A semiconductor refrigerator

Abstract

The utility model belongs to the technical field of refrigeration equipment, disclose a kind of semiconductor refrigerator.Effectively solve the problem of insufficient heat dissipation and complex structure of refrigerator using compressor refrigeration.The semiconductor refrigerator includes inner container, semiconductor refrigerating sheet and refrigerator external heat dissipation system, the cold side of semiconductor refrigerating sheet is close to inner container, and the hot side of semiconductor refrigerating sheet is connected to refrigerator external heat dissipation system by heat pipe;Inner container is composed of double-layer superconducting aluminium plate, and the two layers of superconducting aluminium plate of inner container are supported by rib plate, forming multiple capillary cavities;Capillary cavity is provided with radiating rib on inner wall, and capillary cavity is filled with refrigerant;Refrigerator external heat dissipation system is fin or metal shell, and fan is arranged on fin.The utility model is compact in structure, realizes the efficient refrigeration and heat dissipation performance, with the advantages of energy saving, environmental protection and quiet operation.

Description

Technical Field

[0001] This utility model belongs to the field of refrigeration equipment technology, and in particular relates to a semiconductor refrigerator that uses semiconductor refrigeration technology and a superconducting aluminum plate inner liner. Background Technology

[0002] Traditional refrigerators typically use compressor refrigeration, which has the following problems: (1) The compressor generates significant mechanical vibration and airflow noise during operation, especially at high frequencies, which limits the application scenarios (such as homes and supermarkets). (2) Traditional compressor refrigeration systems typically include multiple components (such as compressors, evaporators, and condensers), resulting in a complex overall structure and high installation and maintenance costs. Furthermore, some components are prone to aging or damage during long-term operation, further increasing maintenance difficulty. (3) As the core component of the refrigeration system, the compressor occupies a large amount of internal space. This not only limits the layout design of other functional modules but may also lead to an increase in the overall size of the equipment, thus affecting the portability and installation flexibility of the product. (4) Traditional compressor refrigeration systems are typically designed to be AC-powered, while the DC power environment used by electric vehicles and other equipment requires complex power conversion devices. This conversion not only increases the complexity and cost of the system but may also lead to energy loss and reduced efficiency.

[0003] With increasing demands for environmental protection and energy conservation, semiconductor refrigeration technology has gradually gained attention due to its advantages such as being CFC-free, small in size, and operating quietly. However, existing semiconductor refrigerators still need improvement in terms of cooling efficiency and heat dissipation performance. Utility Model Content

[0004] The purpose of this invention is to provide a semiconductor refrigerator that effectively solves the problems of insufficient heat dissipation and complex structure of refrigerators using compressor refrigeration.

[0005] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows: a semiconductor refrigerator, including an inner liner, a semiconductor cooling chip, and an external heat dissipation system. The cold side of the semiconductor cooling chip is in close contact with the inner liner, and the hot side of the semiconductor cooling chip is connected to the external heat dissipation system of the refrigerator through a heat pipe. The inner liner is composed of double-layer superconducting aluminum plates, and the two layers of superconducting aluminum plates are supported by ribs to form multiple capillary cavities. The inner wall of the capillary cavity is provided with heat dissipation ribs, and the capillary cavity is filled with refrigerant.

[0006] Furthermore, the external heat dissipation system of the refrigerator is a heat sink, and a fan is configured on the heat sink.

[0007] Furthermore, the refrigerator's external heat dissipation system is a metal casing.

[0008] Furthermore, the metal outer shell is made of superconducting aluminum plate.

[0009] Furthermore, the refrigerant is a non-toxic and environmentally friendly refrigerant.

[0010] Furthermore, there are multiple ribs, and adjacent ribs are parallel to each other.

[0011] Furthermore, the extension direction of the capillary cavity is consistent with the length direction of the inner liner.

[0012] Furthermore, the semiconductor refrigerator is either a vertical refrigerator or a horizontal refrigerator.

[0013] Compared with the prior art, the beneficial technical effects of this utility model are: (1) This utility model achieves efficient cooling and heat dissipation performance, and has the advantages of energy saving, environmental protection and quiet operation. By adopting the structural design of superconducting aluminum plate inner liner and capillary cavity, the heat conduction efficiency is significantly improved and the cooling effect is more uniform; by connecting the hot side of the semiconductor cooling chip to the heat sink or superconducting aluminum plate shell through heat pipe, the heat dissipation path is further optimized and the overall heat dissipation efficiency is improved.

[0014] (2) This utility model has a compact structure, operates quietly, and can be directly powered by DC power. It is suitable for vehicle use, as well as for home and commercial use. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the connection structure of this utility model.

[0016] Figure 2 This is a left view of the inner liner of this utility model.

[0017] Figure 3 This is an isometric view of the inner liner of this utility model, wherein the black arrows indicate the extension direction of the capillary cavity.

[0018] Figure 4 yes Figure 2 Enlarged view of point I in the middle.

[0019] Figure 5 This is a schematic diagram of the working principle of this utility model, in which the blue arrow indicates the direction of movement of the gaseous refrigerant and the red arrow indicates the direction of movement of the liquid refrigerant.

