2: Application of stepped sedimentation tank in silver plating of multi-material components

[0054] like Figure 4 An electronics factory was simultaneously processing silver plating for components made of different materials, such as copper leads and iron bases. The density difference between copper and iron slag made slag separation difficult. After adopting a stepped slag tank (three steps with a height difference of 5cm), the denser iron slag (7.8g / cm³) settled in the first step during plating solution circulation, while the less dense copper slag (8.9g / cm³) flowed with the plating solution to the second step and settled. Trace impurities were finally collected in the third step. Workers could then recycle the slag in layers according to the steps, increasing the iron slag recovery rate to 92% and the copper slag purity to 95%. This not only reduced raw material waste but also reduced the labor costs of subsequent impurity sorting, increasing waste treatment efficiency by 40% per month.

[0055] Example 3: Application of a Separable Drawer Sludge Tank in Small-Batch, Multi-Product Silver Plating Production

[0056] like Figure 2 A research laboratory needs to conduct silver plating tests on sensor probes of different specifications (diameter 2-10mm). After each test, the plating solution needs to be quickly replaced to avoid cross-contamination. After adopting a separate drawer-type sedimentation tank, after completing a batch of tests, the operator does not need to empty the silver plating tank. The entire drawer-type sedimentation tank can be pulled out, and the sediment can be cleaned within 30 seconds. Then, a new sedimentation tank can be installed to carry out the next batch of tests. Compared with the traditional fixed sedimentation tank, which requires 2 hours of emptying and cleaning, the single production changeover time is reduced by 95%. In addition, the sedimentation tank can be pre-installed with filter pads of different materials (such as ceramic filter screens and nylon mesh), which can be quickly adapted to different silver plating processes, meeting the laboratory's flexible production needs for small batches and multiple varieties. The number of test batches per month has increased from 15 to 40.

[0057] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An automated silver plating equipment for electronic components, comprising a silver plating tank (1), characterized in that: A circulation pipe (2) is fixedly installed on the left surface of the silver plating tank (1); Among them, the silver plating tank (1) is equipped with a silver plating mechanism, which includes a conveying pump (3), a polypropylene pleated filter element (4), a sedimentation tank (5), a moving guide rail (6), a moving block (7), and a robotic arm (8). Among them, the delivery pump (3) is fixedly installed on the circulation pipe (2), and the polypropylene pleated filter element (4) is movably installed on the circulation pipe (2); Among them, the sludge tank (5) is slidably sleeved in the inner wall of the silver plating tank (1), and the sludge tank (5) is a separate drawer sludge tank.

2. The automated silver plating equipment for electronic components according to claim 1, characterized in that: The movable guide rail (6) is set on the rear surface of the silver plating tank (1), and the movable block (7) is slidably sleeved on the outer surface of the movable guide rail (6). The robotic arm (8) is fixedly installed on the upper surface of the moving block (7).

3. The automated silver plating equipment for electronic components according to claim 1, characterized in that: The silver plating mechanism also includes a drying chamber (9) fixedly installed on the right surface of the silver plating tank (1), and two fixing plates (10) fixedly installed on the opposite sides of the two vertical plates of the drying chamber (9).

4. The automated silver plating equipment for electronic components according to claim 1, characterized in that: The silver plating mechanism also includes an extension plate (11) and an electric push rod (12). The two extension plates (11) are slidably sleeved on the inner surfaces of the two fixed plates (10). The piston rods of the two electric push rods (12) are fixedly installed on the lower surfaces of the two extension plates (11) respectively. The two electric push rods (12) are fixedly installed on the opposite sides of the two vertical plates of the drying chamber (9).

5. The automated silver plating equipment for electronic components according to claim 1, characterized in that: The silver plating mechanism also includes a fixing block (13), a heating resistance wire (14), and a fan (15). The two fixing blocks (13) are fixedly installed on the inner surfaces of the two vertical plates of the drying chamber (9), and the two heating resistance wires (14) are fixedly installed on the opposite sides of the fixing blocks (13). Two fans (15) are fixedly installed on opposite sides of the fixed block (13), and the two fans (15) are installed in a corresponding manner with the two heating resistance wires (14).

6. The automated silver plating equipment for electronic components according to claim 1, characterized in that: The silver plating mechanism also includes an axial flow duct (16) and a granular activated carbon filter (17), with the axial flow duct (16) fixedly installed on the right surface of the drying chamber (9); Among them, the granular activated carbon filter (17) is fixedly installed at the air outlet of the axial flow duct (16).

7. The automated silver plating equipment for electronic components according to claim 1, characterized in that: The sedimentation tank (5) is set up as an inclined sedimentation tank.

8. The automated silver plating equipment for electronic components according to claim 1, characterized in that: The sedimentation tank (5) is arranged in a stepped sedimentation tank configuration.

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