Refrigerating device for radio frequency device product production

Abstract

The utility model discloses a kind of refrigeration devices for radio frequency device product production, belong to radio frequency device production refrigeration equipment technical field, its technical scheme main points include device main body and be located in the load mechanism of device main body inside, the device main body includes outer box and inner box, air circulation passage is formed between the outer box and inner box, through the air circulation passage formed by the outer box and inner box of device main body, cooperate the large-area cooling structure of cold guide plate, cold guide fin, the cold quantity generated by semiconductor refrigeration system is evenly transferred to inner box, and the circulating fan of inner box bottom and top air flow opening linkage, drive cold air circulation flow between passage and inner box, avoid local temperature difference, realize inner box global constant temperature, simultaneously, double-cavity structure insulates external environment to the interference of cooling process, ensure that the cooling effect of same batch radio frequency device is consistent, guarantee radio frequency device welding fast, uniformly, accurate cooling demand.

Description

Technical Field

[0001] This utility model relates to the technical field of cooling equipment for radio frequency device production, and in particular to a cooling device for the production of radio frequency device products. Background Technology

[0002] Radio frequency (RF) devices are widely used in modern communications, radar, navigation and other fields. Their performance directly affects the working quality of the entire electronic system. In the production process of RF devices, many processes (such as soldering and packaging) need to be carried out at high temperatures, and after high-temperature treatment, the RF devices need to be precisely cooled.

[0003] In existing technologies, natural cooling or direct fan cooling is commonly used to cool the soldered radio frequency devices. However, these cooling methods have the following drawbacks: First, the cooling speed is slow, which affects production efficiency; second, the temperature control accuracy is low, and the performance of radio frequency devices is easily degraded due to uneven cooling or excessive temperature fluctuations; third, the cooling process is easily affected by the external environment, resulting in inconsistent cooling effects among products in the same batch, which affects the stability of product quality.

[0004] Therefore, a cooling device for the production of radio frequency devices is proposed. Utility Model Content

[0005] The purpose of this invention is to provide a cooling device for the production of radio frequency (RF) devices, which can solve the problems of the existing technology, which usually uses natural cooling or direct fan cooling to cool the soldered RF devices. However, these cooling methods have the disadvantages of slow cooling speed, which affects production efficiency, low temperature control accuracy, and easy degradation of RF device performance due to uneven cooling or excessive temperature fluctuations. In addition, the cooling process is easily affected by the external environment, resulting in inconsistent cooling effects in the same batch of products and affecting the stability of product quality.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a cooling device for the production of radio frequency device products, comprising a device body and a carrying mechanism disposed inside the device body. The device body includes an outer casing and an inner casing, with an airflow circulation channel formed between the outer casing and the inner casing. A cooling plate and cooling fins are disposed inside the airflow circulation channel. The cooling fins are welded to the inner side of the cooling plate, and the inner side of the cooling fins is bolted to the surface of the inner casing. The cooling plate is disposed on both sides and the rear side of the inner casing, and a semiconductor cooling system is in contact with the outer side of the cooling plate. A circulating fan is rotatably disposed at the bottom of the inner casing, and an airflow opening is provided at the top of the inner casing, and the airflow opening is connected to the airflow circulation channel.

[0007] Preferably, the loading mechanism includes two fixed columns, which are respectively bolted to both sides of the inner wall of the inner box. Two loading plates are slidably arranged between the two fixed columns. Fixed rods are slidably arranged on both sides of the bottom of the loading plates, and the fixed rods are inserted into the fixed columns on the side closest to them.

[0008] Preferably, a movable plate is bolted between the two fixed rods on opposite sides, and a positioning spring is bolted between the two movable plates.

[0009] Preferably, the fixed column has a plurality of fixing holes inside for use, and the fixing holes are distributed along the length of the fixed column.

[0010] Preferably, the top of the carrier plate has two storage slots, and the inside of the storage slots is filled with a thermally conductive silicone pad. Both the storage slots and the thermally conductive silicone pads have flow holes inside.

