Door handle sensing structure and door handle

Abstract

The utility model discloses door handle sensing structure and door handle related to automobile electronic technical field, specifically related to door handle sensing structure and door handle, the utility model discloses door handle sensing structure includes first casing, second casing and circuit module, and the first casing periphery is provided with the point gum boss, and the second casing is provided with the point gum groove, and after the point gum groove point coats silica gel, and the silica gel of point gum groove is extruded through the point gum boss to form the sealing rubber ring, the utility model discloses the flexible silica gel material is replaced traditional epoxy resin, keeps structural stability under the cold and hot impact, simplifies the packaging technology and realizes the maintenance of nondestructive dismounting simultaneously, has the advantage that the environmental adaptability, maintainability and production economy of promotion sealing structure.

Description

Technical Field

[0001] This utility model relates to the field of automotive electronics technology, specifically to a door handle sensing structure and a door handle. Background Technology

[0002] The vehicle digital key system uses a capacitive sensor integrated into the door handle to enable touch unlocking. A user's light touch on a specific area triggers a signal, and the door automatically unlocks after digital key authentication. The door handle pops out quickly within 0.5 seconds of unlocking for easy door opening; if no opening action is detected, it automatically retracts after one minute, effectively preventing accidental touches. To meet the IP6K9 waterproof rating requirements for high-pressure, high-temperature spray protection and the integration requirements of the rear wiring harness, the industry currently commonly uses a potting compound sealing process.

[0003] However, this process has significant technical drawbacks: it primarily uses epoxy resin as the encapsulation material, which, after curing, has high hardness but insufficient toughness. Under the frequent thermal shocks (≥50℃) in vehicle use environments, it is prone to micro-cracks, significantly increasing the risk of seal failure. The potting sealing process not only substantially increases production energy consumption and equipment costs but also restricts manufacturing efficiency. The permanent encapsulation formed after curing is not removable, requiring destructive removal for repairs, causing rework costs to surge by more than 50%. Furthermore, the unavoidable air gap residue during potting (porosity generally ≥1%) directly degrades seal reliability; water seepage channels formed by air bubbles can lead to short circuits in electronic components, further weakening insulation protection. These material characteristics and process defects collectively restrict the long-term environmental adaptability, production economy, and maintainability of the door handle module, urgently requiring the development of new encapsulation solutions to overcome these technical bottlenecks. Utility Model Content

[0004] In view of the above problems, this utility model provides a door handle sensing structure and a door handle, which solves the problem that the existing potting and sealing process uses epoxy resin as the encapsulation material. After curing, the epoxy resin has high hardness but insufficient toughness, and is prone to micro-cracks under frequent thermal shocks in the vehicle use environment, which significantly increases the risk of sealing structure failure. The potting and sealing process not only greatly increases production energy consumption and equipment costs, but also restricts manufacturing efficiency.

[0005] In a first aspect, this utility model provides a door handle sensing structure, characterized in that it includes: The first housing has adhesive-coated bosses on its periphery; The second housing is provided with a first receiving groove and a dispensing groove, wherein the dispensing groove is located on the periphery of the first receiving groove and is disposed opposite to the dispensing boss. And a circuit module, which is disposed in the first receiving slot, wherein the circuit module is provided with a capacitor and detects touch signals through the capacitor; In this process, after silicone is applied to the dispensing groove, the silicone in the dispensing groove is squeezed by the dispensing boss to form a sealing ring.

[0006] In some alternative embodiments, the second housing is provided with an inner peripheral protrusion and an outer peripheral protrusion, the first receiving groove is formed by the inner peripheral protrusion, and the dispensing groove is formed by the inner peripheral protrusion and the outer peripheral protrusion.

[0007] In some alternative embodiments, a cable outlet is provided on one side of the second housing, and at least one capacitor slot is provided in the first receiving groove.

[0008] In some alternative implementations, the circuit module includes a circuit board, a connecting harness, and at least one capacitor plate, the capacitor plate being disposed within the capacitor slot and electrically connected to the circuit board via a connector; a first end of the connecting harness is connected to one side of the circuit board, and a second end of the connecting harness passes through the outlet and is connected to the vehicle infotainment system.

[0009] In some optional embodiments, the number of capacitor plates is two, and the two capacitor plates are respectively arranged in different capacitor slots so that the two capacitor plates are separated.

[0010] In some alternative embodiments, the inner peripheral protrusion is provided with at least one snap fastener; when the circuit module is disposed in the first receiving groove, the circuit board abuts against the upper end of the inner peripheral protrusion, and the snap fastener is fixed to the upper surface of the circuit board.

[0011] In some alternative embodiments, the dispensing boss includes a first step and a second step, the first step extending into the dispensing groove and the second step abutting against the outer peripheral protrusion.

