An adjustable height semiconductor equipment mounting bracket

Abstract

The utility model relates to the technical field of semiconductor equipment auxiliary device, concretely relates to a semiconductor equipment mounting support of adjustable support height, including heat dissipation subassembly, lifting assembly and buffer component, heat dissipation subassembly includes mounting panel, and the top of mounting panel is equipped with the installation groove, is used for placing semiconductor equipment. The sliding slot of installation groove both sides cooperates with the screw rod, and the screw rod is rotated by drive motor no. 1 of mounting panel one end drive, and the sliding block of screw rod outer end can move in the sliding slot, the utility model discloses through utilize drive motor and drive screw rod rotation, control the opening angle of connecting rod, realize the flexible adjustment of support height, can satisfy the use demand of different scenes and personnel, improved the versatility of support.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment auxiliary devices, specifically to a semiconductor equipment mounting bracket with adjustable support height. Technical Background

[0002] In the use of semiconductor devices, good heat dissipation, appropriate installation height, and operational stability are crucial. In the prior art, the device disclosed in Chinese Patent Publication No. CN202110801819.8 uses an insulating plate to support the light-emitting semiconductor element and conductive pillars to connect the light-emitting semiconductor element with the conductive structure. This can reduce the use of metal, reduce the reliance on metal plating for reflection of the light-emitting semiconductor element, reduce the pollution of the metal structure, and save costs.

[0003] However, the mounting bracket of the device is fixed in height and difficult to adjust flexibly, which brings many inconveniences to actual use. Moreover, semiconductor equipment may be affected by external vibrations and other factors during operation. The device lacks effective buffering measures, which threatens the stability and service life of the equipment. Furthermore, the heat dissipation method of the device is ineffective and cannot meet the requirements of efficient heat dissipation for semiconductor equipment.

[0004] Therefore, developing a semiconductor device mounting bracket with good heat dissipation performance, flexible adjustable support height, and effective vibration damping is of great practical significance. Utility Model Content

[0005] This utility model provides a semiconductor device mounting bracket with adjustable support height, mainly including a heat dissipation component, a lifting component, and a buffer component.

[0006] As a further description of the above technical solution:

[0007] The heat dissipation assembly includes a mounting plate with a mounting slot at its top for placing semiconductor equipment. Slots on both sides of the mounting slot engage with lead screws, which are driven by a motor at one end of the mounting plate. A slider at the outer end of the lead screw can move within the slots. A clamping plate at the top of the slider can be adjusted according to the size of the semiconductor equipment to clamp it securely. Several symmetrically arranged heat sinks at one end of the clamping plate increase the heat dissipation area. Several ventilation holes are provided at one end of the outer shell of the heat sinks to facilitate airflow and heat dissipation.

[0008] As a further description of the above technical solution:

[0009] In addition, the heat dissipation assembly is equipped with a fixing plate located inside the mounting slot of the mounting plate. The cooling pipe at the top of the fixing plate is connected to the external cooling system through the liquid inlet pipe and the liquid outlet pipe. The heat conduction plate at the top of the cooling pipe can conduct the heat generated by the semiconductor device to the cooling pipe, and achieve efficient heat dissipation through the circulation of coolant.

[0010] As a further description of the above technical solution:

[0011] The lifting assembly is located at the bottom of the heat dissipation assembly. A movable block is provided in the sliding groove at the bottom of the support plate one. The movable block is movably connected to the connecting rod two. The connecting rod two cooperates with the connecting rod one, which is arranged in a cross shape. A rotating shaft is provided at the intersection of the connecting rod one and the connecting rod two. Anti-detachment caps at both ends of the rotating shaft can prevent it from falling off. The support plate two at the bottom of the connecting rod one is used to support the entire bracket.

[0012] As a further description of the above technical solution:

[0013] The lifting assembly also includes a first horizontal plate and a second horizontal plate. The first horizontal plate is located at the bottom end of the first connecting rod, and the second horizontal plate is located at the bottom end of the second connecting rod. A threaded rod passing through the middle of the first horizontal plate is connected to the second horizontal plate. The drive motor at the extension end of the threaded rod can drive the threaded rod to rotate, thereby controlling the opening angle of the first and second connecting rods through the first and second horizontal plates to achieve the adjustment of the support height.

[0014] As a further description of the above technical solution:

[0015] The buffer assembly is located at the bottom of the lifting assembly. The damper at the top of the base is fixedly connected to the bottom of the support plate. The buffer spring sleeved on the outer end of the damper can play a buffering role when the equipment is subjected to vibration, reducing the impact of vibration on the semiconductor equipment and improving the stability of equipment operation.

