Wafer inspection platform and three-dimensional interferometric optical profiler

Abstract

The utility model discloses a kind of wafer detection platform and three-dimensional interference optical profilometer, comprising: first platform, suction passage is formed on first platform;Second platform is set below first platform, with first center line and second center line;First adjusting mechanism is set in second platform, for adjusting the angle of first platform rotation along first center line;Second adjusting mechanism is set in second platform, for adjusting the angle of first platform rotation along second center line;Rotary body is arranged at the central position of first platform and second platform, part rotatable is placed in first platform, part rotatable is placed in second platform;Fixing part;Elastic support unit is arranged between first adjusting mechanism and rotary body, between second adjusting mechanism and rotary body;Locking component is used to position first platform after first platform is adjusted in place.The wafer detection platform proposed in the utility model can realize simple and rapid positioning of wafer, and has compact structure.

Description

Technical Field

[0001] This utility model belongs to the field of measurement and testing technology, specifically, it relates to an improvement in a platform structure for inspecting wafers. Background Technology

[0002] Wafer inspection is a core step in the semiconductor manufacturing process. Its core objective is to ensure the yield and performance of chip manufacturing through precise analysis of the wafer surface and internal structure.

[0003] As a device for inspecting wafers, the 3D interferometric optical profilometer can easily achieve motion detection along the XYZ axes. However, wafer inspection also requires adjusting the wafer's angle to ensure optimal field of view and clarity during the inspection process. Simultaneously, the wafer must remain stationary during inspection to avoid affecting accuracy. Because wafers are thin sheets, traditional fixtures are difficult to use for securing them, and angle adjustment platforms are complex and bulky, occupying a significant amount of space for 3D interferometric optical profilometer inspection.

[0004] The information disclosed in this background section is only intended to enhance the understanding of the background technology of this application, and therefore may include prior art that is not known to those skilled in the art. Utility Model Content

[0005] This invention addresses the aforementioned technical problems in existing wafer inspection technologies by proposing a wafer inspection platform that not only enables simple and rapid wafer positioning but also features a simple structure, small footprint, and convenient and quick angle adjustment for wafers positioned on it.

[0006] To achieve the above-mentioned design objectives, the present invention adopts the following technical solution: A wafer inspection platform, comprising: The first platform has an adsorption channel for connection with vacuum equipment. The second platform is located below the first platform and has a first centerline and a second centerline perpendicular to the first centerline. The first adjustment mechanism is disposed within the second platform and cooperates with the first platform to adjust the rotation angle of the first platform along the first center line; The second adjustment mechanism, located within the second platform, is used to adjust the tilt angle of the first platform along the second centerline. A rotating body is arranged at the center of the first platform and the second platform, with part of it rotatably placed inside the first platform and part of it rotatably placed inside the second platform. A fastener is provided below the second platform to secure the second platform. At least two elastic support units are provided, arranged between the first adjustment mechanism and the rotating body, and between the second adjustment mechanism and the rotating body, for supporting the first platform when it rotates and adjusts. A locking component, connected to the first platform and the second platform, is used to position the first platform after it has been adjusted into place.

[0007] In some embodiments of this application, the first adjustment mechanism includes: The first adjusting micrometer includes a micrometer housing and a screw that is threadedly engaged with the micrometer housing; The first adjustment seat is fixed on the side wall of the second platform. The micrometer housing passes through the first adjustment seat and is locked and fixed by a nut screwed onto the micrometer housing. The first adjusting component is arranged laterally within the second platform and engages with the screw. The second adjusting member is vertically arranged inside the second platform, in contact with the inclined surface of the first adjusting member, and its end abuts against the bottom surface of the first platform; The second adjustment mechanism has the same structure as the first adjustment mechanism.

[0008] In some embodiments of this application, the first adjusting micrometer is provided with a first adjusting ball head, the first adjusting member is provided with a first ball head that contacts the first adjusting ball head, the first platform is provided with a first ball head groove with a bottom opening, and the second adjusting member is provided with a second ball head for insertion into the first ball head groove.