[0012] In some optional embodiments, the first housing is provided with a second receiving groove, which is formed by the first step; when the first housing is closed on the upper end of the second housing, the circuit board of the circuit module is disposed in the second receiving groove; at least one fixing member is also provided in the second receiving groove, and the fixing member is fixedly disposed on the upper end of the circuit board.

[0013] In some optional embodiments, a first snap-fit ​​member is provided on the outer periphery of the first housing, and a second snap-fit ​​member is provided on the outer periphery of the second housing. When the first housing is closed on the upper end of the second housing, the second snap-fit ​​member is snapped and fixed inside the first snap-fit ​​member.

[0014] Secondly, this utility model provides a door handle, including the aforementioned door handle sensing structure, and the door handle obtains touch signals through the door handle sensing structure.

[0015] Compared to existing technologies, the advantages of this invention are as follows: The door handle sensing structure of this invention includes a first housing, a second housing, and a circuit module. The first housing has dispensing protrusions on its periphery, and the second housing has dispensing grooves. After silicone is applied to the dispensing grooves, the dispensing protrusions compress the silicone in the dispensing grooves to form a sealing ring. This invention uses flexible silicone material instead of traditional epoxy resin, maintaining structural stability under thermal shock, while simplifying the encapsulation process and enabling non-destructive disassembly and maintenance. It has the advantages of improving the environmental adaptability, maintainability, and production economy of the sealing structure.

[0016] The above description is merely an overview of the technical solutions of the present utility model embodiments. In order to better understand the technical means of the present utility model embodiments and to implement them in accordance with the contents of the specification, and to make the above and other objects, features and advantages of the present utility model embodiments more obvious and understandable, specific embodiments of the present utility model are described below. Attached Figure Description

[0017] The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of the invention. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings: Figure 1 This invention provides a perspective view of the door handle sensing structure. Figure 2 An exploded view of the door handle sensing structure provided by this utility model is shown; Figure 3 A perspective view of the second housing provided by this utility model is shown; Figure 4 A perspective view of the first housing provided by this utility model is shown.

[0018] 1. First housing; 11. Adhesive dispensing boss; 12. First step; 13. Second step; 14. Second receiving groove; 15. Fixing component; 2. Second housing; 21. First receiving groove; 22. Dispensing groove; 23. Inner peripheral protrusion; 24. Outer peripheral protrusion; 25. Capacitor groove; 26. Cable outlet hole; 27. Buckle; 3. Circuit module; 31. Circuit board; 32. Capacitor sheet; 33. Connecting harness; 34. Connector; 4. Sealing ring; 5. First card receiving; 6. Second card connector. Detailed Implementation

[0019] Exemplary embodiments of the present invention will now be described in more detail with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be implemented in various forms and should not be limited to the embodiments set forth herein.

[0020] Example 1: Figures 1-4 This invention illustrates a first embodiment of a door handle sensing structure to address the shortcomings of existing potting and sealing processes that use epoxy resin as the encapsulation material. Epoxy resin, after curing, has high hardness but insufficient toughness, making it prone to micro-cracks under frequent thermal shocks in vehicle use environments, significantly increasing the risk of seal failure. The potting and sealing process not only significantly increases production energy consumption and equipment costs but also restricts manufacturing efficiency. This invention proposes a door handle sensing structure comprising a first housing 1, a second housing 2, and a circuit module 3. The first housing 1 has a dispensing boss 11 on its periphery. The second housing 2 has a first receiving groove 21 and a dispensing groove 22 located on its periphery, with the dispensing groove 22 opposite to the dispensing boss 11. The circuit module 3 is disposed within the first receiving groove 21 and integrates a capacitor 32. After silicone is applied to the dispensing groove 22, the silicone is compressed by the dispensing boss 11 to form a sealing ring 4.

[0021] In this embodiment, the dispensing boss 11 refers to a raised structure disposed on the periphery of the housing, specifically a ring-shaped stepped boss, used to apply directional pressure to the liquid silicone during assembly. The dispensing groove 22 refers to an annular groove surrounding the receiving groove, specifically formed by the enclosing of inner and outer peripheral protrusions 24, used to accommodate uncured silicone and restrict its lateral flow. The first receiving groove 21 refers to a recessed area used to fix the circuit module 3, specifically processed by injection molding. The sealing ring 4 refers to a silicone sealing structure formed by mechanical extrusion, specifically made of room temperature curing silicone material, whose elastic modulus can adapt to deformation caused by temperature changes.

[0022] Specifically, the second housing 2 is manufactured using injection molding to form a first receiving groove 21 and a dispensing groove 22 surrounding it. During assembly, silicone is applied to the dispensing groove 22 using a dispensing device, and then the first housing 1 and the second housing 2 are aligned and pressed together. The dispensing boss 11 is embedded in the dispensing groove 22 and exerts radial pressure on the silicone, forcing the adhesive to fill the assembly gap between the housings. During this process, the silicone forms a continuous annular sealing structure within the confined space, while any overflowing adhesive can cover any possible micropores. The circuit module 3 is fixed in the first receiving groove 21 by a snap-fit ​​27, and its capacitor 32 detection area maintains a preset distance from the outer surface of the door handle.