[0016] The present invention has the following advantages: 1. The present invention utilizes a drive motor to rotate the threaded rod and control the opening angle of the connecting rod to achieve flexible adjustment of the support height, which can meet the usage needs of different scenarios and personnel and improve the versatility of the support.

[0017] 2. The buffer assembly composed of damping and buffer springs in this utility model can effectively absorb vibration, reduce the interference of external vibration on semiconductor equipment, and extend the service life of the equipment.

[0018] 3. This utility model achieves the dual effects of air cooling and liquid cooling through the combined design of heat sink, ventilation holes and cooling pipes, which greatly improves heat dissipation efficiency, effectively reduces the operating temperature of semiconductor equipment and ensures stable equipment performance.

[0019] Figure Labels

[0020] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0021] Figure 2 This is a schematic diagram of the overall structure of the heat dissipation component of this utility model;

[0022] Figure 3 This is a partial enlarged view of the heat dissipation component of this utility model;

[0023] Figure 4 This is a schematic diagram of the overall structure of the lifting component of this utility model;

[0024] Figure 5 This is a schematic diagram of the overall structure of the buffer component of this utility model.

[0025] The attached figures are labeled as follows:

[0026] 1. Heat dissipation assembly; 11. Mounting plate; 12. Drive motor one; 13. Lead screw; 14. Housing one; 15. Heat sink; 16. Housing; 17. Clamping plate; 18. Fixing plate; 19. Cooling pipe; 110. Heat conduction plate; 2. Lifting assembly; 21. Support plate one; 22. Support plate two; 23. Drive motor; 24. Housing two; 25. Connecting rod one; 26. Connecting rod two; 27. Horizontal plate one; 28. Horizontal plate two; 29. ​​Threaded rod; 3. Buffer assembly; 31. Base; 32. Damping; 33. Buffer spring. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The utility model will be further described in detail below with reference to the accompanying drawings.

[0029] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0030] As attached Figure 1 To be continued Figure 5 The present invention provides a semiconductor device mounting bracket with adjustable support height, which mainly includes a heat dissipation component 1, a lifting component 2 and a buffer component 3.

[0031] Example 1

[0032] Specifically, the heat dissipation component 1 includes a mounting plate 11. The top of the mounting plate 11 has a mounting groove for placing semiconductor equipment. The sliding grooves on both sides of the mounting groove cooperate with the lead screw 13. The lead screw 13 is driven to rotate by a drive motor 12 at one end of the mounting plate 11. This connection method allows the rotational power of the lead screw 13 to come directly from the drive motor 12, ensuring efficient power transmission.

[0033] The slider at the outer end of the lead screw 13 can move within the groove. The clamping plate 17 at the top of the slider can be adjusted according to the size of the semiconductor device to clamp the device. The connection between the slider and the clamping plate 17 realizes the conversion of the rotational motion of the lead screw 13 into the linear motion of the clamping plate 17, thereby accurately adjusting the clamping degree. Several heat sinks 15 symmetrically arranged at one end of the clamping plate 17 can increase the heat dissipation area. Several ventilation holes are opened at one end of the housing 16 at the outer end of the heat sink 15. The connection between the heat sink 15 and the housing 16 forms a heat dissipation channel, which facilitates air circulation to remove heat.

[0034] In addition, the heat dissipation assembly 1 is also provided with a fixing plate 18, which is located inside the mounting groove of the mounting plate 11. The connection between the fixing plate 18 and the mounting plate 11 provides a stable mounting base for subsequent components. The cooling pipe 19 at the top of the fixing plate 18 is connected to the external cooling system through the liquid inlet pipe and the liquid outlet pipe. The heat conduction plate 110 at the top of the cooling pipe 19 can conduct the heat generated by the semiconductor device to the cooling pipe 19. The tight connection between the heat conduction plate 110 and the cooling pipe 19 ensures the high efficiency of heat conduction and achieves efficient heat dissipation through the circulation of coolant.

[0035] Example 2

[0036] Based on Example 1, in order to further achieve flexible adjustment of the bracket height, a lifting component is provided at the bottom of the heat dissipation component.

[0037] Among them, a movable block is provided in the sliding groove at the bottom of the support plate 21. The movable block is movably connected to the connecting rod 26. This movable connection allows the connecting rod 26 to rotate flexibly. The connecting rod 26 cooperates with the connecting rod 25, which is arranged in a cross shape. A pivot is provided at the intersection of the connecting rod 25 and the connecting rod 26. Anti-detachment caps at both ends of the pivot prevent it from falling off. The connection of the pivot allows the connecting rod 25 and the connecting rod 26 to rotate stably in a cross shape. The anti-detachment caps ensure the safety of the structure. The support plate 22 at the bottom of the connecting rod 25 is used to support the entire bracket and provide stable support for the upper components.

