A device for detecting the thickness of a core in real time

Abstract

The utility model belongs to but is not limited to the field of semiconductor technology, especially the device for real -time detection of the thickness of thinning machine core piece, including equipment main part, connecting piece, reconstruction height gauge main part, displacement sensor bracket, connecting pin, action cylinder and displacement sensor, reconstruction height gauge main part is fixedly connected with equipment main part through connecting piece, displacement sensor bracket is installed in the bottom of reconstruction height gauge main part through connecting pin, action cylinder is installed in the middle position of reconstruction height gauge main part, and displacement sensor is installed in the right upper corner of reconstruction height gauge main part. The cylinder movement drives the bracket displacement, and the bracket drags the up and down movement of displacement sensor, and the up and down movement of displacement sensor probe can be converted into the change of chip thickness, and the real -time measurement of chip thickness is realized. The utility model mechanical structure is simple, and maintenance is convenient, and the displacement sensor of this model has higher waterproof grade, and effectively prevents the precision deviation problem caused by coil water inlet.

Description

Technical Field

[0001] This utility model belongs to, but is not limited to, the field of semiconductor technology, and particularly relates to a device for real-time detection of chip thickness in a thinning machine. Background Technology

[0002] Thinning machines require height gauges to measure chip thickness in real time during the thinning process. However, height gauges operate in a humid environment for extended periods, and the following issues may arise over time: ① The aging of the external sealing ring and the cup of the height gauge can cause moisture and air to enter the height gauge. After moisture and air enter, the internal coil is prone to short circuit and damage, which in turn leads to the thickness deviation of the chip thinning and causes potential production quality problems.

[0003] ②Aging of internal components such as spring sheets, tension springs, and oil reservoirs in height gauges can lead to deviations in testing accuracy, which in turn can cause deviations in chip thickness reduction, creating potential production quality risks.

[0004] The original height gauge has a complex internal structure, making maintenance difficult. Moreover, it operates in a water and air environment for a long time, posing a risk of short-circuiting and damaging the internal coils if water or air enters.

[0005] Existing LED chip thinning control methods include: obtaining the chip workpiece's model size and initial thickness, and setting an initial removal rate; performing thinning processing on the chip workpiece based on the initial removal rate, conducting multi-point thickness detection on the thinned chip, and calculating the average thickness and thickness difference of the thinned chip; calculating the actual removal rate of the thinned chip and adjusting the initial removal rate to the actual removal rate; calculating a comparative analysis value of the chip workpiece within the same polishing cycle based on the thickness difference, generating a chiller temperature adjustment value based on the comparative analysis value, and adjusting the chiller's operating temperature based on the chiller temperature adjustment value; detecting whether the average thickness meets the chip workpiece's model size requirements, and improving the stability and quality of the polishing process by dividing the polishing cycle into multiple polishing cycles and dynamically adjusting the process based on the actual removal rate of the polishing cycle, combined with real-time adjustment and control of the chiller's operating temperature.

[0006] The prior art, CN118910575B, entitled "A Real-Time Device for Detecting Thin Film Thickness on the Surface of a Semiconductor Wafer," discloses a device for real-time monitoring of the thin film thickness on the wafer surface using spectral or laser methods during vapor deposition. This device includes a turntable, a spectral detector, a lifting structure, and a control module, enabling online real-time thickness detection during the thin film deposition process.

[0007] Although the existing solution achieves real-time online detection, several key issues remain: 1. Optical measurements are susceptible to environmental interference—in vapor deposition equipment, gases, vapors, or deposits may affect the accuracy of the reflectance / transmission spectra, leading to measurement errors; 2. Complex structure and limited applicability – This device is mainly designed for thin film deposition processes and uses spectral / laser detection methods. It is not suitable for directly measuring the thickness of the chip or for processes where the chip is mechanically thinned. Utility Model Content

[0008] To address the problems existing in the prior art, this utility model provides a device for real-time detection of chip thickness in a chip thinning machine. It features an independently designed mechanical structure and selects a high-precision displacement sensor (with a waterproof rating of up to IP67G) to replace the coil inside the original height gauge to achieve real-time chip thickness testing. The device has a simple structure and is easy to maintain.

[0009] This utility model is implemented as follows: a device for real-time detection of chip thickness in a thinning machine includes a main body, a connector, a modified height gauge main body, a displacement sensor bracket, a connecting pin, an actuating cylinder, and a displacement sensor. The modified height gauge main body is fixedly connected to the main body through the connector. The displacement sensor bracket is installed at the bottom of the modified height gauge main body through the connecting pin. The actuating cylinder is installed in the middle of the modified height gauge main body. The displacement sensor is installed in the upper right corner of the modified height gauge main body.

[0010] Furthermore, the cylinder's movement causes the bracket to shift, which in turn drags the displacement sensor up and down. The up-and-down movement of the displacement sensor probe can be converted into a change in chip thickness, enabling real-time measurement of the chip thickness.