[0011] Preferably, guide plates are bolted to the four corners of the inner box, and the surface of the guide plates slides in contact with the inner wall of the loading plate.

[0012] Preferably, a sealing door is rotatably connected to the front side of the outer casing, and a transparent observation window is provided inside the sealing door. A controller is bolted to the bottom of the front side of the sealing door, and a temperature sensor is provided inside the inner casing, and the temperature sensor is electrically connected to the controller.

[0013] Preferably, a dust filter ring is bolted to the bottom of the inner box, and the bottom of the dust filter ring is bolted to the inner wall of the outer box. Both sides of the top of the inner wall of the inner box are bolted with guide plates, and the guide plates are used in conjunction with the airflow opening.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] 1. This application utilizes the airflow circulation channel formed by the outer and inner housings of the main body of the device, combined with the large-area cooling structure of the cooling plate and cooling fins, to uniformly transfer the cooling capacity generated by the semiconductor cooling system to the inner housing. The circulating fan at the bottom of the inner housing is linked with the airflow opening at the top to drive the cold air to circulate between the channel and the inner housing, avoiding local temperature differences and achieving constant temperature throughout the inner housing. At the same time, the dual-cavity structure isolates the external environment from the interference of the cooling process, ensuring consistent cooling effect for RF devices of the same batch, and guaranteeing the rapid, uniform, and precise cooling requirements after the RF devices are soldered.

[0016] 2. The two carrier plates of this application can slide and adjust the distance along the fixed column to accommodate radio frequency devices of different heights. The insertion and cooperation between the fixing rod and the fixing hole ensures that the height of the carrier plate is fixed and there is no looseness. This avoids the carrier plate tilting during the cooling process, which may cause the device to collide. It can ensure that there is no displacement or wear during the device cooling process, and further ensure the performance stability of the device after cooling. Attached Figure Description

[0017] Figure 1 This is an overall structural diagram of the cooling device used in the production of radio frequency devices according to this utility model;

[0018] Figure 2 This is a schematic diagram showing the connection between the main body of the device and the loading mechanism of this utility model;

[0019] Figure 3 This is a schematic diagram of the main body of the device of this utility model;

[0020] Figure 4 This is a schematic diagram of the structure of the loading mechanism of this utility model;

[0021] Figure 5 This is a schematic diagram showing the connection between the carrier plate and the thermally conductive silicone pad of this utility model.

[0022] In the diagram, 1. Main body of the device; 11. Outer casing; 12. Inner casing; 13. Cooling plate; 14. Cooling fins; 15. Semiconductor refrigeration system; 16. Circulating fan; 2. Loading mechanism; 21. Fixed column; 22. Loading plate; 23. Fixed rod; 24. Moving plate; 25. Positioning spring; 3. Fixing hole; 4. Storage slot; 5. Thermally conductive silicone pad; 6. Flow hole; 7. Sealing door; 8. Dust filter ring; 9. Guide plate; 10. Guide plate. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Please see Figure 1-5 The present invention provides the following technical solution:

[0025] A cooling device for manufacturing radio frequency devices includes a main body 1 and a loading mechanism 2 disposed inside the main body 1. The main body 1 includes an outer casing 11 and an inner casing 12, forming an airflow circulation channel between the outer casing 11 and the inner casing 12. A cooling plate 13 and cooling fins 14 are disposed inside the airflow circulation channel. The cooling fins 14 are welded to the inner side of the cooling plate 13 and are bolted to the surface of the inner casing 12. The cooling plate 13 is disposed on both sides and the rear side of the inner casing 12, and a semiconductor cooling system 15 is in contact with the outer side of the cooling plate 13. A circulating fan 16 is rotatably disposed at the bottom inside the inner casing 12, and an airflow opening is provided at the top of the inner casing 12, which is connected to the airflow circulation channel.