[0009] In some embodiments of this application, a countersunk hole with a bottom opening is provided in the second platform, and a threaded hole is provided in the first platform; The elastic support unit includes multiple elastic support components, each elastic support component including: The connecting member includes a head, which is disposed within the countersunk hole; The rod body is connected to the head, and an external thread is provided on the rod body. The rod body passes through the countersunk hole and is screwed into the threaded hole. An elastic element is sleeved on the rod body, with one end abutting against the head and the other end abutting against the top wall of the countersunk hole.

[0010] In some embodiments of this application, the elastic support unit is provided in three groups, respectively arranged on the line connecting the rotating body and the first adjustment mechanism, on the line connecting the rotating body and the second adjustment mechanism, and on the hypotenuse of the triangle formed by the connection of the rotating body, the first adjustment mechanism and the second adjustment mechanism.

[0011] In some embodiments of this application, a first ball hole is provided in the first platform, and a second ball hole is provided in the second platform. The rotating body is partially placed in the first platform and partially placed in the second platform.

[0012] In some embodiments of this application, the adsorption channel includes an annular channel arranged circumferentially along the first platform and a linear channel arranged along the diameter of the annular channel. The annular channel and the linear channel are connected at the intersection. A micro-air passage hole is provided at the connection point. An adsorption hole connected to the adsorption device is provided on the side of the first platform. The micro-air passage hole and the adsorption hole are connected.

[0013] In some embodiments of this application, multiple locking components are provided and arranged circumferentially along the second platform. A through hole is provided on the first platform, and a locking hole is provided in the second platform. The locking components pass through the through hole and are locked and fixed in the locking hole.

[0014] In some embodiments of this application, a first insertion hole for inserting the first adjusting member and a second insertion hole for inserting the second adjusting member are provided in the second platform, and the second insertion hole communicates with the first insertion hole.

[0015] Compared with the prior art, the advantages and positive effects of this utility model are: The wafer inspection platform of this utility model is configured with a first platform, a second platform and a fixing component arranged from top to bottom. An adsorption channel is set on the first platform at the top, and the wafer is positioned and fixed by vacuum adsorption. This not only achieves a firm positioning of the wafer, but also ensures that the wafer structure is not damaged. Secondly, a rotating body is set between the first platform and the second platform, and a first adjustment mechanism and a second adjustment mechanism are arranged on the second platform accordingly. The first adjustment mechanism and the second adjustment mechanism work together to adjust the flip angle of the first platform relative to the second platform along the X and Y directions, thereby realizing the adjustment of the angle of the first platform and the wafer placed on it. The entire platform structure not only realizes wafer positioning and angle adjustment, but also has a compact and simple structure with the upper and lower parts arranged sequentially, occupying little space.

[0016] Other features and advantages of this utility model will become clearer after reading the detailed embodiments of this utility model in conjunction with the accompanying drawings. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a front view of one embodiment of the wafer inspection platform proposed in this utility model; Figure 2 This is a top view of one embodiment of the wafer inspection platform proposed in this utility model; Figure 3 This is a front view of the first and second platforms of the wafer inspection platform proposed in this utility model in combination; Figure 4 This is a schematic diagram of the internal structure of the wafer inspection platform proposed in this utility model, showing the cooperation between the first platform and the second platform. Figure 5 This is a schematic diagram of the structure of the wafer inspection platform proposed in this utility model, in which a first adjustment mechanism and a second adjustment mechanism are assembled on the second platform. Figure 6 This is a three-dimensional structural diagram of the second platform of the wafer inspection platform proposed in this utility model; Figure 7 This is a top view of the second platform of the wafer inspection platform proposed in this utility model; Figure 8 This is a full cross-sectional view of the second platform of the wafer inspection platform proposed in this utility model; Figure 9 This is a schematic diagram of the structure of the first platform of the wafer inspection platform proposed in this utility model.

[0019] In the diagram, 100 is the first platform; 110 is the linear channel; 120 is the annular channel; 130 is the first ball head groove; 140 is the threaded hole; 150 is the first ball hole; 160 is the suction hole; 200 is the second platform; 210 is the first center line; 220 is the second center line; 230 is the countersunk hole; 240 is the second ball hole; 250 is the first insertion hole; 260 is the second insertion hole; 300 is the first adjusting mechanism; 310 is the first adjusting micrometer; 311 is the first adjusting ball head; 320 is the first adjusting seat; 330 is the first adjusting component; 331 is the first ball head; 340 is the second adjusting component; 341 is the second ball head; 400 is the second adjusting mechanism; 500 is the rotating body; 600 is the fixing component; 700 is the elastic support assembly; 710 is the connecting component; 711 is the head; 712 is the rod part; 720 is the elastic element; and 800 is the locking component. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] In the description of this utility model, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0022] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. In the description of the embodiments, specific features, structures, materials, or characteristics can be combined in any suitable manner in one or more embodiments or examples.

