A temperature uniform platform based on semiconductor refrigeration technology

Abstract

The utility model discloses a kind of temperature equalization platform based on semiconductor refrigeration technology, it includes temperature equalization platform, semiconductor refrigeration piece, radiator, temperature controller and shell. Temperature equalization platform replaces traditional aluminium alloy, purple copper platform using high efficient heat conduction characteristics of temperature equalization platform, realize cold energy fast and even conduction, temperature equalization error is controlled in lower range, can reach 0.1 degree, satisfy ultra-high precision temperature control scene demand. And semiconductor refrigeration piece cooperates with radiator, forms high efficient refrigeration and heat dissipation circulation, avoid heat accumulation in refrigeration process influence refrigeration effect. While through the heat pipe for accelerating heat conduction in radiator interior along heat dissipation direction filling in radiator interior. Temperature controller monitors and regulates semiconductor refrigeration piece working condition in real time, guarantee temperature equalization platform temperature constant. Equipped 485 communication module provides basis for remote monitoring and regulation, solve the limitation that only local operation can be carried out by existing temperature equalization platform.

Description

Technical Field

[0001] This utility model relates to the field of temperature control equipment technology, and in particular to a temperature equalization platform based on semiconductor refrigeration technology. Background Technology

[0002] As an important temperature control device, the core function of a temperature equalization platform is to maintain a constant and balanced platform temperature to meet the stringent environmental temperature requirements of various precision operations. Currently, temperature equalization platforms on the market are mainly made of aluminum alloy or copper. Among them, aluminum alloy platforms have poor temperature uniformity due to their limited thermal conductivity, making it difficult to meet the needs of high-precision temperature control scenarios. Although copper platforms have better thermal conductivity than aluminum alloy and improve temperature uniformity, their temperature uniformity error is still greater than 1 degree Celsius when the platform size is large, which cannot meet the requirements of ultra-high precision temperature control scenarios.

[0003] Meanwhile, existing temperature vaporization platforms rely heavily on local operation for temperature control, lacking remote monitoring and control functions, resulting in poor operational convenience in scenarios involving centralized management of multiple devices and unattended operation. Furthermore, some vaporization platforms suffer from significant cold energy loss and low heat dissipation efficiency of the hot surface, leading to increased cooling energy consumption and decreased temperature control stability. To address these shortcomings, this invention proposes an optimized temperature vaporization platform based on semiconductor refrigeration technology. Utility Model Content

[0004] The technical problem to be solved by this utility model is to provide a temperature equalization platform based on semiconductor refrigeration technology.

[0005] The technical solution adopted by this utility model to solve its technical problem is: to construct a temperature equalization platform based on semiconductor refrigeration technology, which includes a temperature equalization plate platform, a semiconductor refrigeration chip, a heat sink, a temperature controller and a shell;

[0006] The temperature distribution plate platform is used to achieve rapid and uniform conduction of cold energy;

[0007] The cold side of the semiconductor cooling chip is attached to the heat spreader platform to transfer cold energy to the heat spreader platform, and the hot side of the semiconductor cooling chip is connected to the heat sink to dissipate the heat generated during the cooling process.

[0008] The radiator has multiple heat pipes embedded inside along the heat dissipation direction, and the heat pipes are used to accelerate the heat conduction inside the radiator.

[0009] The temperature controller is used to monitor the temperature of the heat exchanger platform in real time and regulate the working status of the semiconductor cooling chip. The temperature controller is equipped with a 485 communication module.

[0010] The vapor chamber platform, the thermoelectric cooling chip, the heat sink, and the temperature controller are all mounted on the housing.

[0011] In some embodiments, the housing is provided with a 485 communication interface corresponding to the 485 communication module.

[0012] In some embodiments, a cold-end insulation cotton is also included, which is disposed between the heat exchanger platform and the outer shell to reduce the loss of cold energy from the heat exchanger platform to the outer shell and the external environment.

[0013] In some embodiments, a hot-end insulation cotton is also included, which is disposed between the radiator and the outer casing to prevent the heat dissipated by the radiator from being transferred to the heat spreader platform and other components inside the outer casing.