[0038] In addition, the lifting assembly 2 also includes a first horizontal plate 27 and a second horizontal plate 28. The first horizontal plate 27 is located at the bottom end of the first connecting rod 25, and the second horizontal plate 28 is located at the bottom end of the second connecting rod 26. The connection between the first horizontal plate 27 and the first connecting rod 25, and the connection between the second horizontal plate 28 and the second connecting rod 26, transmits the movement of the horizontal plate to the connecting rod. The threaded rod 29 that passes through the middle of the first horizontal plate 27 is connected to the second horizontal plate 28. The drive motor 23 at the extension end of the threaded rod 29 can drive the threaded rod 29 to rotate. The connection between the drive motor 23 and the threaded rod 29 provides the power for height adjustment. Thus, the opening angle of the first connecting rod 25 and the second connecting rod 26 can be controlled by the first horizontal plate 27 and the second horizontal plate 28 to achieve the adjustment of the support height.

[0039] Among them, the buffer component 3 is located at the bottom of the lifting component 2. The damper 32 at the top of the base 31 is fixedly connected to the bottom of the support plate 22. The buffer spring 33 is sleeved on the outer end of the damper 32. The fixed connection between the damper 32 and the support plate 22 and the base 31 ensures that the buffering force can be effectively transmitted. The cooperation between the buffer spring 33 and the damper 32 can play a buffering role when the equipment is subjected to vibration, reduce the impact of vibration on the semiconductor equipment, and improve the stability of equipment operation.

[0040] In actual use, the semiconductor device is placed in the mounting slot of the mounting plate 11, and the drive motor 12 is started. The drive motor 12 drives the lead screw 13 to rotate. Since the lead screw 13 is threadedly connected to the slider, and the slider is restricted by the slide groove and cannot rotate with the lead screw 13, the slider will move in a straight line along the slide groove, thereby driving the clamping plate 17 to move and clamp the semiconductor device.

[0041] Part of the heat generated by the semiconductor device during operation is transferred to the clamping plate 17, and then from the clamping plate 17 to the heat sink 15. The heat sink 15 exchanges heat with the outside air through the ventilation holes on the housing 16, dissipating the heat into the air.

[0042] Meanwhile, another portion of the heat generated by the semiconductor device is transferred to the cooling pipe 19 through the heat conduction plate 110. The external cooling system inputs coolant into the cooling pipe 19 through the liquid inlet pipe. The coolant absorbs heat during its flow in the cooling pipe 19 and then flows back to the external cooling system through the liquid outlet pipe for cooling, thus achieving circulating heat dissipation.

[0043] When the height of the bracket needs to be adjusted, the drive motor 23 is started, which drives the threaded rod 29 to rotate. The threaded rod 29 is threadedly connected to the first horizontal plate 27. Under the rotation of the threaded rod 29, the first horizontal plate 27 will move linearly along the threaded rod 29, and the second horizontal plate 28 will move with the movement of the first horizontal plate 27.

[0044] The movement of horizontal plates 27 and 28 changes the intersection angle of connecting rods 25 and 26, because connecting rod 25 is connected to horizontal plate 27, and connecting rod 26 is connected to horizontal plate 28, and connecting rods 25 and 26 are cross-connected via a pivot. When the intersection angle of connecting rods 25 and 26 increases, the distance between support plate 21 and support plate 22 increases, and the height of the support increases; when the intersection angle decreases, the distance between support plate 21 and support plate 22 decreases, and the height of the support decreases.

[0045] During the movement of connecting rod 25 and connecting rod 26, the pivot ensures the flexible rotation of both. The anti-disengagement caps at both ends of the pivot prevent the pivot from detaching from connecting rod 25 and connecting rod 26, ensuring the stability of the lifting process.

[0046] When the support is subjected to external vibration, the vibration is transmitted to the damper 32 and the buffer spring 33 through the support plate 22. The buffer spring 33 will undergo elastic deformation due to the vibration, converting part of the vibration energy into elastic potential energy, thereby reducing the impact of the vibration.

[0047] At the same time, the damper 32 generates resistance in the opposite direction of vibration, consumes the energy of vibration, and further slows down the transmission of vibration. The combined effect of the damper 32 and the buffer spring 33 effectively reduces the impact of vibration on semiconductor equipment and ensures the stable operation of semiconductor equipment.