[0023] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

[0024] In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0025] In some embodiments of this application, a wafer inspection platform is proposed, comprising a first platform 100, a second platform 200, and a fixture 600 arranged sequentially from top to bottom.

[0026] An adsorption channel for connection with a vacuum device is formed on the first platform 100; The first platform 100 is mainly used to place wafers. Through the adsorption channel connected to the vacuum equipment on the first platform 100, the wafer placed on it can be adsorbed and positioned by the adsorption channel when the vacuum equipment is operating. The negative pressure formed between the wafer and the adsorption channel can firmly adsorb and position the wafer on the first platform 100.

[0027] Vacuum equipment includes vacuum pumps or vacuum generators.

[0028] When wafer inspection is complete and it is time to remove the wafer, stop the vacuum pump or de-vacuum the vacuum generator. The negative pressure between the wafer and the gas channel will disappear, and the wafer can be easily removed.

[0029] The second platform 200 is disposed below the first platform 100 and has a first centerline 210 and a second centerline 220 perpendicular to the first centerline 210. The first centerline 210 is a centerline along the X direction, and the second centerline 220 is a centerline along the Y direction.

[0030] The first adjustment mechanism 300 is disposed within the second platform 200 and is used to adjust the rotation angle of the first platform 100 along the first center line 210; The second adjustment mechanism 400 is disposed within the second platform 200 and is used to adjust the rotation angle of the first platform 100 along the second center line 220; By cooperating with the first adjustment mechanism 300 and the second adjustment mechanism 400, the rotation angle of the first platform 100 along the first center line 210 and the second center line 220 can be adjusted, thereby achieving the adjustment of the angle position of the first platform 100 and thus the adjustment of the angle position of the wafer placed on it.

[0031] The rotating body 500 is arranged at the center of the first platform 100 and the second platform 200, with part of it rotatably placed inside the first platform 100 and part of it rotatably placed inside the second platform 200.

[0032] The rotating body 500 is a universal rotating steel ball, which provides an adjustment support point for the rotation of the first platform 100 relative to the second platform 200.

[0033] The fastener 600 is disposed below the second platform 200 and is used to fix the second platform 200.

[0034] The fixing component 600 is a fixing plate, and the second platform 200 is fixedly connected to the fixing component 600. The fixing component 600 is also used to fix the Y-axis motion platform of the three-dimensional interferometric optical profile measuring instrument to realize Y-axis motion detection.

[0035] At least two elastic support units are provided, arranged between the first adjustment mechanism 300 and the rotating body 500, and between the second adjustment mechanism 400 and the rotating body 500, for supporting the first platform 100 when it rotates and adjusts. The elastic support unit is connected to the first platform 100 and the second platform 200. It can be used to provide support for the first platform 100 during the angle adjustment process of the first platform 100 rotating relative to the second platform 200, so as to ensure the stability of the first platform 100 during the angle adjustment process.

[0036] The locking component 800 is connected to the first platform 100 and the second platform 200, and is used to position the first platform 100 after it has been adjusted into place.

[0037] In this embodiment, the wafer inspection platform is configured with a first platform 100, a second platform 200 and a fixing member 600 arranged sequentially from top to bottom. An adsorption channel is set on the first platform 100 at the top, and the wafer is positioned and fixed by vacuum adsorption. This not only achieves a firm positioning of the wafer, but also ensures that the wafer structure is not damaged. Secondly, a rotating body 500 is set between the first platform 100 and the second platform 200, and a first adjustment mechanism 300 and a second adjustment mechanism 400 are arranged on the second platform 200 accordingly. The first adjustment mechanism 300 and the second adjustment mechanism 400 cooperate to adjust the flip angle of the first platform 100 relative to the second platform 200 along the X and Y directions, thereby realizing the adjustment of the angle of the first platform 100 and the wafer placed on it. The entire platform structure not only realizes wafer positioning and angle adjustment, but also has a compact and simple structure with the upper and lower parts arranged sequentially, occupying little space.