[0023] Compared to existing technologies, traditional potting processes require high-temperature environments to completely fill the gaps in the shell with liquid epoxy resin. This solution, however, achieves precise silicone molding through structure-guided mechanical extrusion, avoiding the energy consumption issues caused by high-temperature curing. The rigid structure formed by epoxy resin encapsulation requires complete destruction during maintenance, while the silicone sealing ring can be disassembled non-destructively by separating the shell. Furthermore, the design of the dispensing groove 22 and the boss effectively controls the adhesive flow path, making it easier to eliminate porosity defects compared to free-flowing potting processes.

[0024] Through the above technical solutions, this application resolves the technical contradiction of the incompatibility between hardness and toughness in epoxy resin encapsulation, improving the reliability of the sealing structure under temperature shock. Using room-temperature curing silicone instead of high-temperature curing epoxy resin reduces production energy consumption and equipment investment costs. The detachable sealing structure eliminates the need to damage the shell during maintenance, significantly reducing the difficulty of rework. The directional extrusion molding process effectively reduces the probability of residual pores, ensuring compliance with the IP6K9 waterproof rating.

[0025] Example 2: Based on Embodiment 1, this embodiment provides a second embodiment of the door handle sensing structure to further describe the first housing 1, the second housing 2, and the circuit module 3.

[0026] Specifically, see Figure 3 The present invention proposes that the second shell 2 is provided with an inner peripheral protrusion 23 and an outer peripheral protrusion 24, the first receiving groove 21 is formed by the inner peripheral protrusion 23, and the dispensing groove 22 is formed by the inner peripheral protrusion 23 and the outer peripheral protrusion 24.

[0027] In this embodiment, the inner peripheral protrusion 23 refers to an annular protrusion extending along the edge of the first accommodating groove 21, which can be integrally molded using injection molding. It is used to define the installation position of the circuit module 3 and prevent silicone from seeping into the interior of the first accommodating groove 21. The outer peripheral protrusion 24 refers to an annular protrusion located outside the inner peripheral protrusion 23, which can be segmented protrusions coaxial with the inner peripheral protrusion 23. It is used to form the boundary of the dispensing groove 22 together with the inner peripheral protrusion 23, constraining the silicone flow path. The first accommodating groove 21 refers to the recessed area enclosed by the inner peripheral protrusion 23, which can be rectangular or circular in shape. It is used to accommodate the circuit module 3 and limit its horizontal displacement. The dispensing groove 22 refers to an annular groove formed by the gap between the inner peripheral protrusion 23 and the outer peripheral protrusion 24. It can be a continuous channel with a preset width, used to store silicone and form a continuous sealing ring 4 by extrusion.

[0028] Specifically, the inner circumferential protrusion 23 and the outer circumferential protrusion 24 form a double-layer limiting structure through their height difference. When the silicone is applied to the dispensing groove 22, the dispensing boss 11 of the first housing 1 presses the silicone downward, causing it to extend evenly along the groove between the inner circumferential protrusion 23 and the outer circumferential protrusion 24, forming a closed-loop sealing layer surrounding the first receiving groove 21. The height of the inner circumferential protrusion 23 can be set to be higher than that of the outer circumferential protrusion 24. For example, the height of the inner circumferential protrusion 23 is 2 mm and the height of the outer circumferential protrusion 24 is 1.5 mm, so that the silicone preferentially fills towards the inner circumferential protrusion 23 when under pressure, preventing it from overflowing into the first receiving groove 21.

[0029] Compared with existing technologies, which rely on epoxy resin to fill the entire cavity, this embodiment uses a double-layer protrusion structure to confine the sealing area within the dispensing groove 22. Only local dispensing is needed to achieve an equivalent sealing effect, eliminating the need for high-temperature curing and reducing the adhesive volume by more than 80%. Furthermore, the physical restraint effect of the inner circumferential protrusion 23 and the outer circumferential protrusion 24 eliminates shrinkage stress after adhesive curing, preventing the formation of microcracks.

[0030] Through the above technical solution, this application solves the problem of sealing failure caused by residual pores in the potting process, and reduces maintenance costs through a detachable silicone sealing structure. The synergistic effect of the inner circumferential protrusion 23 and the outer circumferential protrusion 24 ensures that the shape of the sealing ring 4 is controllable, preventing silicone from penetrating into the electronic component area, thereby improving the long-term reliability of the door handle under thermal shock environments.

[0031] In some embodiments, the present invention proposes that a cable outlet is provided on one side of the second housing 2, and at least one capacitor slot 25 is provided in the first receiving groove 21.

