A multi-color temperature LED lamp bead and a PCBA board

Abstract

The utility model is suitable for lamp pearl technical field provides a kind of multicolor temperature LED lamp pearl and PCBA board.The multicolor temperature LED lamp pearl includes support, first soldering pad, second soldering pad, first chip, second chip and control IC, the first soldering pad and the second soldering pad are set in the support bottom, the anode of the first chip, the second chip and the control IC is respectively conducted the first soldering pad, the cathode of the control IC is conducted the second soldering pad, the cathode of the first chip and the second chip is respectively connected the control IC, the control IC is used to control the first chip and / or the second chip light emitting, the first chip and the second chip are used to emit light of different color temperature, only two external electrical connection points are used to complete power supply and three mode controls, greatly simplify device structure and peripheral circuit, reduce LED lamp pearl package size.

Description

Technical Field

[0001] This utility model belongs to the field of LED bead technology, and in particular relates to a multi-color temperature LED bead and a PCBA board. Background Technology

[0002] Dual-color-temperature white LED chips are light-emitting diodes capable of producing white light of different color temperatures through adjustment. By combining cool white and warm white light chips, they achieve continuous or segmented adjustment of the color temperature within the range of 2700K-6500K, thus meeting the needs of different scenarios and users. Dual-color-temperature white LED chips have a wide range of applications, such as smart home lighting, smart desk lamps, and car reading lights.

[0003] Currently, dual-color temperature white LED chips are generally COB packaged, which typically requires at least 4 pins. This design has some problems: dual-color temperature white light can only achieve two colors of light, and more pins are needed to achieve more colors of light, resulting in a relatively large LED chip package size. Summary of the Invention

[0004] The purpose of this utility model embodiment is to provide a multi-color temperature LED lamp bead, which aims to solve the problems of relatively large LED lamp bead package size, which is not conducive to the design of secondary optical lenses and cannot meet the needs of more optical colors.

[0005] This utility model embodiment is implemented as follows: a multi-color temperature LED lamp bead includes a bracket, a first pad, a second pad, a first chip, a second chip, and a control IC. The first pad and the second pad are disposed at the bottom of the bracket. The positive terminals of the first chip, the second chip, and the control IC are respectively connected to the first pad, and the negative terminal of the control IC is connected to the second pad. The negative terminals of the first chip and the second chip are respectively connected to the control IC. The control IC is used to control the first chip and / or the second chip to emit light. The first chip and the second chip are used to emit light of different color temperatures.

[0006] Furthermore, the first chip, the second chip, and the control IC are disposed in the same bowl-shaped container formed by the first pad, the second pad, and the support.

[0007] Furthermore, the second pad is larger than the first pad, and the first chip, the second chip, and the control IC are disposed on the second pad.

[0008] Furthermore, the first pad and the second pad are separated by an insulating channel.

[0009] Furthermore, a first fluorescent adhesive is disposed on the first chip, and a second fluorescent adhesive covering the first fluorescent adhesive is filled inside the bowl.

[0010] Furthermore, the first fluorescent adhesive is a low color temperature fluorescent adhesive with a temperature below 3300K, and the second fluorescent adhesive is a high color temperature fluorescent adhesive with a temperature above 6000K.

[0011] Furthermore, the first control mode of the control IC is: when a continuous high-level signal is received within a time window, the first chip emits light.

[0012] Furthermore, the second control mode of the control IC is: within a time window, the second chip emits light when there are two high-level signals and one low-level signal.

[0013] Furthermore, the third control mode of the control IC is as follows: within a time window, there is a short high-level signal and a long low-level signal, and the first chip and the second chip emit light simultaneously.

[0014] This utility model embodiment can also be implemented as follows: a PCBA board, the PCBA board including at least one of the multi-color temperature LED beads.

[0015] This utility model provides a multi-color temperature LED bead. The first chip and the second chip respectively realize different color temperature illumination, and when the two chips work at the same time, they can realize a third color temperature white light. The control IC is used to control the first chip and the second chip to work individually or simultaneously. The first pad and the second pad each correspond to a pin. Power supply and three mode control are completed with only two external electrical connection points, which greatly simplifies the device structure and peripheral circuit, and reduces the LED bead package size. Attached Figure Description

[0016] Figure 1 Top view of the multi-color temperature LED beads provided in the embodiments of this utility model Figure 1 ; Figure 2 Top view of the multi-color temperature LED beads provided in the embodiments of this utility model Figure 2 ; Figure 3 A side view of a multi-color temperature LED bead provided in an embodiment of this utility model; Figure 4 A bottom view of a multi-color temperature LED bead provided in an embodiment of this utility model; Figure 5 The signal control diagram of the control IC provided in the embodiment of this utility model; 1. Bracket; 2. First pad; 3. Second pad; 4. First chip; 5. Second chip; 6. Control IC; 7. Insulating channel; 8. Bonding wire; 9. First fluorescent adhesive; 10. Second fluorescent adhesive. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0018] It is understood that the terms "first," "second," etc., used herein may be used to describe various elements, but unless otherwise specified, these elements are not limited by these terms. These terms are used only to distinguish one element from another. For example, without departing from the scope of this application, the first mechanism may be referred to as the second mechanism, and similarly, the second mechanism may be referred to as the first mechanism.