[0038] In some embodiments of this application, the first adjustment mechanism 300 includes: The first adjustment micrometer 310 is equipped with a scale. Fine adjustments can be made using the first adjustment micrometer 310. The adjustment amount can be accurately obtained by measuring the scale value on the first adjustment micrometer 310. This allows for more precise angle adjustments to the first platform 100, ensuring that the wafer finds a clearer detection field of view.

[0039] The first adjusting micrometer includes a micrometer housing and a screw that is threadedly engaged with the micrometer housing.

[0040] The first adjustment seat 320 is fixed on the side wall of the second platform 200.

[0041] The micrometer housing passes through the first adjustment seat and is locked in place by a nut screwed onto the micrometer housing.

[0042] Specifically, the micrometer housing is provided with an annular protrusion and an external thread section, and the first adjusting seat is provided with a through hole. The micrometer housing passes through the through hole, and is limited on one side by the annular protrusion and on the other side by the nut, thereby realizing the connection between the micrometer housing and the first adjusting seat 320.

[0043] The screw is rotatably mounted inside the micrometer housing.

[0044] When the screw is rotated, it can move back and forth relative to the first adjusting seat 320.

[0045] The first adjusting component 330 is arranged laterally within the second platform 200 and engages with the screw of the first adjusting micrometer 310. The second adjusting member 340 is vertically arranged inside the second platform 200, and contacts the inclined surface of the first adjusting member 330, with its end abutting against the bottom surface of the first platform 100; The second adjustment mechanism 400 has the same structure as the first adjustment mechanism 300.

[0046] The first adjusting component 330 is a first adjusting column, which is arranged laterally and its end is in contact with the screw of the first adjusting micrometer 310.

[0047] The second adjusting component 340 is a second adjusting column, which is arranged vertically.

[0048] A first wedge-shaped surface is provided on the first adjusting member 330, and a second wedge-shaped surface that cooperates with it is provided on the second adjusting member 340. The first wedge-shaped surface and the second wedge-shaped surface are in contact and cooperate.

[0049] When it is necessary to adjust the rotation angle of the first platform 100 along the X direction, the screw of the first adjusting micrometer 310 can be turned. The screw of the first adjusting micrometer 310 moves along the first adjusting seat 320, thereby exerting force on the first adjusting member that is in contact with it to move forward horizontally. When the first adjusting member moves forward horizontally, it transmits force to the second adjusting member 340 that is in contact with it. The second adjusting member 340 moves upward and abuts against the first platform 100, thereby causing the first platform 100 to rotate a certain angle around the first center line 210 as the axis, thus realizing the function of adjusting the angle of the first platform 100 along the X direction.

[0050] When the screw of the first adjusting micrometer 310 rotates in the reverse direction, it will move backward. At this time, the first adjusting member 330 will be pressed backward by the gravity of the first platform 100 and the second adjusting member 340, thereby realizing position adjustment.

[0051] The adjustment method and principle of the second adjustment mechanism 400 are the same as those of the first adjustment mechanism 300, and will not be described in detail here.

[0052] In some embodiments of this application, the first adjusting micrometer 310 is provided with a first adjusting ball head 311, the first adjusting member 330 is provided with a first ball head 331 and contacts the first adjusting ball head 311, the first platform 100 is provided with a first ball head groove 130 with a bottom opening, and the second adjusting member 340 is provided with a second ball head 341 for insertion into the first ball head groove 130.

[0053] In some embodiments of this application, a countersunk hole 230 with a bottom opening is provided in the second platform 200, and a threaded hole 140 is provided in the first platform 100. The elastic support unit includes a plurality of elastic support components 700, each elastic support component 700 including: The connecting member 710 includes: a head 711 disposed within the countersunk hole 230; The rod body 712 is connected to the head 711. An external thread is provided on the rod body 712. The rod body 712 passes through the countersunk hole 230 and is screwed into the threaded hole 140.

[0054] The connecting member 710 is a connecting screw or a connecting bolt.

[0055] An elastic element 720 is sleeved on the rod body 712, with one end abutting against the head 711 and the other end abutting against the top wall of the countersunk hole 230. The elastic element 720 is a spring.