[0026] In this embodiment: by setting the main body 1, the outer casing 11 and the inner casing 12 of the main body 1 form a closed airflow circulation channel. The cooling plate 13 is fixed on both sides and the rear side of the inner casing 12 respectively. The cooling fins 14 are welded to the inner side of the cooling plate 13 and connected to the surface of the inner casing 12. The semiconductor cooling system 15 is close to the outer side of the cooling plate 13. The circulating fan 16 at the bottom of the inner casing 12 and the airflow opening at the top serve as the airflow power source and the flow channel, respectively, forming a bottom-in and top-out airflow circulation path. The semiconductor cooling system 15 generates cooling energy, which is transferred to the cooling fins 14 through the cooling plate 13. The cooling fins 14 diffuse the cooling energy into the airflow through large-area contact. Within the circulation channel, the air at the bottom of the inner casing 12 is driven to flow to the top by the circulation fan 16. When the airflow passes through the cooling fins 14, it absorbs cold energy and becomes cold air. Then, it enters the inner casing 12 through the top airflow opening to cool the internal radio frequency devices. The airflow that has absorbed heat flows back to the vicinity of the cooling fins 14 along the airflow circulation channel, absorbs cold energy again to form a cycle, and continuously maintains the low temperature environment of the inner casing 12. Thus, the dual-cavity structure of the outer casing 11 and the inner casing 12 isolates the external room temperature fluctuations and dust, avoiding external environmental interference with the cooling process. The directional cooling design of the cooling plate 13 and the cooling fins 14 ensures that the cold energy is concentrated on the inner casing 12, reducing the loss of cold energy.

[0027] Specifically, such as Figure 4 As shown, the loading mechanism 2 includes two fixed columns 21, which are respectively bolted to both sides of the inner wall of the inner box 12. Two loading plates 22 are slidably arranged between the two fixed columns 21. Fixed rods 23 are slidably arranged on both sides of the bottom of the loading plate 22, and the fixed rods 23 are inserted into the side of the fixed column 21 closest to it.

[0028] Specifically, such as Figure 4 As shown, a movable plate 24 is bolted between the two fixed rods 23 on opposite sides, and a positioning spring 25 is bolted between the two movable plates 24.

[0029] Specifically, such as Figure 4 As shown, the fixed column 21 has several fixing holes 3 for use, and the fixing holes 3 are distributed along the length of the fixed column 21.

[0030] In this embodiment: by setting up a carrying mechanism 2, two fixed columns 21 are respectively fixed on both sides of the inner wall of the inner box 12. The two sides of the carrying plate 22 are slidably connected to the fixed columns 21 and can move up and down along the fixed columns 21. The distance between the two carrying plates 22 can be adjusted according to the height of the radio frequency device to ensure that the top of the device is unobstructed after placement and does not affect the circulation of cold air. After adjustment, the fixing rod 23 inside the carrying plate 22 is slid so that the fixing rod 23 is inserted into the fixing hole 3 of the fixed column 21 to complete the height fixation of the carrying plate 22. The elasticity of the positioning spring 25 makes the fixing rod 23 less likely to move, ensuring the stability of the position of the carrying plate 22.

[0031] Specifically, such as Figure 5 As shown, the top of the carrier plate 22 has two storage slots 4, and the inside of the storage slots 4 is filled with a thermally conductive silicone pad 5. Both the storage slots 4 and the thermally conductive silicone pad 5 have flow holes 6 inside.

[0032] Specifically, such as Figure 4 As shown, guide plates 10 are bolted to the four corners inside the inner box 12, and the surface of the guide plates 10 slides in contact with the inner wall of the loading plate 22.