[0014] In some embodiments, a fan bracket and a DC fan are also included, wherein the fan bracket is fixed to the side of the heat sink away from the thermoelectric cooler to stably support the DC fan;

[0015] The DC fan is mounted on a fan bracket and is used to accelerate airflow to remove heat from the surface of the heat sink.

[0016] In some embodiments, a relay is also included, the relay being used to receive control signals from the temperature controller.

[0017] In some embodiments, the housing is provided with a main switch and a power socket. The power socket is used to connect to an external power source, and the main switch is used to control the circuit switching of the entire temperature equalization platform.

[0018] In some embodiments, a switching power supply is also included, which is electrically connected to the power socket.

[0019] In some embodiments, the temperature controller is provided with a temperature setting button, which is used to manually input the target temperature control value.

[0020] In some embodiments, the temperature controller is provided with a temperature display module, which is used to display the current temperature of the heat exchanger platform in real time.

[0021] The present invention offers the following advantages: It replaces traditional aluminum alloy and copper platforms with a vapor chamber platform, utilizing the vapor chamber's high thermal conductivity to achieve rapid and uniform heat transfer, minimizing temperature uniformity errors to as low as 0.1 degrees Celsius, thus meeting the demands of ultra-high precision temperature control scenarios. The semiconductor cooling chip, in conjunction with the heat sink, forms an efficient cooling and heat dissipation cycle, preventing heat buildup during cooling and ensuring optimal performance. Simultaneously, heat pipes embedded within the heat sink along the heat dissipation direction accelerate heat transfer within the heat sink. A temperature controller monitors and regulates the semiconductor cooling chip's operating status in real time, ensuring a constant temperature on the vapor chamber platform. The included RS-485 communication module provides a foundation for remote monitoring and control, overcoming the limitation of existing vapor chamber platforms that can only be operated locally, and enhancing the applicability of the equipment in scenarios involving centralized management of multiple devices and unattended operation. Attached Figure Description

[0022] To more clearly illustrate the technical solution of this utility model, the present utility model will be further described below in conjunction with the accompanying drawings and embodiments. It should be understood that the following drawings only show some embodiments of this utility model and should not be considered as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort. In the drawings:

[0023] Figure 1 This is a three-dimensional structural schematic diagram of a temperature equalization platform based on semiconductor refrigeration technology in some embodiments of this utility model;

[0024] Figure 2 yes Figure 1 A schematic diagram of the three-dimensional structure hidden behind the upper shell;

[0025] Figure 3 This is a schematic diagram of the internal structure of a temperature equalization platform based on semiconductor refrigeration technology in some embodiments of this utility model;

[0026] Figure 4 yes Figure 3 A structural diagram from another direction. Detailed Implementation

[0027] To provide a clearer understanding of the technical features, objectives, and effects of this utility model, the specific embodiments of this utility model are now described in detail with reference to the accompanying drawings. In the following description, it should be understood that the orientations or positional relationships indicated by terms such as "front," "rear," "upper," "lower," "left," "right," "longitudinal," "horizontal," "vertical," "horizontal," "top," "bottom," "inner," "outer," "head," and "tail" are based on the orientations or positional relationships shown in the accompanying drawings, and are constructed and operated in a specific orientation. They are only for the convenience of describing this technical solution and do not indicate that the device or component referred to must have a specific orientation; therefore, they should not be construed as limitations on this utility model.