[0032] In this embodiment, the cable outlet refers to an opening structure located on the side of the housing. Specifically, it can be implemented using a through-hole or channel structure formed by stamping or injection molding, providing a path for the connecting wire harness 33 to pass through and preventing the wire harness from bending or being compressed inside the housing. The capacitor groove 25 refers to a recessed area located within the receiving groove. Specifically, it can be implemented using a rectangular or circular groove structure that matches the shape of the capacitor sheet 32, used to fix the installation position of the capacitor sheet 32 ​​and prevent it from shifting under vibration.

[0033] Specifically, the cable outlet is located in the side wall area of ​​the second housing 2. One end of the connecting wire harness 33 passes through this opening to connect to the external vehicle infotainment system, and the other end extends into the receiving slot to connect to the circuit board 31. Capacitor slots 25 are arranged in an array or at intervals at the bottom of the receiving slot. The depth of each capacitor slot 25 can be set to match the thickness of the capacitor sheet 32, so that the surface of the capacitor sheet 32 ​​is flush with the bottom surface of the receiving slot after it is embedded. During assembly, the capacitor sheet 32 ​​is pre-placed into the capacitor slot 25 and electrically connected to the circuit board 31 through the connector 34.

[0034] Compared to existing technologies, traditional door handle modules lack a dedicated cable outlet, requiring the wiring harness to pass through gaps in the housing, which can easily lead to sealing failure. Furthermore, the capacitor 32 is directly fixed to the circuit board 31 without a positioning structure, making it prone to stress deformation under temperature changes. This application reduces the risk of wiring harness bending through the directional guidance of the cable outlet, while the limiting design of the capacitor slot 25 ensures that the capacitor 32 maintains stable contact under thermal expansion conditions.

[0035] Through the above technical solutions, this application solves the problem of sealing failure caused by disordered wiring harness arrangement and the problem of signal detection deviation caused by the lack of positioning structure in capacitor 32, improves the assembly accuracy and long-term reliability of the module, and provides a clear path for the disassembly operation of the wiring harness during maintenance.

[0036] In some embodiments, the present invention proposes that the circuit module 3 includes a circuit board 31, a connecting harness 33, and at least one capacitor 32. The capacitor 32 is disposed in a capacitor slot 25 and is electrically connected to the circuit board 31 through a connector 34. The first end of the connecting harness 33 is connected to one side of the circuit board 31, and the second end of the connecting harness 33 passes through the outlet and is connected to the vehicle infotainment system.

[0037] In this embodiment, the capacitor sheet 32 ​​refers to a metal conductor used for detecting touch signals, specifically a nickel-plated copper foil sheet, which is embedded in the capacitor groove 25 to fix the detection position. The connecting wire harness 33 refers to a signal transmission component composed of multiple insulated wires, specifically a flexible flat cable, which is electrically connected to the circuit board 31 by soldering or plugging. The cable outlet refers to a cable channel located on the side wall of the housing, specifically a rectangular through-hole structure molded by injection molding, used to constrain the exit path of the connecting wire harness 33.

[0038] Specifically, the capacitor 32 is pre-installed in the corresponding capacitor slot 25 of the second housing 2, and forms a stable electrical connection with the circuit board 31 through the connector 34, thereby transmitting the touch signal to the circuit board 31 for processing. One end of the connecting wire harness 33 is fixed to the side of the circuit board 31, and the other end extends to the outside through the housing outlet, forming a communication link with the vehicle system. This structure allows the capacitance detection unit and the signal processing unit to form a modular assembly relationship, while the path constraint of the outlet prevents the wire harness from being arranged randomly inside the housing.

[0039] Compared to existing technologies, the current solution uses a monolithic potting encapsulation, resulting in a non-removable connection between the wire harness and the circuit board 31. This solution, however, achieves maintainability of the circuit module 3 through a separate wire harness connection structure. In existing processes, the wire harness is completely encased in epoxy resin, requiring destructive cutting of the resin for repairs. This solution, with its independent wire outlet design, keeps the wire harness detachable, allowing for replacement without damaging the encapsulation structure.

[0040] Through the above technical solution, this application achieves modular separation and assembly of the capacitance detection unit and the signal processing unit. While ensuring signal transmission stability, it also makes the circuit board 31 and the connecting harness 33 form a detachable structure. When maintenance is required, the interface between the connecting harness 33 and the vehicle system can be directly disconnected for component replacement, avoiding the permanent encapsulation of the harness by traditional potting processes and significantly reducing the risk of damage to the sealing structure during rework. In addition, the path constraint of the cable outlet on the harness effectively prevents bending and tangling of the wires during assembly, improving production assembly efficiency.

[0041] In some embodiments, the present invention proposes that there be two capacitor sheets 32, which are respectively arranged in different capacitor slots 25 so that the two capacitor sheets 32 are separated.