[0020] Explanation of reference numerals in the attached diagram: Inner liner - 1; Semiconductor cooling chip - 2; External heat dissipation system of the refrigerator - 3; Rib plate - 4; Capillary cavity - 5; Heat dissipation fin - 6; Heat pipe - 7. Detailed Implementation

[0021] Example 1: A semiconductor refrigerator includes an inner liner 1, a semiconductor cooling chip 2, and an external heat dissipation system 3. The inner liner 1 is composed of double-layer superconducting aluminum plates, such as... Figure 2and Figure 3 As shown, the two layers of superconducting aluminum plates in the inner liner 1 are supported by multiple parallel ribs 4, thereby forming multiple capillary cavities 5, as shown. Figure 3 As shown, the extension direction of the capillary cavity 5 is consistent with the length direction of the inner liner 1. Figure 4 As shown, the inner wall of the capillary cavity 5 is covered with heat dissipation fins 6 to enhance heat conduction performance. The capillary cavity 5 is filled with refrigerant (such as non-toxic and environmentally friendly refrigerant). The refrigerant circulates in the capillary cavity 5, absorbing and dissipating heat, thereby achieving a high-efficiency cooling effect and reducing energy consumption.

[0022] like Figure 1 As shown, the cold side of the semiconductor cooling chip 2 is in close contact with the inner liner 1. Utilizing the high thermal conductivity of the superconducting material, the cooling energy generated by the semiconductor cooling chip 2 is quickly transferred to the interior of the inner liner 1.

[0023] like Figure 1 As shown, the hot side of the thermoelectric cooler 2 is connected to the external cooling system 3 of the refrigerator via a heat pipe 7. The external cooling system 3 can be a heat sink equipped with a fan for forced air circulation, enhancing heat dissipation. Alternatively, the external cooling system 3 can be the refrigerator's metal casing; to further improve heat dissipation performance, the metal casing can be made of superconducting aluminum. When the external cooling system 3 is the refrigerator's metal casing, a fan is unnecessary compared to a heat sink, saving costs.

[0024] The working principle of this utility model is as follows: Figure 5 As shown, at room temperature, the refrigerant in capillary cavity 5 exists in both gaseous and liquid forms (primarily gaseous). When it comes into contact with a cold source, a localized low-pressure area forms within capillary cavity 5. Affected by the pressure change, the gaseous refrigerant liquefies and releases heat. The superconducting aluminum plate rapidly transfers the heat from the heat source to the cold source. The liquid refrigerant flows to both sides of capillary cavity 5 and reabsorbs heat to vaporize, while the gaseous refrigerant drifts back towards the low-pressure area. Thus, the refrigerant within capillary cavity 5 forms a self-circulating system, continuously transferring heat.

[0025] This utility model has a compact structure, operates quietly, and can be directly powered by DC power, making it suitable for vehicle use, as well as home and commercial applications.

[0026] This invention achieves highly efficient cooling and heat dissipation performance, offering advantages such as energy saving, environmental friendliness, and quiet operation. By employing a superconducting aluminum plate inner liner and a capillary cavity 5 structural design, heat conduction efficiency is significantly improved, resulting in a more uniform cooling effect. The circulation of refrigerant within the capillary cavity 5 enhances the system's heat dissipation performance and reduces energy consumption. Furthermore, by connecting the hot side of the semiconductor cooling chip 2 to the heat sink or superconducting aluminum plate outer shell via a heat pipe 7, the heat dissipation path is further optimized, improving overall heat dissipation efficiency.

[0027] Of course, the above description is not intended to limit the present utility model, and the present utility model is not limited to the examples given above. Any changes, modifications, additions or substitutions made by those skilled in the art within the scope of the present utility model should also fall within the protection scope of the present utility model.

Claims

1. A semiconductor refrigerator, characterized in that, It includes an inner liner, a thermoelectric cooling chip, and an external heat dissipation system for the refrigerator. The cold side of the thermoelectric cooling chip is in close contact with the inner liner, and the hot side of the thermoelectric cooling chip is connected to the external heat dissipation system for the refrigerator through a heat pipe. The inner liner is composed of a double-layer superconducting aluminum plate, and the two layers of superconducting aluminum plate are supported by ribs to form multiple capillary cavities. The inner wall of the capillary cavity is provided with heat dissipation ribs, and the capillary cavity is filled with refrigerant.

2. The semiconductor refrigerator according to claim 1, characterized in that, The refrigerator's external heat dissipation system is a heat sink, and a fan is mounted on the heat sink.

3. The semiconductor refrigerator according to claim 1, characterized in that, The refrigerator's external heat dissipation system is a metal casing.

4. The semiconductor refrigerator according to claim 3, characterized in that, The metal outer shell is made of superconducting aluminum plate.

5. The semiconductor refrigerator according to any one of claims 1-4, characterized in that, The refrigerant is a non-toxic and environmentally friendly refrigerant.

6. The semiconductor refrigerator according to claim 5, characterized in that, There are multiple ribs, and adjacent ribs are parallel to each other.

7. The semiconductor refrigerator according to claim 6, characterized in that, The capillary cavity extends in the same direction as the length of the inner liner.

8. The semiconductor refrigerator according to claim 7, characterized in that, The semiconductor refrigerator is either a vertical or horizontal refrigerator.

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