[0033] In this embodiment: by setting up a storage slot 4 and a thermally conductive silicone pad 5, the radio frequency device is placed on the thermally conductive silicone pad 5 in the storage slot 4. The thermally conductive silicone pad 5 is in close contact with the bottom of the device and the storage slot 4, which quickly transfers the residual heat after the device is soldered to the carrier plate 22, and then to the surrounding cold air through the carrier plate 22, accelerating heat dissipation and shortening the cooling time. The storage slot 4 and the flow hole 6 inside the thermally conductive silicone pad 5 are interconnected. When the circulating fan 16 at the bottom of the inner box 12 drives the cold air to flow upward, some of the cold air passes through the flow hole 6. The overload plate 22 acts directly on the bottom of the device, carrying away the heat accumulated at the bottom of the device. This avoids localized heat dissipation problems caused by the contact between the bottom of the device and the overload plate 22, enabling bidirectional cooling of the device from top to bottom. This avoids the problem of heat accumulation at the bottom in traditional cooling methods, ensuring that the temperature of the device drops uniformly across its entire range and further reducing performance deviations caused by uneven cooling. By setting the guide plate 10, the orientation constraint of the guide plate 10 prevents the overload plate 22 from sliding off course, ensuring that the fixing rod 23 is precisely aligned with the fixing hole 3, reducing adjustments and rework caused by misalignment, and improving operational efficiency.

[0034] Specifically, such as Figure 1As shown, a sealing door 7 is rotatably connected to the front side of the outer casing 11, and a transparent observation window is provided inside the sealing door 7. A controller is bolted to the bottom of the front side of the sealing door 7. A temperature sensor is provided inside the inner casing 12, and the temperature sensor is electrically connected to the controller.

[0035] Specifically, such as Figure 3 As shown, a dust filter ring 8 is bolted to the bottom of the inner box 12, and the bottom of the dust filter ring 8 is bolted to the inner wall of the outer box 11. Both sides of the top of the inner wall of the inner box 12 are bolted with guide plates 9, and the guide plates 9 are used in conjunction with the airflow opening.

[0036] In this embodiment: the internal temperature is detected in real time by the temperature sensor of the inner casing 12, and the temperature signal is transmitted to the controller on the front side of the sealing door 7. The operator sets the target cooling temperature through the controller. When the actual temperature is higher than the set value, the controller automatically starts the semiconductor cooling system 15 to enhance the cooling intensity. When the actual temperature is lower than the set value, the controller reduces the power of the semiconductor cooling system 15 to maintain temperature stability. The temperature data is displayed on the controller panel in real time, which is convenient for the operator to monitor intuitively. After the sealing door 7 is closed, the cooling status of the radio frequency devices inside the inner casing 12 can be observed in real time through the transparent observation window without opening the sealing door 7, thus avoiding the loss of cold air and temperature fluctuations caused by opening the door.

[0037] Working principle: When the main body 1 cools the components after the RF devices have been soldered, the distance between the two carrier plates 22 is first adjusted according to the height of the devices. This can be achieved by pushing the two moving plates 24 relative to each other and compressing the positioning spring 25, causing the moving plates 24 to move the fixing rod 23 out of the fixing column 21, thus releasing the lock on the carrier plate 22. After adjusting the carrier plate 22 to the required position, the moving plates 24 are released, and the positioning spring 25 returns to its original position, pushing the fixing rod 23 into the fixing hole 3 at the corresponding height of the fixing column 21, thus fixing the height of the carrier plate 22. Then, the RF devices to be cooled after soldering are placed one by one on the carrier plate 22. Inside the storage slot 4, the bottom of the device is in close contact with the thermally conductive silicone pad 5 inside the storage slot 4. This not only prevents surface wear of the device through the flexibility of the silicone pad, but also accelerates heat transfer through its high thermal conductivity. After placement, the sealing door 7 is closed and locked to ensure a tight fit with the outer casing 11, forming a closed space. The target cooling temperature and cooling time are then input through the controller. The temperature parameters are processed by the controller and transmitted to the semiconductor cooling system 15, and the device enters the formal cooling operation state. After the semiconductor cooling system 15 is started, the cooling energy is transferred through the cooling plate 13 to the cooling fins 14 welded to its inner side. The cooling fins 14, through contact with... The tight connection of the inner casing 12 surface diffuses the cold air to the airflow circulation channel between the outer casing 11 and the inner casing 12. Simultaneously, the circulating fan 16 at the bottom of the inner casing 12 starts working, driving the air inside the inner casing 12 to flow upwards. The airflow first contacts the bottom of the carrier plate 22. Some of the cold air passes through the storage slot 4 and the flow holes 6 on the thermally conductive silicone pad 5, directly acting on the bottom of the RF device to remove residual heat after soldering. The remaining cold air flows upwards along the gaps between the carrier plates 22, flowing past the sides and top of the device, absorbing heat from the device surface. The heat-absorbing airflow, guided by the top guide plate 9, flows through the inner casing 12... 2. The airflow opening at the top enters the airflow circulation channel, contacts the cooling fins 14 and absorbs the cold energy, transforming it into low-temperature cold air. The low-temperature cold air flows downward along the airflow circulation channel, returns to the bottom of the inner box 12, is drawn in again by the circulation fan 16 and driven upward, forming a complete refrigeration cycle. During this process, the temperature sensor inside the inner box 12 monitors the temperature change in real time and feeds the data back to the controller. When the actual temperature is higher than the set value, the controller increases the power of the semiconductor refrigeration system 15 to increase the cooling output. When the actual temperature is lower than the set value, the controller reduces the power of the semiconductor refrigeration system 15 to maintain a stable temperature.