[0028] It should also be noted that, unless otherwise explicitly specified and limited, terms such as "installation," "connection," "joining," "fixing," and "setting" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. When an component is referred to as being "on" or "below" another component, the component can be located "directly" or "indirectly" on the other component, or there may be one or more intermediary components. The terms "first," "second," "third," etc., are only for the convenience of describing this technical solution and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first," "second," "third," etc., may explicitly or implicitly include one or more of that feature. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0029] Please see Figures 1 to 4 This invention relates to a temperature equalization platform based on semiconductor refrigeration technology, comprising a temperature equalization plate platform 1, a semiconductor refrigeration chip 2, a heat sink 3, a temperature controller 4, and a housing 5. The temperature equalization plate platform 1 is used to achieve rapid and uniform conduction of cold energy; the cold side of the semiconductor refrigeration chip 2 is attached to the temperature equalization plate platform 1 to transfer cold energy to the platform, and the hot side of the chip 2 is connected to the heat sink 3 to dissipate heat generated during the refrigeration process; multiple heat pipes are embedded inside the heat sink 3 along the heat dissipation direction to accelerate heat conduction within the radiator 3; the temperature controller 4 is used to monitor the temperature of the temperature equalization plate platform 1 in real time and regulate the working state of the semiconductor refrigeration chip 2, and is equipped with a 485 communication module; the temperature equalization plate platform 1, the semiconductor refrigeration chip 2, the heat sink 3, and the temperature controller 4 are all mounted on the housing 5.

[0030] Specifically, semiconductor cooling technology is based on the Peltier effect. When two different types of semiconductor materials form a thermocouple and a direct current is applied, a temperature difference is generated at both ends of the thermocouple. One end absorbs heat to form a cold surface, achieving cooling, while the other end releases heat to form a hot surface, which needs to be dissipated through heat dissipation. The vapor chamber platform 1 can be made of copper-aluminum composite material, with a microchannel vacuum cavity and a heat-conducting working fluid inside. This allows the cooling energy transferred by the semiconductor cooling chip 2 to be quickly and evenly conducted to all areas of the vapor chamber platform 1, ensuring that the temperature uniformity error of the vapor chamber platform 1 is ≤0.1 degrees Celsius, solving the problem of poor temperature uniformity of existing aluminum alloy and copper platforms. The cold surface of the semiconductor cooling chip 2 is tightly attached to the vapor chamber platform 1 through thermally conductive silicone grease, and the hot surface is also connected to the heat sink 3 through thermally conductive silicone grease. After power is applied, the cold surface absorbs heat from the vapor chamber platform 1 to achieve cooling, and the heat generated by the hot surface is transferred to the heat sink 3, completing the core cooling cycle of cooling energy transfer and heat dissipation. The heat sink 3 can be an aluminum alloy finned heat sink 3. The inner wall of the heat pipe is provided with a microgroove capillary structure, and the two ends of the heat pipe extend to the heat inlet and heat outlet of the heat sink 3 respectively, which can quickly conduct the concentrated heat from the heat surface to the entire fins of the heat sink 3, avoiding local heat accumulation.

[0031] Understandably, replacing traditional aluminum alloy or copper platforms with a vapor chamber platform 1 leverages the vapor chamber's high thermal conductivity to achieve rapid and uniform heat transfer, minimizing temperature uniformity errors to within 0.1 degrees Celsius, thus meeting the demands of ultra-high precision temperature control scenarios. The thermoelectric cooler 2, working in conjunction with the heat sink 3, forms an efficient cooling and heat dissipation cycle, preventing heat buildup during cooling and ensuring optimal performance. Simultaneously, heat pipes embedded within the heat sink 3 along the heat dissipation direction accelerate heat transfer within the radiator. The temperature controller 4 monitors and regulates the thermoelectric cooler 2 in real time, ensuring a constant temperature for the vapor chamber platform 1. The included RS-485 communication module provides a foundation for remote monitoring and control, overcoming the limitation of existing vapor chamber platforms that can only be operated locally, and enhancing the applicability of the equipment in scenarios involving centralized management of multiple devices and unattended operation.

[0032] The housing 5 is equipped with a 485 communication interface 51 corresponding to the 485 communication module. The housing 5 provides fixed support and protection for all components, isolating them from external dust and moisture, thus extending the equipment's lifespan. Simultaneously, the housing 5 reduces the interference of external temperature fluctuations on the internal temperature control system, improving temperature control stability. The 485 communication interface 51 on the housing 5 is compatible with the 485 communication module of the temperature controller 4, providing a physical interface for connecting the 485 communication module to external devices.