[0042] In this embodiment, the capacitor 32 refers to a sensor unit used to detect touch signals. It can be made of a metallic conductor material and senses user touch actions through capacitance changes. The capacitor slot 25 refers to a groove structure provided on the second housing 2, used to accommodate and fix the capacitor 32. It can be formed using injection molding. The phase-separated arrangement means that the two capacitors 32 are spatially spaced to avoid signal interference. This can be achieved by arranging the capacitors 32 separately in independent, non-connected capacitor slots 25.

[0043] Specifically, the two capacitor plates 32 are installed in different capacitor slots 25, thus physically isolating them. When a user touches the door handle, the two capacitor plates 32 independently detect the capacitance change in a local area and fuse the data through the signal processing unit. Since there is no overlap between the capacitor plates 32 and the spacing is sufficient to eliminate coupling effects, the risk of signal crosstalk is reduced. For example, the capacitor plates 32 can be arranged in the front and rear areas of the door handle to cover different touch positions, thereby expanding the detection range.

[0044] Compared to existing technologies, traditional solutions typically involve multiple capacitors 32 clustered together in the same accommodating space, leading to signal superposition and interference, which can easily cause false triggering or uneven sensitivity. This solution, however, uses a split layout, allowing the capacitors 32 to operate independently, thus avoiding cross-interference and improving touch positioning accuracy.

[0045] Through the above technical solution, this application effectively solves the signal crosstalk problem caused by the dense layout of the capacitor sheet 32, enhances the stability and accuracy of touch detection, and optimizes the user touch experience through regional coverage, making the recognition of unlocking actions more reliable.

[0046] In some embodiments, the present invention proposes that the inner peripheral protrusion 23 is provided with at least one buckle 27; when the circuit module 3 is disposed in the first receiving groove 21, the circuit board 31 abuts against the upper end of the inner peripheral protrusion 23, and the buckle 27 is fixed on the upper surface of the circuit board 31.

[0047] In this embodiment, the inner circumferential protrusion 23 refers to the annular protrusion structure formed around the first accommodating groove 21. Specifically, it can be integrally formed with the second housing 2 using injection molding, serving to define the installation position of the circuit module 3 and provide a supporting reference. The latch 27 refers to a locking component with elastic deformation capability, specifically made of polycarbonate material through injection molding. The clamping force generated by deformation enables rapid fixing and disassembly of the circuit board 31. In a specific example, there are four latches 27, respectively located on both sides of the first accommodating groove 21, to secure the circuit board 31. Circuit board 31 abutment refers to the contact between the lower surface of the circuit board 31 and the top plane of the inner circumferential protrusion 23. This can be achieved by controlling the height tolerance of the inner circumferential protrusion 23 to ensure that the circuit board 31 remains horizontal during installation. The latch 27 fixing refers to the locking end of the latch 27 being embedded in a pre-set positioning hole on the upper surface of the circuit board 31. This can be achieved using a barbed structure design, forming a mechanical interlock to prevent vertical displacement of the circuit board 31.

[0048] Specifically, when the circuit module 3 is assembled into the first receiving slot 21, the lower surface of the circuit board 31 contacts the top plane of the inner peripheral protrusion 23 to form support. At this time, the elastic arm of the latch 27 is deformed by the pressure of the edge of the circuit board 31. After the circuit board 31 is fully in place, the barb structure of the latch 27 springs back and embeds into the positioning hole on the upper surface of the circuit board 31, forming a double lock in the vertical direction. This structure replaces the traditional adhesive fixing method with mechanical interlocking, ensuring the installation stability of the circuit board 31 while allowing the circuit module 3 to be disassembled and assembled without damage.

[0049] Compared with existing technologies, traditional potting processes require the circuit board 31 to be completely sealed in epoxy resin. During maintenance, the cured adhesive must be destroyed to remove the circuit board 31. However, this solution uses the elastic locking mechanism of the clip 27, which only requires releasing the mechanical constraint of the clip 27 to completely remove the circuit module 3, thus avoiding increased maintenance costs caused by damage to the encapsulation material.

[0050] Through the above technical solution, this application realizes the reversible assembly of circuit module 3. Under the premise of ensuring waterproof sealing performance, the maintenance operation of the door handle sensing structure does not need to damage the original encapsulation structure, significantly reducing the material consumption and labor time of rework, and eliminating the problem of reduced secondary assembly accuracy caused by adhesive residue.

[0051] In some embodiments, the present invention proposes that the dispensing boss 11 includes a first step 12 and a second step 13, the first step 12 extending into the dispensing groove 22 and the second step 13 abutting against the outer peripheral protrusion 24.

[0052] In this embodiment, the first step 12 refers to the extension of the dispensing boss 11 near the dispensing groove 22, which can be implemented using a stepped protrusion structure. Its function is to guide the silicone to fill into the dispensing groove 22 and form an initial sealing layer. The second step 13 refers to the supporting part where the dispensing boss 11 contacts the outer peripheral protrusion 24, which can be implemented using a planar boss structure. Its function is to provide a stable supporting surface and ensure that the silicone in the dispensing groove 22 is uniformly pressurized.