[0038] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A cooling device for manufacturing radio frequency device products, comprising a device body (1) and a loading mechanism (2) disposed inside the device body (1), characterized in that: The main body (1) of the device includes an outer casing (11) and an inner casing (12). An airflow circulation channel is formed between the outer casing (11) and the inner casing (12). A cooling plate (13) and a cooling fin (14) are provided inside the airflow circulation channel. The cooling fin (14) is welded to the inner side of the cooling plate (13), and the inner side of the cooling fin (14) is bolted to the surface of the inner casing (12). The cooling plate (13) is respectively provided on both sides and the rear side of the inner casing (12). A semiconductor refrigeration system (15) is in contact with the outer side of the cooling plate (13). A circulating fan (16) is rotatably provided at the bottom inside the inner casing (12). An airflow opening is provided at the top of the inner casing (12), and the airflow opening is connected to the airflow circulation channel.

2. The cooling device for manufacturing radio frequency device products according to claim 1, characterized in that: The loading mechanism (2) includes two fixed columns (21), which are respectively bolted to the two sides of the inner wall of the inner box (12). Two loading plates (22) are slidably arranged between the two fixed columns (21). Fixed rods (23) are slidably arranged on both sides of the bottom of the loading plate (22), and the fixed rods (23) are inserted into the side of the fixed column (21) near it.

3. A cooling device for manufacturing radio frequency device products according to claim 2, characterized in that: A movable plate (24) is bolted between the two fixed rods (23) on opposite sides, and a positioning spring (25) is bolted between the two movable plates (24).

4. A cooling device for manufacturing radio frequency device products according to claim 2, characterized in that: The fixed column (21) has several fixing holes (3) inside, and the fixing holes (3) are distributed along the length of the fixed column (21).

5. A cooling device for manufacturing radio frequency device products according to claim 2, characterized in that: The top of the carrier plate (22) has two storage slots (4), and a thermally conductive silicone pad (5) is placed inside the storage slots (4). Both the storage slots (4) and the thermally conductive silicone pad (5) have flow holes (6).

6. A cooling device for manufacturing radio frequency device products according to claim 2, characterized in that: Guide plates (10) are bolted to the four corners inside the inner box (12), and the surface of the guide plates (10) slides in contact with the inner wall of the loading plate (22).

7. A cooling device for manufacturing radio frequency device products according to claim 1, characterized in that: The outer casing (11) is rotatably connected to the front side of the inner casing, and a transparent observation window is provided inside the sealing door (7). A controller is bolted to the bottom of the front side of the sealing door (7). A temperature sensor is provided inside the inner casing (12), and the temperature sensor is electrically connected to the controller.

8. A cooling device for manufacturing radio frequency device products according to claim 1, characterized in that: The bottom of the inner box (12) is bolted with a dust filter ring (8), and the bottom of the dust filter ring (8) is bolted to the inner wall of the outer box (11). Both sides of the top of the inner wall of the inner box (12) are bolted with guide plates (9), and the guide plates (9) are used in conjunction with the airflow opening.

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