[0033] The vapor chamber platform based on semiconductor refrigeration technology also includes cold-end insulation cotton 6, which is disposed between the vapor chamber platform 1 and the outer shell 5 to reduce the loss of cold energy from the vapor chamber platform 1 to the outer shell 5 and the external environment. Specifically, the cold-end insulation cotton 6 can block the transfer path of cold energy to the outer shell 5 and the external environment by covering the non-working surface of the vapor chamber platform, so that the cooling capacity of the semiconductor refrigeration chip 2 is more concentrated on the temperature control of the vapor chamber platform 1. It utilizes the low thermal conductivity of the insulation material to reduce the loss of cold energy from the vapor chamber platform 1 to the outer shell 5 and the external environment, thereby reducing refrigeration energy consumption and improving refrigeration efficiency. The material of the cold-end insulation cotton 6 is preferably high-density polyurethane insulation cotton.

[0034] The vapor chamber platform based on semiconductor refrigeration technology also includes hot-end insulation cotton 7, which is placed between the heat sink 3 and the outer shell 5 to prevent heat dissipated by the heat sink 3 from being transferred to the vapor chamber platform 1 and other components inside the outer shell 5. The hot-end insulation cotton 7 prevents heat dissipated by the heat sink 3 from being transferred to the vapor chamber platform 1, avoiding the reverse influence of hot surface heat on cold end temperature control, ensuring the temperature stability of the vapor chamber platform 1, further improving temperature uniformity. Simultaneously, it prevents heat from the heat sink 3 from being transferred to electronic components such as the temperature controller 4, preventing electronic components from aging or degrading due to high temperatures, ensuring the overall operational stability of the equipment, and extending the service life of electronic components. The material of the hot-end insulation cotton 7 is preferably high-temperature resistant glass wool.

[0035] The vapor chamber based on semiconductor cooling technology also includes a fan bracket 81 and a DC fan 82. The fan bracket 81 is fixed to the side of the heat sink 3 away from the semiconductor cooling chip 2 to stably support the DC fan 82. The DC fan 82 is mounted on the fan bracket 81 and is used to accelerate the removal of heat from the surface of the heat sink 3 through airflow. The DC fan 82 accelerates the removal of heat from the surface of the heat sink 3 through airflow, significantly improving the heat dissipation efficiency of the heat sink 3, causing the temperature of the hot surface of the semiconductor cooling chip 2 to drop rapidly, thereby improving the cooling efficiency of the semiconductor cooling chip 2. At the same time, it prevents the semiconductor cooling chip 2 from triggering overheat protection due to excessively high hot surface temperature, ensuring a continuous and stable cooling process.

[0036] The temperature equalization platform based on semiconductor refrigeration technology also includes a relay 83, which is connected in series with the temperature controller 4 and the semiconductor refrigeration chip 2 to receive control signals from the temperature controller 4. The relay 83, connected in series with the temperature controller 4 and the semiconductor refrigeration chip 2, can control the circuit's on / off state according to the control signals from the temperature controller 4. When the platform temperature is too low or the equipment malfunctions, it promptly cuts off the power supply to the semiconductor refrigeration chip 2, preventing it from operating under unnecessary conditions or overload for extended periods, reducing component wear, and extending the lifespan of the semiconductor refrigeration chip 2.

[0037] The outer casing 5 is equipped with a main switch 84 and a power socket 85. The power socket 85 is used to connect to an external power source, and the main switch 84 is used to control the circuit on / off of the entire temperature equalization stage. The temperature equalization stage based on semiconductor refrigeration technology also includes a switching power supply 86, which is electrically connected to the power socket 85. The power socket 85 facilitates connection to an external power source, improving the ease of use of the equipment.

[0038] Heat pipes are embedded inside the radiator 3 and arranged along the heat dissipation direction of the radiator 3 to accelerate the heat conduction efficiency inside the radiator 3. By embedding heat pipes inside the radiator 3 and arranging them along the heat dissipation direction, the high thermal conductivity of the heat pipes is utilized to accelerate the heat conduction inside the radiator 3, prevent heat from accumulating locally below the hot surface of the semiconductor cooling chip 2, make the temperature of each area of ​​the radiator 3 uniform, and improve the overall heat dissipation efficiency.