[0053] Specifically, the extension depth of the first step 12 is configured to partially embed within the dispensing groove 22. When the first housing 1 and the second housing 2 are assembled, the first step 12 applies a vertical extrusion force to the silicone in the dispensing groove 22, causing the silicone to extend along the gap between the inner peripheral protrusion 23 and the outer peripheral protrusion 24, forming a continuously closed sealing ring 4. The planar structure of the second step 13 covers the upper surface of the outer peripheral protrusion 24, achieving surface contact through the assembly pressure between the housings, thus avoiding uneven distribution of silicone due to local stress concentration.

[0054] Compared to existing technologies, which rely on the integral filling of epoxy resin, require high-temperature curing, and are non-removable, this solution achieves directional extrusion molding of silicone through a split stepped structure, eliminating the need for a high-temperature curing step. Furthermore, the elastic properties of silicone allow it to adapt to thermal deformation, preventing microcracks. The mechanical restraint created by the stepped structure further simplifies the sealing ring molding process and reduces the risk of residual porosity.

[0055] Through the above technical solution, this application solves the problems of sealing failure and maintenance difficulties caused by epoxy resin encapsulation process. The silicone sealing ring maintains elastic deformation capability under thermal shock, the sealing interface can be repeatedly disassembled and maintained, and the stepped structure achieves precise silicone filling through mechanical limiting, reducing porosity defects and improving sealing reliability.

[0056] In some embodiments, this utility model proposes a door handle sensing structure, including a first housing 1, a second housing 2, and a circuit module 3. The first housing 1 is provided with a second receiving groove 14, which is formed by a first step 12. When the first housing 1 is closed on the upper end of the second housing 2, the circuit board 31 of the circuit module 3 is disposed in the second receiving groove 14. At least one fixing member 15 is also provided in the second receiving groove 14, and the fixing member 15 is fixedly disposed on the upper end of the circuit board 31.

[0057] In this embodiment, the second receiving groove 14 refers to the spatial structure formed by the first step 12. Specifically, it can be implemented by forming a groove structure inside the housing using injection molding, which is used to accommodate the circuit board 31 and restrict its horizontal displacement. The first step 12 refers to the extension of the dispensing boss 11, which can be implemented by a stepped protrusion structure, forming a nested fit with the second housing 2 when closed. The fixing member 15 refers to the limiting structure used to restrict the vertical displacement of the circuit board 31, which can be implemented by screws, clips 27 or pressure plates, pressing the circuit board 31 firmly to the bottom of the second receiving groove 14 through a mechanical connection.

[0058] Specifically, when the first housing 1 and the second housing 2 are assembled, the second receiving groove 14 formed by the first step 12 completely surrounds the edge of the circuit board 31, and a vertical constraint force is applied by the fastener 15. This structure ensures that the circuit board 31 remains stably positioned after the sealing ring 4 has cured, avoiding stress concentration at the sealing interface caused by thermal deformation. At the same time, the enclosing structure of the second receiving groove 14 guides the circuit board 31 to precise alignment during assembly, eliminating sealing gaps caused by human error.

[0059] Compared to existing technologies, the epoxy resin encapsulation formed by traditional potting processes requires destructive removal to repair circuit board 31. This solution, however, utilizes a detachable fixing component 15 in conjunction with the second receiving groove 14, allowing circuit board 31 to be replaced without damaging the sealing structure. Furthermore, existing technologies rely on high-temperature curing processes to form permanent encapsulations, while this solution uses a mechanical limiting structure to fix the components, avoiding energy consumption and equipment investment during production.

[0060] Through the above technical solution, this application effectively solves the maintenance difficulties and production energy consumption problems caused by the potting process, and achieves component maintainability while ensuring sealing reliability. The synergistic effect of the second receiving groove 14 and the fixing part 15 reduces the dependence on operational precision during assembly and improves production yield. This structural design also avoids the risk of seal failure caused by residual pores in the potting process, and enhances the long-term stability of the door handle in complex environments.

[0061] In some embodiments, the present invention proposes that a first snap-fit ​​member 5 is provided on the outer periphery of the first housing 1 and a second snap-fit ​​member 6 is provided on the outer periphery of the second housing 2. When the first housing 1 is covered by the upper end of the second housing 2, the second snap-fit ​​member 6 is snapped and fixed in the first snap-fit ​​member 5.

[0062] In this embodiment, the first locking member 5 refers to the locking structure disposed on the outer peripheral edge of the first housing 1, which can be implemented as an annular flange with a groove, for forming a mechanical interlock with the second locking member 6. The second locking member 6 refers to the locking structure disposed on the outer peripheral edge of the second housing 2, which can be implemented as an annular flange with a protrusion, and is embedded into the groove of the first locking member 5 through elastic deformation to achieve a fixed connection between the housings.