[0019] In the first embodiment, such as Figure 1 , 3 As shown in Figure 4, a multi-color temperature LED bead is proposed. The multi-color temperature LED bead includes a bracket 1, a first pad 2, a second pad 3, a first chip 4, a second chip 5, and a control IC 6. The first pad 2 and the second pad 3 are disposed at the bottom of the bracket 1. The positive terminals of the first chip 4, the second chip 5, and the control IC 6 are respectively connected to the first pad 2, and the negative terminal of the control IC 6 is connected to the second pad 3. The negative terminals of the first chip 4 and the second chip 5 are respectively connected to the control IC 6. The control IC 6 is used to control the first chip 4 and / or the second chip 5 to emit light. The first chip 4 and the second chip 5 are used to emit light of different color temperatures.

[0020] In this embodiment, a structure of a PLCC-type two-pin tri-color temperature LED is presented. The first chip 4 and the second chip 5 respectively realize different color temperature illumination, and when the two chips work simultaneously, a third color temperature white light can be realized. The control IC 6 is used to control the first chip 4 and the second chip 5 to work individually or simultaneously. The first pad 2 and the second pad 3 each correspond to one pin. Power supply and three mode control are completed with only two external electrical connection points, which greatly simplifies the device structure and peripheral circuits and reduces the LED chip package size.

[0021] In this embodiment, the bracket 1 is the mechanical skeleton of the LED beads and a mounting platform for the internal chips, control IC 6, and wires. It is typically made of a plastic material with high thermal conductivity, high reflectivity, and insulation, and must be able to withstand the temperatures of subsequent die bonding, wire bonding, and high-temperature curing processes. The first pad 2 and the second pad 3 are the exposed electrical interfaces of the conductive lead frame inside the bracket 1 at the bottom of the cup. They are typically made of copper alloy or iron-nickel alloy and plated with silver or gold to ensure good conductivity, solderability, and oxidation resistance. The first chip 4, the second chip 5, and the control IC 6 can be located on any one of the first pad 2 and the second pad 3; this embodiment does not impose any restrictions here.

[0022] In this embodiment, it is necessary to explain that "the first chip 4 and the second chip 5 are used to emit light of different color temperatures." When current flows through the chip, the semiconductor material inside the chip is excited, emitting light of a specific wavelength. This light is then converted by phosphor, and the remaining unabsorbed blue light mixes with the light emitted by the phosphor in space, ultimately producing white light. For example, indium gallium nitride (InGaN) can be excited to emit blue light, and the phosphor, after being excited, emits yellow or red light with longer wavelengths. After mixing, white light of different color temperatures is obtained. It is understood that whether the light is emitted by the chip itself or the light after being converted and mixed by the phosphor, it should be understood as "the first chip 4 and the second chip 5 are used to emit light of different color temperatures" in this embodiment.

[0023] In this embodiment, as Figure 1 As shown, the first chip 4, the second chip 5, and the control IC 6 are disposed in the same cup formed by the first pad 2, the second pad 3, and the bracket 1. Current dual-color temperature or higher white LED lamp bead structures require multiple cups, generally at least two cups. However, double cups are not conducive to secondary optical lens design. Therefore, this embodiment designs a single cup structure, placing the first chip 4, the second chip 5, and the control IC 6 in the same optical cavity. This facilitates the addition of dedicated optical elements to control the final distribution of light in the target area after the LED chip has completed its initial optical design and packaging.

[0024] In this embodiment, as Figure 1-4 As shown, the second pad 3 is larger than the first pad 2. The first chip 4, the second chip 5, and the control IC 6 are disposed on the second pad 2. The first pad 2 and the second pad 3 are separated by an insulating channel 7. Figure 1As shown, the positive terminals of the first chip 4, the second chip 5, and the control IC 6 are connected to the first pad 2 via bonding wires 8. The negative terminal of the control IC 6 is connected to the second pad 3 via bonding wires 8. The negative terminal of the first chip 4 is connected to the first channel pad of the control IC 6 via bonding wires 8, and the negative terminal of the second chip 5 is connected to the second channel pad of the control IC 6 via bonding wires 8. The first chip 4, the second chip 5, and the control IC 6 can be fixed to the same substrate with the same type of adhesive. During subsequent high-temperature curing and cooling processes, the thermal stress conditions they withstand are more consistent, reducing the risk of chip cracking or connection failure due to uneven stress. The insulating trench 7 is a physical barrier formed by precision machining, filled with insulating material. The filler is a high-temperature engineering plastic, such as PPA, PCT, or EMC, that constitutes the main body of the support 1.