[0039] The temperature controller 4 is equipped with a temperature setting button 41 and a temperature display module 42. The temperature setting button 41 is used to manually input the target temperature control value, and the temperature display module 42 is used to display the current temperature of the heat spreader platform 1 in real time. The temperature setting button 41 allows operators to manually input the target temperature control value, improving local operation convenience. The temperature display module 42 displays the current temperature, target temperature, and equipment status in real time, allowing operators to quickly grasp the equipment's operating status and facilitate timely detection of temperature anomalies.

[0040] It is understood that the above embodiments only illustrate preferred embodiments of the present utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the present utility model patent. It should be noted that for those skilled in the art, the above technical features can be freely combined, and several modifications and improvements can be made without departing from the concept of the present utility model, all of which fall within the protection scope of the present utility model. Therefore, all equivalent transformations and modifications made within the scope of the claims of the present utility model should fall within the coverage of the claims of the present utility model.

Claims

1. A temperature equalization stage based on semiconductor cooling technology, characterized in that, It includes a heat spreader platform (1), a semiconductor cooling chip (2), a heat sink (3), a temperature controller (4), and a housing (5); The temperature distribution plate platform (1) is used to achieve rapid and uniform conduction of cold energy; The cold side of the semiconductor cooling chip (2) is attached to the heat exchanger platform (1) to transfer cold energy to the heat exchanger platform (1), and the hot side of the semiconductor cooling chip (2) is connected to the heat sink (3) to dissipate the heat generated during the cooling process. The radiator (3) has multiple heat pipes embedded inside along the heat dissipation direction, which are used to accelerate the heat conduction inside the radiator (3). The temperature controller (4) is used to monitor the temperature of the heat exchange plate platform (1) in real time and regulate the working status of the semiconductor cooling chip (2). The temperature controller (4) is equipped with a 485 communication module. The heat exchanger platform (1), the semiconductor cooling chip (2), the heat sink (3), and the temperature controller (4) are all mounted on the outer casing (5).

2. The temperature equalization stage based on semiconductor cooling technology according to claim 1, characterized in that, The outer casing (5) is provided with a 485 communication interface (51) corresponding to the 485 communication module.

3. The temperature equalization stage based on semiconductor cooling technology according to claim 1, characterized in that, It also includes cold end insulation cotton (6), which is disposed between the temperature equalization plate platform (1) and the outer shell (5) to reduce the loss of cold energy from the temperature equalization plate platform (1) to the outer shell (5) and the external environment.

4. The temperature equalization stage based on semiconductor cooling technology according to claim 1, characterized in that, It also includes a hot end insulation cotton (7), which is disposed between the radiator (3) and the outer shell (5) to isolate the heat dissipated by the radiator (3) from being transferred to the heat spreader platform (1) and other components inside the outer shell (5).

5. The temperature equalization stage based on semiconductor cooling technology according to claim 1, characterized in that, It also includes a fan bracket (81) and a DC fan (82), wherein the fan bracket (81) is fixed to the side of the heat sink (3) away from the semiconductor cooling chip (2) for stable support of the DC fan (82). The DC fan (82) is mounted on the fan bracket (81) and is used to remove heat from the surface of the heat sink (3) by accelerating the airflow.

6. The temperature equalization stage based on semiconductor cooling technology according to claim 1, characterized in that, It also includes a relay (83) for receiving control signals from the temperature controller (4).

7. The temperature equalization stage based on semiconductor cooling technology according to claim 1, characterized in that, The outer casing (5) is provided with a main switch (84) and a power socket (85). The power socket (85) is used to connect an external power source, and the main switch (84) is used to control the circuit switching of the entire temperature equalization platform.

8. The temperature equalization stage based on semiconductor cooling technology according to claim 7, characterized in that, It also includes a switching power supply (86), which is electrically connected to the power socket (85).

9. The temperature equalization stage based on semiconductor cooling technology according to claim 1, characterized in that, The temperature controller (4) is provided with a temperature setting button (41), which is used to manually input the target temperature control value.

10. The temperature equalization stage based on semiconductor cooling technology according to claim 1, characterized in that, The temperature controller (4) is equipped with a temperature display module (42), which is used to display the current temperature of the heat exchanger platform (1) in real time.

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