[0056] When the first platform 100 rotates along the rotating body 500 to adjust its angle, it will drive the connecting member 710 connected to it to move. The head 711 of the connecting member 710 will compress the elastic element 720 arranged between the head 711 and the top wall of the countersunk hole 230. The elastic deformation of the elastic element 720 ensures that the connecting member 710 can be adjusted in angle as the first platform 100 moves.

[0057] When the first platform 100 rotates around the rotating body 500, the compression deformation of the elastic element 720 provides a certain degree of damping, ensuring the stability of the first platform 100 during angle adjustment. Once the angle is adjusted to the correct position, tightening the locking component 800 further ensures the stability of the angle adjustment plate and guarantees the accuracy of wafer measurement.

[0058] In some embodiments of this application, the elastic support unit is provided in three groups, respectively arranged on the line connecting the rotating body 500 and the first adjustment mechanism 300, on the line connecting the rotating body 500 and the second adjustment mechanism 400, and on the hypotenuse of the triangle formed by the rotating body 500, the first adjustment mechanism 300 and the second adjustment mechanism 400.

[0059] During the arrangement, each set of elastic support units can be arranged with at least 2 sets or more of elastic support components 700.

[0060] By arranging the elastic support units on the three sides of the triangle formed by the rotating body 500, the first adjustment mechanism 300, and the second adjustment mechanism 400, a triangular layout is formed, which can ensure the stability of the first platform 100 in angle adjustment.

[0061] In some embodiments of this application, a first ball hole 150 is provided in the first platform 100, and a second ball hole 240 is provided in the second platform 200. The rotating body 500 is partially placed in the first ball hole 150 and partially placed in the second ball hole 240.

[0062] The first ball hole 150 is open at the bottom, and the second ball hole 240 is open at the top. The rotating body 500 is partially placed in the first ball hole 150 and partially placed in the second ball hole 240. This ensures that the first platform 100 can rotate relative to the second platform 200 and supports the first platform 100.

[0063] In some embodiments of this application, the adsorption channel includes an annular channel arranged circumferentially along the first platform 100 and a linear channel 110 arranged along the diameter direction of the annular channel. The tops of the annular channel and the linear channel 110 are open, and the annular channel and the linear channel 110 are connected at their intersection. A micro-air passage hole is provided at the connection point. An adsorption hole 160 connected to the adsorption device is provided on the side of the first platform 100, and the micro-air passage hole and the adsorption hole 160 are connected.

[0064] The annular channel can be integrally formed with the first platform 100 during molding. The annular channel is circular and multiple channels are provided. The diameters of the multiple annular channels are different. During arrangement, the multiple annular channels are arranged in sequence along the direction of increasing diameter, and evenly cover the first platform 100.

[0065] Linear channels 110 are arranged along the diameter of annular channels 120, and multiple such channels can be provided.

[0066] The first platform 100 can be evenly distributed by the combination of linear channel 110 and annular channel 120.

[0067] The adsorption hole 160 is connected to the vacuum equipment. When the vacuum equipment is in operation, a vacuum can be drawn through the adsorption hole 160, the micro air channel hole connected to the adsorption hole 160, and the linear channel 110 and the annular channel 120 connected to the micro air channel hole, so that a negative pressure is formed in the linear channel 110 and the annular channel to achieve the adsorption and positioning function of the wafer.

[0068] In some embodiments of this application, multiple locking components 800 are provided and arranged circumferentially along the second platform 200. A through hole is provided on the first platform 100, and a locking hole is provided in the second platform 200. The locking component 800 passes through the through hole and is locked and fixed in the locking hole.

[0069] The locking component 800 is a fixed knob, and there are four of them, which are evenly distributed around the second platform 200.

[0070] After the first platform 100 is finely adjusted into place, the first platform 100 can be positioned and fixed by screwing on the locking component 800 that passes through the first platform 100 and locks it in the second platform 200.

[0071] In some embodiments of this application, a first insertion hole 250 for inserting the first adjusting member 330 and a second insertion hole 260 for inserting the second adjusting member 340 are provided in the second platform 200, and the second insertion hole 260 communicates with the first insertion hole 250.

[0072] The first insertion hole 250 is adapted to the outline of the first adjusting member 330, and the second insertion hole 260 is adapted to the outline of the second adjusting member 340.