[0011] This utility model has a simple mechanical structure and is easy to maintain. In addition, the displacement sensor of this model has a high waterproof rating, which effectively prevents accuracy deviation caused by water ingress into the coil.

[0012] Compared with the prior art, the present invention has a simple structure. Compared with the existing device (which requires adjustment of tension springs, springs, oil cans, etc. for maintenance), only the displacement sensor itself needs to be maintained, which is convenient and saves time and costs. The maintenance time is reduced from the original 2-3 hours to 0.5 hours.

[0013] Compared to existing technologies, this invention employs a high-precision displacement sensor to detect silicon wafer thickness in real time, performing up to 200 million continuous tests. This displacement sensor boasts a repeatability accuracy of 1µm, thus ensuring the stability of the thinning thickness. The procurement cost of this invention is reduced by 73%. Compared to existing technologies, this invention also features a higher level of waterproofing, effectively preventing accuracy deviations caused by water ingress into the coil. Attached Figure Description

[0014] Figure 1This utility model embodiment provides an assembly diagram of the connector, the main body of the equipment, and the modified height gauge main body; Figure 2 This is a schematic diagram of the connector provided in an embodiment of the present utility model; Figure 3 This is a schematic diagram of the main body of the modified height gauge provided in this embodiment of the utility model; Figure 4 This is a schematic diagram of the displacement sensor bracket provided in an embodiment of the present invention; Figure 5 This is a schematic diagram of the connecting pin provided in an embodiment of the present utility model; In the diagram: 1. Connector; 2. Modified height gauge body; 3. Displacement sensor bracket; 4. Connecting pin. Detailed Implementation

[0015] To make the objectives, technical solutions, and advantages of this utility model clearer, the following detailed description is provided in conjunction with embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this utility model.

[0016] like Figure 1 As shown, the device for real-time detection of chip thickness in a chip thinning machine provided by this utility model includes a main body, such as... Figure 2 Connector 1 shown, as Figure 3 The modified height gauge body 2 is shown. Figure 4 Displacement sensor bracket 3 as shown Figure 5 The connecting pin 4, the actuating cylinder, and the displacement sensor are shown. The modified height gauge body 2 is fixedly connected to the equipment body through the connector 1. The displacement sensor bracket 3 is installed at the bottom of the modified height gauge body 2 through the connecting pin 4. The actuating cylinder is installed in the middle position of the modified height gauge body 2. The displacement sensor is installed in the upper right corner of the modified height gauge body 2.

[0017] The movement of the cylinder drives the bracket to move, and the bracket drags the displacement sensor up and down. The up and down movement of the displacement sensor probe can be converted into a change in chip thickness, realizing real-time measurement of chip thickness.

[0018] The device consists of a main body, connector 1, modified height gauge body 2, displacement sensor bracket 3, connecting pin 4, actuating cylinder, and displacement sensor. Connector 1 is fixedly connected to the main body of the device at one end and to the modified height gauge body 2 at the other end, ensuring the positioning and stability of the height gauge body within the device. The displacement sensor bracket 3 is located at the bottom of the modified height gauge body 2 and is hinged to it via connecting pin 4, ensuring both secure installation of the bracket and allowing for a certain amount of rotation or linear movement to cooperate with the cylinder's actuation.

[0019] An actuating cylinder is installed in the middle of the main body 2 of the modified height gauge, and the output end of the cylinder is connected to the displacement sensor bracket 3. When the cylinder extends or retracts, it can drive the bracket to move vertically. The bracket itself has a structural interface for mounting the displacement sensor, which can support and fix the sensor, ensuring that the sensor probe moves accurately in the vertical direction. With this layout, the linear displacement of the actuating cylinder is directly converted into the vertical displacement of the sensor probe.

[0020] The displacement sensor is mounted in the upper right corner of the modified height gauge body 2, supported by a bracket that keeps the probe facing the surface of the chip being measured. During device operation, as the cylinder pushes the bracket up and down, the probe contacts or approaches the chip surface, converting the distance between the chip and the reference surface into an electrical signal output in real time. This layout ensures a stable sensor measurement path and high repeatability, avoiding interference from lateral displacement on the measurement results.

[0021] In terms of assembly, connector 1 ensures a stable connection between the modified height gauge body 2 and the main body of the equipment. Connecting pin 4 enables a movable connection between the bracket and the height gauge body. The actuating cylinder provides driving force and, through its piston rod, links with the bracket to form a drive-actuate mechanical transmission chain. The displacement sensor is rigidly connected to the bracket, thus transmitting the displacement of the cylinder to the probe without loss, achieving high-precision synchronization in the measurement process.