[0063] Specifically, when the first housing 1 and the second housing 2 are closed, the protrusion of the second snap-fit ​​member 6 is guided by the groove of the first snap-fit ​​member 5 to undergo elastic deformation until it is fully embedded in the groove. At this point, the protrusion returns to its original shape and forms an interference fit with the inner wall of the groove, thereby fixing the two housings. This mechanical snap-fit ​​method replaces the adhesive fixing in the traditional potting process, avoiding the problem of being unable to disassemble after the adhesive has cured. In some specific embodiments, the first snap-fit ​​member 5 can be an elastic groove, and the second snap-fit ​​member 6 can be a snap-fit ​​protrusion. When the first housing 1 and the second housing 2 are closed, the snap-fit ​​protrusion snaps into the elastic groove. The number of first snap-fit ​​members 5 and second snap-fit ​​members 6 can be 6, and they are evenly arranged on both sides of the first housing 1 or the second housing 2. In some specific embodiments, the inner wall of the groove of the first snap-fit ​​member 5 can be provided with a guide slope to facilitate the sliding and deformation of the protrusion of the second snap-fit ​​member 6 along the slope during the closing process. The end of the protrusion of the second snap-fit ​​member 6 can be provided with a barb structure to enhance the pull-out resistance after snap-fit.

[0064] Compared to existing technologies, which rely on potting processes to achieve shell sealing, require high-temperature curing of the adhesive, and are non-removable, this solution directly fixes the shell using a snap-fit ​​structure, eliminating the need for an adhesive curing step and avoiding the energy consumption issues associated with high-temperature processing. Furthermore, the snap-fit ​​structure allows for repeated assembly and disassembly of the shell, resolving the maintenance difficulties caused by the irreversibility of potting encapsulation.

[0065] Through the above technical solution, this application achieves detachable fixing between the housings, significantly reducing the risk of damage to the sealing structure during repairs. The mechanical interlocking formed by the snap-fit ​​structure avoids micro-cracks generated after the colloid cures, improving sealing reliability. In addition, this structure eliminates the need for high-temperature curing equipment, simplifying the production process and reducing manufacturing costs.

[0066] In a specific example, the assembly process of the door handle sensor structure includes: attaching the capacitor 32 of the circuit module 3 to the second housing 2 with tape; applying silicone adhesive to the dispensing groove 22 of the second housing 2; assembling the circuit board 31 of the circuit module 3 into the second housing 2; assembling the first housing 1 into the second housing 2 and fixing it with the first snap-fit ​​5 and the second snap-fit ​​6; allowing it to stand for 1 hour to cure; and then conducting an airtightness test after curing. The first housing 1 and the second housing 2 are plastic housings, and the capacitor 32 is a metal component.

[0067] Example 3: Based on Embodiment 1 or Embodiment 2, this embodiment provides an embodiment of a door handle, including a door handle sensing structure, and the door handle obtains touch signals through the door handle sensing structure.

[0068] In this embodiment, the door handle sensing structure refers to a detection device integrating a capacitor 32. Specifically, it can be implemented by combining a first housing 1, a second housing 2, and a circuit module 3. The first housing 1 and the second housing 2 form a waterproof structure through a sealing ring 4. The circuit module 3 detects touch signals through the capacitor 32. The sealing ring 4 refers to a flexible sealing layer formed by a dispensing process. Specifically, it can be made of silicone material extruded through a dispensing groove 22 and a dispensing boss 11. The elastic modulus of the silicone can be controlled within the range of 0.5-5 MPa to balance sealing performance and resistance to thermal shock.

[0069] Specifically, when a user touches the door handle surface, the capacitor 32 detects a change in capacitance and generates a touch signal. This signal is processed by the circuit module 3 and transmitted to the vehicle's infotainment system for authentication. Upon successful authentication, the door handle extends within a preset time to allow the door to be opened. If no opening action is detected, the door handle automatically retracts after a set time. The sealing ring 4 is made of silicone material and forms a continuous sealing interface through the engagement of the dispensing groove 22 and the dispensing protrusion 11, preventing liquid from seeping into the internal circuit area.

[0070] Compared to existing technologies, which employ epoxy resin potting, resulting in high hardness and non-removable parts after curing, this solution replaces potting with a detachable shell structure and a flexible silicone sealing layer. This avoids the energy consumption issues caused by high-temperature curing and eliminates the risk of residual pores. Furthermore, the elastic properties of silicone can withstand deformation under thermal shock, preventing microcracks. The sealing interface can be separated without damage during maintenance, significantly reducing repair costs.

[0071] Through the above technical solution, this application solves the problems of sealing failure, maintenance difficulty and low production efficiency caused by the potting process, and realizes high reliability sealing, repeated disassembly and maintenance and low cost manufacturing of door handle module, while meeting the IP6K9 waterproof rating and automotive-grade environmental adaptability requirements.