[0073] In some embodiments of this application, a three-dimensional interferometric optical profile measuring instrument is proposed, which includes a base, a Y-axis motion platform, and a wafer inspection platform, wherein the wafer inspection platform is fixed to the Y-axis motion platform by screws.

[0074] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions claimed by this utility model.

Claims

1. A wafer inspection platform, characterized in that, Including: The first platform has an adsorption channel for connection with vacuum equipment. The second platform is located below the first platform and has a gap between them, and has a first center line and a second center line perpendicular to the first center line; A first adjustment mechanism is disposed within the second platform and is used to adjust the rotation angle of the first platform along the first center line; The second adjustment mechanism, located within the second platform, is used to adjust the rotation angle of the first platform along the second center line. A rotating body is arranged at the center of the first platform and the second platform, with part of it rotatably placed inside the first platform and part of it rotatably placed inside the second platform. A fastener is provided below the second platform to secure the second platform. At least two elastic support units are provided, arranged between the first adjustment mechanism and the rotating body, and between the second adjustment mechanism and the rotating body, for supporting the first platform when it rotates and adjusts. A locking component, connected to the first platform and the second platform, is used to position the first platform after it has been adjusted into place.

2. The wafer inspection platform according to claim 1, characterized in that, The first adjustment mechanism includes: The first adjusting micrometer includes a micrometer housing and a screw that is threadedly engaged with the micrometer housing; The first adjustment seat is fixed on the side wall of the second platform. The micrometer housing passes through the first adjustment seat and is locked and fixed by a nut screwed onto the micrometer housing. The first adjusting component is arranged laterally within the second platform and engages with the screw. The second adjusting member is vertically arranged inside the second platform, in contact with the inclined surface of the first adjusting member, and its end abuts against the bottom surface of the first platform; The second adjustment mechanism has the same structure as the first adjustment mechanism.

3. The wafer inspection platform according to claim 2, characterized in that, The first adjusting micrometer is provided with a first adjusting ball head, the first adjusting member is provided with a first ball head that contacts the first adjusting ball head, the first platform is provided with a first ball head groove with a bottom opening, and the second adjusting member is provided with a second ball head for insertion into the first ball head groove.

4. The wafer inspection platform according to claim 2, characterized in that, A countersunk hole with a bottom opening is provided in the second platform, and a threaded hole is provided in the first platform; The elastic support unit includes multiple elastic support components, each elastic support component including: The connecting component includes: a head disposed within the countersunk hole; The rod body is connected to the head, and an external thread is provided on the rod body. The rod body passes through the countersunk hole and is screwed into the threaded hole. An elastic element is sleeved on the rod body, with one end abutting against the head and the other end abutting against the top wall of the countersunk hole.

5. The wafer inspection platform according to claim 2, characterized in that, The elastic support unit is provided in 3 sets, which are respectively arranged on the line connecting the rotating body and the first adjustment mechanism, on the line connecting the rotating body and the second adjustment mechanism, and on the hypotenuse of the triangle formed by the rotating body, the first adjustment mechanism and the second adjustment mechanism.

6. The wafer inspection platform according to claim 2, characterized in that, A first ball hole is provided in the first platform, and a second ball hole is provided in the second platform. The rotating body is partially placed in the first platform and partially placed in the second platform.

7. The wafer inspection platform according to claim 2, characterized in that, The adsorption channel includes an annular channel arranged circumferentially along the first platform and a linear channel arranged diametrically along the annular channel. The tops of the annular channel and the linear channel are open, and the annular channel and the linear channel are connected at their intersection. A micro-air passage is provided at the connection point. An adsorption hole connected to the adsorption device is provided on the side of the first platform. The micro-air passage and the adsorption hole are connected.

8. The wafer inspection platform according to claim 2, characterized in that, Multiple locking components are provided and arranged circumferentially along the second platform. A through hole is provided on the first platform and a locking hole is provided in the second platform. The locking components pass through the through hole and are locked and fixed in the locking hole.

9. The wafer inspection platform according to claim 2, characterized in that, The second platform is provided with a first insertion hole for inserting the first adjusting member and a second insertion hole for inserting the second adjusting member, and the second insertion hole is connected to the first insertion hole.

10. A three-dimensional interferometric optical profile measuring instrument, characterized in that, Includes the wafer inspection platform as described in any one of claims 1-9.

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