[0025] In this embodiment, as Figure 2 As shown, a first fluorescent adhesive 9 is disposed on the first chip 4, and a second fluorescent adhesive 10 covering the first fluorescent adhesive 9 is filled in the bowl. Figure 1 This is a top view of multi-color temperature LED beads without showing the fluorescent adhesive. Figure 2 This is a top view of a multi-color-temperature LED bead displaying phosphor adhesive. In the phosphor adhesive application process, a low-color-temperature phosphor adhesive, such as a warm white light with a color temperature of 2700K, is first applied directly above the first chip 4. After high-temperature baking, the warm white phosphor adhesive on the top of the first chip 4 cures. Then, a second application of high-color-temperature phosphor adhesive is performed, filling the bowl-shaped cavity of the LED bracket 1 and covering the first application of low-color-temperature phosphor adhesive, leveling the cavity. It is understood that both the first phosphor adhesive 9 and the second phosphor adhesive 10 are optional. The first phosphor adhesive 9 can be a low-color-temperature phosphor adhesive below 3300K, and the second phosphor adhesive 10 can be a high-color-temperature phosphor adhesive above 6000K.

[0026] In this embodiment, the time window can be set. This embodiment uses 30 microseconds as an example of a time window and provides a corresponding explanation. Figure 5 As shown, three control modes for control IC6 are given: First control mode: When the first pad 2 is positively energized and the second pad 3 is negatively energized (after the positive and negative terminals of control IC6 are energized), if there is a continuous high level for 30 microseconds, the first chip 4 emits light, emitting a low-color warm white light, as shown in control 1.

[0027] Second control mode: When the first pad 2 is positively energized and the second pad 3 is negatively energized (after the positive and negative terminals of control IC6 are energized), if there are two high-level signals and one low-level signal within 30 microseconds, the second chip 5 emits light, emitting low color temperature cool white light. As shown in control 2.

[0028] The third control mode: When the first pad 2 is positively energized and the second pad 3 is negatively energized (after the control IC6 is energized), if there is a short high-level signal and a long low-level signal within 30 microseconds, the first chip 4 and the second chip 5 will emit light simultaneously, with a mixed color of sunlight white. In this control mode, the length of the "short high-level" and "long low-level" signals is relative, meaning the high-level signal duration is shorter than the low-level signal duration. As an example... Figure 5 As shown in control 3, the high-level signal is 0-10 microseconds, and the low-level signal is 10-30 microseconds.

[0029] In a second embodiment, a PCBA board is proposed, the PCBA board including at least one multi-color temperature LED bead as described in the above embodiments.

[0030] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0031] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

[0032] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A multi-color temperature LED lamp bead, characterized in that, The multi-color temperature LED lamp bead includes a bracket, a first pad, a second pad, a first chip, a second chip, and a control IC. The first pad and the second pad are disposed at the bottom of the bracket. The positive terminals of the first chip, the second chip, and the control IC are respectively connected to the first pad, and the negative terminal of the control IC is connected to the second pad. The negative terminals of the first chip and the second chip are respectively connected to the control IC. The control IC is used to control the first chip and / or the second chip to emit light. The first chip and the second chip are used to emit light of different color temperatures.

2. The multi-color temperature LED lamp bead according to claim 1, characterized in that, The first chip, the second chip, and the control IC are disposed in the same bowl formed by the first pad, the second pad, and the bracket.

3. The multi-color temperature LED lamp bead according to claim 2, characterized in that, The second pad is larger than the first pad, and the first chip, the second chip, and the control IC are disposed on the second pad.

4. The multi-color temperature LED lamp bead according to claim 3, characterized in that, The first pad and the second pad are separated by an insulating channel.

5. The multi-color temperature LED lamp bead according to claim 2, characterized in that, The first chip is coated with a first fluorescent adhesive, and the bowl is filled with a second fluorescent adhesive that covers the first fluorescent adhesive.

6. The multi-color temperature LED lamp bead according to claim 5, characterized in that, The first fluorescent adhesive is a low color temperature fluorescent adhesive with a temperature below 3300K, and the second fluorescent adhesive is a high color temperature fluorescent adhesive with a temperature above 6000K.

7. The multi-color temperature LED lamp bead according to claim 1, characterized in that, The first control mode of the control IC is: when a continuous high-level signal is received within a time window, the first chip emits light.

8. The multi-color temperature LED lamp bead according to claim 1, characterized in that, The second control mode of the control IC is: within a time window, the second chip emits light when there are two high-level signals and one low-level signal.

9. The multi-color temperature LED lamp bead according to claim 1, characterized in that, The third control mode of the control IC is as follows: within a time window, there is a short high-level signal and a long low-level signal, and the first chip and the second chip emit light simultaneously.

10. A PCBA board, characterized in that, The PCBA board includes at least one multi-color temperature LED bead as described in any one of claims 1-9.

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