[0022] When chip thickness needs to be measured, the cylinder receives a control signal and extends its piston rod, pushing the bracket and displacement sensor probe downwards to contact the chip surface and record the distance value. When the cylinder retracts, the bracket moves the probe away from the chip, completing one measurement cycle. The displacement sensor converts the vertical displacement of the probe into an electrical signal corresponding to the chip thickness, which is then displayed or recorded in real time by the processing module, enabling continuous monitoring and analysis of the chip thickness. Example

[0023] In one specific embodiment, the main body of the equipment adopts a box structure welded from steel plates, and the outer surface is provided with a machined mounting surface to facilitate the fixed installation of the connector 1. The connector 1 is a rectangular plate structure with bolt mounting holes machined at both ends, and is rigidly connected to the main body of the equipment and the modified height gauge body 2 by high-strength bolts.

[0024] The main body 2 of the height gauge is made of aluminum alloy as a whole. The middle part has a pre-reserved mounting groove for the actuating cylinder, the upper right part has a mounting step for the displacement sensor, and the bottom two sides are provided with mounting holes for connecting pins 4, which facilitates hinged connection with the displacement sensor bracket 3. Example

[0025] In another embodiment, the piston rod end of the actuating cylinder is fixedly connected to the displacement sensor bracket 3 via a flange plate. The flange plate is connected to the bracket mounting surface by screw fastening, ensuring that the piston rod can directly drive the bracket to move vertically when it extends or retracts.

[0026] The cylinder is a double-acting cylinder, which realizes the reciprocating motion of the piston rod through the air source control system. The bracket slides vertically along the guide hole mating surface to keep the displacement sensor measurement direction consistent with the chip thickness direction. Example

[0027] In one structural improvement embodiment, the displacement sensor bracket 3 adopts an integral aluminum alloy processing structure, and the bracket body and the displacement sensor mounting surface are processed in one step to ensure flatness and perpendicularity accuracy.

[0028] The mounting surface is machined with through holes and countersunk holes so that the displacement sensor base can be directly fixed with screws, avoiding probe position displacement caused by secondary assembly errors and ensuring that the probe is perpendicular to the surface of the chip being tested. Example

[0029] In another embodiment, the connector 1 is an integral stepped steel plate with mating surfaces at both ends for the main body of the equipment and the main body of the modified height gauge 2.

[0030] Bolt mounting holes are machined on the mating surfaces at both ends of connector 1, and reinforcing ribs are designed around the holes to improve the connection rigidity and prevent loosening or deformation of the connection under cylinder drive. Example

[0031] In one detachable embodiment, the connecting pin 4 is a cylindrical pin with grooves at both ends, and retaining springs are installed in the grooves at both ends to prevent the connecting pin 4 from sliding out axially when the bracket moves.

[0032] The connecting pin 4 passes through the mating hole at the bottom of the displacement sensor bracket 3 and the modified height gauge body 2, forming a reliable rotating hinge connection, ensuring that the bracket is evenly transmitted in the vertical direction and moves smoothly. Example

[0033] In another embodiment, the displacement sensor probe is mounted downwards, pointing vertically towards the processed surface of the chip, and the probe is fixed to the bracket by screws on the sensor housing base.

[0034] To ensure a secure installation, the mounting surface of the bracket is designed with positioning pin holes, which, together with the positioning pins on the displacement sensor base, enable the probe to be fixedly positioned with the bracket, preventing the probe from undergoing slight rotation or displacement during the measurement process.

[0035] In the description of this utility model, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In addition, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0036] The above description is only a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any modifications, equivalent substitutions and improvements made by those skilled in the art within the technical scope disclosed in this utility model, and within the spirit and principles of this utility model, should be included within the protection scope of this utility model.

Claims

1. A device for real-time detection of chip thickness in a chip thinning machine, characterized in that, The device includes a main body, connectors, a modified height gauge body, a displacement sensor bracket, a connecting pin, an actuating cylinder, and a displacement sensor. The modified height gauge body is fixedly connected to the main body via the connectors. The displacement sensor bracket is rotatably connected to the bottom of the modified height gauge body via the connecting pin. The actuating cylinder is installed in the middle of the modified height gauge body, and the displacement sensor is installed in the upper right part of the modified height gauge body.

2. The apparatus according to claim 1, characterized in that, The piston rod of the actuating cylinder is fixedly connected to the displacement sensor bracket to drive the displacement sensor bracket to move in the vertical direction.

3. The apparatus according to claim 1, characterized in that, The displacement sensor bracket has a mounting surface for mounting the displacement sensor, and the mounting surface and the main body of the displacement sensor bracket are integrally formed.

4. The apparatus according to claim 1, characterized in that, One end of the connector is rigidly connected to the main body of the equipment, and the other end is rigidly connected to the main body of the modified height gauge.

5. The apparatus according to claim 1, characterized in that, The two ends of the connecting pin are respectively embedded in the mating holes of the displacement sensor bracket and the modified height gauge body, so as to realize the rotational connection of the displacement sensor bracket relative to the modified height gauge body.

6. The apparatus according to claim 1, characterized in that, The probe of the displacement sensor is positioned facing the surface of the chip being tested and is fixedly connected to the displacement sensor bracket.

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