[0048] This application discloses an adjustable support height semiconductor equipment mounting bracket. This equipment can be used for various operations such as installation and fixing of semiconductor equipment, height adjustment, heat dissipation protection, and shock absorption. This utility model is applicable to the installation and support of semiconductor chip manufacturing equipment and semiconductor packaging and testing equipment in various semiconductor production workshops; it is also applicable to the fixing and debugging of various experimental semiconductor devices in semiconductor R&D laboratories.

[0049] It should be noted that all electrical components mentioned in this article are connected to an external main controller and 220V AC mains power. The main controller can be a conventional known device that can be controlled by a computer or other means. The detailed description of known functions and known components is omitted in the specific implementation of this disclosure. In order to ensure the compatibility of the device, the operating methods used are consistent with the parameters of commercially available instruments.

[0050] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A semiconductor device mounting bracket with adjustable support height, characterized in that, include: Heat dissipation assembly (1), lifting assembly (2), and buffer assembly (3); The heat dissipation assembly (1) includes a mounting plate (11), a mounting groove is provided at the top of the mounting plate (11), and sliding grooves are provided on both sides of the mounting groove. A drive motor (12) is provided at one end of the mounting plate (11), a housing (14) is provided at the outer end of the drive motor (12), a lead screw (13) is provided at the output end of the drive motor (12), the lead screw (13) is located inside the sliding groove, a slider is provided at the outer end of the lead screw (13), a clamping plate (17) is provided at the top of the slider, a number of heat dissipation fins (15) are symmetrically provided at one end of the clamping plate (17), a housing (16) is provided at the outer end of the heat dissipation fins (15), and a number of ventilation holes are provided at one end of the housing (16).

2. The semiconductor device mounting bracket with adjustable support height according to claim 1, characterized in that: The heat dissipation assembly (1) also includes a fixing plate (18), which is located inside the mounting groove of the mounting plate (11). The top of the fixing plate (18) is provided with a cooling pipe (19), one end of the cooling pipe (19) is provided with an inlet pipe, the other end of the cooling pipe (19) is provided with an outlet pipe, and the top of the cooling pipe (19) is provided with a heat-conducting plate (110).

3. The semiconductor device mounting bracket with adjustable support height according to claim 2, characterized in that: The lifting assembly (2) is located at the bottom of the heat dissipation assembly (1). The lifting assembly (2) includes a support plate (21). The bottom of the support plate (21) is provided with a sliding groove. A movable block is provided inside the sliding groove. A connecting rod (26) is movably provided at the bottom of the movable block. A connecting rod (25) is provided on one side of the connecting rod (26). The connecting rod (25) and the connecting rod (26) are arranged in a cross shape. The bottom of the connecting rod (25) is provided with a support plate (22).

4. The semiconductor device mounting bracket with adjustable support height according to claim 3, characterized in that: The lifting assembly (2) also includes a first horizontal plate (27) and a second horizontal plate (28). The first horizontal plate (27) is located at the bottom end of the first connecting rod (25), and the second horizontal plate (28) is located at the bottom end of the second connecting rod (26). A threaded rod (29) is provided through the middle of the first horizontal plate (27). The threaded rod (29) extends through the first horizontal plate (27) to one end of the second horizontal plate (28). A drive motor (23) is provided at the extended end of the threaded rod (29), and a second outer casing (24) is provided at the outer end of the drive motor (23).

5. The adjustable support height semiconductor device mounting bracket according to claim 4, characterized in that: The buffer assembly (3) is located at the bottom of the lifting assembly (2). The buffer assembly (3) includes a base (31), and a damper (32) is provided at the top of the base (31). The bottom of the damper (32) is fixedly connected to the top of the base (31), and the top of the damper (32) is fixedly connected to the bottom of the support plate (22). A buffer spring (33) is sleeved on the outer end of the damper (32).

6. The semiconductor device mounting bracket with adjustable support height according to claim 5, characterized in that: The inner side of the clamp (17) is provided with an anti-slip pad, which is made of high temperature resistant rubber material and has several anti-slip patterns on its surface.

7. The semiconductor device mounting bracket with adjustable support height according to claim 6, characterized in that: A pivot is provided at the intersection of connecting rod 1 (25) and connecting rod 2 (26). The pivot passes through connecting rod 1 (25) and connecting rod 2 (26). Anti-detachment caps are provided at both ends of the pivot, and the anti-detachment caps are connected to the pivot by threads.

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