[0072] The algorithms or displays provided herein are not inherently related to any particular computer, virtual system, or other device. Furthermore, the embodiments of this invention are not directed to any particular programming language.

[0073] Numerous specific details are set forth in the specification provided herein. However, it will be understood that embodiments of the present invention may be practiced without these specific details. Similarly, for the sake of brevity and to aid in understanding one or more aspects of the invention, in the above description of exemplary embodiments of the invention, various features of the embodiments of the invention are sometimes grouped together in a single embodiment, figure, or description thereof. The claims, which follow the detailed description, are hereby expressly incorporated into that detailed description, wherein each claim itself constitutes a separate embodiment of the invention.

[0074] Those skilled in the art will understand that the modules in the device of the embodiment can be adaptively changed and placed in one or more devices different from that embodiment. Modules, units, or components in the embodiment can be combined into a single module, unit, or component, and further, they can be divided into multiple sub-modules, sub-units, or sub-components, except that at least some of such features and / or processes or units are mutually exclusive.

[0075] It should be noted that the above embodiments are illustrative of the present invention and not restrictive of it, and those skilled in the art can devise alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses should not be construed as limiting the claims. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The present invention can be implemented by means of hardware comprising several different elements and by means of a suitably programmed computer. In the unit claims listing several means, several of these means may be embodied by the same item of hardware. The use of the words first, second, and third, etc., does not indicate any order. These words can be interpreted as names. The steps in the above embodiments, unless otherwise specified, should not be construed as limiting the order of execution.

Claims

1. A door handle sensing structure, characterized in that, include: The first housing (1) has adhesive protrusions (11) on its periphery. The second housing (2) is provided with a first receiving groove (21) and a dispensing groove (22). The dispensing groove (22) is located on the periphery of the first receiving groove (21) and is disposed opposite to the dispensing boss (11). And a circuit module (3) is provided in the first accommodating slot (21). The circuit module (3) is provided with a capacitor (32) and detects touch signals through the capacitor (32). After silicone is applied to the dispensing groove (22), the silicone is squeezed by the dispensing boss (11) to form a sealing ring (4).

2. The door handle sensing structure according to claim 1, characterized in that, The second housing (2) is provided with an inner peripheral protrusion (23) and an outer peripheral protrusion (24). The first receiving groove (21) is formed by the inner peripheral protrusion (23), and the dispensing groove (22) is formed by the inner peripheral protrusion (23) and the outer peripheral protrusion (24).

3. The door handle sensing structure according to claim 2, characterized in that, The second housing (2) has a cable outlet on one side, and the first receiving groove (21) has at least one capacitor groove (25).

4. The door handle sensing structure according to claim 3, characterized in that, The circuit module (3) includes a circuit board (31), a connecting harness (33), and at least one capacitor (32). The capacitor (32) is disposed in the capacitor slot (25) and is electrically connected to the circuit board (31) through a connector (34). The first end of the connecting harness (33) is connected to one side of the circuit board (31), and the second end of the connecting harness (33) passes through the outlet and is connected to the vehicle system.

5. The door handle sensing structure according to claim 4, characterized in that, The number of capacitors (32) is two, and the two capacitors (32) are respectively arranged in different capacitor slots (25) so that the two capacitors (32) are separated.

6. The door handle sensing structure according to claim 4, characterized in that, The inner circumferential protrusion (23) is provided with at least one buckle (27); when the circuit module (3) is located in the first receiving groove (21), the circuit board (31) abuts against the upper end of the inner circumferential protrusion (23), and the buckle (27) is fixed on the upper surface of the circuit board (31).

7. The door handle sensing structure according to claim 2, characterized in that, The dispensing boss (11) includes a first step (12) and a second step (13). The first step (12) extends into the dispensing groove (22) and the second step (13) abuts against the outer peripheral protrusion (24).

8. The door handle sensing structure according to claim 7, characterized in that, The first housing (1) is provided with a second receiving groove (14), which is formed by the first step (12); when the first housing (1) covers the upper end of the second housing (2), the circuit board (31) of the circuit module (3) is provided in the second receiving groove (14); at least one fixing member (15) is also provided in the second receiving groove (14), and the fixing member (15) is fixedly provided on the upper end of the circuit board (31).

9. The door handle sensing structure according to claim 1, characterized in that, The first housing (1) is provided with a first snap-fit ​​member (5) on its outer periphery, and the second housing (2) is provided with a second snap-fit ​​member (6) on its outer periphery. When the first housing (1) is covered by the upper end of the second housing (2), the second snap-fit ​​member (6) is snapped and fixed inside the first snap-fit ​​member (5).

10. A door handle, characterized in that, Includes the door handle sensing structure according to any one of claims 1-9, wherein the door handle obtains touch signals through the door handle sensing structure.

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